Pixel packaging structure and display panel

Abstract

The utility model discloses a pixel packaging structure and a display panel, the pixel packaging structure comprises a carrier plate, a plurality of light-emitting chips and an integrated circuit unit, the carrier plate is provided with a plurality of pixel areas, and the distances between the centers of the adjacent pixel areas are equal; the plurality of light-emitting chips at least have three light-emitting colors, and the light-emitting chips with at most two light-emitting colors are arranged on the same pixel area; the integrated circuit unit is arranged on the carrier plate and is electrically connected with the light-emitting chip. Due to the fact that the light-emitting chips with at most two light-emitting colors are arranged on the same pixel area, the number of the light-emitting chips in a single pixel area can be reduced, the pixel areas can be controlled to be matched through the integrated circuit unit to achieve the original light-emitting effect, and finally the effect of reducing the manufacturing cost is achieved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a pixel packaging structure and a display panel. BACKGROUND

[0002] At present, a traditional light-emitting diode (LED) single pixel packaging structure controlled by a micro integrated circuit generally comprises three LED chips. The micro integrated circuit can control the three LED chips to realize the light-emitting logic of the traditional LED single pixel packaging structure according to the gray scale data from a system. Since the traditional LED single pixel packaging structure needs at least three LED chips, the cost of the LED single pixel packaging structure is difficult to reduce. CONTENT OF THE UTILITY MODEL

[0003] The present application aims to provide a pixel packaging structure and a display panel, and aims to solve the cost problem of the traditional LED single pixel packaging structure.

[0004] A first aspect of the present application embodiment provides a pixel packaging structure, comprising: a carrier plate, a plurality of pixel regions are arranged on the carrier plate, and the center-to-center distances of adjacent pixel regions are equal; a plurality of light-emitting chips, the plurality of light-emitting chips have at least three light-emitting colors, and at most two light-emitting chips of the light-emitting colors are arranged on the same pixel region; an integrated circuit unit, the integrated circuit unit is arranged on the carrier plate, and the integrated circuit unit is electrically connected with the light-emitting chips.

[0005] In one embodiment, the plurality of pixel regions are arranged in a matrix, and the light-emitting chips in the plurality of pixel regions in the same column and / or the same row include light-emitting chips of at least three light-emitting colors.

[0006] In one embodiment, the light-emitting chips in the pixel regions in the same column are arranged in a first straight line direction in sequence; or, the light-emitting chips in the pixel regions in the same row are arranged in a second straight line direction in sequence.

[0007] In one embodiment, the pixel regions include a first pixel region and a second pixel region; the light-emitting chips include first light-emitting chips, second light-emitting chips and third light-emitting chips of different light-emitting colors; the first light-emitting chips and the second light-emitting chips are arranged on the first pixel region, and the second light-emitting chips and the third light-emitting chips are arranged on the second pixel region.

[0008] In one embodiment, the pixel packaging structure includes two first pixel regions and two second pixel regions, and the two first pixel regions and the two second pixel regions are arranged in a matrix of two rows and two columns.

[0009] In one embodiment, one of the first pixel regions and one of the second pixel regions are arranged in the same row of the pixel packaging structure; one of the first pixel regions and one of the second pixel regions are arranged in the same column of the pixel packaging structure.

[0010] In one embodiment, the pixel regions include a third pixel region, a fourth pixel region, and a fifth pixel region; the light emitting chips include first light emitting chips, second light emitting chips, and third light emitting chips with different light emitting colors; the first light emitting chips are arranged on the third pixel regions, the second light emitting chips are arranged on the fourth pixel regions, and the third light emitting chips are arranged on the fifth pixel regions.

[0011] In one embodiment, the pixel packaging structure includes three third pixel regions, three fourth pixel regions, and three fifth pixel regions, which are arranged in a matrix of three rows and three columns.

[0012] In one embodiment, the three third pixel regions are arranged in a first row of the pixel packaging structure, the three fourth pixel regions are arranged in a second row of the pixel packaging structure, and the three fifth pixel regions are arranged in a third row of the pixel packaging structure.

