Heat dissipation structure and electronic equipment
By designing receiving grooves and rounded corner structures on the thermal conductive components, the problems of thermal gel shrinkage and leakage were solved, improving heat dissipation and reducing maintenance costs.
Patent Information
- Application Number
- CN202422186053.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2034-09-05
AI Technical Summary
In existing technologies, thermal conductive gels tend to shrink during use, resulting in a reduced contact area and affecting heat dissipation. Furthermore, when leaks occur, they need to be covered with acetate tape, increasing costs and making maintenance inconvenient.
A receiving groove is designed on the heat-conducting component to accommodate the heat-conducting layer and prevent it from overflowing. The contact area between the heat-conducting layer and the heating element is increased by the bending and rounding design of the heat-conducting component.
It effectively prevents the heat-conducting layer from leaking out, improves heat dissipation capacity, saves on the cost of using acetate tape, and enhances the overall performance of the heat dissipation structure.
Smart Images
Figure CN223810039U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of heat dissipation devices, and in particular, to a heat dissipation structure and an electronic device. BACKGROUND
[0002] With the gradual miniaturization of various electronic devices, the heat dissipation space of the electronic devices is compressed, and the limitation of the heat dissipation space causes an increase in the demand for heat-conducting gel. Due to the characteristics of the heat-conducting gel, after being in contact with air for a period of time, the heat-conducting gel will shrink inward, which may affect the contact area with the heat-generating element, and thus cause poor heat dissipation effect. Therefore, a large compression ratio is needed to avoid the problem of shrinkage of the heat-conducting gel, and thus the problem of leakage of the heat-conducting gel often occurs. The existing solution to the problem of leakage of the heat-conducting gel is to paste acetic acid tape to cover the leaked heat-conducting gel, but this method increases the production cost and is not convenient for maintenance. SUMMARY
[0003] The present disclosure provides a heat dissipation structure and an electronic device to at least solve the above technical problems in the prior art.
[0004] According to a first aspect of the present disclosure, a heat dissipation structure is provided, comprising: a heat-conducting member connected with a heat-generating element, at least one accommodating groove being formed on the heat-conducting member; and a heat-conducting layer located between the heat-conducting member and the heat-generating element, part of the heat-conducting layer being filled in the accommodating groove.
[0005] In an implementable manner, part of the heat-conducting layer is configured to be filled in the accommodating groove under the extrusion of the heat-conducting member and the heat-generating element.
[0006] In an implementable manner, the heat-conducting member comprises opposite first and second faces, the heat-generating element is arranged on the first face, and the second face is configured to be connected with a heat dissipation member, the accommodating groove being formed by bending the first face towards the second face.
[0007] In an implementable manner, the bottom of the accommodating groove is convex relative to the second face.
[0008] In an implementable manner, the heat-conducting member has a fillet at a position where the heat-conducting member transitions to the accommodating groove.
[0009] In an implementable manner, the accommodating groove is located at the edge of the heat-conducting member, and the accommodating groove has opposite first and second side walls, the height of the second side wall being greater than the height of the first side wall.
[0010] In an implementable manner, the radius of the fillet is not less than 0.5 times the thickness of the heat-conducting member.
[0011] In an embodiment, the height of the first sidewall is not less than 2 times the thickness of the heat conducting member, and the height of the second sidewall is not less than 3.5 times the thickness of the heat conducting member.
[0012] In an embodiment, the width of the accommodating groove is not less than 1.5 times the thickness of the heat conducting member.
[0013] According to a second aspect of the present disclosure, an electronic device is provided, comprising a main body, wherein the main body is provided with the heat dissipation structure as described in any one of the above embodiments.
[0014] In the present disclosure, since the accommodating groove is formed on the heat conducting member of the heat dissipation structure, the heat conducting layer can be limited to fill in the accommodating groove, preventing the heat conducting layer from overflowing; and since the contact area between the heat conducting layer and the heat generating element is increased, the heat dissipation capacity of the heat dissipation structure is also improved. Therefore, the heat dissipation structure of the present disclosure not only solves the problem of the heat conducting layer overflowing, but also saves the cost of using acetate cloth and improves the heat dissipation capacity.
[0015] It should be understood that the content described in this section is not intended to identify key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become apparent through the following description. BRIEF DESCRIPTION OF DRAWINGS
[0016] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
[0017] In the drawings, identical or corresponding reference signs refer to identical or corresponding parts.
