Radiating device and electronic equipment
By employing a planar heat dissipation device in a semiconductor cooler, the Peltier effect of the conductive components is used to form heat dissipation and heat absorption areas in the plane, thus solving the heat dissipation problem of ultra-thin devices caused by sandwich structures and achieving efficient heat transfer and heat dissipation.
Patent Information
- Application Number
- CN202422390695.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The sandwich structure of semiconductor coolers is not conducive to the development of ultra-thin devices and increases the difficulty of heat dissipation in the heat-generating areas of the device.
The heat dissipation device adopts a planar structure. By arranging a first heat-conducting part and a second heat-conducting part at intervals in a first plane, and placing an electrical conductivity component between them, a heat dissipation area and a heat absorption area are formed after the device is energized. Heat transfer is achieved by utilizing the Peltier effect of the electrical conductivity component.
It reduces the overall thickness of the device, improves heat dissipation efficiency, and does not increase hot zone contamination, making it suitable for the heat dissipation needs of ultra-thin devices.
Smart Images
Figure CN223810040U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic devices, and in particular to a heat dissipation device and an electronic device. BACKGROUND
[0002] A semiconductor cooler (TEC, Thermo Electric Cooler) is a cooler made of semiconductor materials using the Peltier effect. The semiconductor cooler is usually a sandwich structure, and when an electric current passes through, the heat generated by the electric current will be transferred from one side of the semiconductor cooler to the other side, resulting in a hot side and a cold side.
[0003] At present, the semiconductor cooler is widely used in optical communication, sensors and other fields to dissipate heat from heat generating devices.
[0004] However, the sandwich structure of the semiconductor cooler not only hinders the development of ultra-thin devices, but also increases the difficulty of dissipating heat from the heat generating area of the whole device. Utility model content
[0005] The first aspect of the present application provides a heat dissipation device, which comprises
[0006] a first heat conduction part, which is arranged on a first plane;
[0007] a second heat conduction part, which is arranged in the first plane and spaced apart from the first heat conduction part;
[0008] an electrically conductive component, which is arranged between the first heat conduction part and the second heat conduction part, and at least part of the structure of the electrically conductive component is connected to the first heat conduction part and the second heat conduction part;
[0009] Wherein, the electrically conductive component is energized to form a heat dissipation area and a heat absorption area in the first heat conduction part and the second heat conduction part, respectively.
[0010] In some modified embodiments of the first aspect of the present application, the heat dissipation device described above, wherein the electrically conductive component comprises a plurality of first conductive particles and a plurality of second conductive particles;
[0011] The plurality of first conductive particles and the plurality of second conductive particles are arranged alternately and connected in series along a first direction;
[0012] The series connection ends of the first conductive particles and the second conductive particles arranged in the first direction are alternately connected to the first heat conduction part and the second heat conduction part;
[0013] The first direction is perpendicular to the direction of the first heat conduction part pointing to the second heat conduction part.
[0014] In some alternative embodiments of the first aspect of the present application, the heat dissipation device as described above, wherein the electrically conductive assembly further comprises a first electrically conductive member and a second electrically conductive member.
[0015] The first electrically conductive member is arranged corresponding to the connecting ends of the first electrically conductive particles and the second electrically conductive particles towards the first thermally conductive part, and the first electrically conductive member connects the first thermally conductive part.
[0016] The second electrically conductive member is arranged corresponding to the connecting ends of the first electrically conductive particles and the second electrically conductive particles towards the second thermally conductive part, and the second electrically conductive member connects the second thermally conductive part.
[0017] In some alternative embodiments of the first aspect of the present application, the heat dissipation device as described above, wherein the first electrically conductive member and / or the second electrically conductive member is in a straight line structure or an arc structure or a bent structure or a wavy line structure.
[0018] In some alternative embodiments of the first aspect of the present application, the heat dissipation device as described above, wherein the first electrically conductive particles are connected to a positive pole of a power supply, the first thermally conductive part overlapped by the connecting ends of the first electrically conductive particles and the second electrically conductive particles arranged in the first direction in sequence forms the heat absorbing region, and the second thermally conductive part overlapped by the connecting ends of the first electrically conductive particles and the second electrically conductive particles arranged in the reverse direction of the first direction forms the heat dissipation region.
