Ceiling sound box

Abstract

The embodiment of the utility model provides a ceiling-mounted sound box. The ceiling-mounted sound box comprises a loudspeaker assembly, a circuit board and a connecting structure, the circuit board comprises a circuit mainboard and a power supply module, a main control module and a power amplifier which are connected with each other are arranged in the circuit mainboard, and a high-voltage energy storage module is integrated at one end, close to a ceiling, of the power supply module; the circuit board is connected with one end of the loudspeaker assembly close to the ceiling. The circuit board and the loudspeaker assembly are fixed on a ceiling through a connecting structure.

Description

TECHNICAL FIELD

[0001] The present specification relates to the field of sound technology, in particular to a ceiling speaker. BACKGROUND

[0002] In modern home environments, ceiling speakers have become an indispensable part of audio systems due to their advantages of full-range sound coverage and non-ground space occupation. However, as users demand higher sound quality, ceiling speakers often require higher performance power supplies to provide sufficient power to achieve higher quality audio output. However, this often results in increased cost, size, and weight of the power supply device, thereby limiting the size and installation flexibility of the ceiling speaker and potentially affecting the integration of the ceiling speaker in the ceiling space.

[0003] Therefore, it is desirable to provide a ceiling speaker that can maintain a smaller size, achieve high power output, and also consider installation convenience and effective use of space. SUMMARY

[0004] One or more embodiments of the present specification provide a ceiling speaker, which includes a speaker assembly, a circuit board, and a connecting structure; the circuit board includes a circuit mainboard and a power module, the circuit mainboard is provided with a master control module and a power amplifier connected to each other, and the power module is integrated with a high-voltage energy storage module at one end close to the ceiling; the circuit board is connected to one end of the speaker assembly close to the ceiling; and the circuit board and the speaker assembly are fixed to the ceiling through the connecting structure.

[0005] In some embodiments, the high-voltage energy storage module adopts an electrolytic capacitor group.

[0006] In some embodiments, the speaker assembly is a double-unit structure, which includes a low-frequency unit and a high-frequency unit.

[0007] In some embodiments, the low-frequency unit includes a woofer, and the high-frequency unit includes a tweeter and a speaker support; the tweeter is fixed on the speaker support; the caliber of the woofer is larger than that of the tweeter, and the tweeter is embedded in the woofer through the speaker support.

[0008] In some embodiments, the circuit mainboard includes a frequency division circuit; the frequency division circuit is arranged between the power amplifier and the speaker assembly, and the speaker assembly is connected to the circuit board through the frequency division circuit.

[0009] In some embodiments, the circuit board comprises a USB interface, a network interface and a controller; the USB interface is connected to an external device, and the network interface is connected to an Ethernet cable; the USB interface and the network interface are connected to the main control module, the network interface is connected to the controller, and the controller is installed in the circuit board.

[0010] In some embodiments, the circuit board comprises an audio decoder, and the main control module is connected to the power amplifier through the audio decoder.

[0011] In some embodiments, the circuit board comprises an audio output interface connected to the output end of the power amplifier.

[0012] In some embodiments, the ceiling speaker comprises a protective cover covering the end of the loudspeaker assembly away from the ceiling.

[0013] In some embodiments, the connecting structure comprises a mounting rack and a safety lock, the mounting rack is a hollow box-shaped structure, the end of the mounting rack away from the ceiling is provided with a protruding structure, the protruding structure is close to the ceiling, and the safety lock is connected to the side of the mounting rack. BRIEF DESCRIPTION OF DRAWINGS

[0014] The present specification will be further illustrated in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, the same numbers represent the same structures, wherein:

[0015] Figure 1 is an exemplary structural diagram of a ceiling speaker according to some embodiments of the present specification;

[0016] Figure 2 is an exemplary circuit block diagram of a circuit board according to some embodiments of the present specification;

[0017] Figure 3 is an exemplary structural diagram of a circuit board according to some embodiments of the present specification;

[0018] In some embodiments, the circuit board comprises a USB interface, a network interface and a controller; the USB interface is connected to an external device, and the network interface is connected to an Ethernet cable; the USB interface and the network interface are connected to the main control module, the network interface is connected to the controller, and the controller is installed in the circuit board. DETAILED DESCRIPTION

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is clear from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structures or operations.