[0013] A second aspect of an embodiment of the present application provides a display panel including a plurality of pixel packaging structures as described above.

[0014] Compared with the prior art, the embodiment of the present application has the beneficial effect that the number of light emitting chips in a single pixel region can be reduced because at most two light emitting chips with different light emitting colors are arranged on the same pixel region, and a plurality of pixel regions can be controlled to emit light to present an image by an integrated circuit unit, thereby achieving the effect of reducing manufacturing cost. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A schematic diagram of a pixel packaging structure provided by an embodiment of the present application;

[0016] Figure 2 Another schematic diagram of a pixel packaging structure provided by an embodiment of the present application;

[0017] Figure 3 Still another schematic diagram of a pixel packaging structure provided by an embodiment of the present application;

[0018] Figure 4 A schematic diagram of a driving circuit provided by an embodiment of the present application;

[0019] Figure 5Another schematic view of the pixel packaging structure provided by an embodiment of the present application is shown.

[0020] Figure 6 Another schematic view of the pixel packaging structure provided by an embodiment of the present application is shown.

[0021] Figure 7 Another schematic view of the pixel packaging structure provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0022] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0024] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0025] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0026] Figure 1 A schematic view of a pixel packaging structure provided by an embodiment of the present application is shown. For ease of illustration, only parts related to the present embodiment are shown, and are described in detail as follows:

[0027] A pixel packaging structure 10 includes a carrier board 100, a plurality of light emitting chips 300 and an integrated circuit unit 400.

[0028] As Figure 1 , Figure 2As shown, a plurality of pixel regions 200 are arranged on the carrier board 100, and the center-to-center distance between adjacent pixel regions 200 is equal. The plurality of light emitting chips 300 have at least three light emitting colors, and at most two light emitting chips 300 of the same light emitting color are arranged on the same pixel region 200. An integrated circuit unit 400 is arranged on the carrier board 100, and the integrated circuit unit 400 is electrically connected to the light emitting chips 300. For example, one or two light emitting chips 300 of the same light emitting color are arranged on a single pixel region 200, and light emitting chips 300 of different light emitting colors are arranged on different pixel regions 200, so that the entire pixel packaging structure 10 has at least three light emitting colors. Exemplarily, the at least three light emitting colors can include red, green, and blue, and can also include other colors, such as yellow, white, etc.

[0029] Since at most two light emitting chips 300 of the same light emitting color are arranged on the same pixel region 200, the number of light emitting chips 300 in a single pixel region 200 can be reduced, and the original light emitting effect can be achieved by cooperation between the plurality of pixel regions 200 through the integrated circuit unit 400, so that the manufacturing cost is ultimately reduced.

[0030] The integrated circuit unit 400 can specifically include a corresponding driving chip.

[0031] It can be understood that one pixel region 200 corresponds to one conventional pixel unit, and at least three light emitting chips 300 of different light emitting colors are required in a conventional pixel unit. In the present embodiment, the cooperation of at least three light emitting colors can be achieved by cooperation of light mixing of adjacent pixel regions 200, so that the missing light emitting color of a single pixel region 200 is compensated. For example, when a pixel region 200 is missing a red light emitting chip 300, the missing red light of the pixel region 200 can be compensated by the red light emitting chip of another pixel region 200 of the same pixel packaging structure 10.

[0032] The light emitting chip 300 and the integrated circuit unit 400 can be fixed on the same surface of the carrier board 100 by bonding, or can be fixed on different surfaces of the carrier board 100.

[0033] In some embodiments, one pixel region 200 can include a plurality of first color light emitting chips 300 and a plurality of second color light emitting chips 300. For example, two first color light emitting chips 300 and two second color light emitting chips 300 can be included, and various color light emitting chips 300 can be arranged according to actual needs.

[0034] In some embodiments, the area of the pixel packaging structure 10 is between 50 μm*50 μm and 5 mm*5 mm.

[0035] In an embodiment, the plurality of pixel regions 200 are arranged in a matrix, and the light emitting chips 300 in the pixel regions 200 in the same column and / or the same row include at least three light emitting chips 300 of different light emitting colors.

