Heat dissipation structure for spaceflight electronic assembly

Abstract

The utility model belongs to the technical field of spaceflight electronic equipment, and discloses a heat dissipation structure for a spaceflight electronic assembly, which comprises an upper mounting rack and a lower mounting rack, the lower mounting rack is provided with a mounting groove, an electronic assembly body is arranged in the mounting groove, and the electronic assembly body is provided with a heat dissipation hole. The electronic component comprises an electronic component body and a lower mounting rack, a heat conduction layer is arranged at the joint of the electronic component body and the lower mounting rack, a heat dissipation channel is arranged in the heat conduction layer in a penetrating manner, and two ends of the heat dissipation channel are connected with heat dissipation components. The medium circularly flows under the action of heat, the heat is brought to the heat dissipation assembly to be quickly released, the heat dissipation efficiency of the spaceflight electronic assembly in special environments such as vacuum and microgravity can be remarkably improved through the mode that multi-path heat conduction and active heat dissipation are combined, stable operation of devices is guaranteed, and the service life of the spaceflight electronic assembly is prolonged. The structure is light, the heat conduction efficiency is high, and the reliability is high.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of spaceflight electronic equipment, and specifically relates to a heat dissipation structure for spaceflight electronic components. BACKGROUND

[0002] As the core support of aerospace engineering, spaceflight electronic technology covers key fields such as communication, navigation, target identification, remote measurement and remote control, plays a decisive role in the stable operation of spacecraft, and with the complication and refinement of spaceflight tasks, the integration and functional density of spaceflight electronic components continue to improve, accompanied by significant growth in power consumption, and a large amount of heat generated during component operation has become a core bottleneck restricting its performance and reliability.

[0003] Meanwhile, a heat dissipation structure for spaceflight electronic components is disclosed (announced) in CN 220606402 U, which comprises a mounting box, a heat conduction plate is fixed inside the mounting box, a spaceflight electronic component body is fixedly installed on the left side of the heat conduction plate, a water cooling mechanism is arranged on the inner bottom wall of the mounting box, and an air cooling mechanism is arranged on the left side of the mounting box.

[0004] The heat dissipation structure for spaceflight electronic components described above has the structures of air cooling and water cooling during use, but the design of the liquid storage tank occupies the mounting space of the electronic components, cannot adapt to the precise installation of spaceflight electronic equipment, lacks a reinforcing structure for the electronic components, and the mounting rack is prone to horizontal displacement under the vibration environment during spaceflight, resulting in loosening of the fitting state of the electronic components and the heat conduction structure, generation of a contact gap, and influence on the heat dissipation effect.

[0005] Therefore, a heat dissipation structure for spaceflight electronic components is proposed for the above problems. Utility model content

[0006] To solve the problems in the background art, the utility model provides a heat dissipation structure for spaceflight electronic components, which has precise limiting insertion and locking structures of the upper mounting rack and the lower mounting rack, realizes stable fitting and rapid assembly of the electronic components and the heat conduction structure, and combines the multi-path heat conduction of the heat dissipation channel and the heat dissipation component with the active heat dissipation mode, thereby significantly improving the heat dissipation efficiency of the spaceflight electronic components.

[0007] To achieve the above object, the utility model provides the following technical scheme: A heat dissipation structure for spaceflight electronic assembly, including upper mounting frame and lower mounting frame, the lower mounting frame is opened with mounting groove, electronic assembly body is provided with in the mounting groove, the adhesion of electronic assembly body and lower mounting frame is provided with heat conducting layer, the heat conducting layer is inserted with heat dissipation channel, the both ends of heat dissipation channel are connected with heat dissipation assembly, heat dissipation assembly sets up in the outside of lower mounting frame, the side of upper mounting frame towards lower mounting frame is provided with limit boss, the top of upper mounting frame is evenly opened with heat dissipation hole, the four corner edge positions of upper mounting frame and lower mounting frame are provided with locking assembly.

[0008] Preferably, the long side of the mounting groove is provided with a limiting groove matched with the limiting boss, and the upper mounting frame is inserted into the limiting groove through the limiting boss.

[0009] Preferably, the short side of the lower mounting frame is provided with a ventilation opening through the mounting groove, and the both sides of the ventilation opening are provided with through holes matched with the shape of the heat dissipation channel.