[0020] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, sections or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0021] As shown in the specification and claims, unless the context clearly indicates otherwise, the words "one", "a", "an", and / or "the" do not refer to the singular, but can also include the plural. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0022] Figure 1 is an exploded schematic view of a ceiling speaker according to some embodiments of the present specification.

[0023] Some embodiments of the present specification provide a ceiling speaker.

[0024] As shown in Figure 1 , the ceiling speaker can include a loudspeaker assembly 1, a circuit board 2, and a connecting structure 3, the circuit board 2 and the loudspeaker assembly 1 being fixed to the ceiling through the connecting structure 3.

[0025] The loudspeaker assembly 1 is a sound generating device of the ceiling speaker, which is used to convert electronic signals into sound. For more information about the loudspeaker assembly 1, please refer to the corresponding content later.

[0026] The circuit board 2 is a substrate that carries various electronic components.

[0027] In some embodiments, the circuit board 2 is used to realize the circuit function and control function of the ceiling speaker. For example, to control the volume adjustment, sound effect mode switching, etc. of the ceiling speaker.

[0028] Figure 2 is an exemplary circuit block diagram of a circuit board according to some embodiments of the present specification. As shown in Figure 2 , the circuit board 2 can include a circuit mainboard 21 and a power module 22.

[0029] The circuit mainboard 21 is a device for receiving, processing and amplifying audio signals. Figure 3 is an exemplary structural diagram of a circuit board according to some embodiments of the present specification. As shown in Figure 2 and Figure 3 The circuit mainboard 21 is provided with a main control module 211 and a power amplifier 212 connected to each other.

[0030] The main control module 211 is a control unit for controlling the operation of various modules and components. The main control module 211 has functions such as audio decoding and processing audio signals. For example, the main control module 211 can perform one or more operations such as decoding and amplifying audio signals, so that the ceiling speaker can receive and process audio data from the network.

[0031] For example, the main control module 211 can include a processor, a memory and a wireless network module. When the wireless network module is connected to an external network device, the processor can receive audio data uploaded by the external network device, and convert the received audio data into an electrical signal after decoding and processing, and then transmit it to the power amplifier 212. The power amplifier 212 amplifies the electrical signal to control the speaker assembly 1 to output sound.

[0032] In some embodiments, the main control module 211 can support multiple feasible network audio transmission protocols. For example, the main control module 211 can support Dante network audio transmission protocol, AES67 network audio transmission protocol, etc.

[0033] The power amplifier 212 is used to amplify the electrical signal to drive the speaker assembly 1 to produce sound.

[0034] According to some embodiments of the present specification, through the power amplifier 212, high-power HiFi sound quality can be provided, so that the ceiling speaker also has high playback sound quality when loading compressed audio signals, ensuring the clarity of the sound and improving the dynamic range of the sound.

[0035] The power supply module 22 is used to power the ceiling speaker.

[0036] In some embodiments, the power supply module 22 can be a charging power supply. For example, the charging power supply can be any one of an alkaline battery, a silver-zinc battery, and an alkaline zinc-manganese battery, etc.

[0037] In some embodiments, the external power supply can charge the power supply module 22, and the power supply module 22 can store power and power the ceiling speaker, so that the ceiling speaker can work normally without connecting to the external power supply.

[0038] In some embodiments, the power supply module 22 can also be a non-charging power supply. For example, the non-charging power supply can be any one of an alkaline battery, a silver-zinc battery, and an alkaline zinc-manganese battery, etc.

[0039] In some embodiments, the power module 22 can be a Power Delivery (PD) power supply, and the power supply standard of the power module 22 can be a Power over Ethernet Plus (PoE+) power supply standard.

[0040] In some embodiments, the power module 22 is integrated with a high-voltage energy storage module 221 at one end close to the ceiling.

[0041] For example, the high-voltage energy storage module 221 can include a plurality of high-voltage capacitors. For example, the high-voltage capacitors can be high-voltage ceramic capacitors, high-voltage power capacitors, etc. After the external power supply is connected to the power module 22, the high-voltage capacitors start to accumulate electric charge and complete rapid charging. When the loudspeaker assembly 1 needs to produce sound, the main control module 211 controls the high-voltage capacitors to release instantaneous current. After discharging, the high-voltage capacitors start the next charge accumulation. Each charging and the next discharging constitute a charge-discharge cycle.