[0018] Figure 1 Fig. 1 shows a schematic diagram of the overall structure of a heat dissipation structure according to an exemplary embodiment of the present disclosure; Figure 1
[0019] Figure 2 Fig. 2 shows a schematic diagram of the overall structure of a heat dissipation structure according to another exemplary embodiment of the present disclosure; Figure 2
[0020] Figure 3 Fig. 3 shows a schematic diagram of the structure of a heat conducting member of a heat dissipation structure according to an exemplary embodiment of the present disclosure;
[0021] Figure 4 Fig. 4 shows a sectional view of a heat dissipation structure according to an exemplary embodiment of the present disclosure;
[0022] Figure 5 Fig. 5 shows a schematic diagram of the flow direction when the heat conducting layer of a heat dissipation structure according to an exemplary embodiment of the present disclosure is extruded.
[0023] Figure 6 A schematic view of the heat conduction layer of the heat dissipation structure of one example embodiment of the present disclosure after being extruded is shown.
[0024] Explanation of reference numerals in the drawing: 1, heat conduction member; 2, heat conduction layer; 3, heat generating element; 4, heat dissipation member; 5, PCBA circuit board; 10, accommodating groove; 11, first surface; 12, second surface; 13, rounded corner; 101, first side wall; 102, second side wall. DETAILED DESCRIPTION
[0025] In order to make the objectives, characteristics and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present disclosure.
[0026] The embodiments of the present disclosure will be described in detail below with reference to the drawings.
[0027] Referring to Figures 1-6 The heat dissipation structure of one example embodiment of the present disclosure includes a heat conduction member 1 and a heat conduction layer 2. The heat conduction member 1 is connected with a heat generating element 3. At least one accommodating groove 10 is formed on the heat conduction member 1. The heat conduction layer 2 is located between the heat conduction member 1 and the heat generating element 3. Part of the heat conduction layer 2 is filled in the accommodating groove 10,
[0028] In the embodiment, the material of the heat conduction layer 2 can be, but is not limited to, a heat conduction gel, a heat conduction silicone grease, a heat conduction gasket, a heat conduction potting compound, or the like. The main function of the heat conduction member 1 is to improve the heat dissipation efficiency, so as to ensure that the core component can maintain a stable temperature during operation, and prevent failure or damage due to overheating. The heat conduction member 1 is usually made of a material with excellent heat conduction performance, and the commonly used materials include copper, aluminum, nickel, ceramics, and the like. In the embodiments of the present disclosure, the heat conduction layer 2 is made of a heat conduction gel, and the heat conduction member 1 is made of a heat conduction copper plate. The accommodation groove 10 formed on the heat conduction member 1 can be one or more, and the accommodation groove 10 is located at the edge of the heat conduction member 1 to accommodate the heat conduction layer 2 extruded by absorbing the stress, so as to prevent the heat conduction layer 2 from leaking out. It can be understood that the heat dissipation structure can be applied to the fields including, but not limited to, electronic equipment, industrial control computers, medical equipment, aerospace, and solar energy storage and heat accumulation, and the like. The equipment in the above fields has a heating element 3 and needs to have a heat dissipation function. The heating element 3 can be, but is not limited to, a central processing unit, a chip, a resistance wire, or the like. When conducting heat, the temperature of the heating element 3 is first conducted to the heat conduction member 1 through the heat conduction layer 2. The heat is quickly conducted to the heat dissipation member 4 through the heat conduction member 1. On the surface of the heat dissipation member 4, the heat is dissipated into the air by the fan and other heat dissipation equipment, so as to achieve the cooling effect.
[0029] In the embodiment, the accommodation groove 10 is formed on the heat conduction member 1 of the heat dissipation structure. The heat conduction layer 2 can be limited to be filled in the accommodation groove 10, so as to prevent the heat conduction layer 2 from overflowing. In addition, the contact area between the heat conduction layer 2 and the heating element 3 is increased, and the heat dissipation capacity of the heat dissipation structure is also improved. Therefore, the heat dissipation structure of the present disclosure not only solves the problem of the heat conduction layer 2 overflowing, but also saves the cost of using the acetic acid cloth and improves the heat dissipation capacity.
[0030] Reference Figures 4-6 In an embodiment, the heat conduction layer 2 is configured to be filled in the accommodation groove 10 by being extruded by the heat conduction member 1 and the heating element 3.
