Chip aging test device

Abstract

The utility model belongs to the technical field of chip testing, and particularly relates to a chip aging testing device. The chip aging test device comprises an aging plate and a plurality of temperature control units, a plurality of connecting pieces are arranged on the aging plate, each temperature control unit comprises an air volume control device, a heating device and a temperature detection device, the heating device comprises a heating chamber and a heating device, and the heating device and the temperature detection device are arranged in the heating chamber; the heating chamber is provided with an air inlet and an air outlet. The air volume control device is used for adjusting the opening degree of the air inlet. And each connecting piece can be electrically connected with the chip to be tested in the heating chamber of one temperature control unit, so that the burn-in board can test the operation parameters of the chip to be tested at the target temperature. When cold air flows into the heating chamber of each temperature control unit, the opening degree of the air inlet is adjusted through the corresponding air volume control device so as to control the air volume introduced into the corresponding heating chamber, so that cooling is performed according to the operating temperature of each chip to be tested, and accurate temperature control adjustment of the single chip is realized.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology, and in particular relates to a chip aging test device. Background Technology

[0002] With the rapid development of artificial intelligence, the computing speed of low-voltage, high-current, high-power SOC chips such as CPUs, GPUs, and ASICs is increasing, and their heat generation is also gradually increasing. When the chip temperature rises, its performance will be affected, for example, by changes in parameters or a decrease in the maximum operating frequency. From the user's perspective, when these situations occur, the product no longer functions properly. Under the condition of meeting parameter specifications, the maximum allowable temperature of the chip should be higher than the ambient temperature of the industry in which the chip is used, so that the chip can maintain good performance for the longest possible operating time and over the widest range of environmental conditions.

[0003] The maximum permissible temperature of a chip depends primarily on its manufacturing process and design methodology. To eliminate chips with early potential failures due to manufacturing process issues and reduce product failure rates, aging tests are performed during chip manufacturing. Aging tests typically involve placing multiple chips under test (DUTs) in the heated chamber of an aging test apparatus, with the DUTs electrically connected to an aging board to simulate their operation at a target temperature.

[0004] However, the chip under test generates heat when powered on. During the aging test, cold air is usually introduced into the heating chamber to keep the chip under test at the target temperature, making it difficult to achieve precise temperature regulation for a single chip. Utility Model Content

[0005] The technical problem to be solved by this utility model is: to provide a chip aging test device that addresses the difficulty of achieving precise temperature regulation of a single chip in existing aging test devices.

[0006] To address the aforementioned problems, this utility model provides a chip aging test device, comprising an aging board and multiple temperature control units. The aging board is equipped with multiple connectors. Each temperature control unit includes an airflow control device, a heating device, and a temperature detection device. The heating device includes a heating chamber and a heating element. The heating element and the temperature detection device are disposed within the heating chamber. The heating element heats the chip under test placed within the heating chamber, and the temperature detection device detects the operating temperature of the chip under test within the heating chamber. The heating chamber has an air inlet and an air outlet. The airflow control device adjusts the opening of the air inlet, allowing cold air to enter the heating chamber, and the air outlet allows air to exit the heating chamber.

[0007] Each of the connectors is electrically connected to a chip under test in the heating chamber of one of the temperature control units, so that the aging board can test the operating parameters of the chip under test at a target temperature.

[0008] Optionally, the air volume control device includes an air valve structure and a stepper motor. The air valve structure includes a base and a rotating component. The base is installed at the air inlet and has a valve port communicating with the air inlet. The rotating component is rotatably installed in the valve port around an axis. The stepper motor is used to drive the rotating component to rotate in order to adjust the opening of the valve port.

[0009] Optionally, only one rotating component is provided, and the two ends of the rotating component are rotatably mounted on the base along its rotation axis. The rotating component is provided with a plurality of communication ports spaced apart along its rotation axis.

[0010] The rotating component can rotate under the drive of the stepper motor, so that the rotating component closes the valve port or the connecting port connects to the valve port.

[0011] Optionally, the temperature detection device includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is used to detect the surface temperature of the chip under test in the heating chamber, and the second temperature sensor is used to detect the temperature of the air inlet and / or the air outlet.

[0012] Optionally, the heating chambers of the multiple temperature control units are distributed in a rectangular array, and the multiple connectors are also distributed in a rectangular array, with each connector corresponding to one of the multiple temperature control units.

[0013] Optionally, multiple aging boards are provided, and the multiple aging boards are arranged in parallel and spaced apart. Each aging board has multiple temperature control units arranged in a rectangular array above it.