[0042] By integrating the high-voltage energy storage module 221, the power module 22 can reduce the volume while increasing the instantaneous peak power of the power module 22. For example, by integrating the high-voltage energy storage module 221, the thickness of the power module 22 can be reduced to 85mm, and the instantaneous peak power can be increased to 50W.

[0043] In some embodiments, the high-voltage energy storage module 221 can improve the continuous power output of the power module 22, while ensuring that the power module 22 has the ability to downwardly compatible with lower power supply standards, and upwardly compatible with higher power supply standards. For example, under a 4Ω load, the high-voltage energy storage module 221 can provide a maximum of 50W root-mean-square (RMS) continuous power output. The PoE+ power supply standard power module 22 can reach the PoE++ power supply standard, while having the ability to downwardly compatible with the PoE power supply standard.

[0044] The high-voltage energy storage module 221 realizes fast storage and release of electric energy through efficient charge and discharge management, and can provide flexible power support for the ceiling speaker.

[0045] In some embodiments of the present specification, by integrating the high-voltage energy storage module 221, the power module 22 can make the PoE+ power supply standard ceiling speaker downwardly compatible with the PoE power supply standard, while realizing the power output of the PoE++ power supply standard, improving the power output and sound quality of the ceiling speaker, and reducing the thickness of the power module 22 to expand the application scenarios of the ceiling speaker.

[0046] In some embodiments, the high-voltage energy storage module 221 uses an electrolytic capacitor group.

[0047] The electrode of the electrolytic capacitor is made of aluminum foil with large surface area and small volume, which enables it to store more electric charge, so the small volume electrolytic capacitor can provide high capacitance value. For example, the capacity of the electrolytic capacitor group can reach 1-33000 μF. Some embodiments of the present specification provide instantaneous energy support at high power output by using small volume electrolytic capacitor group, ensuring stable sound pressure level output; it can also save space for placing power supply for ceiling speakers, thereby making the size of the ceiling speaker smaller.

[0048] In some embodiments, the circuit board 2 is in communication connection with the power module 22 to realize communication between the circuit board 2 and the power module 22, so that the circuit board 2 can control the charging and discharging of the power module 22. For example, the circuit board 2 can be connected with the power module 22 in a wired connection manner.

[0049] In some embodiments, the circuit board 2 is connected to the loudspeaker assembly 1 near the ceiling.

[0050] In some embodiments, the circuit board 2 is in communication connection with the loudspeaker assembly 1 to realize communication between the loudspeaker assembly 1 and the circuit board 2, so that the circuit board 2 can control the sound production of the loudspeaker assembly 1. For example, the loudspeaker assembly 1 can be connected to the power amplifier 212 in the circuit board 2 in a wired connection manner.

[0051] The connecting structure 3 is the support and connection body of the ceiling speaker. The connecting structure 3 is used to support the ceiling speaker and connect the ceiling speaker with the ceiling.

[0052] In some embodiments, the connecting structure 3 can include a thin shell having a mounting cavity, which is surrounded by the thin shell away from the ceiling.

[0053] The mounting cavity is used to accommodate components of the ceiling speaker, such as the loudspeaker assembly 1, the circuit board 2, etc.

[0054] In some embodiments, the size and shape of the mounting cavity can be set according to requirements. For example, if the loudspeaker assembly 1 is in the shape of a circular truncated cone, the mounting cavity can be designed in the shape of a circular truncated cone to fit the circular truncated cone-shaped loudspeaker assembly 1, ensuring that the loudspeaker assembly 1 is stably installed in the mounting cavity.

[0055] In some embodiments, the connecting structure 3 can be a shallow pot type thin structure. For example, after the thickness of the power module 22 is reduced to 85 mm, the depth of the connecting structure 3 can be 85 mm to adapt to the installation environment of various ceiling speakers.

[0056] In some embodiments, the material of the connecting structure 3 is not limited and can be any one or a combination of plastic, wood, polymer, rubber, metal, composite material, etc.

[0057] In some embodiments, the material of the connecting structure 3 can be polypropylene. The connecting structure 3 made of polypropylene is lighter in weight, which can provide flexible design while having the ability of durability and resistance to environmental influences.

[0058] In some embodiments, the connecting structure 3 can be connected to the ceiling.

[0059] The connecting manner of the connecting structure 3 to the ceiling can include any one or a combination of fixed connection such as welding and bonding, and detachable connection such as screw connection and buckle connection. More details about the connecting structure 3 can be found in the relevant description below.