[0010] Preferably, the heat dissipation assembly comprises a heat dissipation substrate, a heat exchange pipe, a heat dissipation fin, and a circulating pump, the heat dissipation substrate is fixed at the bottom of the lower mounting frame, the heat exchange pipe and the heat dissipation fin are arranged on the heat dissipation substrate, one end of the heat exchange pipe is sealingly connected with the heat dissipation channel, and the other end is connected with the heat dissipation channel through the circulating pump.

[0011] Preferably, the heat dissipation channel and the heat exchange pipe are both arranged in an S shape, and the inner cavity of the heat dissipation channel is provided with a heat conducting medium.

[0012] Preferably, the locking assembly comprises a positioning screw and a locking sleeve, and the positioning screw is threadedly connected in the locking sleeve.

[0013] Preferably, the four corner edge positions of the upper mounting frame and the lower mounting frame are provided with corresponding positioning holes, and the locking sleeve is fitted below the positioning hole of the upper mounting frame through the positioning hole of the lower mounting frame.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The heat dissipation channel and the heat dissipation assembly are arranged, the heat dissipation channel is provided with a heat conducting medium, the medium forms a circulating flow under the action of heat, and the heat is brought to the heat dissipation assembly for rapid release. Through the combination of multi-path heat conduction and active heat dissipation, the heat dissipation efficiency of the spaceflight electronic assembly in a vacuum, microgravity, and other special environments can be significantly improved, the device can be stably operated, and the utility model has the characteristics of lightweight structure, high heat conduction efficiency, and high reliability.

[0016] 2, the utility model discloses a upper mounting frame and lower mounting frame are set up, after electronic assembly body is placed in the mounting groove, the limiting boss of upper mounting frame and the limiting groove of lower mounting frame mounting groove are inserted accurately, form the positioning constraint, avoid the horizontal displacement of upper and lower mounting frame in the vibration, ensure that the fit state of electronic assembly and heat conduction layer, heat dissipation channel is stable, and through limiting boss and limiting groove can realize quick positioning alignment, need not repeatedly calibrate, improve assembly efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is whole structure schematic diagram of the utility model;

[0018] Figure 2 It is upper mounting frame structure schematic diagram of the utility model;

[0019] Figure 3 It is lower mounting frame structure schematic diagram of the utility model;

[0020] Figure 4 It is heat dissipation assembly structure schematic diagram of the utility model;

[0021] Figure 5 It is locking assembly structure schematic diagram of the utility model.

[0022] In the drawing: 1, upper mounting frame;2, lower mounting frame;3, mounting groove;4, electronic assembly body;5, heat conduction layer;6, heat dissipation channel;

[0023] 7, heat dissipation assembly;71, heat dissipation base plate;72, heat exchange pipe;73, heat dissipation fin;74, circulating pump;

[0024] 8, limiting boss;9, heat dissipation hole;

[0025] 10, locking assembly;101, positioning screw;102, locking screw sleeve;

[0026] 11, limiting groove;12, vent. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the utility model.

[0028] The embodiments of the utility model will be described below according to the whole structure of the utility model.

[0029] As Figures 1 to 5As shown, the utility model provides a heat dissipation structure for spaceflight electronic assembly, including upper mounting frame 1 and lower mounting frame 2, and is equipped with installation groove 3 on lower mounting frame 2, and electronic assembly body 4 is arranged in installation groove 3, and the appearance of installation groove 3 and electronic assembly body 4 is adapted, ensures that component position is limited, and the abutment of electronic assembly body 4 and lower mounting frame 2 is provided with heat conduction layer 5, is used for the heat generated in working process even conduction to heat dissipation channel 6, and heat dissipation channel 6 is inserted in heat conduction layer 5, and heat dissipation channel 6 is connected with heat dissipation assembly 7 at both ends, and heat dissipation channel 6 is provided with heat conduction medium, and the medium forms circulation flow under the action of heat, and heat is taken to heat dissipation assembly 7 and is released quickly, and heat dissipation assembly 7 is arranged on the outside of lower mounting frame 2, and the side of upper mounting frame 1 towards lower mounting frame 2 is provided with limit boss 8, and the top of upper mounting frame 1 is evenly provided with heat dissipation hole 9, and the four corner edge positions of upper mounting frame 1 and lower mounting frame 2 are provided with locking assembly 10, and the locking of upper mounting frame 1 and lower mounting frame 2 is fixed.