[0031] In the embodiment, the accommodation groove 10 is formed by bending the heat conduction member 1. After the heat conduction layer 2 is extruded by the heating element 3 and the heat conduction member 1, the heat conduction layer 2 can flow into the accommodation groove 10 by inertia. The heat conduction layer 2 can be prevented from overflowing, and the heat dissipation capacity of the heat dissipation structure is also improved due to the increase of the contact area.
[0032] In an embodiment, the heat conduction member 1 includes opposite first and second faces 11 and 12. The heating element 3 is arranged on the first face 11, and the second face 12 is used to be connected with the heat dissipation member 4. The accommodation groove 10 is formed by bending the first face 11 towards the second face 12.
[0033] Specifically, in an embodiment, the bottom of the accommodation groove 10 protrudes relative to the second face 12.
[0034] In the present embodiment, the heat dissipating member 4 is a heat pipe, which takes full advantage of the heat conduction principle and the rapid heat transfer property of the phase change medium, and rapidly transfers the heat of the heat generating object to the heat source outside through the heat pipe, and its heat conduction capacity exceeds that of any known metal. The accommodating groove 10 is bent from the first face 11 to the second face 12 of the heat conducting member 1, so that the first face 11 of the heat conducting member 1 is inwardly recessed to the second face 12 to accommodate the heat conducting layer 2 after being extruded.
[0035] In an embodiment, the heat conducting member 1 has a rounded corner 13 at the position where it transitions to the accommodating groove 10.
[0036] In the present embodiment, the rounded corner 13 plays a guiding role. The accommodating groove 10 and the rounded corner 13 are formed by bending the heat conducting member 1, so that the heat conducting layer 2 flows into the accommodating groove 10 along the rounded corner 13 after being extruded by the force, i.e. the heat conducting layer 2 flows into the accommodating groove 10 by the rounded corner 13 and inertia, so as to effectively achieve the effect of avoiding the leakage of the heat conducting layer 2.
[0037] In an embodiment, the accommodating groove 10 is located at the edge of the heat conducting member 1, and has opposite first and second side walls 101 and 102, and the height of the second side wall 102 is greater than that of the first side wall 101.
[0038] In the present embodiment, the second side wall 102 is the edge portion of the heat conducting member 1, and the height of the second side wall 102 is designed to be greater than that of the first side wall 101, so as to collect the heat conducting layer 2 in the accommodating groove 10 and prevent it from flowing out.
[0039] Specifically, referring to FIG. 1, Figure 4 In an embodiment, the radius of the rounded corner 13 is not less than 0.5 times the thickness of the heat conducting member 1.
[0040] In an embodiment, the height of the first side wall 101 is not less than 2 times the thickness of the heat conducting member 1, and the height of the second side wall 102 is not less than 3.5 times the thickness of the heat conducting member 1.
[0041] In an embodiment, the width of the accommodating groove 10 is not less than 1.5 times the thickness of the heat conducting member 1.
[0042] In the embodiment, the thickness of the heat conducting member 1 is not limited to a specific size, and therefore the thickness of the heat conducting member 1 is defined as T. In order to ensure that the heat conducting layer 2 can smoothly flow into the accommodating groove 10, the size of the accommodating groove 10 should not be too small, and therefore, through multiple tests, it is obtained that the radius of the rounded corner 13 should be greater than or equal to 0.5T, the height of the first side wall 101 is the distance between the edge of the rounded corner 13 and the second surface 12 at the bottom of the accommodating groove 10, the height of the first side wall 101 should be greater than or equal to 2T, the height of the second side wall 102 is the distance between the edge of the second side wall 102 and the second surface 12 at the bottom of the accommodating groove 10, and the height of the second side wall 102 should be greater than or equal to 3.5T. The width of the accommodating groove 10 is the distance between the first side wall 101 and the second side wall 102, and the width should be greater than or equal to 1.5T. In the embodiment of the present disclosure, the radius of the rounded corner 13 is 0.5T, the height of the first side wall 101 is 2T, the height of the second side wall 102 is 3.5T, and the width of the accommodating groove 10 is 1.5T, and through experiments, it is obtained that the heat dissipation structure of the present disclosure can reduce the temperature of the heat generating element 3 by at least 0.5°.
[0043] The present disclosure also provides an electronic device, which comprises a main body, and the main body is provided with the heat dissipation structure in any one of the above embodiments.
