Heat dissipation device of modular electronic case

Abstract

The utility model belongs to the technical field of heat dissipation of electronic equipment, and relates to a heat dissipation device of a modular electronic case. Comprising a cooling fan, a cover plate and a flow guide blocking structure. Symmetrically-distributed sliding grooves are formed in the flow guide blocking structure in the length direction, and the air volume adjusting mechanism is arranged on the sliding grooves and comprises a sliding block, an overturning plate and a vertical strip. The turnover plate is connected with the vertical strip through a hinge, clamping rods are arranged on the two sides of the vertical strip respectively and matched with round holes in the sliding blocks, the two sliding blocks correspond to sliding grooves in the flow guide blocking structure respectively, a containing groove is formed in the vertical strip, an arc-shaped strip is arranged on the turnover plate, and when the turnover plate rotates, the arc-shaped strip stretches into the containing groove. An extrusion screw rod penetrates through a through hole in the arc-shaped strip and then extrudes the blocking frame, and the rotation angle of the overturning plate is fixed; the heat dissipation fan is installed on the cover plate, and the cover plate covers the flow guide blocking structure to form the heat dissipation device. The flow direction of the gas is guided, the utilization efficiency of the gas is improved, the operation load of the fan can be reduced, and electric energy consumption is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of electronic equipment heat dissipation, and relates to a heat dissipation device of modular electronic case. BACKGROUND

[0002] Modular electronic case (or called "rack"), there are two kinds of horizontal heat dissipation and vertical heat dissipation, the main feature of horizontal heat dissipation is that cooling air flows horizontally, and the main feature of vertical heat dissipation is that cooling air flows vertically, and both of the two schemes can realize heat dissipation to a certain extent while isolating flowing air and electronic module.

[0003] During the heat dissipation process in the rack, the heat dissipation fan guides the external gas, and the guided gas enters the rack. At this time, the heat dissipation blowing gas cannot be guided, causing the airflow in the rack to be turbulent, and causing some gas to be unable to blow the electronic components, resulting in low heat dissipation efficiency of the electronic components. UTILITY MODEL CONTENTS

[0004] UTILITY MODEL PURPOSE

[0005] The utility model discloses a heat dissipation device of modular electronic case, which can solve the problem of low heat dissipation efficiency of electronic components in the prior art.

[0006] TECHNICAL SCHEME

[0007] A heat dissipation device of modular electronic case, comprising a heat dissipation fan, a cover plate, and a flow guiding and blocking structure. The flow guiding and blocking structure is frame-shaped, and symmetrically distributed sliding grooves are arranged in the length direction of the flow guiding and blocking structure. A wind volume adjusting mechanism is arranged on the sliding grooves and can move back and forth along the length direction of the flow guiding and blocking structure. The wind volume adjusting mechanism comprises a sliding block, a turnover plate, and a vertical bar. The turnover plate and the vertical bar are connected by a hinge. Card clamping rods are arranged on both sides of the vertical bar. The card clamping rods are matched with the round holes on the sliding block. Two sliding blocks correspond to the sliding grooves on the flow guiding and blocking structure, so that the vertical bar can slide. A placing groove is arranged on the vertical bar. An arc-shaped bar is arranged on the turnover plate. When the turnover plate rotates, the arc-shaped bar extends into the placing groove and extrudes the barrier frame after the screw rod passes through the through hole on the arc-shaped bar, thereby fixing the rotation angle of the turnover plate. The heat dissipation fan is installed on the cover plate, and the cover plate covers the flow guiding and blocking structure to form the heat dissipation device.

[0008] Further, a plurality of through holes are arranged on the arc-shaped bar to adjust the rotation angle of the turnover plate and fix it.

[0009] Further, the turnover plate is provided with a baffle, the baffle can be telescoped in the turnover plate, the turnover plate is provided with a guide groove, the bolt passes through the guide groove, and the telescoped baffle can be limited.

[0010] Further, the air volume adjusting mechanism is arranged on the flow guide barrier structure.

[0011] Further, the heat dissipation device is arranged on the modular case.

[0012] Further, the heat dissipation fan is evenly distributed on the cover plate.

[0013] The application has the following advantages:

[0014] (1) The air flow in the rack is changed, part of the gas cannot blow the electronic components, and the problem of resource waste is solved, and the heat dissipation efficiency of the electronic components is improved, the gas is guided, the guided gas can blow the outside of the electronic components, and the heat dissipation effect of the electronic components is improved.

