Self-healing metallized film capacitor

Abstract

The utility model discloses a self-healing type metalized film capacitor, which relates to the technical field of capacitors and comprises a pin, a limiting mechanism is arranged at the top of the pin and comprises a built-in plate, a clamping plate and a supporting seat, the bottom of a film component is clamped with the supporting seat, the clamping plate is slidably connected with a sealing plate, and the sealing plate is connected with the pin. When the sealing plate and the packaging shell are assembled, the threaded rod is rotated, the clamping plates are driven to move, one sides of the moved clamping plates are in lap joint with the thin film assembly, the upper side and the lower side of the thin film assembly are limited through the buffering elastic pieces and the supporting bases, and the two sides of the thin film assembly are limited through the clamping plates; therefore, shaking and displacement of the thin film assembly in the packaging shell during use can be reduced, the use performance of the capacitor can be guaranteed, heat dissipation of the thin film assembly can be accelerated through multi-layer transmission, accumulation of heat in the packaging shell can be reduced, and the influence of high heat on use of the capacitor is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of capacitor especially relates to a self -healing metallized film capacitor. BACKGROUND

[0002] Self -healing metallized film capacitor is a kind of capacitor. Its electrode is made by vacuum evaporation etc. on the surface of plastic film (such as polypropylene film) thin metal (such as zinc, aluminum etc.) layer, and the combination of this film and metal layer constitutes the basic structure of capacitor.

[0003] Such as Chinese patent CN211980433U discloses a self -healing high -power metallized film capacitor, including insulating shell and the first electrode stick and the second electrode stick fixedly connected on insulating shell, the first metal layer and the second metal layer are equipped in insulating shell, the first metal layer and the second metal layer are pasted with insulating film, the side of the first metal layer and the second metal layer pasting insulating film is bonded with insulating bead, the first electrode stick penetrates pasting the first metal layer, the second electrode stick penetrates the second metal layer.

[0004] In the above patent, the problem of large-area evaporation failure of metal layer is solved by insulating bead and insulating film, but the external vibration in the use process of capacitor can be transmitted to the inside of capacitor, when the inside of capacitor lacks limiting structure, metal film is prone to shaking and displacement, causing poor contact between film and electrode, affecting the use performance of capacitor. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the problem of the prior art that the external vibration in the use process of capacitor can be transmitted to the inside of capacitor, when the inside of capacitor lacks limiting structure, metal film is prone to shaking and displacement, causing poor contact between film and electrode, affecting the use performance of capacitor, and proposes a self -healing metallized film capacitor.

[0006] In order to achieve the above object, the utility model adopts the following technical scheme: a self -healing metallized film capacitor, including pin, the top of pin is provided with limiting mechanism, the limiting mechanism includes built-in plate, clamping plate and support seat, one side of built-in plate is fixedly connected with buffer spring, one side of built-in plate is fixedly connected with packaging shell, the inner wall of packaging shell is fixedly connected with sealing plate, the bottom of sealing plate is fixedly connected with pin, the top of sealing plate is fixedly connected with support seat, the inside of support seat is clamped with film assembly, one side of film assembly is overlapped with clamping plate, the bottom of clamping plate is slidably connected between sealing plate and sealing plate, and clamping plate is connected with threaded rod by screw thread.

[0007] Preferably, the threaded rod is rotatably connected with a fixed block at one end, and the top of the fixed block is fixedly connected with the sealing plate.

[0008] Preferably, one side of the film assembly is overlapped with a heat-conducting frame, one side of the heat-conducting frame is penetrated through the side wall of the packaging shell and is clamped with a heat-dissipating plate, and one side of the heat-dissipating plate is clamped and connected with the packaging shell.

[0009] Preferably, the film assembly comprises an insulating core rod, a film base layer and an insulating protective layer, the outer ring surface of the insulating core rod is wound with a metal layer, and one side of the metal layer is provided with a reserved edge.

[0010] Preferably, one side of the metal layer is combined with the film base layer, and one side of the film base layer is combined with a heat-conducting layer.

[0011] Preferably, the thickness of the film base layer is the same as that of the heat-conducting layer.

[0012] Preferably, one side of the heat-conducting layer is combined with the insulating protective layer, and the thickness of the insulating protective layer is twice that of the heat-conducting layer.

[0013] Compared with the prior art, the utility model has the advantages and positive effects that:

[0014] 1、in the utility model, the film assembly is clamped with the supporting seat, the clamping plate is slidably connected with the sealing plate, when the sealing plate is assembled with the packaging shell, the threaded rod is rotated to drive the clamping plate to move, one side of the moved clamping plate is overlapped with the film assembly, the upper and lower sides of the film assembly are limited by the buffer spring and the supporting seat, the two sides of the film assembly are limited by the clamping plate, so that the shaking and displacement of the film assembly in the packaging shell during use can be reduced, and the use performance of the capacitor can be ensured.