[0030] Further, the long edge of the installation groove 3 is provided with a limiting groove 11 matched with the limiting boss 8, the upper mounting frame 1 is inserted into the limiting groove 11 through the limiting boss 8, and the upper mounting frame is inserted into the limiting groove 11 of the lower mounting frame 2 through the limiting boss 8, so that the positioning and alignment of the upper and lower mounting frames are realized, and the limiting boss 8 presses the edge of the electronic assembly body 4, thereby ensuring the close contact between the electronic assembly body 4 and the abutting surface of the lower mounting frame 2.

[0031] The short edge of the lower mounting frame 2 is provided with a ventilation opening 12 communicated with the installation groove 3, and the both sides of the ventilation opening 12 are provided with through holes matched with the shape of the heat dissipation channel 6, the ventilation opening 12 of the short edge of the lower mounting frame 2 is communicated with the installation groove 3, and the heat dissipation holes 9 evenly arranged on the top of the upper mounting frame 1 can quickly discharge the hot air generated on the surface of the electronic assembly, thereby improving the active heat dissipation effect of the electronic assembly.

[0032] The heat dissipation assembly 7 includes a heat dissipation base plate 71, a heat exchange pipe 72, a heat dissipation fin 73, and a circulating pump 74, the heat dissipation base plate 71 is fixed on the bottom of the lower mounting frame 2, the heat exchange pipe 72 and the heat dissipation fin 73 are arranged on the heat dissipation base plate 71, one end of the heat exchange pipe 72 is sealingly connected with the heat dissipation channel 6, and the other end is connected with the heat dissipation channel 6 through the circulating pump 74, the heat generated when the electronic assembly body 4 works is transmitted to the heat dissipation channel 6 through the heat conduction layer 5, the heat dissipation channel 6 is filled with heat conduction medium, the transmitted heat is absorbed by the heat conduction medium, the circulating pump 74 in the heat dissipation assembly 7 is started, the high-temperature heat conduction medium in the heat dissipation channel 6 is driven to flow, and the high-temperature heat conduction medium is transported to the heat exchange pipe 72 through the heat dissipation channel 6.

[0033] The heat dissipation channel 6 and the heat exchange pipe 72 are both arranged in an S-shaped coil, and the inner cavity of the heat dissipation channel 6 is provided with a heat conducting medium. The S-shaped structure prolongs the flow path of the heat conducting medium in the heat dissipation channel 6 and the heat exchange pipe 72, increases the contact time with the heat conducting layer 5 and the heat dissipation substrate 71, and the heat exchange is more sufficient.

[0034] The locking assembly 10 comprises a positioning screw 101 and a locking nut 102, the positioning screw 101 is threadedly connected in the locking nut 102, the four corner edge positions of the upper mounting frame 1 and the lower mounting frame 2 are provided with corresponding positioning holes, the locking nut 102 is fitted below the positioning hole of the upper mounting frame 1 through the positioning hole of the lower mounting frame 2, after the locking nut 102 is fitted below the positioning hole of the upper mounting frame 1 through the positioning hole of the lower mounting frame 2, the positioning screw 101 is threadedly connected in the locking nut 102, the axial pressure is applied by tightening the screw, the upper and lower mounting frames are firmly locked, and finally the stable fixation of the electronic component body 4 is realized.