[0015] (2) The gas flow direction is guided, the utilization efficiency of the gas is improved, the operation load of the fan is reduced, and the power consumption is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Fig. 1 shows a structure diagram of a heat dissipation device of a modular electronic case;

[0017] Figure 2 Fig. 4 shows an installation structure diagram of a flow guide barrier structure;

[0018] Figure 3 Fig. 5 shows an installation structure diagram of a turnover plate;

[0019] Figure 4 Fig. 6 shows a structure diagram of a middle A area. Figure 2

[0020] Wherein, 1-heat dissipation fan, 2-cover plate, 3-flow guide barrier structure, 4-placing groove, 5-sliding groove; 31-barrier frame, 32-sliding block, 33-round hole, 34-clamping rod, 35-vertical bar, 36-turnover plate, 37-baffle, 38-bolt, 39-guide groove; 310-arc-shaped bar, 311-extrusion screw. DETAILED DESCRIPTION

[0021] ​In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the utility model embodiment will be described in more detail in the following in combination with the utility model embodiments. In the examples, the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The described embodiments are part of the embodiments of the utility model, not all. The described embodiments below are exemplary and are intended to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model. The embodiments of the utility model will be described in detail below.

[0022] A heat dissipation device of a modular electronic cabinet, comprising: a heat dissipation fan, one end of the heat dissipation fan is installed on a cover plate by a screw, and the heat dissipation fan is located in the interior of a rack, and a flow guide blocking structure is fixedly installed between the heat dissipation fan and the rack.

[0023] The flow guide blocking structure comprises a blocking frame fixedly installed between the rack and the heat dissipation fan, vertical bars are symmetrically installed in the interior of the blocking frame, a turnover plate is hingedly connected to one end of the vertical bar, and a baffle is slidably connected in the interior of the turnover plate.

[0024] Preferably, a sliding groove is symmetrically formed on both sides of the inner wall of the flow guide blocking structure, a plurality of sliding blocks are symmetrically and equidistantly slidably connected in the interior of the sliding groove, a circular hole is symmetrically formed on one end surface of the sliding block, and a clamping rod is clamped and installed in the interior of the circular hole.

[0025] Preferably, the clamping rod is fixedly connected between one end surface of the clamping rod and one end of the vertical bar, and the vertical bar is connected through the clamping rod and the sliding block.

[0026] Preferably, a bolt is symmetrically connected to one end surface of the baffle through a thread, and a guide groove is formed in the interior of the turnover plate at a position corresponding to one end of the bolt.

[0027] Preferably, an arc-shaped strip is symmetrically welded to one end surface of the turnover plate, and an extrusion screw is threadedly connected in the interior of the arc-shaped strip.

[0028] Preferably, the extrusion screw is attached to the inner wall of the blocking frame, and a placement groove is formed in the interior of the vertical bar at a position corresponding to one end of the arc-shaped strip.

[0029] Preferably, the center point of the placement groove and the arc-shaped strip and the turnover point of the turnover plate are on the same horizontal line.

[0030] Embodiment 1

[0031] The utility model provides a kind of heat dissipation device of modular electronic cabinet, as Figures 1-4As shown, it comprises: heat dissipation fan 1, heat dissipation fan 1 one end through screw installation has cover plate 2 and heat dissipation fan 1 is located in cover plate 2 inside, heat dissipation fan 1 and cover plate 2 between fixed installation has flow resistance structure 3 of barrier;

[0032] Flow resistance structure 3 includes fixed installation between the frame and heat dissipation fan 1 of barrier frame 31, barrier frame 31 inside symmetrical installation has vertical bar 35, the number of vertical bar 35 is set to multiple, vertical bar 35 one end through the hinge is hinged with turnover plate 36, turnover plate 36 inside sliding connection has baffle 37.

[0033] As shown in Figure 2 And Figure 3 The inner wall of flow resistance structure 3 is symmetrically provided with a sliding groove 5, a plurality of sliding blocks 32 are symmetrically and equidistantly connected in the sliding groove 5, the sliding blocks 32 can displace along the sliding groove 5, the displacement difficulty of the sliding blocks 32 is changed, a circular hole 33 is symmetrically formed in one end surface of the sliding block 32, a clamping rod 34 is clamped and connected in the circular hole 33, the clamping rod 34 is fixedly connected between one end surface of the vertical bar 35 and one end surface of the barrier frame 31, the vertical bar 35 and the barrier frame 31 are connected through the clamping rod 34 and the sliding block 32, the clamping rod 34 is connected in the sliding block 32 through the circular hole 33, and the clamping rod 34 and the sliding block 32 are fixed, the clamping rod 34 is convenient to install, the vertical bar 35 is convenient to install and disassemble, a bolt 38 is symmetrically connected with one end surface of the baffle 37 through threads, a guide groove 39 is formed in the turnover plate 36 corresponding to the position of one end of the bolt 38, the guide groove 39 is convenient for the movement of the bolt 38, and the bolt 38 is extruded and fixed to the baffle 37 after rotation, so that the baffle 37 after displacement is fixed.