[0019] In some alternative embodiments of the first aspect of the present application, the heat dissipation device as described above, wherein the number of the first electrically conductive particles is the same as that of the second electrically conductive particles, and the first electrically conductive particles and the second electrically conductive particles are arranged on a first plane.
[0020] In some alternative embodiments of the first aspect of the present application, the heat dissipation device as described above, further comprising a substrate.
[0021] The first surface of the substrate forms the first plane.
[0022] The first thermally conductive part, the second thermally conductive part and the electrically conductive assembly are attached to the first surface.
[0023] The electrically conductive assembly is made of a semiconductor material.
[0024] In some alternative embodiments of the first aspect of the present application, the heat dissipation device as described above, wherein the first thermally conductive part, the second thermally conductive part and the electrically conductive assembly are all adhered to the first surface.
[0025] The second aspect of the present application provides an electronic device, comprising
[0026] The display screen, the heat dissipation device, the heat generating element and the mainboard are arranged in layers.
[0027] The heat absorbing region of the heat dissipating device is attached to the heat generating element.
[0028] In some alternative embodiments of the second aspect of the present application, the electronic device further comprises a battery.
[0029] The battery is disposed on a side of the heat dissipating device opposite to the display screen and at a position different from the heat generating element.
[0030] The heat dissipating region of the heat dissipating device extends in parallel to the main board towards the battery. BRIEF DESCRIPTION OF DRAWINGS
[0031] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which a number of embodiments of the present application are shown by way of example, and wherein like reference numerals refer to like elements throughout. The embodiments of the present application, however, can be embodied in various forms, all of which are not necessarily shown in the drawings, and are not intended to limit the scope of the present application. Rather, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the present application.
[0032] Figure 1 A structural schematic diagram of the heat dissipating device provided by the present embodiment is schematically shown;
[0033] Figure 2 A structural schematic diagram of the electrically conductive assembly in the heat dissipating device provided by the present embodiment is schematically shown;
[0034] Figure 3 Another structural schematic diagram of the electrically conductive assembly in the heat dissipating device provided by the present embodiment is schematically shown;
[0035] Figure 4 A structural schematic diagram of the electronic device provided by the present embodiment is schematically shown;
[0036] BRIEF DESCRIPTION OF DRAWINGS The first heat conducting portion 1, the second heat conducting portion 2, the electrically conductive assembly 3, the first electrically conductive particles 31, the second electrically conductive particles 32, the first electrically conductive member 33, the second electrically conductive member 34, the substrate 4, the display screen 5, the heat dissipating device 6, the heat generating element 7, the main board 8, the rear shell 9, the battery 10, the first direction a. DETAILED DESCRIPTION
[0037] Exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be accurately conveyed to those skilled in the art.
[0038] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present application shall be the general meanings understood by the skilled in the art to which the present application belongs.
[0039] The technical solution of the embodiments of the present application is to solve the above technical problems, and the general idea is as follows:
[0040] Embodiment 1
[0041] Referring to the drawings Figure 1 The heat dissipation device provided by the embodiments of the present application includes a first heat conduction part 1, a second heat conduction part 2, and an electrically conductive component 3. The first heat conduction part 1 is arranged on a first plane. The second heat conduction part 2 is arranged in the first plane and is spaced apart from the first heat conduction part 1. The electrically conductive component 3 is arranged between the first heat conduction part 1 and the second heat conduction part 2, and at least part of the structure of the electrically conductive component 3 is connected to the first heat conduction part 1 and the second heat conduction part 2. Wherein, the electrically conductive component 3 is energized to form a heat dissipation area and a heat absorption area for the first heat conduction part 1 and the second heat conduction part 2 respectively.
[0042] Specifically, in order to solve the problem that the sandwich structure of the semiconductor refrigerator not only is not conducive to the development of ultra-thin equipment, but also increases the difficulty of heat dissipation of the whole equipment in the heating area, the embodiments provide a planar semiconductor refrigerator. The first heat conduction part 1 and the second heat conduction part 2 are respectively connected to the two ends of the electrically conductive component 3 in the first plane, so that the electrically conductive component 3 can form a heat dissipation area and a heat absorption area for the first heat conduction part 1 and the second heat conduction part 2 after being energized. The heat dissipation device realizes an ultra-thin form, and when applied in an electronic device, it can effectively reduce the overall thickness of the device.