[0036] It should be noted that for a single pixel, at least three light sources of red, green and blue colors are generally needed in one pixel to obtain any color.

[0037] In the case where each pixel region 200 includes at most two light emitting chips 300 of different light emitting colors, at least three light emitting chips 300 of different colors are included in the four light emitting chips 300 in the pixel regions 200 in the same column and / or the same row. Therefore, any pixel region 200 of the embodiment can cooperate with the light emitting chips 300 in the adjacent pixel region 200 to obtain the desired color. For example, if a red light emitting chip and a green light emitting chip are included in a pixel region 200, the red light emitting chip and the green light emitting chip can cooperate with a blue light emitting chip in the adjacent pixel region 200 to emit light to obtain the desired color.

[0038] Compared with the conventional pixel array of two rows and two columns which needs 12 light sources, the pixel regions 200 of two rows and two columns of the embodiment need at least only 6 to 8 light emitting chips 300, and the embodiment has lower cost.

[0039] In an embodiment, the light emitting chips 300 in the pixel regions 200 in the same column are arranged in a first linear direction in sequence; or the light emitting chips 300 in the pixel regions 200 in the same row are arranged in a second linear direction in sequence.

[0040] The first linear direction and the second linear direction can be perpendicular to each other.

[0041] In the case where each pixel region 200 includes two light emitting chips 300, it can be understood that if the light emitting chips 300 in the pixel regions 200 in the same column are arranged in a first linear direction in sequence, in the pixel regions 200 of two rows and two columns, the eight light emitting chips 300 in the four pixel regions 200 can be arranged in a square matrix of four rows and two columns.

[0042] In an embodiment, as shown in Figure 3 The pixel region 200 includes a first pixel region 210 and a second pixel region 220; the light emitting chips 300 include first light emitting chips 310, second light emitting chips 320 and third light emitting chips 330 of different light emitting colors; the first light emitting chips 310 and the second light emitting chips 320 are arranged on the first pixel region 210, and the second light emitting chips 320 and the third light emitting chips 330 are arranged on the second pixel region 220.

[0043] In the case that the light emitting colors of the first light emitting chip 310, the second light emitting chip 320 and the third light emitting chip 330 are red, green and blue respectively, only one first pixel region 210 and one second pixel region 220 are needed to collect the three color light emitting chips 300, and the required light emitting color can be obtained through the cooperation of the four light emitting chips 300 in the two pixel regions 200.

[0044] In some embodiments, the first light emitting chip 310, the second light emitting chip 320 and the third light emitting chip 330 can be red LED chips, green LED chips and blue LED chips respectively.

[0045] In an embodiment, the pixel packaging structure 10 includes two first pixel regions 210 and two second pixel regions 220, and the two first pixel regions 210 and the two second pixel regions 220 are distributed in a matrix of two rows and two columns.

[0046] In an embodiment, one pixel packaging structure 10 includes two red LED chips, four green LED chips and two blue LED chips.

[0047] In an embodiment, the integrated circuit unit 400 is arranged in the middle of the four pixel regions 200.

[0048] It can be understood that each pixel region 200 can contain 1 / 4 of the integrated circuit unit 400. The specific position of the integrated circuit unit 400 can be set according to actual needs.

[0049] One integrated circuit unit 400 can drive eight light emitting chips 300 (including two red LED chips, four green LED chips and two blue LED chips) at the same time. The light emitting chips 300 can adopt a common cathode or common anode conduction mode.

[0050] As shown in FIG. 4, in one pixel packaging structure 10, the light emitting chips D1-D8 can adopt a common cathode conduction mode. Figure 4

[0051] In some embodiments, the integrated circuit unit 400 can determine the light emitting gray scale of the pixel packaging structure 10 based on the control signal, and then control the corresponding light emitting of each light emitting chip 300 according to the light emitting gray scale.

[0052] ​The control signal includes at least one timing signal and at least one data signal. The timing signal and the data signal can be pulse width modulation (PWM) signals. The integrated circuit unit 400 can determine the gray scale of the pixel packaging structure 10 according to the repetition frequency of the data signal. The repetition frequency of the data signal ranges from 1 MHz to 50 MHz, the high level ranges from 0.8 V to 8 V, and the low level ranges from 0 V to 0.2 V.