[0014] Optionally, it also includes a test chamber, the test chamber having a first air vent and a second air vent arranged opposite to each other along a first direction, the first air vent for cold air to enter the test chamber, and the second air vent for air to be discharged from the test chamber;

[0015] The aging board and multiple temperature control units are all located inside the test chamber, with the first direction being parallel to the thickness direction of the aging board.

[0016] Optionally, it also includes a heat exchanger disposed at the second air outlet, the heat exchanger being used to exchange heat with the air flowing through the second air outlet.

[0017] Optionally, the test box is square, and an upright plate extending along the length of the test box is provided inside the test box. The upright plate is located between the two side plates in the width direction of the test box. The bottom end of the upright plate is connected to the bottom plate of the test box, and the top end of the upright plate supports the top plate of the test box.

[0018] Optionally, it also includes a power board and a system board, wherein a controller is installed on the system board and the controller is communicatively connected to the aging board, the temperature detection device, the heating device and the air volume control device, and the power board is used to supply power to the aging board and the temperature control unit.

[0019] This novel chip aging test device includes multiple temperature control units. Each temperature control unit is equipped with an airflow control device, a heating device, and a temperature detection device. Each temperature control unit can adjust the airflow control device and the heating device based on the operating temperature of the chip under test in the heating chamber detected by the temperature detection device. This allows the aging board to detect the parameters of the chip under test in each temperature unit at the corresponding target temperature. When cold air flows into the heating chamber of each temperature control unit, the opening of the air inlet can be adjusted by the airflow control device of the corresponding temperature control unit to control the amount of airflow entering the corresponding heating chamber. This allows for cooling based on the operating temperature of each chip under test, achieving precise temperature control for individual chips. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the chip aging test device provided in one embodiment of the present invention;

[0022] Figure 2 for Figure 1 AA section view;

[0023] Figure 3 yes Figure 2 A schematic diagram of the air valve structure in the middle;

[0024] Figure 4 yes Figure 3 Exploded view;

[0025] Figure 5 This is a schematic diagram of the layout of the chip aging test device provided in one embodiment of the present invention when two aging boards are set.

[0026] The reference numerals in the accompanying drawings are as follows:

[0027] 1. Aging board; 11. Connector; 2. System board; 3. Power board; 4. Test chamber; 41. Vertical plate; 42. First air outlet; 43. Second air outlet; 5. Temperature control unit; 6. Heating chamber; 7. Air volume control device; 71. Stepper motor; 72. Base; 73. Rotating component; 74. Valve port; 75. Connecting port. Detailed Implementation

[0028] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0029] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] like Figure 1 and Figure 2 As shown, an embodiment of this utility model provides a chip aging test device, including an aging board 1 and multiple temperature control units 5. The aging board 1 is provided with multiple connectors 11. The temperature control unit 5 includes an airflow control device 7, a heating device and a temperature detection device. The heating device includes a heating chamber 6 and a heating element. The heating element and the temperature detection device are disposed in the heating chamber 6. The heating element is used to heat the chip under test placed in the heating chamber 6, and the temperature detection device is used to detect the operating temperature of the chip under test in the heating chamber 6.

[0032] The heating chamber 6 is equipped with an air inlet and an air outlet. The air volume control device 7 is used to adjust the opening of the air inlet. The air inlet allows cold air to enter the heating chamber 6, and the air outlet allows air to be discharged from the heating chamber 6. The air volume entering the heating chamber 6 from the air inlet per unit time is different for air inlets with different openings, and the cooling rate of the chip under test in the heating chamber 6 is different.

[0033] Each connector 11 can be electrically connected to the chip under test in the heating chamber 6 of a temperature control unit 5, so that the aging board 1 can test the operating parameters of the chip under test at the target temperature.

[0034] When this chip aging test device is used to test chips, each chip under test is placed in the heating chamber 6 of the corresponding temperature control unit 5, and the chip under test is connected to the connector 11 on the aging board 1. After the aging board 1 is powered on, the chip under test operates normally, and the heating device in the heating chamber 6 heats the chip under test. The temperature detection device simultaneously detects the operating temperature of the chip under test. When the operating temperature of the chip under test reaches the target temperature, the heating device stops heating to simulate the working conditions of the chip under test when used by the client. After the chip under test is powered on, it generates heat. When the operating temperature of the chip under test is higher than the target temperature, the airflow control device 7 opens the air inlet, and cold air enters the heating chamber 6 through the air inlet. After the cold air exchanges heat with the chip under test, it carries the heat and is discharged from the air outlet to keep the operating temperature of the chip under test at the target temperature. When the operating temperature of the chip under test is lower than the target temperature, the heating device restarts heating until the operating temperature of the chip under test reaches the target temperature. Thus, the aging board 1 can detect the operating parameters of the chip under test at the target temperature, and screen out chips with early potential risks based on the detected operating parameters.