[0043] Among them, the first heat conduction part 1 and the second heat conduction part 2 are both rigid structures, which can conduct heat and can not conduct electricity, for example: ceramic material. In the embodiments, the first heat conduction part 1 and the second heat conduction part 2 can be flat plate structures, and their sizes are not limited and can be designed and adjusted according to actual needs, thereby ensuring the heat conduction area and the heat dissipation area while avoiding excessive thickness.
[0044] Among them, the first plane in the embodiments can be the inner wall of the shell of the electronic device, can be the surface of the main board or the auxiliary board, or can be the surface of the substrate separately provided for the heat dissipation device, for example: referring to the drawings Figure 1 The heat dissipation device further includes a substrate 4, a first surface of the substrate 4 forms the first plane, and the first heat conduction part 1, the second heat conduction part 2 and the electrically conductive component 3 are attached to the first surface. The size and shape of the substrate 4 can be designed and adjusted according to actual needs, as long as it can provide a mounting surface for the first heat conduction part 1, the second heat conduction part 2 and the electrically conductive component 3.
[0045] The conductive component 3 is made of semiconductor material, which can absorb heat at one end and release heat at the other end when direct current passes through it. For example, the conductive component 3 is formed by two semiconductor particles connected in series, and when the direct current flows from one semiconductor particle to the other, a Peltier effect is generated. In this embodiment, the conductive component 3 can be powered by the battery of the electronic device, or a separate battery can be provided for the heat dissipation device. In this embodiment, the two ends of the conductive component 3 are respectively connected to the first heat-conducting part 2 and the second heat-conducting part 3, so that the first heat-conducting part 2 and the second heat-conducting part 3 form a heat dissipation area and a heat absorption area, respectively. The heat dissipation area is the hot area, and the heat absorption area is the cold area. When applied in electronic devices, the heat absorption area can correspond to or be attached to the heat-generating element of the electronic device to transfer heat to the heat dissipation area. This improves heat dissipation efficiency, and the heat absorption and heat dissipation processes are pollution-free. In this embodiment, the connection between the conductive component 3 and the two heat-conducting parts can be a butt connection, an overlapping connection, or a covering connection. For example, the end of the conductive component 3 can be butt-to-butt with the end of the heat-conducting part; or as shown in the attached figure. Figure 1 The portions shown overlap; alternatively, one-third of the conductive component 3 may cover the first heat-conducting part 1 and the other one-third may cover the second heat-conducting part 2. Of course, the size of the covered area can be designed and adjusted according to the space requirements of the actual electronic device, as long as the distance between the first heat-conducting part 1 and the second heat-conducting part 2 is maintained. The conductive component 3 may be attached to the first plane, or it may only have a connection with the two heat-conducting parts; the design can be adjusted according to actual needs.
[0046] As described above, the heat dissipation device provided in this application, by arranging a first heat-conducting part 1 and a second heat-conducting part 2 at intervals and cooperating with a conductive component 3, allows the first heat-conducting part 1 and the second heat-conducting part 2 to form corresponding heat absorption and heat dissipation areas, i.e., cold side and hot side, when the conductive component 3 is energized, thus forming a planar semiconductor cooling device structure. This structure can absorb heat from the heat-generating element through the heat absorption area and extend the heat dissipation area away from the heat absorption area through the planar arrangement. This reduces the thickness of the heat dissipation device while effectively transferring and dissipating heat to the cold area of the electronic device, greatly improving heat dissipation efficiency. This solves the problem that the sandwich structure of semiconductor coolers is not only unfavorable for the development of ultra-thin devices but also increases the difficulty of heat dissipation in the heat-generating area of the device as a whole.
[0047] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships, such as A and / or B. Specifically, it can be understood as: A and B can be included at the same time, A can exist alone, or B can exist alone, and any of the above three situations can be met.
[0048] Further, see Appendix Figure 2 , Figure 2For the top view of the electric conduction assembly, the heat dissipation device provided by the embodiment, in specific implementation, the electric conduction assembly 3 includes a plurality of first conductive particles 31 and a plurality of second conductive particles 32; the plurality of first conductive particles 31 and the plurality of second conductive particles 32 are arranged alternately and connected in series along a first direction a; the series connection ends of the first conductive particles 31 and the second conductive particles 32 arranged in sequence along the first direction a are alternately overlapped on the first heat conduction part 1 and the second heat conduction part 2; the first direction a is perpendicular to the direction of the first heat conduction part 1 pointing to the second heat conduction part 2.