[0015] 2、in the utility model, one side of the heat-conducting layer is combined with the insulating protective layer, one side of the heat-conducting frame is overlapped with the film assembly, the heat generated by the metal layer is transmitted to the heat-conducting layer through the film base layer, then transmitted to the insulating protective layer through the heat-conducting layer, and finally transmitted to the heat-dissipating plate through the heat-conducting frame, so that the heat dissipation of the film assembly can be accelerated, the heat accumulation in the packaging shell can be reduced, and the influence of high heat on the capacitor during use can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 a three-dimensional structure schematic diagram of the self-healing metalized film capacitor is provided for the utility model;

[0017] Figure 2 a heat-conducting frame structure installation schematic diagram of the self-healing metalized film capacitor is provided for the utility model;

[0018] Figure 3 a threaded rod structure installation schematic diagram of the self-healing metalized film capacitor is provided for the utility model;

[0019] Figure 4The utility model provides a self -healing metallized film capacitor's film assembly structure section schematic drawing.

[0020] Legend: 1, package shell; 2, heat dissipation plate; 3, pin; 4, sealing plate; 5, film assembly; 501, insulating core rod; 502, metal layer; 503, film base layer; 504, heat conducting layer; 505, insulating protective layer; 506, edge; 6, heat conducting frame; 7, built-in plate; 8, buffer spring; 9, clamping plate; 10, threaded rod; 11, fixed block; 12, support seat. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the drawings and examples. It should be explained that, in the case of no conflict, the embodiment of the present application and the features in the embodiment can be combined with each other.

[0022] In the following description, a lot of specific details are set forth in order to facilitate a full understanding of the utility model, but the utility model can also be implemented in other ways different from the description, therefore, the utility model is not limited to the specific embodiment disclosed in the following disclosure.

[0023] Example one: refer to Figures 1-3 As shown: a self -healing metallized film capacitor, including pin 3, pin 3 top is provided with limiting mechanism, limiting mechanism includes built-in plate 7, clamping plate 9 and support seat 12, built-in plate 7 one side is fixedly connected with buffer spring 8, built-in plate 7 one side is fixedly connected with package shell 1, package shell 1 inner wall is fixedly connected with sealing plate 4, sealing plate 4 bottom is fixedly connected with pin 3, sealing plate 4 top is fixedly connected with support seat 12, support seat 12 inside is clamped with film assembly 5, film assembly 5 one side and clamping plate 9 overlap, clamping plate 9 bottom penetrates sealing plate 4 and is slidably connected between sealing plate 4, clamping plate 9 is connected with threaded rod 10 by screwing, threaded rod 10 one end is rotatably connected with fixed block 11, and fixed block 11 top is fixedly connected with sealing plate 4.

[0024] The sealing plate 4 can be used to support and reinforce the bottom of the support base 12. The support base 12 facilitates the placement of the thin film assembly 5 on top of the sealing plate 4. The connection between the encapsulation shell 1 and the sealing plate 4 enables the assembly of the thin film assembly 5 inside the sealing plate 4. The built-in plate 7 can assist in the installation of the buffer spring 8 inside the encapsulation shell 1. The two buffer springs 8 can limit and protect the top of the thin film assembly 5. The fixing block 11 can support one end of the threaded rod 10. The threaded connection between the threaded rod 10 and the clamping plate 9 can drive the clamping plate 9 to move inside the encapsulation shell 1, thereby adjusting the distance between the clamping plate 9 and the thin film assembly 5. The two clamping plates 9 clamp and fix the thin film assembly 5, thereby improving the limiting effect of the thin film assembly 5 inside the encapsulation shell 1 and ensuring the stable installation and use of the thin film assembly 5.

[0025] Example 2: Figures 1-4 As shown, a heat-conducting frame 6 is attached to one side of the thin-film assembly 5. A heat dissipation plate 2 is snapped onto one side of the heat-conducting frame 6 after penetrating the side wall of the encapsulation shell 1. The heat dissipation plate 2 is snapped onto one side of the encapsulation shell 1. The thin-film assembly 5 includes an insulating core rod 501, a thin-film base layer 503, and an insulating protective layer 505. A metal layer 502 is wound around the outer ring surface of the insulating core rod 501. An edge 506 is provided on one side of the metal layer 502. One side of the metal layer 502 is composite with the thin-film base layer 503. A heat-conducting layer 504 is composite on one side of the thin-film base layer 503. The thickness of the thin-film base layer 503 is the same as that of the heat-conducting layer 504. One side of the heat-conducting layer 504 is composite with the insulating protective layer 505. The thickness of the insulating protective layer 505 is twice that of the heat-conducting layer 504.

