Thermoelectric refrigerating unit and refrigerating equipment

Abstract

The utility model provides a thermoelectric refrigerating unit and refrigerating equipment, which comprises a thermoelectric refrigerating unit body, a lead bonding area is arranged on the thermoelectric refrigerating unit body, and the lead bonding area is used for being connected with an external device. According to the utility model, the bottom structure (a cold surface and a hot surface) of the thermoelectric refrigerating unit is expanded, and the functional gold immersion part, namely the lead bonding area, of the ceramic substrate is re-carved on the bottom structure, so that the bottom structure directly serves as a lead bonding transition layer. According to the design, the requirement of an independent ceramic substrate is omitted, the thermoelectric refrigerating unit directly undertakes the function of the ceramic substrate, and the heat management and packaging reliability is further optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to refrigeration technical field especially relates to a thermoelectric refrigerator and refrigeration plant. BACKGROUND

[0002] With the improvement of the heat dissipation and reliability requirement of electronic equipment, refrigeration BOX packaging is widely used in microelectronic and optoelectronic devices. The refrigeration BOX usually relies on thermoelectric refrigerator (TEC) to carry out temperature control, and needs ceramic substrate as the transition layer of wire bonding. However, the ceramic substrate and the thermoelectric refrigerator are separated in the prior art, which leads to complex packaging structure, large number of pins, complicated process flow, large process control difficulty, and easy to affect the overall reliability and efficiency of packaging. The separation design of the ceramic substrate and the TEC increases the complexity of the production process, affects the overall efficiency; the reliability of the wire bonding transition layer depends on the processing quality of the ceramic substrate, resulting in high cost; the multi-step packaging process increases the process uncertainty, and it is difficult to ensure long-term stability. SUMMARY

[0003] In view of the above problems, the utility model provides a thermoelectric refrigerator and refrigeration plant.

[0004] In the first aspect, a thermoelectric refrigerator is provided, comprising: a thermoelectric refrigerator body, a wire bonding area is arranged on the thermoelectric refrigerator body, and the wire bonding area is used to connect with external devices.

[0005] Wherein, the thermoelectric refrigerator body comprises a hot face and a cold face.

[0006] Wherein, the thermoelectric refrigerator is connected with external devices in a first connection mode through the wire bonding area, the hot face is used for heat dissipation, and the cold face is used for refrigeration after power on.

[0007] Wherein, the thermoelectric refrigerator is connected with external devices in a second connection mode through the wire bonding area, the hot face is used for refrigeration after power on, and the cold face is used for heat dissipation.

[0008] Wherein, the area of the cold face is less than the area of the hot face.

[0009] Wherein, the wire bonding area is arranged on the hot face.

[0010] Wherein, the wire bonding area is arranged on the cold face.

[0011] Wherein, a metal layer is arranged on the hot face, or a metal layer is arranged on the cold face; the wire bonding area is prepared on the metal layer through etching process; or

[0012] The lead bonding region is prepared on the hot face or the cold face by chemical gold plating.

[0013] The thermoelectric cooler body is made of aluminum-based material.

[0014] In a second aspect, the utility model provides a refrigeration equipment, including above -mentioned thermoelectric cooler.

[0015] The utility model discloses a thermoelectric cooler, the bottom structure (cold face and hot face) of thermoelectric cooler is extended, and the functional gold plating part of ceramic substrate, i.e. lead bonding region (the designed gold plating part can be changed according to different circuits) is engraved on it, so that it directly acts as the transition layer of lead bonding. This design cancels the need for an independent ceramic substrate, and makes the TEC directly bear the function of the ceramic substrate, further optimizing heat management and packaging reliability.

[0016] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, which can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the utility model more obvious and easy to understand, the following specific embodiments of the utility model are described. BRIEF DESCRIPTION OF DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present utility model. Furthermore, the same reference numerals are intended to denote the same components throughout the accompanying drawings. In the drawings:

[0018] Figure 1 Fig. 1 is a structural schematic diagram of a first embodiment of the thermoelectric cooler of the utility model;

[0019] Figure 2 Fig. 2 is a structural schematic diagram of a second embodiment of the thermoelectric cooler of the utility model;

[0020] Figure 3 Fig. 3 is a structural schematic diagram of a first embodiment of the refrigeration equipment of the utility model. DETAILED DESCRIPTION

[0021] Exemplary embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. While example embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure can be more thoroughly understood, and the scope of the present disclosure can be accurately conveyed to those skilled in the art. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present disclosure.

[0022] Various structural diagrams according to embodiments of the present disclosure are shown in the drawings. These diagrams are not drawn to scale, in which certain details are exaggerated for clarity of presentation and may be omitted. The shapes of various regions, layers, and the relative size and positional relationship therebetween shown in the drawings are merely exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and regions / layers having different shapes, sizes, and relative positions can be additionally designed according to actual needs by those skilled in the art.

