LED packaging structure with high brightness and low energy efficiency

Abstract

The utility model discloses an LED packaging structure with high brightness and low energy efficiency, which comprises a substrate and a support integrally formed by a bowl cup, a silver coating is arranged on the support, a first electrode area and a second electrode area which are used for placing a flip chip are arranged on the substrate where an area surrounded by the bowl cup is located, and the first electrode area and the second electrode area are arranged on the support. The bowl cup where the periphery of the flip chip is located is filled with a white glue layer, the white glue layer covers the silver plating layer, and a fluorescent glue layer covering the flip chip and the white glue layer is arranged in the bowl cup. The application of the white glue layer can play a good role in protecting the silver coating, the reliability is good, the anti-vulcanization and anti-light-decay performances are improved, the brightness can be improved by about 5%, and the cost is reduced; more stable reliability is achieved by adopting the flip-chip technology, and energy consumption can be remarkably reduced through the flip-chip; and the fluorescent glue layer is used for packaging, so that the overall luminance is improved.

Description

Technical Field

[0001] This utility model belongs to the field of LED lamp bead technology and relates to a high-brightness, low-energy-efficiency LED packaging structure. Background Technology

[0002] With the continued expansion of the medium-to-high power TV backlight LED market, replacement demand has become a new opportunity for market development. Against this backdrop, brightness, as a crucial indicator of product performance, is becoming the focus of market competition, prompting the emergence of ultra-high brightness TV products. However, the energy efficiency issues of current TV models are becoming increasingly prominent; high energy consumption not only increases operating costs but also hinders energy conservation and emission reduction.

[0003] From a technical perspective, existing LED packaging structures have reached their limits in terms of brightness improvement, making it difficult to meet market demands for higher brightness products. At the same time, the high energy consumption of LED chips and reliability issues under prolonged loads also limit the further application and promotion of these products. Therefore, how to reduce energy consumption and improve product reliability while maintaining brightness has become a pressing technical challenge. Utility Model Content

[0004] The purpose of this invention is to provide a high-brightness, low-energy-efficiency LED packaging structure to solve the problems mentioned in the background art.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A high-brightness, low-efficiency LED packaging structure includes a substrate and a cup-shaped support integrally formed with a silver-plated layer on the support. The substrate, where the cup-shaped support is located, has a first electrode area and a second electrode area for placing a flip chip. The cup-shaped support surrounding the flip chip is filled with a white adhesive layer, which covers the silver-plated layer. A fluorescent adhesive layer covering the flip chip and the white adhesive layer is disposed inside the cup-shaped support.

[0007] As a further improvement of one embodiment of the present invention, the flip chip is die bonded to the first electrode region and the second electrode region by solder paste.

[0008] As a further improvement of one embodiment of the present invention, the upper surface of the white adhesive layer is flush with the upper surface of the flip chip.

[0009] As a further improvement of one embodiment of this utility model, the length of the substrate is set in the range of 2.6 to 3.4 mm, the width of the substrate is set in the range of 2.6 to 3.4 mm, and the height of the substrate is set in the range of 0.5 to 0.7 mm. Preferably, the length, width, and height of the substrate are 3 mm * 3 mm * 0.6 mm, respectively.

[0010] By using the technical scheme, the following beneficial effects are achieved: the application of the white adhesive layer can provide good protection for the silver plating layer, the reliability is good, the anti-sulfuration and light decay performance is improved, the brightness is improved by about 5%, and the cost is reduced; the flip technology has more stable reliability, and the flip chip can significantly reduce energy consumption; the fluorescent adhesive layer is used for packaging, and the overall luminous brightness is improved. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only exemplary, and for those skilled in the art, other drawings can be derived from the provided drawings without creative labor.

[0012] The structures, proportions, sizes, etc. shown in the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present application, so they do not have technical substantive significance. Any modification of structure, change of proportion relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application.

[0013] Fig. 1 The structural schematic diagram provided by the present application is provided.

[0014] Fig. 2 The top view schematic diagram provided by the present application is provided.

[0015] In the figure:

[0016] 1-substrate;

[0017] 2-bowl cup;

[0018] 3-flip chip;

[0019] 4-white adhesive layer;

[0020] 5-fluorescent adhesive layer. DETAILED DESCRIPTION

[0021] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0023] In the utility model, in the case where no contrary illustration is made, the orientation words such as '' upper, lower, top, bottom '' used are generally for the direction shown in the drawing or for the vertical, perpendicular or gravity direction of the component itself; similarly, for the convenience of understanding and description, '' inner, outer '' refers to the inner and outer of the contour of each component itself, but the above-mentioned orientation words are not used to limit the utility model.