[0060] In some embodiments of the present specification, the power supply module 22 integrates the high-voltage energy storage module 221, which can provide higher peak power for the ceiling speaker without upgrading the power supply standard and size. The ceiling speaker of PoE+ obtains the peak power output of PoE++, which meets the high-power demand of the ceiling speaker playing high dynamic range music, thereby improving the clarity of sound quality and the sufficiency of volume. The innovative overall power supply scheme economically and efficiently reduces the cost; by reducing the size of the power supply module 22, the ultra-thin design of the ceiling speaker is realized, which can significantly reduce the occupation of the ceiling space during installation, and make the ceiling speaker easily integrated into various home environments; the characteristics of ultra-thin design and instantaneous high-power output make the ceiling speaker adapt to various different installation environments, including commercial and home places such as conference rooms, multi-purpose halls, auditoriums, etc., providing flexibility and convenience for the application of ceiling speakers.

[0061] In some embodiments, the loudspeaker assembly 1 can be a double-unit structure.

[0062] The double-unit structure refers to a loudspeaker structure including two audio units.

[0063] In some embodiments, the double-unit structure can include a low-frequency unit 11 and a high-frequency unit 12.

[0064] The low-frequency unit 11 is a loudspeaker unit that outputs low-frequency sound. The frequency range of the low-frequency sound is below 200 Hz. For example, 20 Hz-200 Hz.

[0065] The high-frequency unit 12 is a loudspeaker unit that outputs high-frequency sound. The frequency range of the high-frequency sound is above 2000 Hz.

[0066] In some embodiments, the low-frequency unit 11 can include a woofer, and the high-frequency unit 12 can include a tweeter 121 and a loudspeaker bracket 122; the tweeter 121 is fixed on the loudspeaker bracket 122; the caliber of the woofer is larger than that of the tweeter 121, and the tweeter 121 is embedded in the woofer through the loudspeaker bracket 122.

[0067] The woofer is a component that emits low frequency sound.

[0068] In some embodiments, the size of the woofer can be set according to actual needs.

[0069] In some embodiments, the diameter of the woofer can be 6.5 inches.

[0070] The tweeter 121 is a component that emits high frequency sound.

[0071] In some embodiments, the size of the tweeter 121 can be set according to actual needs.

[0072] In some embodiments, the diameter of the tweeter 121 can be 0.75 inches.

[0073] The speaker bracket 122 is a component that supports the tweeter 121.

[0074] In some embodiments, the shape and size of the speaker bracket 122 can be set according to needs. For example, a honeycomb structure of the speaker bracket 122 can provide excellent rigidity while maintaining a lightweight design, effectively reducing vibration propagation and providing good sound wave propagation conditions.

[0075] In some embodiments, the speaker bracket 122 can be provided with ventilation holes. The ventilation holes can allow air to flow more smoothly, reducing sound distortion caused by air pressure.

[0076] In some embodiments, the material of the speaker bracket 122 is not limited and can be any one or a combination of polymers, rubbers, composites, etc.

[0077] In some embodiments, the material of the speaker bracket 122 can be carbon fiber material. Carbon fiber material is extremely light in weight but extremely high in strength, providing excellent vibration damping performance.

[0078] In some embodiments, the speaker bracket 122 can connect the tweeter 121 and the woofer. For example, the woofer and the tweeter 121 are arranged on one side of the speaker bracket 122 close to the ceiling, and the tweeter 121 is connected to the speaker bracket 122 and embedded in the woofer.

[0079] The connection mode of the exemplary tweeter 121 and the speaker bracket 122 can include any one or a combination of fixed connections such as welding and bonding, and detachable connections such as screw connection and buckle connection.

[0080] In some embodiments of the present specification, the tweeter 121 can provide clear and delicate sound quality, helping the sound box to achieve wide sound field coverage and uniform sound distribution; the woofer can provide deep and full bass effect, enhancing the impact of music and sound. The woofer cooperates with the tweeter 121 to achieve a wider frequency response, making the sound quality output by the ceiling sound box more rich and balanced.

[0081] In some embodiments of the present specification, the loudspeaker assembly 1 can achieve full-band sound restoration by adopting a double-unit structure, and optimize the frequency response for audio scenes to meet the audio playback requirements in different scenes and improve the overall auditory experience.