[0034] As shown in Figure 3 And Figure 4 One end surface of the turnover plate 36 is symmetrically welded with an arc-shaped strip 310, an extrusion screw 311 is connected with the arc-shaped strip 310 through threads, the extrusion screw 311 can move along the arc-shaped strip 310 and extrude the barrier frame 31, so that the arc-shaped strip 310 is extruded and fixed, the extrusion screw 311 is in close contact with the inner wall of the barrier frame 31, a placing groove 4 is formed in the vertical bar 35 corresponding to the position of one end of the arc-shaped strip 310, the placing groove 4 is convenient for the placement of the arc-shaped strip 310, the placement difficulty of the arc-shaped strip 310 is changed, the center point of the placing groove 4 and the arc-shaped strip 310 is on the same horizontal line as the turning point of the turnover plate 36, so that the turnover plate 36 can drive the arc-shaped strip 310 to enter the placing groove 4 when the turnover plate 36 rotates, and the difficulty of the arc-shaped strip 310 entering the placing groove 4 is changed.

[0035] Working principle: during actual use, the personnel install the heat dissipation fan 1, the blocking frame 3 and the cover plate 2, then the personnel install the vertical strip 35 and the sliding block 32 through the clamping rod 34 and the circular hole 33, at this time, multiple vertical strips 35 can be installed according to the requirements, and when the vertical strip 35 is installed, the angle of the turnover plate 36 at one end of the vertical strip 35 is changed, at this time, the turnover plate 36 drives the arc-shaped strip 310 into the placing groove 4, then when the turnover plate 36 is adjusted, the personnel rotate the extrusion screw 311, the extrusion screw 311 moves along the arc-shaped strip 310, and extrudes the blocking frame 31, so that the arc-shaped strip 310 and the blocking frame 31 are extruded and fixed, and the turnover plate 36 is fixed, then the personnel move the baffle 37, the baffle 37 moves and drives the bolt 38 to move along the guide groove 39, when the baffle 37 moves to the predetermined position, the personnel rotate the bolt 38, and the bolt 38 is extruded and fixed after being rotated, and the gas generated when the heat dissipation fan 1 operates is blocked along the vertical strip 35, the turnover plate 36 and the baffle 37, the blocked gas directly blows to the outside of the electronic element, changes the problem that part of the gas cannot blow to the electronic element in the prior art, causing resource waste, and changes the problem that the heat dissipation efficiency of the electronic element in the prior art is not high, the way guides the gas, so that the guided gas can blow to the outside of the electronic element, thereby improving the heat dissipation effect of the electronic element.

[0036] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with those in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless otherwise defined. The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present application, and it should be understood that the above description is only a specific embodiment of the present application and is not intended to limit the present application. Any skilled person in the art can modify or improve the above disclosed technical content to obtain equivalent embodiments within the spirit and principles of the present application, and apply it to other fields, but any simple modification, equivalent change and improvement made to the above embodiments according to the technical essence of the present application should be included in the protection scope of the present application.

Claims

1. A heat dissipation device for a modular electronic chassis, characterized in that, Including heat dissipation fan, cover plate, flow guide barrier structure, the flow guide barrier structure is frame type, the flow guide barrier structure length direction is equipped with symmetric distribution chute, the air volume adjusting mechanism is arranged on the chute, can move back and forth along the flow guide barrier structure length direction, the air volume adjusting mechanism includes sliding block, turnover plate, vertical strip, the turnover plate is connected with vertical strip through hinge, both sides of the vertical strip are equipped with clamping rod respectively, the clamping rod is adapted with the round hole on the sliding block, two sliding blocks correspond to the chute on the flow guide barrier structure respectively, make the vertical strip can slide, be equipped with the placing groove on the vertical strip, be equipped with arc strip on the turnover plate, when the turnover plate rotates, the arc strip stretches into the placing groove in, extrude the barrier frame after extruding screw passes through the through hole on the arc strip, fix the rotation angle of turnover plate, the heat dissipation fan is installed on the cover plate, the cover plate covers on the flow guide barrier structure, forms the heat dissipation device.

2. The apparatus of claim 1, wherein, The arc strip is provided with a plurality of through holes, which can adjust the different rotation angles of the turnover plate and fix them.

3. The apparatus of claim 1, wherein, The turnover plate is provided with a baffle, which can be telescopic in the turnover plate, and a guide groove is arranged on the turnover plate, and a bolt passes through the guide groove to limit the telescopic baffle.

4. The apparatus of claim 1, wherein, The air volume adjusting mechanism is several, and is arranged on the flow guide barrier structure.

5. The apparatus of claim 1, wherein, The heat dissipation device is several, and is arranged in parallel on the modular case.

6. The apparatus of claim 1, wherein, The heat dissipation fan is several, and is uniformly distributed on the cover plate.

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