[0035] The temperature detection device converts the detected temperature into an electrical signal, which is amplified by a conditioning circuit and sent to the controller of the chip aging test device. The controller analyzes and calculates the operating temperature of the chip under test in the heating chamber 6. When the temperature of the chip under test is too high, an execution command is sent to the drive circuit of the heating device to shut off the heating. At the same time, an execution command is also sent to the drive circuit of the airflow control device 7 to control the airflow control device 7 to operate, sending cool air into the heating chamber 6 to dissipate heat from the chip under test. Through the PID algorithm of the heating device, the airflow control device 7, and the temperature detection device, the chip under test in the heating chamber 6 is brought to the target temperature.

[0036] Furthermore, when cold air flows into the heating chamber 6 of each temperature control unit 5, the opening of the air inlet can be adjusted by the air volume control device 7 of the corresponding temperature control unit 5 to control the amount of air entering the corresponding heating chamber 6, thereby cooling down according to the operating temperature of each chip under test, so as to achieve precise temperature control adjustment of a single chip.

[0037] In addition, the temperature control of each temperature control unit 5 does not affect each other, which makes it easy to increase or decrease the number of temperature control units 5 to achieve system expansion and maintenance.

[0038] It should be noted that the target temperature refers to a temperature range, such as "100℃~110℃", which has a maximum temperature and a minimum temperature. When the operating temperature of the chip under test is higher than the maximum target temperature, the air volume control device 7 opens the air inlet to allow cold air to enter the heating chamber 6 through the air inlet. When the operating temperature of the chip under test is lower than the minimum target temperature, the heating device starts heating until the operating temperature of the chip under test reaches the target temperature, at which point the heating device stops heating.

[0039] The chip aging test device of this invention includes multiple temperature control units 5. Each temperature control unit 5 is equipped with an airflow control device 7, a heating device, and a temperature detection device. Each temperature control unit 5 can adjust the airflow control device 7 and the heating device according to the operating temperature of the chip under test in the heating chamber 6 detected by the temperature detection device, so that the aging board 1 can detect the parameters of the chip under test in each temperature unit at the corresponding target temperature. Moreover, when cold air flows into the heating chamber 6 of each temperature control unit 5, the opening of the air inlet can be adjusted by the airflow control device 7 of the corresponding temperature control unit 5 to control the amount of airflow entering the corresponding heating chamber 6, thereby cooling according to the operating temperature of each chip under test, so as to achieve precise temperature control of individual chips.

[0040] In one embodiment, the airflow control device 7 includes an air valve structure and a stepper motor 71. The air valve structure includes a base 72 and a rotating component 73. The base 72 is installed at the air inlet and has a valve port 74 communicating with the air inlet. The rotating component 73 is rotatably installed in the valve port 74 around an axis. The stepper motor 71 drives the rotating component 73 to rotate, thereby adjusting the opening of the valve port 74 and controlling the opening degree of the air inlet to connect with the outside. Since the rotating component 73 of the air valve structure of this airflow control device 7 is rotatably installed on the base 72, when assembling the air valve structure with the heating chamber 6, the air valve structure can be assembled into a module first, and then the base 72 can be fixed at the air inlet of the heating chamber 6, making installation convenient.

[0041] In one embodiment, the heating device is a heating plate or a heating rod, which begins to heat up after being powered on.

[0042] In one embodiment, such as Figure 3 and Figure 4 As shown, only one rotating component 73 is provided. The two ends of the rotating component 73 are rotatably mounted on the base 72 along its rotation axis. The rotating component 73 is provided with a plurality of connecting ports 75 spaced apart along its rotation axis. The rotating component 73 can rotate under the drive of the stepper motor 71 so that the rotating component 73 closes the valve port 74 or the connecting port 75 connects to the valve port 74.

