Six-layer rigid-flex board

Abstract

The utility model discloses a six-layer rigid-flex board, which relates to the field of circuit boards and comprises a first copper layer, a first base material layer, a second copper layer, a second base material layer, a third copper layer, a fourth copper layer, a third base material layer, a fifth copper layer, a fourth base material layer and a sixth copper layer. The first base material layer, the second base material layer, the third base material layer and the fourth base material layer are laminated and fixed together through the first bonding layer, the second bonding layer and the third bonding layer to form the six-layer rigid-flex board, sufficient wiring space is ensured, the six-layer rigid-flex board has double excellent characteristics of an FPC and a PCB, the six-layer rigid-flex board can be folded and bent, the space is reduced, complex components can be welded, and the cost is reduced. And meanwhile, compared with a flat cable, the cable has longer service life and more reliable stability, is not easy to break, oxidize and fall off, and can greatly improve the performance of a product.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, especially a six layer rigid-flex board. BACKGROUND

[0002] The basic feature of flexible electronics is to integrate various electronic components on a flexible substrate, thereby forming a skin-like flexible circuit board, which has high flexibility and elasticity like skin. Traditional PCBs do not have flexibility and cannot well adhere to the surface of the measured object, nor can they deform with the measured object, so their application range is limited.

[0003] FPC can be freely bent, curled, and folded, can be arbitrarily arranged, and can move in three-dimensional space and scale according to space layout requirements, realizing the integration of component assembly and wiring, and having high flexibility; FPC can change shape in three dimensions according to product structure space, improve wiring density, reduce weight, volume, and connector use, and significantly improve economic benefits and mass volume-to-volume manufacturing capacity; FPC has good mechanical, chemical, and electronic properties, can withstand high temperature and humidity, acid and alkali mist environment, and high flame resistance, improving the reliability, reliability, and adaptability of the whole machine; FPC has the advantages of high systematization and integration, which can improve the fault tolerance, and is easy and convenient to maintain.

[0004] With the light, thin, short, small, intelligent, and multi-functional requirements of products in the field of circuit boards, single PCB or FPC cannot meet the requirements, and although the "hard board + soft board + connector" mode can solve the three-dimensional assembly of the circuit, the space saving type, electrical reliability, and signal integrity are not good due to the existence of the connector, so the soft and hard combination board RFPC with the rigidity of the hard board and the bending performance of the soft board emerges as the times require. SUMMARY

[0005] The utility model aims at overcoming the defects of prior art, and provides a six layer rigid-flex board which is light and thin and has high assembly flexibility.

[0006] In order to achieve the above purpose, the solution of the utility model is as follows:

[0007] A six layer rigid-flex board, comprising a first copper layer, a first substrate layer, a second copper layer, a second substrate layer, a third copper layer, a fourth copper layer, a third substrate layer, a fifth copper layer, a fourth substrate layer, and a sixth copper layer, the first substrate layer, the second substrate layer, the third substrate layer, and the fourth substrate layer are arranged in order from top to bottom, the first copper layer is arranged on the upper surface of the first substrate layer, the second copper layer and the third copper layer are arranged on the upper surface and the lower surface of the second substrate layer, the fourth copper layer and the fifth copper layer are arranged on the upper surface and the lower surface of the third substrate layer, the sixth copper layer is arranged on the lower surface of the fourth substrate layer, the upper surface of the first copper layer is provided with a first anti-soldering layer, and the lower surface of the sixth copper layer is provided with a second anti-soldering layer.

[0008] The lower surface of the first substrate layer and the upper surface of the second copper layer are provided with a first adhesive layer, the lower surface of the third copper layer and the upper surface of the fourth copper layer are provided with a second adhesive layer, and the lower surface of the fifth copper layer and the upper surface of the fourth substrate layer are provided with a third adhesive layer.

[0009] The first copper layer and the second copper layer are provided with a first blind hole, the fifth copper layer and the sixth copper layer are provided with a second blind hole, the second copper layer and the fifth copper layer are provided with a buried hole, and the first copper layer and the sixth copper layer are provided with a through hole.

[0010] Further, the first substrate layer and the fourth substrate layer are hard boards, and the second substrate layer and the third substrate layer are soft boards.

