Wafer snap ring cover plate

Abstract

The utility model discloses a wafer snap ring cover plate, which comprises a snap ring cover plate assembly at least partially embedded in a ring carrying hole, the snap ring cover plate assembly extending out of the ring carrying hole is sleeved on two fixing columns, and the snap ring cover plate assembly comprises a snap ring piece embedded in the ring carrying hole. The cover plate piece is arranged on the side, away from the ring carrying hole, of the clamping ring piece, the clamping ring piece comprises first fixing lugs with the two sides extending outwards, first assembling holes used for being connected to the fixing columns in a sleeving mode are formed in the first fixing lugs, and the cover plate piece comprises second fixing lugs with the two sides extending outwards; the second fixing lug is provided with a second assembling hole used for being connected to the fixing column in a sleeving mode, the first assembling hole and the second assembling hole are sequentially aligned to the fixing column to be sleeved in, installation of the clamping ring piece and the cover plate piece on the clamping ring piece can be rapidly completed, installation is accurate, and rapid installation is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to ion plating processing technical field, especially relate to a wafer snap ring cover plate. BACKGROUND

[0002] Ion plating is to put the snap ring on the plating pot, the wafer is put on the snap ring, then the wafer is covered with the cover plate, to avoid the wafer from being back plated on the snap ring, the wafer front is subjected to the hidden danger of evaporation, so when designing the snap ring cover plate, the dimensional accuracy requirement is very high, the snap ring cover plate is carefully designed according to the size of wafer.

[0003] And the current snap ring cover plate is angular, usually the size of cover plate is only less than 0.5mm of snap ring, this causes the alignment difficulty in the production operation process to make the installation difficulty increase, greatly reduces the operation efficiency, in addition, the snap ring cover plate belongs to the frequently disassembled and repeatedly used tool, and in the taking and placing process, the deformation due to the knock will further increase the operation difficulty. UTILITY MODEL CONTENT

[0004] Therefore, the utility model discloses a wafer snap ring cover plate, aiming at solving the problems of angular snap ring cover plate in the prior art, leading to the alignment installation difficulty increase in the installation process of the snap ring cover plate and the retaining ring, and reducing the operation efficiency in the frequent disassembly process.

[0005] The utility model embodiment provides a wafer snap ring cover plate is set up on the plating pot, is set up on the plating pot multiple for accommodating the wafer snap ring cover plate's load ring hole, is close to the load ring hole both sides and extends the fixed column outward, the wafer snap ring cover plate includes at least partial embedding in the load ring hole's snap ring cover plate subassembly, and the snap ring cover plate subassembly of extending the load ring hole outward is sleeved on two fixed columns.

[0006] The snap ring cover plate subassembly includes embedding in the load ring hole's snap ring piece and setting up in the snap ring piece far from the load ring hole one side's cover plate piece.

[0007] The snap ring piece includes two sides and extends the first fixed ear outward, and the first fixed ear is set up on the first assembly hole for the sleeve joint in the fixed column.

[0008] The cover plate piece includes two sides and extends the second fixed ear outward, and the second fixed ear is set up on the second assembly hole for the sleeve joint on the fixed column.

[0009] The first assembly hole of the above-mentioned application is aligned with the fixing columns on both sides of the carrier ring hole, and then is sleeved in, and then the clamping ring can be directly slid into the carrier ring hole along the track of the fixing column, wherein the clamping ring can be accurately clamped into the carrier ring hole through the limitation of the two fixing columns, and the rapid assembly is completed, in addition, through the structure design of the circular truncated cone type of the fixing column, the first assembly hole can be better adapted, so that the first assembly hole with larger hole diameter can be quickly sleeved on the fixing column with smaller outer diameter at the top, while ensuring the installation accuracy, the operator is convenient to install, solves the problem that the existing technology is that the clamping ring cover plate is angular, which leads to the difficulty of alignment and installation of the clamping ring cover plate and the retainer ring during the installation process, and reduces the work efficiency in the frequent disassembly process.

[0010] In addition, the wafer clamping ring cover plate according to the embodiment of the utility model also has the following additional technical features:

[0011] Further, the fixing column shape gradually decreases from the bottom side close to the plating pot to the side away from the fixing.

[0012] Further, the clamping ring part further comprises a clamping ring embedded in the carrier ring hole, a plurality of clamping points extending inward along the inner wall of the clamping ring, and at least one flat edge, and the first fixing lug is fixedly arranged on both sides of the periphery of the clamping ring.

[0013] Further, the inner wall of the clamping ring gradually decreases from the top to the side embedded in the carrier ring hole.

