High-order precision multilayer flexible circuit board
By setting a hollow structure and secondary board group in a specific bending area of the flexible circuit board, the problem of poor bending performance caused by the increased rigidity of the multilayer flexible circuit board is solved, and better bending performance and ease of use are achieved.
Patent Information
- Application Number
- CN202520133752.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-01-21
AI Technical Summary
As existing flexible circuit boards become multilayered and integrate more electronic components, their rigidity increases, leading to poorer bending performance and affecting the testing, assembly, and use of electronic products.
A hollow structure is set in a specific bending area of the flexible circuit board, and a secondary board group is set on the adjacent main board. An asymmetrical hollow area design is adopted, combined with a protective layer to improve flexibility and reduce rigidity.
By using a hollow structure and secondary board design, the bending performance of the flexible circuit board is improved, the overall thickness and friction after bending are reduced, and the ease of use of electronic products is enhanced.
Smart Images
Figure CN223809954U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of circuit board, concretely relates to a high order precision multilayer flexible circuit board. BACKGROUND
[0002] Flexible Printed Circuit (FPC) is a kind of flexible printed circuit board with high reliability and excellent flexibility, which is made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness and good bending performance. Flexible circuit board is widely used in products such as batteries and mobile phones. With the progress of science and technology, flexible circuit board develops towards more layers and more integrated electronic components. However, due to the increase of thickness and the increase of integrated electronic components, the hardness also increases, and the bending performance also decreases, which brings great inconvenience to the testing, assembly and bending use of electronic products. SUMMARY
[0003] Therefore, the purpose of the utility model is to provide a high order precision multilayer flexible circuit board to solve the problems in the background art.
[0004] A high order precision multilayer flexible circuit board, comprising a main board group and a secondary board group, the secondary board group is arranged on the outer side of the main board group; The high order precision multilayer flexible circuit board is provided with a specific bending area, and the secondary board group is arranged on the specific bending area; The main board group comprises a first main board and a second main board and a third main board arranged on both sides of the first main board, and the secondary board group comprises a first secondary board, a second secondary board and a third secondary board, the second main board is provided with a first hollow area in the specific bending area, the first secondary board is arranged on the outer surface of the second main board, and the two ends of the first secondary board are respectively connected to the two sides of the first hollow area of the first main board; The three main boards are provided with a second hollow area and a third hollow area, and the second secondary board and the third secondary board are respectively connected to the third main boards on both sides of the second hollow area and the third hollow area.
[0005] Further, a connecting part is arranged between the bottom of the second hollow area and the third hollow area, and the center line of the connecting part coincides with the center line of the first hollow area.
[0006] Further, the length of the third hollow area is greater than that of the second hollow area, and the center line of the second hollow area and the center line of the third hollow area are asymmetrically arranged along the center line of the first hollow area.
[0007] Further, the distance between the center line of the second hollow area and the center line of the first hollow area is smaller than the distance between the center line of the third hollow area and the center line of the second hollow area.
[0008] Furthermore, a protective layer is provided on the outer surface of the second motherboard and the third motherboard, and the protective layer is located in the area outside the first hollow area, the second hollow area and the third hollow area.
[0009] Furthermore, the second plate and the third plate are integrally connected, and the bottom middle part of the connected plate is connected to the connecting part.
[0010] In summary, this invention improves flexibility and reduces the hardness of the board in a specific bending area by setting a hollow structure between adjacent main boards. The secondary board assembly on the outermost side compensates for the hollow area of the main board, reducing the impact of the removed portion of the hollow structure on the overall circuit wiring and current. By setting asymmetrical second and third hollow areas, the protruding parts of the secondary boards can be staggered after bending, which can reduce the bending radius and overall thickness after bending to a certain extent, and also avoid friction on the board surface to some extent. This invention is highly practical and has significant potential for widespread application. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the structure of a first embodiment of a high-precision multilayer flexible circuit board proposed in this utility model.
[0012] Figure 2 for Figure 1 A cross-sectional view of the circuit board in a bent state;
[0013] Figure 3 This is a schematic diagram of the structure of a second embodiment of a high-precision multilayer flexible circuit board proposed in this utility model;
[0014] Figure 4 for Figure 3 A cross-sectional diagram of the bent state. Detailed Implementation
[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.
[0016] like Figure 1 and Figure 2 As shown, this utility model provides a high-precision multilayer flexible circuit board, which includes a main board assembly 10 and a secondary board assembly 20, wherein the secondary board assembly 20 is disposed outside the main board assembly 10. The high-precision multilayer flexible circuit board has a specific bending region a, and the secondary board assembly 20 is disposed on the specific bending region a.
[0017] The main plate group 10 comprises several layers of main plates, and the secondary plate group 20 comprises a first secondary plate 21, a second secondary plate 22 and a third secondary plate 23. The upper and lower main plates of the middle main plate of the specific bending area a are provided with hollow structures, so that there is a bending space between the adjacent two main plates, and the softness of the specific bending area a is better, which is more conducive to bending operation. In this embodiment, the main plate group 10 comprises a first main plate 11 and a second main plate 12 and a third main plate 13 arranged on both sides of the first main plate 11. The second main plate 12 is provided with a first hollow area 121 at the specific bending area a. The first secondary plate 21 is arranged on the outer surface of the second main plate 12, and the two ends of the first secondary plate 21 are respectively connected to the two sides of the first hollow area 121 of the first main plate 11.