[0026] The heat-conducting frame 6 can assist in the transfer of heat from the thin-film assembly 5 to the heat sink 2. The heat sink 2 increases the heat dissipation area on one side of the heat-conducting frame 6. Air contact with the heat sink 2 can assist in the heat dissipation of the heat-conducting frame 6. The insulating core rod 501 can assist in the forming of the thin-film assembly 5 and also support one side of the metal layer 502. The thin-film base layer 503 can connect the metal layer 502 and the heat-conducting layer 504, so that the heat generated by the metal layer 502 can be initially conducted by the heat-conducting layer 504. Then, the insulating protective layer 505 can wrap and protect one side of the heat-conducting layer 504, which can further assist in the heat dissipation of the heat-conducting layer 504, reduce the accumulation of heat inside the thin-film assembly 5, and allow the heat to dissipate quickly, thereby ensuring the normal use of the capacitor at high frequencies.

[0027] The working principle and method of using the device: firstly, the film base layer 503 is made of polypropylene film, the heat conducting layer 504 is made of aluminum oxide ceramic, which can conduct the heat on one side of the film base layer 503, the insulating protective layer 505 is made of mica sheet, which can further insulate and assist heat dissipation protection for the heat conducting layer 504, when the film assembly 5 is installed in the support seat 12, the sealing plate 4 is assembled with the packaging shell 1, the buffer spring 8 on one side of the built-in plate 7 contacts the film assembly 5, the two sides of the top of the film assembly 5 are limited, then the threaded rod 10 is rotated on both sides of the fixed block 11, under the action of the screw, the clamping plate 9 is driven to approach one side of the film assembly 5, the film assembly 5 is clamped by the two symmetrically arranged clamping plates 9, the limiting and fixing of the film assembly 5 are realized, during the use of the capacitor, the pin 3 is connected with the external circuit, the heat generated by the film assembly 5 is transmitted to the heat conducting frame 6 by the heat conducting layer 504 and the insulating protective layer 505, and then transmitted to the surface of the heat dissipation plate 2 through the heat conducting frame 6, the heat dissipation plate 2 contacts with air, and the heat dissipation is accelerated.

[0028] The above is only the preferred embodiment of the present application, and is not intended to limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present application still belong to the protection scope of the present application.

Claims

1. A self-healing metallized film capacitor comprising a pin (3), characterized in that: The top of the pin (3) is provided with a limiting mechanism, the limiting mechanism includes built-in plate (7), clamping plate (9) and support seat (12), one side of the built-in plate (7) is fixedly connected with buffer spring (8), one side of the built-in plate (7) is fixedly connected with packaging shell (1), the inner wall of the packaging shell (1) is fixedly connected with sealing plate (4), the bottom of the sealing plate (4) is fixedly connected with pin (3), the top of the sealing plate (4) is fixedly connected with support seat (12), the support seat (12) is clamped with film assembly (5), one side of the film assembly (5) is overlapped with clamping plate (9), the bottom of the clamping plate (9) penetrates the sealing plate (4) and is slidably connected between the sealing plate (4), the clamping plate (9) is connected with threaded rod (10) through screw thread.

2. The self-healing metallized film capacitor of claim 1, wherein: One end of the threaded rod (10) is rotatably connected with the fixed block (11), and the top of the fixed block (11) is fixedly connected with the sealing plate (4).

3. The self-healing metallized film capacitor of claim 1, wherein: One side of the film assembly (5) is overlapped with the heat conducting frame (6), one side of the heat conducting frame (6) penetrates the side wall of the packaging shell (1) and is clamped with the heat dissipation plate (2), one side of the heat dissipation plate (2) is clamped with the packaging shell (1).

4. The self-healing metallized film capacitor of claim 1, wherein: The film assembly (5) includes an insulating core rod (501), a film base layer (503) and an insulating protective layer (505), the outer ring surface of the insulating core rod (501) is wound with a metal layer (502), one side of the metal layer (502) is provided with a selvedge (506).

5. The self-healing metallized film capacitor of claim 4, wherein: One side of the metal layer (502) is compounded with the film base layer (503), one side of the film base layer (503) is compounded with a heat conducting layer (504).

6. The self-healing metallized film capacitor of claim 5, wherein: The thickness of the film base layer (503) is the same as that of the heat conducting layer (504).

7. The self-healing metallized film capacitor of claim 5, wherein: One side of the heat conducting layer (504) is compounded with the insulating protective layer (505), and the thickness of the insulating protective layer (505) is twice that of the heat conducting layer (504).

Images