[0014] Further, the cover plate part further comprises a cover plate abutting against the top of the clamping ring part, and a T-shaped nail extending outward from the center of the side of the cover plate away from the clamping ring part.

[0015] Further, the cover plate extends an embedded wall matching the inner wall thereof toward the side close to the clamping ring part.

[0016] Further, the T-shaped nail is provided with an exhaust hole at the center, and the exhaust hole is used to exhaust the gas in the space between the cover plate part and the clamping ring part when the cover plate part covers the top of the clamping ring part, so that the air pressure in the clamping ring cover plate assembly is equal to the outside. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The structure schematic view of the wafer clamping ring cover plate and the plating pot in the embodiment one of the utility model is shown;

[0018] Figure 2 The side view cross-sectional structure schematic view of the clamping ring cover plate assembly in the wafer clamping ring cover plate in the embodiment one of the utility model is shown;

[0019] Figure 3Part of the overhead structure schematic diagram of the clasp ring part in the wafer clasp ring cover plate is provided in the embodiment one of the utility model.

[0020] Figure 4 Part of the overhead structure schematic diagram of the cover plate part in the wafer clasp ring cover plate is provided in the embodiment one of the utility model.

[0021] Figure 5 The side view cross section structure schematic diagram of the clasp ring cover plate assembly in the wafer clasp ring cover plate is provided in the embodiment two of the utility model.

[0022] Main element symbol explanation:

[0023]

[0024] The following detailed embodiments will further illustrate the utility model in combination with the above-mentioned drawings. DETAILED DESCRIPTION

[0025] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] Embodiment one

[0029] Please refer to Figures 1 to 4The utility model discloses a wafer clamping ring cover plate, set up on plating pot 1, be equipped with a plurality of for accommodating wafer clamping ring cover plate's ring loading hole 2 on plating pot 1, extend the fixed column 4 outwardly close to ring loading hole 2 both sides, and wafer clamping ring cover plate includes at least part embedding in ring loading hole 2's clamping ring cover plate subassembly 3, and the clamping ring cover plate subassembly 3 that extends the ring loading hole 2 outwardly is sleeved on two fixed columns 4, and clamping ring cover plate subassembly 3 includes embedding in ring loading hole 2's clamping ring piece 31 and sets up the cover plate piece 32 on the one side of clamping ring piece 31 away from ring loading hole 2, and clamping ring piece 31 includes two sides outwardly extending first fixed lug 312, and first fixed lug 312 is equipped with first assembly hole 313 for the sleeve of fixed column 4 on, and cover plate piece 32 includes two sides outwardly extending second fixed lug 322, and second fixed lug 322 is equipped with second assembly hole 323 for the sleeve of fixed column 4 on.

[0030] Further, the fixed column 4 shape gradually reduces from the bottom side close to the plating pot 1 to the side away from the fixed column, the clamping ring piece 31 further includes at least part embedding in the ring loading hole 2, a plurality of clamping points 314 extending inwardly along the inner wall of the clamping ring 311, and at least one flat edge 315, the first fixed lug 312 is fixedly arranged on the two sides of the periphery of the clamping ring 311, the inner wall of the inner side of the clamping ring 311 gradually reduces from the top to the side embedded in the ring loading hole 2, the cover plate piece 32 further includes a cover plate 321 abutting against the top of the clamping ring piece 31, and a T-shaped nail 324 extending outwardly from the center of the side of the cover plate 321 away from the clamping ring piece 31, the cover plate 321 extends from the side close to the clamping ring piece 31 to the inner embedding wall matched with the inner wall thereof, the center of the T-shaped nail 324 penetrates a vent hole, through which the gas in the space between the cover plate piece 32 and the clamping ring piece 31 is exhausted when the cover plate piece 32 is closed on the top of the clamping ring piece 31, so that the air pressure in the clamping ring cover plate subassembly 3 is equal to the outside air pressure.