[0023] Please refer to Figure 1 , Figure 1 The structural diagram of the first embodiment of the thermoelectric refrigerator of the utility model. At present, the thermoelectric refrigerator is widely used in military field (such as communication vehicle, military navigation, etc.), medical field (such as blood analyzer, electronic low-temperature testing device, etc.), household and civilian field (such as cold and hot water dispenser, small constant temperature control system, etc.), industrial field (CPU cooling device, microcomputer chip refrigeration, etc.), scientific research field, etc.

[0024] The thermoelectric refrigerator of the utility model comprises a thermoelectric refrigerator body 10, a lead bonding area 101 is arranged on the thermoelectric refrigerator body 10, and the lead bonding area 101 is used for being connected with external devices.

[0025] In the existing refrigeration BOX packaging, the ceramic substrate and the TEC (thermoelectric refrigerator) are respectively used as the lead bonding transition layer and the temperature control device, and the process is complex and the cost is high. The scheme of the utility model integrates the ceramic substrate and the TEC (thermoelectric refrigerator) in an integrated manner through structure optimization, the lead bonding area is directly arranged on the thermoelectric refrigerator body, and the thermoelectric refrigerator is directly connected with external devices through the lead bonding area. The ceramic substrate is removed as a transition layer, the packaging process is simplified, the process difficulty is reduced, and the overall reliability and production efficiency of the device are improved.

[0026] Specifically, the thermoelectric refrigerator body 10 comprises a hot face 102 and a cold face 103. The thermoelectric refrigerator can be connected with external devices in a first connection mode (positive connection) or a second connection mode (reverse connection) through the lead bonding area.

[0027] It should be noted that when the thermoelectric refrigerator is connected with external devices in the first connection mode (positive connection) through the lead bonding area, the hot face is used for heat dissipation, and the cold face is used for refrigeration after power-on. At this time, the area of the cold face is smaller than the area of the hot face. It can be understood that a large amount of heat will be generated during the refrigeration process of the thermoelectric refrigerator, in order to avoid equipment damage or affect the working efficiency of the equipment, rapid heat dissipation is required, so the area of the hot face is set to be larger.

[0028] When the thermoelectric refrigerator is connected with external devices through the wire bonding area in the second connection mode (reverse connection), the hot surface is used to refrigerate after being powered on, and the cold surface is used to dissipate heat. Since the area of the cold surface is smaller than that of the hot surface, the heat dissipation efficiency is insufficient. Therefore, in actual use, the thermoelectric refrigerator is preferentially connected with external devices through the wire bonding area in the first connection mode (forward connection).

[0029] In an embodiment, the thermoelectric refrigerator body 10 is made of aluminum-based material, which has good thermal conductivity and can further improve the heat dissipation efficiency.

[0030] In an embodiment, as shown in the embodiment, Figure 1 the wire bonding area is arranged on the hot surface. Specifically, a metal layer is arranged on the hot surface, and the wire bonding area is prepared on the metal layer through an etching process. Alternatively, in another embodiment, the wire bonding area can be prepared directly on the hot surface or the cold surface by chemical gold plating.

[0031] In another embodiment, please refer to Figure 2 , Figure 2 is a structural schematic diagram of the second embodiment of the thermoelectric refrigerator of the utility model. In this embodiment, the wire bonding area is arranged on the cold surface. A metal layer is arranged on the cold surface, and the wire bonding area is prepared on the metal layer through an etching process. Alternatively, in another embodiment, the wire bonding area can be prepared directly on the hot surface or the cold surface by chemical gold plating.

[0032] The thermoelectric refrigerator of the utility model reproduces the bonding function of the ceramic substrate on the hot surface or the cold surface of the TEC through chemical gold plating or etching process; wire bonding is directly performed on the TEC, and the step of using the ceramic substrate as a transition layer is omitted; the packaging structure is integrated, so that the TEC becomes the core temperature control and wire connection module of the refrigeration BOX, and the number of components is reduced.

[0033] The thermoelectric refrigerator of the utility model extends the bottom structure (cold surface and hot surface) of the TEC, reproduces the functional gold plating part of the ceramic substrate, that is, the wire bonding area (the designed gold plating part can be changed according to different circuits), so that it directly serves as a transition layer for wire bonding. This design eliminates the need for an independent ceramic substrate, and makes the TEC directly bear the function of the ceramic substrate, further optimizing the heat management and packaging reliability.

[0034] Specifically, the beneficial effects of the utility model are as follows:

[0035] Simplify the process flow: by canceling the independent ceramic substrate, the packaging process is significantly simplified, and the production steps and process difficulty are reduced.

[0036] Reduced production costs: The elimination of the ceramic substrate directly reduces material costs, and the integrated design of the TEC with the ceramic substrate reduces process uncertainty. The present solution directly sets the wire bonding area on the TEC, further reducing the scrap rate during the manufacturing process.