[0049] It can be understood that, in order to realize the electric conduction and heat conduction characteristics of the electric conduction assembly 3, the electric conduction assembly 3 is arranged in the form of including a plurality of first conductive particles 31 and a plurality of second conductive particles 32 in the embodiment, the first conductive particles 31 and the second conductive particles 32 can be N-type semiconductor particles and P-type semiconductor particles respectively, the N-type semiconductor particles and the P-type semiconductor particles are arranged alternately and connected in series, when there is current, the heat generated by the current is transmitted from the second heat conduction part 2 to the first heat conduction part 1 through the electric conduction assembly 3 for heat dissipation. Specifically, referring to FIG. 1, the first conductive particles 31 and the second conductive particles 32 are arranged alternately and connected in series along the first direction a, and the series connection ends of the first conductive particles 31 and the second conductive particles 32 arranged in sequence along the first direction a are alternately overlapped on the first heat conduction part 1 and the second heat conduction part 2. Figure 2 When the first conductive particles 31 are N-type semiconductor particles and connected to the positive pole of the power supply, the first heat conduction part 1 overlapped by the connection ends of the first conductive particles 31 and the second conductive particles 32 arranged in sequence along the first direction a forms the heat absorption area, and the second heat conduction part 2 overlapped by the connection ends of the first conductive particles 31 and the second conductive particles 32 arranged in the opposite direction of the first direction a forms the heat dissipation area. Correspondingly, referring to FIG. 2, when the first conductive particles 31 are N-type semiconductor particles and connected to the positive pole of the power supply, the first heat conduction part 1 overlapped by the connection ends of the first conductive particles 31 and the second conductive particles 32 arranged in sequence along the first direction a forms the heat absorption area, and the second heat conduction part 2 overlapped by the connection ends of the first conductive particles 31 and the second conductive particles 32 arranged in the opposite direction of the first direction a forms the heat dissipation area. Figure 3 When the first conductive particles 31 are P-type semiconductor particles and connected to the positive pole of the power supply, the heat absorption area and the heat dissipation area are opposite to the above case. Of course, it can be understood that, in the embodiment, the first conductive particles 31 and the second conductive particles 32 can be arranged in parallel and spaced along the first direction a as shown in FIG. 3, or arranged in the form of V or A along the first direction a. Figure 1 Figure 2 When the first conductive particles 31 are P-type semiconductor particles and connected to the positive pole of the power supply, the heat absorption area and the heat dissipation area are opposite to the above case. Of course, it can be understood that, in the embodiment, the first conductive particles 31 and the second conductive particles 32 can be arranged in parallel and spaced along the first direction a as shown in FIG. 3, or arranged in the form of V or A along the first direction a. Figure 2 When the first conductive particles 31 are P-type semiconductor particles and connected to the positive pole of the power supply, the heat absorption area and the heat dissipation area are opposite to the above case. Of course, it can be understood that, in the embodiment, the first conductive particles 31 and the second conductive particles 32 can be arranged in parallel and spaced along the first direction a as shown in FIG. 3, or arranged in the form of V or A along the first direction a. Figure 2 When the first conductive particles 31 are P-type semiconductor particles and connected to the positive pole of the power supply, the heat absorption area and the heat dissipation area are opposite to the above case. Of course, it can be understood that, in the embodiment, the first conductive particles 31 and the second conductive particles 32 can be arranged in parallel and spaced along the first direction a as shown in FIG. 3, or arranged in the form of V or A along the first direction a.
[0050] Further, refer to the accompanying drawings Figure 1 In the heat dissipation device, the electrically conductive assembly further comprises a first electrically conductive member 33 and a second electrically conductive member 34. The first electrically conductive member 33 is arranged at the connecting end of the first thermally conductive part 1 corresponding to the first electrically conductive particles 31 and the second electrically conductive particles 32, and the first electrically conductive member 33 is connected to the first thermally conductive part 1. The second electrically conductive member 34 is arranged at the connecting end of the second thermally conductive part 2 corresponding to the first electrically conductive particles 31 and the second electrically conductive particles 32, and the second electrically conductive member 34 is connected to the second thermally conductive part 2.