[0035] The working principle and process of the heat dissipation structure for the aerospace electronic component are as follows: when the electronic component is installed, the electronic component body 4 is placed in the mounting groove 3 of the lower mounting frame 2, the size of the mounting groove 3 is matched with the electronic component body 4, and the component position is limited; the side of the upper mounting frame 1 facing the lower mounting frame 2 is provided with a limiting boss 8, the upper mounting frame 1 is inserted into the limiting groove 11 of the lower mounting frame 2 through the limiting boss 8, the positioning and alignment of the upper and lower mounting frames are realized, at the same time, the limiting boss 8 compresses the edge of the electronic component body 4, ensures the close contact between the electronic component body 4 and the fitting surface of the lower mounting frame 2, then the locking nut 102 is fitted below the positioning hole of the upper mounting frame 1 through the positioning hole of the lower mounting frame 2, the positioning screw 101 is threadedly connected in the locking nut 102, the axial pressure is applied by tightening the screw, the upper and lower mounting frames are firmly locked, and finally the stable fixation of the electronic component body 4 is realized, the heat generated by the electronic component body 4 during work is transmitted to the heat dissipation channel 6 through the heat conducting layer 5, the inner cavity of the heat dissipation channel 6 is filled with a heat conducting medium, the transmitted heat is absorbed by the heat conducting medium, the circulating pump 74 in the heat dissipation assembly 7 is started, the flow of the heat-absorbed high-temperature heat conducting medium in the heat dissipation channel 6 is driven, the high-temperature heat conducting medium is transported into the heat exchange pipe 72 through the heat dissipation channel 6, the heat dissipation fins 73 are vertically arranged on the heat dissipation substrate 71 and fitted on the outer side of the heat exchange pipe 72, which greatly expands the heat dissipation area, realizes the rapid heat dissipation of the electronic component, at the same time, the ventilation openings 12 are provided on the short edges of the lower mounting frame 2 and communicate with the mounting groove 3, and the heat dissipation holes 9 are uniformly provided on the top of the upper mounting frame 1, which can quickly exhaust the hot air generated on the surface of the electronic component, and improve the active heat dissipation effect of the electronic component.

[0036] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0037] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for space electronic assemblies comprising an upper mounting frame (1) and a lower mounting frame (2), characterized in that: The lower mounting frame (2) is provided with a mounting groove (3), and the mounting groove (3) is provided with an electronic component body (4). The electronic component body (4) is provided with a heat conduction layer (5) at the abutting position with the lower mounting frame (2). The heat conduction layer (5) is provided with a heat dissipation channel (6). The heat dissipation channel (6) is connected with a heat dissipation component (7) at both ends. The heat dissipation component (7) is arranged outside the lower mounting frame (2). The upper mounting frame (1) is provided with a limiting boss (8) on the side facing the lower mounting frame (2). The upper mounting frame (1) is uniformly provided with a heat dissipation hole (9) on the top. The upper mounting frame (1) and the lower mounting frame (2) are provided with a locking component (10) at the four corner edge positions.

2. The heat dissipation structure for space electronic components according to claim 1, wherein: The long side of the mounting groove (3) is provided with a limiting groove (11) matched with the limiting boss (8). The upper mounting frame (1) is inserted into the limiting groove (11) through the limiting boss (8).

3. The heat dissipation structure for space electronic components according to claim 2, wherein: The short side of the lower mounting frame (2) is provided with a ventilation opening (12) penetrating the mounting groove (3). The ventilation opening (12) is provided with a through hole matched with the shape of the heat dissipation channel (6) on both sides.

4. The heat dissipation structure for space electronic components according to claim 3, wherein: The heat dissipation component (7) comprises a heat dissipation base plate (71), a heat exchange pipe (72), a heat dissipation fin (73) and a circulating pump (74). The heat dissipation base plate (71) is fixed at the bottom of the lower mounting frame (2). The heat exchange pipe (72) and the heat dissipation fin (73) are arranged on the heat dissipation base plate (71). One end of the heat exchange pipe (72) is sealingly connected with the heat dissipation channel (6), and the other end is connected with the heat dissipation channel (6) through the circulating pump (74).

5. The heat dissipation structure for space electronic components according to claim 4, wherein: The heat dissipation channel (6) and the heat exchange pipe (72) are both arranged in an S-shaped coil. The inner cavity of the heat dissipation channel (6) is provided with a heat conduction medium.

6. The heat dissipation structure for space electronic components according to claim 5, wherein: The locking component (10) comprises a positioning screw (101) and a locking screw sleeve (102). The positioning screw (101) is threadedly connected in the locking screw sleeve (102).

7. The heat dissipation structure for space electronic components according to claim 6, wherein: The upper mounting frame (1) and the lower mounting frame (2) are provided with corresponding positioning holes at the four corner edge positions. The locking screw sleeve (102) passes through the positioning hole of the lower mounting frame (2) and is abutted below the positioning hole of the upper mounting frame (1).

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