[0037] Improved packaging reliability: The integration of the TEC with the ceramic substrate improves the consistency of the device's thermal management, reducing thermal resistance and structural stress problems caused by the multi-layer structure, making the long-term operation of the package more stable and reliable.

[0038] Optimized production efficiency: Simplified packaging process and reduced material usage greatly improve production efficiency, adapting to the needs of mass production, while improving the consistency and stability of the package.

[0039] Enhanced thermal management performance: The TEC directly serves as a wire bonding transition layer, reducing obstacles in the heat transfer path, allowing the device's thermal performance to be further optimized.

[0040] See Figure 3 , Figure 3 The structure of an embodiment of the refrigeration equipment 30 includes the thermoelectric refrigerator 10 shown in any of the embodiments shown in the above Figure 1 or Figure 2 .

[0041] The algorithms and displays provided herein are not inherently related to any particular computer, virtual system, or other apparatus. Various general purpose systems can be used with programs in accordance with the teachings herein. General purpose systems can be constructed for the required structure based on the description above. In addition, the present application is not intended to be limited to any particular programming language. It will be appreciated that there are many programming languages that can be used to implement the teachings herein, and any such programming language can be used in conjunction with the teachings herein. The descriptions above are intended to provide specific examples of the application and should not be construed as limiting the scope of the application.

[0042] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been described in detail in order to not obscure the understanding of this description.

[0043] Similarly, it is to be understood that the above description is intended to be illustrative only and not restrictive. For example, the present application is not limited to the embodiments described above. Rather, various modifications can be made without departing from the scope of the present application as defined in the claims below. For example, elements of one embodiment can be combined with elements of another embodiment to create further embodiments. Similarly, some elements of the described embodiments can be combined or omitted. Similarly, the various features of the application can be used in any combination or sub-combination.

[0044] Those skilled in the art will appreciate that modules in the apparatus in the embodiments can be adapted and placed in one or more apparatuses other than the embodiments. Modules or units or components in the embodiments can be combined into one module or unit or component and furthermore can be divided into multiple sub-modules or sub-units or sub-components. Any combination of all features disclosed in this specification (including the accompanying abstract and drawings) and any method or process or apparatus of any combination of features disclosed in this specification (including the accompanying abstract and drawings) can be taken, except that at least some of such features and / or processes or units are mutually exclusive, unless expressly stated otherwise. Each feature disclosed in this specification (including the accompanying abstract and drawings) can be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

[0045] Furthermore, those skilled in the art will appreciate that different embodiments of the application have different features and thus not all embodiments will exhibit all of the features described or claimed. It will also be understood by those skilled in the art that, although the terms "first", "second", "third", etc. can be used herein to describe various information or actions, these terms are not necessarily used on a chronological basis, nor to describe a number of different elements. Rather, these terms are used to distinguish different features or actions from each other.

[0046] It is to be noted that the above-mentioned embodiments illustrate the application and do not limit it thereto. Any reference signs in the claims should not be construed as limiting the scope of the application. The word "comprising" does not exclude the presence of elements or steps other than those listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and any combination thereof. In the embodiments using a plurality of devices, these devices can be implemented by means of one and the same hardware item. The use of the words first, second and third does not imply any ordering, but rather these words have been used to distinguish different features. The skilled person will appreciate that the application can be practiced by means of hardware components, but also software-only components, or components partly comprising software.

Claims

1. A thermoelectric refrigerator characterized by comprising: The application relates to a thermoelectric refrigerator, comprising: a thermoelectric refrigerator body, wherein a lead bonding area is arranged on the thermoelectric refrigerator body and used for connecting with external devices; the thermoelectric refrigerator body comprises a hot surface and a cold surface; the lead bonding area is arranged on the hot surface or the lead bonding area is arranged on the cold surface.

2. The thermoelectric refrigerator of claim 1, wherein the thermoelectric refrigerator is connected with external devices in a first connection mode through the lead bonding area, the hot surface is used for heat dissipation and the cold surface is used for refrigeration after power-on.

3. The thermoelectric refrigerator of claim 1, wherein the thermoelectric refrigerator is connected with external devices in a second connection mode through the lead bonding area, the hot surface is used for refrigeration after power-on and the cold surface is used for heat dissipation.

4. The thermoelectric refrigerator of claim 2, wherein the area of the cold surface is smaller than that of the hot surface.

5. The thermoelectric refrigerator of claim 1, wherein, a metal layer is arranged on the hot surface or the cold surface; the lead bonding area is prepared on the metal layer through an etching process; or the lead bonding area is prepared on the hot surface or the cold surface through chemical gold plating.

6. The thermoelectric refrigerator of claim 1, wherein, the thermoelectric refrigerator body is made of aluminum-based material.

7. A refrigeration appliance characterized in that, the thermoelectric refrigerator comprises the thermoelectric refrigerator according to any one of claims 1-6.

Images