[0082] In some embodiments, the circuit mainboard 21 includes a frequency dividing circuit 213. The frequency dividing circuit 213 refers to an electronic circuit that makes the frequency of the output signal an integer fraction of the frequency of the input signal. In some embodiments, the frequency dividing circuit 213 can be implemented by various feasible frequency dividers such as sine frequency dividers, pulse frequency dividers, etc.

[0083] Referring to Figure 2 , the frequency dividing circuit 213 can be arranged between the power amplifier 212 and the loudspeaker assembly 1, and the loudspeaker assembly 1 is connected to the circuit board 2 through the frequency dividing circuit 213. In some embodiments, the output end of the power amplifier 212 is connected to the input end of the frequency dividing circuit 213; the output end of the frequency dividing circuit 213 is connected to the loudspeaker assembly 1.

[0084] In some embodiments, the output end of the frequency dividing circuit 213 includes a bass channel and a treble channel. The bass channel can be connected to the low-frequency unit 11 of the loudspeaker assembly 1, and the bass channel can pass low-frequency signals and block high-frequency signals. The treble channel can be connected to the high-frequency unit 12 of the loudspeaker assembly 1, and the treble channel can pass high-frequency signals and block low-frequency signals. The loudspeaker assembly 1 can emit sound after receiving the audio signal after frequency division by the frequency dividing circuit 213.

[0085] In some embodiments of the present specification, by configuring the frequency dividing circuit 213 and the high and low frequencies of the loudspeaker assembly 1, the mixing effect of high and low frequencies can be obtained to achieve better sound quality performance and provide high-fidelity sound quality.

[0086] In some embodiments, the circuit mainboard 21 can include a USB interface 214, a network interface 215, and a controller 216.

[0087] The USB interface 214 is an interface in the circuit mainboard 21 that connects external devices. The external device refers to a device that performs data transmission and / or firmware upgrade on the ceiling sound box. Exemplary external devices can include computers, mobile devices, and the like.

[0088] The network cable interface 215 is an interface for connecting an Ethernet cable in the circuit mainboard 21. In some embodiments, the network cable interface 215 can support the PoE+ power supply standard. An exemplary network cable interface 215 can be an RJ-45 interface.

[0089] The controller 216 is a control element for managing the amplification and output of the audio signal. For example, the controller 216 can implement functions such as ceiling speaker volume control, sound effect adjustment, etc. by managing the amplification and output of the audio signal.

[0090] An exemplary controller 216 can include an analog controller, a digital signal processor, etc. The controller 216 is installed on the circuit mainboard 21.

[0091] Referring to Figure 2 , the USB interface 214 and the network cable interface 215 are respectively connected with the master control module 211, the network cable interface 215 is connected with the controller 216, and the controller 216 is connected with the power amplifier 212.

[0092] In some embodiments of the present specification, data transmission or firmware upgrade of the ceiling speaker is performed through the USB interface 214, which facilitates the initial setting and maintenance of the ceiling speaker; network power supply and audio signal transmission are realized through the network cable interface 215, which supports the PoE / PoE++ standard, so that the ceiling speaker can be directly powered and transmit audio signals through the network cable, without the need for an additional power cable, simplifying the installation process; the network cable interface 215 is connected with the controller 216, which can realize the management and processing of the audio signal through the controller 216; the controller 216 is connected with the power amplifier 212, which can ensure that the audio signal is properly adjusted before amplification to adapt to different auditory environments and user preferences.

[0093] In some embodiments, the circuit mainboard 21 can further include an audio decoder 217.

[0094] The audio decoder 217 is a device for decoding and converting read digital audio information into an analog audio signal output. An exemplary audio decoder 217 can be a pure audio decoder, a video and audio decoder, etc. Referring to Figure 2 , the master control module 211 can be connected with the power amplifier 212 through the audio decoder 217.

[0095] In some embodiments of the present specification, the master control module 211 and the power amplifier 212 are connected through the audio decoder 217, which can ensure that the digital audio signal can be correctly converted to provide high-quality analog signals for subsequent audio amplification and output.

[0096] In some embodiments, the circuit mainboard 21 can include an audio output interface 218.

[0097] The audio output interface 218 is an interface that can be connected to other ceiling speakers. Referring to Figure 2 The audio output interface 218 can be connected to the output end of the power amplifier 212.