[0053] In an embodiment, one first pixel region 210 and one second pixel region 220 are arranged in the same row of the pixel packaging structure 10, and one first pixel region 210 and one second pixel region 220 are arranged in the same column of the pixel packaging structure 10. That is, two first pixel regions 210 are arranged at diagonal positions of the matrix, and two second pixel regions 220 are arranged at diagonal positions of the matrix.

[0054] Any one pixel region 200 of the embodiment can cooperate with the adjacent pixel region 200 to obtain the required light-emitting color. When viewed from both sides of the pixel packaging structure 10, the first pixel region 210 and the second pixel region 220 are staggered, and the two side edges of the pixel packaging structure 10 will not appear colorless.

[0055] In an embodiment, the four light-emitting chips 300 in the two pixel regions 200 in the same column are arranged in a first straight line direction. Alternatively, the four light-emitting chips 300 in the two pixel regions 200 in the same row are arranged in a second straight line direction. The first straight line direction and the second straight line direction can be perpendicular to each other.

[0056] When the four light-emitting chips 300 in the two pixel regions 200 in the same column are arranged in the first straight line direction, it can be understood that the eight light-emitting chips 300 in the four pixel regions 200 can be distributed in a square matrix of four rows and two columns.

[0057] When the four light-emitting chips 300 in the two pixel regions 200 in the same row are arranged in the second straight line direction, it can be understood that the eight light-emitting chips 300 in the four pixel regions 200 can be distributed in a square matrix of two rows and four columns.

[0058] In an embodiment, as shown in FIG. 2, the four light-emitting chips 300 in the two pixel regions 200 in the same column are arranged in the first straight line direction, and the four light-emitting chips 300 in the two pixel regions 200 in the same row are arranged in the second straight line direction. Figure 5As shown, pixel region 200 includes third pixel region 230, fourth pixel region 240 and fifth pixel region 250; light-emitting chip 300 includes first light-emitting chip 310, second light-emitting chip 320 and third light-emitting chip 330 with different light-emitting colors; first light-emitting chip 310 is disposed on third pixel region 230, second light-emitting chip 320 is disposed on fourth pixel region 240 and third light-emitting chip 330 is disposed on fifth pixel region 250.

[0059] Unlike the above embodiments, this embodiment uses three pixel regions 200 to cooperate with each other to achieve pixel color compensation and obtain the desired color.

[0060] In one embodiment, such as Figure 5 As shown, the pixel encapsulation structure 10 includes three third pixel regions 230, three fourth pixel regions 240 and three fifth pixel regions 250, which are arranged in a matrix of three rows and three columns.

[0061] Compared to the traditional twenty-seven light sources for nine pixels, the nine-pixel area 200 of this embodiment only requires nine light-emitting chips 300, resulting in lower cost.

[0062] In one embodiment, such as Figure 5 As shown, three third pixel regions 230 are arranged in the first row of the pixel encapsulation structure 10, three fourth pixel regions 240 are arranged in the second row of the pixel encapsulation structure 10, and three fifth pixel regions 250 are arranged in the third row of the pixel encapsulation structure 10.

[0063] It is understandable that in the actual operation of a pixel encapsulation structure 10, the nine pixel regions 200 can cooperate with each other to obtain the desired color. For example, the nine pixel regions 200 can emit light in columns.

[0064] One integrated circuit unit 400 can simultaneously drive the light-emitting chips 300 in nine pixel areas 200.

[0065] like Figure 6 As shown, the light-emitting chips D9 to D17 can adopt a common cathode conduction mode.

[0066] Figure 7 A schematic diagram of a display panel according to an embodiment of this application is shown. For ease of explanation, only the parts relevant to this embodiment are shown, and the details are as follows:

[0067] The display panel 20 comprises a plurality of pixel packaging structures 10 as any one of the above embodiments, and the plurality of pixel packaging structures 10 can be distributed in a square matrix. It can be understood that the plurality of pixel packaging structures 10 can also be distributed in other forms, for example, staggered distribution of adjacent rows or adjacent columns.