[0044] In the embodiment, the main body is provided with a printed circuit board assembly (PCBA), and the heat generating element 3 is arranged on the PCBA circuit board 5. The temperature of the heat generating element 3 is first conducted to the heat conducting member 1 through the heat conducting layer 2, and the heat is rapidly conducted to the heat dissipation member 4 through the heat conducting member 1. On the surface of the heat dissipation member 4, the heat is dissipated to the air by the fan and other heat dissipation devices, thereby achieving the cooling effect. Since the electronic device comprises the heat dissipation structure, the accommodating groove 10 is formed on the heat conducting member 1 of the heat dissipation structure, the heat conducting layer 2 can be limited and filled in the accommodating groove 10, and the overflow of the heat conducting layer 2 is prevented. In addition, the contact area between the heat conducting layer 2 and the heat generating element 3 is increased, and the heat dissipation capacity of the heat dissipation structure is also improved. Therefore, the heat dissipation structure of the present disclosure not only solves the problem of overflow of the heat conducting layer 2, but also saves the cost of using the acetate cloth and improves the heat dissipation capacity.
[0045] In the description of the present disclosure, it should be understood that the orientation or position relationship indicated by the orientation words is generally based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Without the opposite description, these orientation words do not indicate and imply that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the protection scope of the present disclosure; the orientation words "inner" and "outer" refer to the inner and outer relative to the outline of each component.
[0046] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "rear", "front", "vertical", "horizontal", and derivatives thereof shall relate to the application as it is oriented in the drawing figures. However, it is to be understood that the application can assume various alternative orientations and, accordingly, such terms are not to be taken as limitations of the present application, except where so expressly defined by the patentee. All such terms are to be interpreted in the manner that the terms are construed in the patent to the full extent permitted by applicable law.
[0047] It is also to be understood that the terminology used herein is for the purpose of describing the particular embodiments only and is not intended to be limiting, since the scope of the exemplary embodiments of this disclosure will be limited only by the appended claims.
[0048] Notably, the terms "first", "second", and the like, used in the description and in the claims of the present disclosure herein, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the use of such terms is merely for distinguishing between the elements being described and not necessarily for describing a particular order or chronology between elements. Unless specifically stated otherwise, the term "comprising" encompasses the presence of one or more elements or steps and does not exclude the presence of one or more other elements or steps.
[0049] While the present disclosure has been illustrated by a description of embodiments thereof, it is not the intention of the applicant to restrict or limit the scope of the present disclosure to the precise details disclosed. Rather, various modifications can be made in the embodiments without departing from the scope of the present disclosure, as defined by the appended claims, and their equivalents.
Claims
1. A heat dissipating structure, characterized by comprising: The application relates to a heat dissipation structure. The heat dissipation structure comprises: a heat conduction member (1) connected with a heat generating element (3), wherein at least one accommodating groove (10) is formed on the heat conduction member (1); a heat conduction layer (2) between the heat conduction member (1) and the heat generating element (3), and part of the heat conduction layer (2) is filled in the accommodating groove (10).
2. The heat dissipating structure according to claim 1, wherein Part of the heat conduction layer (2) is arranged to be filled in the accommodating groove (10) by extrusion of the heat conduction member (1) and the heat generating element (3).
3. The heat dissipating structure according to claim 1, wherein The heat conduction member (1) comprises opposite first and second faces (11) and (12), the heat generating element (3) is arranged on the first face (11), the second face (12) is used for being connected with a heat dissipation member (4), and the accommodating groove (10) is formed by bending the first face (11) towards the second face (12).
4. The heat dissipating structure according to claim 3, wherein The bottom of the accommodating groove (10) is convex relative to the second face (12).
5. The heat dissipating structure according to claim 1, wherein The heat conduction member (1) has a round corner (13) at a position where the heat conduction member (1) is connected with the accommodating groove (10).
6. The heat dissipating structure according to claim 1, wherein The accommodating groove (10) is arranged at the edge of the heat conduction member (1), the accommodating groove (10) has opposite first and second side walls (101) and (102), and the height of the second side wall (102) is greater than that of the first side wall (101).
7. The heat dissipating structure according to claim 5, wherein The radius of the round corner (13) is not less than 0.5 times the thickness of the heat conduction member (1).
8. The heat dissipating structure according to claim 6, wherein The height of the first side wall (101) is not less than 2 times the thickness of the heat conduction member (1), and the height of the second side wall (102) is not less than 3.5 times the thickness of the heat conduction member (1).
9. The heat dissipating structure according to claim 1, wherein The width of the accommodating groove (10) is not less than 1.5 times the thickness of the heat conduction member (1).
10. An electronic device comprising a main body, characterized by The main body is provided with the heat dissipation structure as claimed in any one of claims 1-9.