[0043] Specifically, when the rotating component 73 is facing the valve port 74 under the drive of the stepper motor 71, the rotating component 73 closes the valve port 74. As the stepper motor 71 continues to rotate, the connecting port 75 gradually exposes to the outside of the valve port 74, so that the connecting port 75 connects the valve port 74 with the outside. Moreover, the stepper motor 71 can drive the rotating component 73 to rotate to different angles. At different angle positions, the projected area of ​​the connecting port 75 on the plane where the opening of the valve port 74 is located is different, so as to adjust the opening degree of the valve port 74.

[0044] In one embodiment, the rotating member 73 is provided with rotating shafts at both ends along its rotation axis direction, and correspondingly, the seat 72 is provided with through holes extending along the rotation axis direction of the rotating member 73 on opposite sides of the valve port 74, and the rotating shafts are inserted into the corresponding through holes.

[0045] In one embodiment, the temperature detection device includes a first temperature sensor and a second temperature sensor. The first temperature sensor is used to detect the surface temperature of the chip under test inside the heating chamber 6, and the second temperature sensor is used to detect the temperature of the air inlet and / or air outlet.

[0046] In one embodiment, the heating chambers 6 of the multiple temperature control units 5 are distributed in a rectangular array, and the multiple connectors 11 are distributed in a rectangular array, with each connector 11 corresponding to one of the multiple temperature control units 5.

[0047] In one embodiment, the connector 11 is a probe, which is connected to the aging board 1 and the tip of the probe abuts against the chip under test to achieve an electrical connection between the aging board 1 and the chip under test.

[0048] In other embodiments, such as Figure 5 As shown, multiple aging plates 1 can be provided, and multiple aging plates 1 are arranged in parallel and spaced apart. Each aging plate 1 has multiple temperature control units 5 arranged in a rectangular array above it. Cold air can flow through the gaps between adjacent aging plates 1 and into each heating chamber 6.

[0049] In one embodiment, a test chamber 4 is also included. The test chamber 4 has a first air vent 42 and a second air vent 43 arranged opposite to each other along a first direction. The first air vent 42 allows cold air to enter the test chamber 4, and the second air vent 43 allows air inside the test chamber 4 to be discharged.

[0050] The aging board 1 and multiple temperature control units 5 are all set in the test chamber 4, with the first direction parallel to the thickness direction of the aging board 1.

[0051] After the cold air enters the test chamber 4 through the first air vent 42, it is dispersed into multiple airflows, which flow into the heating chamber 6 from the air inlets of each temperature control unit 5. The airflow control device 7 of each temperature control unit 5 controls the airflow at the corresponding air inlet. After the cold air exchanges heat with the chip under test in the heating chamber 6, it flows out of the heating chamber 6 from the air outlet. Finally, it is discharged from the test chamber 4 through the second air vent 43.

[0052] In one embodiment, a fan is installed at the first air vent 42, which is used to introduce ambient air into the test chamber 4.

[0053] In one embodiment, a heat exchanger is also included, which is disposed in the second air outlet 43. The heat exchanger is used to exchange heat with the air flowing through the second air outlet 43 to improve the heat dissipation efficiency of the air in the second air outlet 43, so as to facilitate the transformation into relatively cool air at a lower temperature. This cool air can be delivered again from the first air outlet 42 to the test chamber 4.

[0054] In one embodiment, the test box 4 is square, and a vertical plate 41 extending along the length direction of the test box 4 is provided inside the test box 4. The vertical plate 41 is located between the two side plates in the width direction of the test box 4. The bottom end of the vertical plate 41 is connected to the bottom plate of the test box 4, and the top end of the vertical plate 41 supports the top plate of the test box 4 to improve the structural strength of the test box 4.

[0055] In one embodiment, the system also includes a power board 3 and a system board 2. The system board 2 is equipped with a controller, which is communicatively connected to the aging board 1, the temperature detection device, the heating device, and the air volume control device 7. The power board 3 is used to supply power to the aging board 1 and the temperature control unit 5.

[0056] In other embodiments, the airflow control device 7 may consist only of a stepper motor 71 and a rotating component 73, which is rotatably mounted inside the air inlet. The stepper motor 71 is used to directly drive the rotating component 73 to rotate at the air inlet so that the rotating component 73 closes or opens the air inlet.

[0057] In other embodiments, the airflow control device 7 can be a proportional solenoid valve. The controller of the chip aging test device controls the drive circuit of the proportional solenoid valve according to the operating temperature of the chip under test detected by the temperature detection device, so that the valve opens to a corresponding degree. The greater the difference between the operating temperature of the chip under test detected by the temperature detection device and the target temperature, the greater the opening degree of the proportional solenoid valve.