[0031] In practice, the operator can first place multiple retaining rings 31 into the ring-carrying holes 2 on the plating pan 1. Specifically, the first mounting hole 313 on the retaining ring 311 is aligned with the fixing posts 4 on both sides of the ring-carrying hole 2 before being inserted. Then, the retaining ring 31 can slide directly into the ring-carrying hole 2 along the trajectory of the fixing posts 4. The constraint of the two fixing posts 4 allows the retaining ring 31 to be accurately inserted into the ring-carrying hole 2, completing the rapid assembly. In addition, the frustum-shaped structure of the fixing posts 4 can better fit the first mounting hole 313, so that the larger diameter first mounting hole 313 can be quickly fitted onto the smaller outer diameter fixing post 4, which is convenient for the operator to install. After that, the operator can place the wafer into the center of the retaining ring 31. Then, the operator can use the T-shaped nail 324 to cover the retaining ring 31 with the cover plate 32. Specifically, the operator first adjusts the... Positioning the cover plate 321 ensures that the second fixing ear 322 corresponds to the first fixing ear 312. Then, the second assembly hole 323 is adjusted and inserted along the fixing post 4. During insertion, the inner wall at the bottom of the cover plate 321 can also be used to vertically insert the retaining ring 311 into the cover plate. The fit between the inner wall and the inner wall of the retaining ring 311 effectively ensures the structural stability between the retaining ring 31 and the cover plate 32. In addition, the unified positioning of the fixing post 4 further improves the structural stability of the retaining ring 31 and the cover plate 32 after closing. At the same time, the vent hole on the T-shaped nail 324 ensures that the air pressure between the cover plate 32 and the retaining ring 31 is equal to that of the outside during the fastening process. This prevents the airflow from "carrying away" the wafer when removing the cover or the irregular airflow inside the retaining ring cover plate assembly 3 from causing wafer misalignment.

[0032] In summary, this application aligns the first mounting hole 313 on the retaining ring 311 with the fixing posts 4 on both sides of the ring-carrying hole 2 and then inserts it. The retaining ring 31 can then slide directly into the ring-carrying hole 2 along the trajectory of the fixing posts 4. The constraint of the two fixing posts 4 allows the retaining ring 31 to be accurately engaged in the ring-carrying hole 2, completing rapid assembly. In addition, the frustum-shaped structure of the fixing posts 4 can better fit the first mounting hole 313, so that the larger diameter first mounting hole 313 can be quickly fitted onto the smaller outer diameter top fixing post 4. This ensures accurate installation and facilitates installation by operators, solving the problem in the prior art where the retaining ring cover plate has sharp edges, which increases the difficulty of alignment during installation and reduces work efficiency during frequent disassembly.

[0033] Example 2

[0034] Please see Figure 5 The image shows a wafer retaining ring cover plate in Embodiment 2 of this utility model. Figure 5As shown in the upper two sides near the fixed column 4, in order to further improve the stability of the snap ring 31 and the cover plate 32 after the cover, based on the contact part of the snap ring 31 and the cover plate 32 can be provided with two magnets, the cover plate 32 is designed as a magnet N pole, the magnet on the snap ring 31 is designed as S pole, the suction force is about 2~3N, which can improve the stability of the snap ring cover plate assembly 3 after the cover, in addition, in some optional embodiments, for the inner wall of the snap ring 311, the embedded wall on the cover plate 321 and the inner wall, and the shape of the fixed column 4 can also be provided as a cylindrical shape, so as to adapt to other wafer shapes.

[0035] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0036] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A wafer clamping ring cover plate arranged on a plating pot, a plurality of carrier ring holes for accommodating the wafer clamping ring cover plate are arranged on the plating pot, and a fixing column is arranged outside the two sides of the carrier ring hole, characterized in that, The wafer clasp cover plate comprises a clasp cover plate assembly embedded at least partially in the carrier ring hole, and the clasp cover plate assembly extending out of the carrier ring hole is sleeved on the two fixing columns; The clasp cover plate assembly comprises a clasp embedded in the carrier ring hole, and a cover plate arranged on the side of the clasp away from the carrier ring hole; The clasp comprises two first fixing ears extending outwardly, and the first fixing ears are provided with first assembly holes for sleeving the fixing columns; The cover plate comprises two second fixing ears extending outwardly, and the second fixing ears are provided with second assembly holes for sleeving the fixing columns; The inner wall of the clasp gradually decreases from the top to the side embedded in the carrier ring hole in a circular cone shape; The cover plate further comprises a cover plate abutting against the top of the clasp, and a T-shaped nail extending outwardly at the center of the side of the cover plate away from the clasp; The center of the T-shaped nail is provided with an exhaust hole, and the exhaust hole is used to exhaust the gas in the space between the cover plate and the clasp when the cover plate is closed on the top of the clasp, so that the air pressure in the clasp cover plate assembly is equal to the outside air pressure.

2. The wafer clasp cover plate of claim 1, wherein, The fixing column gradually decreases from the bottom close to the side of the plating pot to the side away from the fixing column in a circular cone shape.

3. The wafer clasp cover plate of claim 2, wherein, The clasp further comprises a clasp embedded at least partially in the carrier ring hole, a plurality of clamping points extending inwardly along the inner wall of the clasp, and at least one flat edge, and the first fixing ears are fixedly arranged on the two sides of the periphery of the clasp.

4. The wafer clasp cover plate of claim 3, wherein, The cover plate extends toward the side close to the clasp and is provided with an embedded wall matched with the inner wall of the cover plate.

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