[0018] The third main plate 13 is provided with a second hollow area 131 and a third hollow area 132, and a connecting part 133 is arranged between the second hollow area 131 and the third hollow area 132. In this embodiment, the length of the third hollow area 132 is greater than that of the second hollow area 131, and the center line of the second hollow area 131 and the center line of the third hollow area 132 are asymmetrically arranged along the center line of the first hollow area 121. The distance between the center line of the second hollow area 131 and the center line of the first hollow area 121 is smaller than the distance between the center line of the third hollow area 132 and the center line of the second hollow area 131.
[0019] The second secondary plate 22 and the third secondary plate 23 are respectively connected to the third main plate 13 on both sides of the second hollow area 131 and the third hollow area 132. In this embodiment, the second secondary plate 22 on the second hollow area 131 is shorter than the third secondary plate 23 on the third hollow area 132. When bending is needed, the softness of the plate body is improved due to the spacing between the main plate and the secondary plate, which is more conducive to bending. In addition, when reverse bending is needed, the third main plate 13 is bent on one side, and the center line of the first hollow area 121 is used as the bending line. After bending, the first main plate 11 and the first secondary plate 21 have a hollow area as a buffer point. After being pressed, the second secondary plate 22 and the third secondary plate 23 partially protrude inwardly and arch due to the hollow structure of the inner first main plate 11. The asymmetric structure design of different lengths of the two makes the center lines of the two offset, and the highest protruding parts of the two also offset, so that the space occupied by the two after bending is smaller, and the inner plate surface is avoided from being in contact.
[0020] In addition, the outer surfaces of the second main plate 12 and the third main plate 13 are further provided with a protective layer, which is located on the area outside the first hollow area 121, the second hollow area 131 and the third hollow area 132.
[0021] As Figure 3 With Figure 4As shown, it is the second embodiment of the utility model, the structure of this embodiment is basically same with the first embodiment, the difference is that, the second plate and the third plate of this embodiment are integrally connected, the second plate and the third plate of integrally connecting in this embodiment, make the overall thickness of the connecting part position increase, compared with the first embodiment, the bending effect of the first embodiment will be better than this embodiment.
[0022] In conclusion, the utility model discloses hollow structure is arranged in the adjacent main plate of specific bending area a, improves softness, and the hardness of the area plate body is reduced.Secondary plate group 20 is set up in the outermost side, and the hollow area of main plate is compensated, and the influence of the part of hollow structure removal can be reduced to overall wiring and current size;Second hollow area and third hollow area of left and right asymmetric type are set up, so that the part of secondary plate convex after bending can be distributed in error, can reduce bending curvature and overall thickness after bending to some extent, and can avoid the stress friction of the plate face to some extent.The utility model has strong practicality, and has strong popularization significance.
[0023] The above-mentioned embodiments only express two kinds of implementation manners of the utility model, and the description is more specific and detailed, but it can not be understood as the limitation of the patent range of the utility model.There should be noted that for the ordinary skilled person in the art, on the premise of not departing from the concept of the utility model, a number of deformation and improvement can be made, which all belong to the protection scope of the utility model.Therefore, the protection scope of the utility model patent should be the appended claims.
Claims
1. A high order precision multilayer flexible circuit board, characterized by: The high-precision multi-layer flexible circuit board comprises a main plate group and a secondary plate group, the secondary plate group is arranged outside the main plate group, a specific bending area is arranged on the high-precision multi-layer flexible circuit board, the secondary plate group is arranged on the specific bending area, the main plate group comprises a first main plate and second and third main plates arranged on both sides of the first main plate, the secondary plate group comprises first, second and third secondary plates, the second main plate is provided with a first hollow area at the specific bending area, the first secondary plate is arranged on the outer surface of the second main plate, and both ends of the first secondary plate are connected to both sides of the first hollow area of the first main plate, the third main plate is provided with a second hollow area and a third hollow area, and the second and third secondary plates are connected to the third main plate on both sides of the second and third hollow areas.
2. The high-level precision multilayer flexible circuit board of claim 1, wherein: A connecting part is arranged at the bottom between the second and third hollow areas, and the center line of the connecting part coincides with the center line of the first hollow area.
3. The high-precision multilayer flexible circuit board as described in claim 1, characterized in that: The length of the third hollow area is greater than that of the second hollow area, and the center line of the second hollow area and the center line of the third hollow area are asymmetrically arranged along the center line of the first hollow area.
4. The high-level precision multilayer flexible circuit board of claim 3, wherein: The distance between the center line of the second hollow area and the center line of the first hollow area is smaller than the distance between the center line of the third hollow area and the center line of the second hollow area.
5. The high-precision multilayer flexible circuit board as described in claim 1, characterized in that: A protective layer is further arranged on the outer surface of the second and third main plates, and the protective layer is arranged on the area outside the first, second and third hollow areas.
6. The high-level precision multilayer flexible circuit board of claim 2, wherein: The second and third secondary plates are integrally connected, and the bottom middle part of the connected second and third secondary plates is connected to the connecting part.