[0058] In other embodiments, the rotating member 73 may include a plurality of rotating blades distributed along a predetermined direction to form a structure resembling a "Venetian blind", the predetermined direction being perpendicular to the rotation axis of the rotating blades and the opening direction of the valve port 74.

[0059] In other embodiments, the temperature detection device may only detect the surface temperature of the chip under test.

[0060] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A chip aging test apparatus, characterized in that, The device includes an aging board (1) and multiple temperature control units (5). The aging board (1) is provided with multiple connectors (11). The temperature control unit (5) includes an airflow control device (7), a heating device, and a temperature detection device. The heating device includes a heating chamber (6) and a heating element. The heating element and the temperature detection device are located in the heating chamber (6). The heating element is used to heat the chip to be tested placed in the heating chamber (6). The temperature detection device is used to detect the operating temperature of the chip to be tested in the heating chamber (6). The heating chamber (6) is provided with an air inlet and an air outlet. The airflow control device (7) is used to adjust the opening of the air inlet. The air inlet allows cold air to enter the heating chamber (6), and the air outlet allows air in the heating chamber (6) to be discharged. Each of the connectors (11) is electrically connected to a chip under test in the heating chamber (6) of a temperature control unit (5) so that the aging board (1) tests the operating parameters of the chip under test at a target temperature.

2. The chip aging test apparatus according to claim 1, characterized in that, The air volume control device (7) includes an air valve structure and a stepper motor (71). The air valve structure includes a base (72) and a rotating component (73). The base (72) is installed at the air inlet. The base (72) is provided with a valve port (74) communicating with the air inlet. The rotating component (73) is rotatably installed in the valve port (74) around an axis. The stepper motor (71) is used to drive the rotating component (73) to rotate in order to adjust the opening of the valve port (74).

3. The chip aging test apparatus according to claim 2, characterized in that, Only one rotating component (73) is provided. The rotating component (73) is rotatably mounted on the base (72) at both ends along its rotation axis. The rotating component (73) is provided with a plurality of communication ports (75) spaced apart along its rotation axis. The rotating component (73) can rotate under the drive of the stepper motor (71) so that the rotating component (73) closes the valve port (74) or the connecting port (75) connects to the valve port (74).

4. The chip aging test apparatus according to claim 1, characterized in that, The temperature detection device includes a first temperature sensor and a second temperature sensor. The first temperature sensor is used to detect the surface temperature of the chip under test in the heating chamber (6), and the second temperature sensor is used to detect the temperature of the air inlet and / or the air outlet.

5. The chip aging test apparatus according to claim 1, characterized in that, The heating chambers (6) of the multiple temperature control units (5) are distributed in a rectangular array, and the multiple connectors (11) are distributed in a rectangular array, with each of the multiple connectors (11) corresponding to one of the multiple temperature control units (5).

6. The chip aging test apparatus according to claim 5, characterized in that, The aging board (1) is provided in multiple ways, and the multiple aging boards (1) are arranged in parallel and spaced apart. Each aging board (1) is provided with multiple temperature control units (5) arranged in a rectangular array above it.

7. The chip aging test apparatus according to claim 5, characterized in that, It also includes a test chamber (4), which has a first air vent (42) and a second air vent (43) arranged opposite to each other along a first direction. The first air vent (42) allows cold air to enter the test chamber (4), and the second air vent (43) allows air inside the test chamber (4) to be discharged. The aging board (1) and the multiple temperature control units (5) are all disposed inside the test chamber (4), with the first direction being parallel to the thickness direction of the aging board (1).

8. The chip aging test apparatus according to claim 7, characterized in that, It also includes a heat exchanger disposed at the second air outlet (43) for exchanging heat with the air flowing through the second air outlet (43).

9. The chip aging test apparatus according to claim 7, characterized in that, The test box (4) is square. Inside the test box (4) is a vertical plate (41) extending along the length direction of the test box (4). The vertical plate (41) is located between the two side plates in the width direction of the test box (4). The bottom end of the vertical plate (41) is connected to the bottom plate of the test box (4), and the top end of the vertical plate (41) supports the top plate of the test box (4).

10. The chip aging test apparatus according to any one of claims 1 to 9, characterized in that, It also includes a power board (3) and a system board (2). The system board (2) is equipped with a controller, which is connected in communication with the aging board (1), the temperature detection device, the heating device and the air volume control device (7). The power board (3) is used to supply power to the aging board (1) and the temperature control unit (5).

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