[0011] Further, the third copper layer and one side of the second substrate layer extend out of the corresponding side surfaces of the first substrate layer and the third substrate layer, and the fourth copper layer and one side of the third substrate layer extend out of the corresponding side surfaces of the second substrate layer and the fourth substrate layer.

[0012] Further, the upper surface of the first substrate layer is provided with a first nickel plating layer, and the lower surface of the fourth substrate layer is provided with a second nickel plating layer.

[0013] Further, the lower surface of the third copper layer and the upper surface of the second adhesive layer are provided with a first cover film layer, and the lower surface of the second adhesive layer and the upper surface of the fourth copper layer are provided with a second cover film layer.

[0014] After the above structure is adopted, the first copper layer, the first substrate layer, the second copper layer, the second substrate layer, the third copper layer, the fourth copper layer, the third substrate layer, the fifth copper layer, the fourth substrate layer and the sixth copper layer are arranged, the first substrate layer, the second substrate layer, the third substrate layer and the fourth substrate layer are laminated and fixed together through the first adhesive layer, the second adhesive layer and the third adhesive layer to form a six-layer hard-soft combination board, the wiring space is ensured to be sufficient, the double excellent characteristics of the FPC and the PCB are simultaneously possessed, the hard-soft combination board can be folded and bent to reduce the space, complex components can be welded, the service life is longer than that of the flat cable, the stability is more reliable, the hard-soft combination board is not easy to be broken and oxidized and separated, and the performance of the product can be greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a schematic diagram of the layer structure of the utility model.

[0016] Explanation of reference signs: 1, first copper layer; 2, first substrate layer; 3, first adhesive layer; 4, second copper layer; 5, second substrate layer; 6, third copper layer; 7, second adhesive layer; 8, fourth copper layer; 9, third substrate layer; 10, fifth copper layer; 11, third adhesive layer; 12, fourth substrate layer; 13, sixth copper layer; 14, first blind hole; 15, second blind hole; 16, buried hole; 17, through hole; 18, first anti-soldering layer; 19, second anti-soldering layer; 20, first cover film layer; 21, second cover film layer; 22, first nickel plating layer; 23, second nickel plating layer; 24, flexible circuit connecting piece. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the utility model more clear, the technical scheme of the utility model will be described in detail below.

[0018] In the description of the utility model, it is understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0019] As shown in Figure 1 The utility model discloses a six layer rigid-flex board, which comprises a first copper layer 1, a first substrate layer 2, a second copper layer 4, a second substrate layer 5, a third copper layer 6, a fourth copper layer 8, a third substrate layer 9, a fifth copper layer 10, a fourth substrate layer 12 and a sixth copper layer 13. The first substrate layer 2, the second substrate layer 5, the third substrate layer 9 and the fourth substrate layer 12 are sequentially arranged from top to bottom, the first copper layer 1 is arranged on the upper surface of the first substrate layer 2, the second copper layer 4 and the third copper layer 6 are arranged on the upper surface and the lower surface of the second substrate layer 5, the fourth copper layer 8 and the fifth copper layer 10 are arranged on the upper surface and the lower surface of the third substrate layer 9, the sixth copper layer 13 is arranged on the lower surface of the fourth substrate layer 12, the upper surface of the first copper layer 1 is provided with a first anti-soldering layer 18, and the lower surface of the sixth copper layer 13 is provided with a second anti-soldering layer 19.

[0020] The first substrate layer 2 and the fourth substrate layer 12 are hard boards, the second substrate layer 5 and the third substrate layer 9 are soft boards, the lower surface of the first substrate layer 2 and the upper surface of the second copper layer 4 are provided with the first adhesive layer 3, the lower surface of the third copper layer 6 and the upper surface of the fourth copper layer 8 are provided with the second adhesive layer 7, and the lower surface of the fifth copper layer 10 and the upper surface of the fourth substrate layer 12 are provided with the third adhesive layer 11. The first substrate layer 2, the second substrate layer 5, the third substrate layer 9 and the fourth substrate layer 12 are laminated and fixed together through the first adhesive layer 3, the second adhesive layer 7 and the third adhesive layer 11 to form a six-layer soft and hard combination board.

[0021] The first blind hole 14 is arranged between the first copper layer 1 and the second copper layer 4, the second blind hole 15 is arranged between the fifth copper layer 10 and the sixth copper layer 13, the buried hole 16 is arranged between the second copper layer 4 and the fifth copper layer 10, and the through hole 17 is arranged between the first copper layer 1 and the sixth copper layer 13, so that the conductive connection between the layers is realized, and the wiring density is improved.