[0024] Embodiment

[0025] Reference Figs. 1-2 As shown in the figure, a high-brightness low-energy LED packaging structure, including the bracket of the base plate 1 and the bowl cup 2 integrated, the bracket is provided with silver plating layer, to enhance the light reflection efficiency, so as to improve the brightness of LED. In the bowl cup enclosed area of the base plate 2, the first electrode area and the second electrode area specially designed for flip chip 3 are arranged, which is convenient for stable connection and current transmission of the chip. The flip chip 3 is fixed on the first electrode area and the second electrode area by the tin paste. The bowl cup filled with white glue layer 4 is arranged in the periphery of the flip chip 3, which ensures the stability of the structure. The white glue layer 4 is covered on the silver plating layer, which plays a good protective role on the silver plating layer, and the reliability is good. The bowl cup 2 is provided with a fluorescent glue layer 5 covering the flip chip 3 and the white glue layer 4. Through the fluorescent glue layer 5, not only the light emitting efficiency of LED is improved, but also the uniform distribution of light is ensured.

[0026] In the embodiment, the upper end surface of the white glue layer 4 is flush with the upper end surface of the flip chip 3. This design not only helps to improve the overall flatness of the LED packaging structure, but also helps to optimize the light propagation path, reduce the reflection and refraction loss of light inside the packaging structure, and the luminous flux will also be greatly improved, thereby improving the light emitting efficiency of LED.

[0027] Specifically, the size of the base plate 1 in the embodiment is carefully considered. The length of the base plate 1 is set to be 2.6-3.4mm, which ensures that the base plate can provide sufficient support area in the packaging structure, and also avoids the inconvenience caused by too large volume. Similarly, the width of the base plate 1 is also set to be 2.6-3.4mm, which is matched with the length, and together maintains the stability of the base plate. The height of the base plate is set to be 0.5-0.7mm, which not only ensures sufficient thickness to withstand the pressure in the packaging process, but also avoids the influence of too high height on the overall size of the packaging structure.

[0028] Further, the 3.0*3.0*0.6mm specification substrate 1 is selected for packaging, the tin paste is matched with the flip chip for die bonding, the appropriate temperature is selected for reflow, the thrust detection and wafer melting cavity state are perfect after reflow. The empty area is filled with white glue, the white glue in the support is completely filled in the bottom plating area by using centrifugal process, 80° / 30min baking is carried out, the fluorescent powder is matched with glue for dispensing process, the dispensing amount is concave, and finally the finished LED lamp bead is obtained by using the oven for long baking packaging.

[0029] The utility model discloses based on the basis of flip chip, fill in the white glue layer by SMC, EMC white glue, thereby to silver plating layer play good protection function, improve the anti -sulfuration, the anti -light decay performance simultaneously, can improve brightness about 5 simultaneously, reduced cost.

[0030] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor should belong to the range of protection of the utility model.

[0031] It is to be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, work, device, component and / or combination thereof.

[0032] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein.

[0033] The above only describes the preferred embodiments of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model shall be included in the protection scope of the utility model.

Claims

1. A high-brightness, low-energy-efficiency LED packaging structure, characterized in that: The bracket is integrally formed with a substrate and a bowl cup, the bracket is provided with a silver plating layer, the substrate where the bowl cup enclosing area is located is provided with a first electrode area and a second electrode area for placing a flip chip, the periphery of the flip chip is filled with a white glue layer in the bowl cup, the white glue layer covers the silver plating layer, and the bowl cup is provided with a fluorescent glue layer covering the flip chip and the white glue layer.

2. The LED package structure of claim 1, wherein: The flip chip is fixed by tin paste on the first electrode area and the second electrode area.

3. The LED package structure of claim 1, wherein: The upper end surface of the white glue layer is flush with the upper end surface of the flip chip.

4. The LED package structure of claim 1, wherein: The length of the substrate is set in a range of 2.6-3.4 mm, the width of the substrate is set in a range of 2.6-3.4 mm, and the height of the substrate is set in a range of 0.5-0.7 mm.

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