[0098] In some embodiments of the present specification, the ceiling speaker can be connected to other speaker devices to form a playback system through the audio output interface 218.

[0099] In some embodiments, the ceiling speaker can further include a protective cover 4. Referring to Figure 1 The protective cover 4 can cover the end of the loudspeaker assembly 1 away from the ceiling.

[0100] The protective cover 4 is a cover-shaped structure for dust prevention and protection. The protective cover 4 can be made of metal or plastic material. In some embodiments, the protective cover 4 can be a mesh cover that allows sound to pass through while preventing impurities from entering the ceiling speaker. The size of the protective cover 4 is adapted to the size of the loudspeaker support 122 in the loudspeaker assembly 1 to completely cover the loudspeaker assembly 1. In some embodiments, the protective cover 4 can be fixedly connected to the loudspeaker assembly 1 by a buckle mechanism or screws.

[0101] In some embodiments of the present specification, the protective cover 4 can effectively prevent dust and impurities from entering the interior of the ceiling speaker and avoid damaging the loudspeaker assembly 1.

[0102] In some embodiments, the connecting structure 3 can include a mounting bracket 31 and a safety lock 32.

[0103] Referring to Figure 1 The mounting bracket 31 is a hollow box-shaped structure, and the mounting bracket 31 can accommodate the loudspeaker assembly 1 and the circuit board 2 of the ceiling speaker. The end of the mounting bracket 31 away from the ceiling is provided with a protruding structure 311, and the protruding structure 311 is close to the ceiling. The protruding structure 311 extends from the end of the mounting bracket 31 away from the ceiling to the outside of the mounting bracket parallel to the ceiling. Referring to Figure 1 The protruding structure 311 can be round, or any other feasible shape.

[0104] The safety lock 32 is a component for clamping the ceiling speaker in the ceiling. The safety lock 32 is connected to the side of the mounting bracket 31. The number of safety locks 32 can be determined according to actual conditions. Referring to Figure 2When the mounting frame 31 is a five-surface box-shaped structure, the number of safety buckles 32 can be four, and each side surface of the mounting frame 31 is provided with a safety buckle 32. The safety buckle 32 can be installed on the side surface of the mounting frame 31 by means of a screw or the like. When the ceiling speaker is installed on the ceiling, the convex structure 311 of the connecting structure 3 is close to the lower side of the ceiling, and the mounting frame 31 is deep into the upper side of the ceiling. By rotating the screw connecting the safety buckle 32 and the mounting frame 31, the safety buckle 32 can be lowered to be close to the upper side of the ceiling, so as to fix the ceiling speaker on the ceiling.

[0105] According to some embodiments of the present application, the mounting frame 31 and the safety buckle 32 can reinforce the connection between the ceiling speaker and the ceiling, and improve the safety of the ceiling speaker installation.

[0106] The above description has described the basic concept. Obviously, for those skilled in the art, the above detailed disclosure is only used as an example, and does not limit the present application. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present application. Such modifications, improvements and corrections are suggested in the present application, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present application.

[0107] At the same time, specific words are used in the present application to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" means that a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "one embodiment" or "one alternative embodiment" mentioned in different places in the present application does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be properly combined.

[0108] In addition, unless the claim explicitly states otherwise, the order of the processing elements and sequences described in the present application, the use of numerals and letters, or the use of other names, is not intended to limit the order of the processes and methods of the present application. Although some currently considered useful embodiments of the application are discussed in the above disclosure through various examples, it should be understood that such details are only for the purpose of illustration, and the additional claims are not limited to the disclosed embodiments, on the contrary, the claims are intended to cover all modifications and equivalent combinations that meet the spirit and scope of the embodiments of the present application. For example, although the system components described above can be realized by hardware devices, they can also be realized by software solutions, such as installing the described system on existing servers or mobile devices.

[0109] For simplicity and to facilitate understanding of one or more embodiments, a description of an embodiment sometimes refers to a plurality of features in a single embodiment, drawing, or description of an embodiment. However, this method of disclosure is not to be interpreted as meaning that the claimed embodiment requires more features than are explicitly recited in the claims. In fact, claims that do not specifically claim a combination of features are intended to cover the various possible combinations of features as would be understood by a person of ordinary skill in the art.