[0051] It can be understood that, in order to reduce the difficulty of connecting the first electrically conductive particles 31 and the second electrically conductive particles 32 at the end, the first electrically conductive member 33 and the second electrically conductive member 34 are arranged as an adapter structure in the embodiment. The first electrically conductive member 33 and the second electrically conductive member 34 are made of an electrically conductive material and can be in the form of a strip, a rod, a block, or the like. The first electrically conductive member 33 and the second electrically conductive member 34 must be connected to the first thermally conductive part 1 and the second thermally conductive part 2, which can be the aforementioned butt joint, lap joint, or covering connection. When the first electrically conductive particles 31 and the second electrically conductive particles 32 generate an electric current through the first electrically conductive member 33 or the second electrically conductive member 34, heat can be transferred between the first thermally conductive part 1 and the second thermally conductive part 2. The first electrically conductive member 33 and the second electrically conductive member 34 can be the same or different in form and can be designed and adjusted as needed. For example, the first electrically conductive member 33 and / or the second electrically conductive member 34 can be in a straight line, an arc, a bend, or a wavy line structure. The first electrically conductive member 33 and the second electrically conductive member 34 can both be in an arc structure as shown in FIG. 3, with the two ends of the arc connected to the ends of the first electrically conductive particles 31 and the second electrically conductive particles 32, respectively. The arc bend part is used to connect the thermally conductive part, reducing the difficulty of lap joint and the difficulty of forming the electrically conductive member. The first electrically conductive member 33 and the second electrically conductive member 34 can both be in a strip structure as shown in FIG. 4, reducing the alignment accuracy with the first electrically conductive particles 31 and the second electrically conductive particles 32 and increasing the contact area between the electrically conductive assembly 3 and the two thermally conductive parts. The first electrically conductive member 33 and the second electrically conductive member 34 can also be arranged in a straight line and in an arc or wavy line, respectively. Figure 1 Figure 2
[0052] Further, refer to the accompanying drawings Figure 1 In the heat dissipation device, the number of the first electrically conductive particles 31 and the second electrically conductive particles 32 is the same. The first electrically conductive particles 31 and the second electrically conductive particles 32 are arranged on the first plane.
[0053] It can be understood that, in order to simplify the preparation method of the heat dissipation device and improve the structural stability of the heat dissipation device, the first conductive particles 31 and the second conductive particles 32 are arranged on the first plane in this embodiment, which can be but not limited to being adhered or adsorbed on the first plane, and then the electrically conductive assembly 3 is supported by the first plane, so that the stability and integrity of the electrically conductive assembly 3 can be ensured during separate loading and transportation of the heat dissipation device. In this embodiment, the number of the first conductive particles 31 and the second conductive particles 32 is set to be the same, so as to ensure that the size of the heat absorption area and the heat dissipation area is equal, and the heat absorption and heat dissipation efficiency is balanced. Of course, the first heat conduction part 1, the second heat conduction part 2 and the electrically conductive assembly 3 can be adhered to the first plane at the same time or adhered to the first surface of the substrate 4 at the same time.
[0054] Embodiment 2
[0055] With reference to the accompanying drawings, Figure 4 , the embodiment provides an electronic device, which comprises a display screen 5, a heat dissipation device 6, a heating element 7 and a mainboard 8 arranged in layers; the heat absorption area of the heat dissipation device 6 is attached to the heating element 7.
[0056] It can be understood that the electronic device provided in this embodiment can be but not limited to a mobile phone, a tablet computer, a notebook computer, a display and the like having a display screen. The electronic device comprises a display screen 5 and a rear shell 9 arranged in layers and spaced apart, and a containing space is formed between the display screen 5 and the rear shell 9 to accommodate the mainboard 8, and the mainboard 8 is provided with the heating element 7, which can be but not limited to a CPU, a GPU and the like. The heat dissipation device 6 in this embodiment is the heat dissipation device 6 described in the embodiment, and the structure and heat dissipation principle thereof are described in detail in Embodiment 1. The heat absorption area of the heat dissipation device 6, i.e. the second heat conduction part 2, is attached to the heating element 7, and then when the electrically conductive assembly 3 is powered on, the heat of the heating element 7 can be transferred to the first heat conduction part 1 through the second heat conduction part 2 and the electrically conductive assembly 3 for external heat dissipation.
[0057] Further, with reference to the accompanying drawings, Figure 4 , the electronic device provided in this embodiment can further comprise a battery 10, which is arranged on the side of the heat dissipation device 6 away from the display screen 5 and at a position different from the heating element 7; and the heat dissipation area of the heat dissipation device 6 extends in parallel to the mainboard 8 towards the battery 10.