[0022] The third copper layer 6 and the second substrate layer 5 extend on one side of the first substrate layer 2 and the third substrate layer 9, and the fourth copper layer 8 and the third substrate layer 9 extend on one side of the second substrate layer 5 and the fourth substrate layer 12. Specifically, the third copper layer 6, the second substrate layer 5, the fourth copper layer 8 and the third substrate layer 9 are arranged in opposite directions, respectively, and two flexible line connecting pieces 24 are formed.

[0023] The upper surface of the first substrate layer 2 is provided with the first nickel plating layer 22, and the lower surface of the fourth substrate layer 12 is provided with the second nickel plating layer 23. The nickel gold is plated on the surfaces of the first substrate layer 2 and the fourth substrate layer 12, so that the solderability and electrical performance of the first substrate layer 2 and the fourth substrate layer 12 are ensured.

[0024] The lower surface of the third copper layer 6 and the upper surface of the second adhesive layer 7 are provided with the first cover film layer 20, and the lower surface of the second adhesive layer 7 and the upper surface of the fourth copper layer 8 are provided with the second cover film layer 21. An insulating protective layer is formed on the surface of the flexible line connecting piece 24 to protect the line, avoid the influence of the external environment, avoid the oxidation of the copper foil, and play a role of solder mask insulation.

[0025] The six-layer soft and hard combination board can be applied in bionic robot cameras, OLED display screens, mobile phones, cameras, tablet computers and many other fields.

[0026] The principle and implementation mode of the utility model are described in the specification by applying specific examples, and the above examples are only used to help understand the method and core idea of the utility model; meanwhile, according to the idea of the utility model, the specific implementation mode and application range will be changed by the general technical personnel in the field. In conclusion, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. A six-layer rigid-flex printed circuit board, characterized by: The first copper layer, the first substrate layer, the second copper layer, the second substrate layer, the third copper layer, the fourth copper layer, the third substrate layer, the fifth copper layer, the fourth substrate layer and the sixth copper layer are sequentially arranged from top to bottom, the first copper layer is arranged on the upper surface of the first substrate layer, the second copper layer and the third copper layer are arranged on the upper surface and the lower surface of the second substrate layer, the fourth copper layer and the fifth copper layer are arranged on the upper surface and the lower surface of the third substrate layer, the sixth copper layer is arranged on the lower surface of the fourth substrate layer, the upper surface of the first copper layer is provided with a first anti-welding layer, and the lower surface of the sixth copper layer is provided with a second anti-welding layer. The lower surface of the first substrate layer and the upper surface of the second copper layer are provided with a first adhesive layer, the lower surface of the third copper layer and the upper surface of the fourth copper layer are provided with a second adhesive layer, and the lower surface of the fifth copper layer and the upper surface of the fourth substrate layer are provided with a third adhesive layer. The first blind hole is arranged between the first copper layer and the second copper layer, the second blind hole is arranged between the fifth copper layer and the sixth copper layer, the buried hole is arranged between the second copper layer and the fifth copper layer, and the through hole is arranged between the first copper layer and the sixth copper layer.

2. The six-layer rigid-flex printed circuit board of claim 1, wherein: The first substrate layer and the fourth substrate layer are hard boards, and the second substrate layer and the third substrate layer are soft boards.

3. The six-layer rigid-flex printed circuit board of claim 2, wherein: The third copper layer and one side of the second substrate layer extend and protrude from the corresponding side surfaces of the first substrate layer and the third substrate layer, and the fourth copper layer and one side of the third substrate layer extend and protrude from the corresponding side surfaces of the second substrate layer and the fourth substrate layer.

4. The six-layer rigid-flex printed circuit board of claim 1, wherein: The upper surface of the first substrate layer is provided with a first nickel plating layer, and the lower surface of the fourth substrate layer is provided with a second nickel plating layer.

5. The six-layer rigid-flex printed circuit board of claim 1, wherein: The lower surface of the third copper layer and the upper surface of the second adhesive layer are provided with a first cover film layer, and the lower surface of the second adhesive layer and the upper surface of the fourth copper layer are provided with a second cover film layer.

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