[0110] In some embodiments, numbers that describe amounts, quantities, or dimensions are used. It should be understood that the numerical values described in this disclosure for embodiments are, in some examples, modified by the term "about". Unless otherwise stated, "about" indicates that the described value permits a variation of ±20%. Accordingly, numerical parameters such as those included in the exemplary embodiments herein have a practical purpose to establish the outer limits to a range of values that a particular characteristic can assume. Numerical parameters are thus provided to establish a boundary for a range of values that a particular characteristic can assume. Numerical parameters are therefore provided to establish a boundary for a range of values that a particular characteristic can assume. In some embodiments, numerical values used in the specification and claims are approximations that can vary depending on the requirements of the particular embodiment. In some embodiments, numerical values should be considered in the context of the description of the embodiment in which they are used. In some embodiments, numerical values should be considered to have a specified number of significant figures and to be rounded accordingly. Although the numerical ranges and parameters setting forth the broadest scope of the embodiments described herein are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values set forth in the specific examples are provided to be as precise as practicable.

[0111] Every patent, patent application, publication, document, article, book, specification, and other material cited in this specification is hereby incorporated by reference in its entirety for all purposes. Documents, articles, books, specifications, and other materials cited in this specification are hereby incorporated by reference in their entirety for all purposes. Documents, articles, books, specifications, and other materials cited in this specification are hereby incorporated by reference in their entirety for all purposes. To the extent the material incorporated by reference contradicts or contradicts the present specification, including definitions that are not consistent with those contained in the present specification, including by not limited to a definition provided in the present specification and / or by not limited to a definition in this incorporated by reference material, the present specification controls.

[0112] Finally, it should be understood that the embodiments described herein are merely exemplary of the principles of the embodiments described herein. Other variations having essentially the same structure and function but different values for parameters can also be within the scope of the embodiments described herein. Accordingly, the embodiments described herein are not to be considered as limited to the embodiments specifically set forth and any combinations of the features set forth are contemplated as within the scope of the embodiments described herein.

Claims

1. A ceiling speaker, characterized in that, The application relates to a ceiling-mounted sound box, which comprises a horn assembly, a circuit board and a connecting structure; the circuit board comprises a circuit mainboard and a power module, the circuit mainboard is provided with a master control module and a power amplifier which are connected with each other, the power module is integrated with a high-voltage energy storage module at one end close to a ceiling; the circuit board is connected with one end of the horn assembly close to the ceiling; and the circuit board and the horn assembly are fixed on the ceiling through the connecting structure.

2. The ceiling speaker of claim 1, wherein, The high-voltage energy storage module adopts an electrolytic capacitor group.

3. The ceiling speaker of claim 1, wherein, The horn assembly is a double-unit structure, which comprises a low-frequency unit and a high-frequency unit.

4. The ceiling speaker of claim 3, wherein, The low-frequency unit comprises a bass horn, and the high-frequency unit comprises a treble horn and a horn support; the treble horn is fixed on the horn support; the caliber of the bass horn is larger than that of the treble horn, and the treble horn is embedded in the bass horn through the horn support.

5. The ceiling speaker of claim 3, wherein, The circuit mainboard comprises a frequency division circuit; the frequency division circuit is arranged between the power amplifier and the horn assembly, and the horn assembly is connected with the circuit board through the frequency division circuit.

6. The ceiling speaker of claim 1, wherein, The circuit mainboard comprises a USB interface, a network cable interface and a controller; the USB interface is connected with external equipment, and the network cable interface is connected with an Ethernet cable; the USB interface and the network cable interface are connected with the master control module, the network cable interface is connected with the controller, and the controller is installed in the circuit mainboard.

7. The ceiling speaker of claim 1, wherein, The circuit mainboard comprises an audio decoder, and the master control module is connected with the power amplifier through the audio decoder. 8.The ceiling speaker of claim 1, wherein, The circuit mainboard comprises an audio output interface, and the audio output interface is connected with the output end of the power amplifier.

9. The ceiling speaker of claim 1, wherein, The ceiling-mounted sound box comprises a protective cover which covers one end of the horn assembly away from the ceiling.

10. The ceiling speaker of claim 1, wherein, The connecting structure comprises a mounting frame and a safety lock buckle; the mounting frame is a hollow box-shaped structure, one end of the mounting frame away from the ceiling is provided with a convex structure which is close to the ceiling, and the safety lock buckle is connected to the side surface of the mounting frame.

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