[0058] It can be understood that, in order to cooperate with the display screen 5, the heating element 7 and the power supply of the heat dissipation device, the electronic device provided by the embodiment is also provided with a battery 10. The battery can be arranged in sequence with the mainboard 8 along the length direction or the width direction of the electronic device in the accommodating space, so that the area where the battery 10 is located becomes the cold area position of the electronic device itself. The first heat conduction part 1 of the heat dissipation device in the embodiment can extend to the area where the battery 10 is located, improve the heat dissipation efficiency, and transfer the heat absorbed by the second heat conduction part 2 at the heating element 7 to the cold area of the electronic device for heat dissipation, so as to improve the heat dissipation efficiency of the heating element 7 and also not to transfer the heat to the side of the display screen 5 to affect the display screen 5. Of course, the battery 10 in the embodiment can also supply power to the heat dissipation device. For example, the battery 10 forms a power supply port corresponding to the heat dissipation device and a matched power management module on the mainboard 8. The first conductive particle 31 and the last conductive particle 32 in the heat dissipation device are connected to the positive and negative poles of the power supply port, respectively.
[0059] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A heat dissipating device, characterized by, The heat dissipation device comprises: a first heat conduction part arranged on a first plane; a second heat conduction part arranged on the first plane and spaced apart from the first heat conduction part; an electrically conductive assembly arranged between the first heat conduction part and the second heat conduction part, and at least part of the electrically conductive assembly is connected to the first heat conduction part and the second heat conduction part; wherein the electrically conductive assembly is energized to form a heat dissipation area and a heat absorption area in the first heat conduction part and the second heat conduction part, respectively.
2. The heat dissipation device according to claim 1, wherein: the electrically conductive assembly comprises a plurality of first conductive particles and a plurality of second conductive particles; the plurality of first conductive particles and the plurality of second conductive particles are arranged alternately and connected in series along a first direction; the series connection ends of the first conductive particles and the second conductive particles arranged along the first direction are alternately connected to the first heat conduction part and the second heat conduction part; the first direction is perpendicular to the direction of the first heat conduction part pointing to the second heat conduction part.
3. The heat dissipation device according to claim 2, wherein: the electrically conductive assembly further comprises a first conductive member and a second conductive member; the first conductive member is arranged corresponding to the connection end of the first conductive particles and the second conductive particles towards the first heat conduction part, and the first conductive member is connected to the first heat conduction part; the second conductive member is arranged corresponding to the connection end of the first conductive particles and the second conductive particles towards the second heat conduction part, and the second conductive member is connected to the second heat conduction part.
4. The heat dissipation device according to claim 3, wherein: the first conductive member and / or the second conductive member is in a straight line structure or an arc structure or a bending structure or a wavy line structure.
5. The heat dissipation device according to claim 2, wherein: the first conductive particles are connected to the positive electrode of a power supply, the first heat conduction part connected by the connection ends of the first conductive particles and the second conductive particles arranged along the first direction forms the heat absorption area, and the second heat conduction part connected by the connection ends of the first conductive particles and the second conductive particles arranged in the opposite direction of the first direction forms the heat dissipation area.
6. The heat dissipation device according to claim 2, wherein: the number of the first conductive particles is the same as that of the second conductive particles; and the first conductive particles and the second conductive particles are arranged on a first plane.
7. The heat dissipation device according to claim 1, further comprising: a substrate; a first surface of the substrate forms the first plane; the first heat conduction part, the second heat conduction part and the electrically conductive assembly are attached to the first surface; the electrically conductive assembly is made of a semiconductor material.
8. The heat dissipation device according to claim 7, wherein: the first heat conduction part, the second heat conduction part and the electrically conductive assembly are all adhered to the first surface.
9. An electronic device, comprising: The heat dissipation device comprises: a display screen, a heat dissipation device according to any one of claims 1-8, a heating element and a mainboard arranged in layers; the heat absorption area of the heat dissipation device is attached to the heating element.
10. The electronic device of claim 9, wherein: a battery is further included; the battery is disposed on a side of the heat dissipation device opposite to the display screen and different from the position of the heat generating element; a heat dissipation region of the heat dissipation device extends in a direction of the main board towards the battery.