[0068] The number of rows and columns of the square matrix can be set according to actual needs.

[0069] It can be clearly understood by those skilled in the art that, for the convenience and brevity of description, only the above-mentioned division of each functional unit and module is exemplified, and in actual application, the above-mentioned functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of software functional unit. In addition, the specific names of each functional unit and module are only for easy distinction, and do not limit the protection scope of the application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

[0070] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0071] The above-described embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A pixel packaging structure, characterized in that, The pixel packaging structure comprises: a carrier plate, a plurality of pixel regions are arranged on the carrier plate, and the center-to-center distance between adjacent pixel regions is equal; a plurality of light-emitting chips, the plurality of light-emitting chips have at least three light-emitting colors, and at most two light-emitting chips of the same light-emitting color are arranged on the same pixel region; an integrated circuit unit, the integrated circuit unit is arranged on the carrier plate, and the integrated circuit unit is electrically connected with the light-emitting chips.

2. The pixel packaging structure of claim 1, wherein the plurality of pixel regions are arranged in a matrix, and the light-emitting chips in the plurality of pixel regions in the same column and / or the same row include light-emitting chips of at least three light-emitting colors.

3. The pixel package structure of claim 2, wherein, The light-emitting chips in the pixel regions in the same column are arranged in a first linear direction in sequence. Alternatively, the light-emitting chips in the pixel regions in the same row are arranged in a second linear direction in sequence.

4. The pixel encapsulation structure according to any one of claims 1 to 3, wherein, The pixel regions include first pixel regions and second pixel regions. The light-emitting chips include first light-emitting chips, second light-emitting chips, and third light-emitting chips of different light-emitting colors. The first light-emitting chips and the second light-emitting chips are arranged on the first pixel regions, and the second light-emitting chips and the third light-emitting chips are arranged on the second pixel regions.

5. The pixel package structure of claim 4, wherein, The pixel packaging structure includes two first pixel regions and two second pixel regions, and the two first pixel regions and the two second pixel regions are arranged in a matrix of two rows and two columns.

6. The pixel package structure of claim 5, wherein, The pixel packaging structure includes two first pixel regions and two second pixel regions, and the two first pixel regions and the two second pixel regions are arranged in a matrix of two rows and two columns. The pixel packaging structure includes two first pixel regions and two second pixel regions, and the two first pixel regions and the two second pixel regions are arranged in a matrix of two rows and two columns.

7. The pixel encapsulation structure of any of claims 1 to 3, wherein, The pixel regions include third pixel regions, fourth pixel regions, and fifth pixel regions. The light-emitting chips include first light-emitting chips, second light-emitting chips, and third light-emitting chips of different light-emitting colors. The first light-emitting chips are arranged on the third pixel regions, the second light-emitting chips are arranged on the fourth pixel regions, and the third light-emitting chips are arranged on the fifth pixel regions.

8. The pixel package structure of claim 7, wherein, The pixel packaging structure includes three third pixel regions, three fourth pixel regions, and three fifth pixel regions, and the three third pixel regions, the three fourth pixel regions, and the three fifth pixel regions are arranged in a matrix of three rows and three columns.

9. The pixel package structure of claim 8, wherein, The three third pixel regions are arranged in a first row of the pixel packaging structure, the three fourth pixel regions are arranged in a second row of the pixel packaging structure, and the three fifth pixel regions are arranged in a third row of the pixel packaging structure.

10. A display panel, characterized by, The pixel packaging structure comprises: a carrier plate, a plurality of pixel regions are arranged on the carrier plate, and the center-to-center distance between adjacent pixel regions is equal; a plurality of light-emitting chips, the plurality of light-emitting chips have at least three light-emitting colors, and at most two light-emitting chips of the same light-emitting color are arranged on the same pixel region; an integrated circuit unit, the integrated circuit unit is arranged on the carrier plate, and the integrated circuit unit is electrically connected with the light-emitting chips.

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