Pre-pressing suction head for sucking ink jet head chip and ink jet head chip packaging equipment
By using pre-pressurized nozzles made of aluminum nitride ceramic or silicon carbide ceramic materials, the problems of uneven heat distribution, static electricity accumulation, and precision damage in inkjet head chip packaging are solved, achieving higher packaging accuracy and stability.
Patent Information
- Application Number
- CN202520322817.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-02-27
AI Technical Summary
Existing pre-pressurized nozzles are prone to causing chip precision damage, uneven heat distribution, static electricity accumulation, and poor alignment accuracy during inkjet head chip packaging.
The pre-pressurized suction head, made of aluminum nitride ceramic or silicon carbide ceramic material, features a flared suction hole and curved surface connection, combined with an elastic buffer pad and micro-groove and micro-protrusion structure to ensure uniform heat distribution, reduce static electricity, and improve suction accuracy and stability.
It achieves a more uniform suction force distribution, reduces chip damage, improves packaging accuracy and stability, reduces electrostatic effects, and extends the service life of the suction tip.
Smart Images
Figure CN223810127U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a pre-pressure suction head for picking up inkjet head chips and an inkjet head chip packaging device. Background Technology
[0002] In semiconductor manufacturing, chip packaging is a critical step, where the chip placement accuracy directly affects product performance and reliability. Current technology typically employs a pre-pressure pick-and-place head structure to pre-press and fix the chip, ensuring positional accuracy and stability during the placement process. The pre-pressure pick-and-place head usually includes a nozzle, pressure adjustment device, and connecting components. It uses negative pressure to attract the chip and apply a certain pre-pressure, thus initially fixing the chip to the substrate.
[0003] Specifically, in the manufacturing and packaging of the inkjet head chip for ink cartridges used in inkjet printers, a tape-and-roll automatic bonding (TAB) process is employed. This process involves first using a pre-pressurized suction head to pick up the inkjet head chip, then using a computer and a camera for image recognition and alignment, precisely placing it onto a tape-and-roll flexible circuit board and applying pressure to secure it. Finally, heating is used to adhere and fix the inkjet head chip to the flexible circuit board, achieving a bonding and packaging technology between the inkjet head chip and the tape-and-roll flexible circuit board.
[0004] However, as inkjet printers achieve increasingly higher resolutions, the performance requirements for chips are also increasing. Existing pre-pressurized printhead structures are prone to damaging chip precision during the inkjet chip packaging process, particularly in the fixing or lamination stages. Utility Model Content
[0005] This utility model provides a pre-pressurized suction head for picking up inkjet head chips, comprising at least a suction head body; the suction head body has a working surface for contacting the inkjet head chip; the suction head body also has a plurality of suction holes, the suction holes extending through at least a portion of the suction head body from the working surface to sequentially form an opening and a connecting portion; the cross-sectional area of the opening gradually increases from the end of the connecting portion toward the side closer to the working surface; at least one protruding rib is also formed inside the suction hole, the protruding rib extending from the sidewall of the suction hole toward the center of the suction hole.
[0006] In some embodiments, the rib is located at the opening and the end face of the rib near the working surface is flush with the working surface.
[0007] In some embodiments, a plurality of annular grooves are formed on the working surface, the annular grooves are located on the outer periphery of the suction hole, and an elastic buffer pad is embedded in the annular grooves.
[0008] In some embodiments, at least one micro-groove is formed on the working surface, and a projection of the micro-groove on the working surface does not overlap with the suction hole.
[0009] In some embodiments, a plurality of micro-protrusions are formed on the working surface, and a projection of the micro-protrusions on the working surface does not overlap with the suction hole, and a protrusion highest point of the micro-protrusions is flush with an end surface of the suction hole on a side close to the working surface.
[0010] In some embodiments, the material of the suction head body is aluminum nitride ceramic material or silicon carbide ceramic material.
[0011] In some embodiments, the color of the suction head body is dark, and a chroma area of the color in a CIE Lab color space is less than 40.
[0012] In some embodiments, a curved surface is connected between the suction hole and the working surface, the working surface is a mirror surface processed by polishing, a surface roughness Ra of the working surface is less than 0.1 microns, and a flatness of the working surface is less than or equal to 0.3 microns.
[0013] In some embodiments, a thermal conductivity coefficient of the suction head body is between 100 and 350 w / mk, a hardness of the suction head body is between 1500 and 2000 N / mm 2 , and a thermal expansion coefficient of the suction head body is between .
[0014] The utility model also provides a jet head chip packaging equipment adopts the prepressing suction head for sucking jet head chip of any one embodiment as above.
[0015] The prepressing suction head for sucking jet head chip provided by the utility model can provide greater suction force on the chip while optimizing airflow distribution in the sucking process, so that the sucking force is more uniform, ensures good bonding force between the chip and the suction head body, reduces movement and loosening of the chip on the suction head, and also protects the chip from damage, thereby improving the stability of chip packaging preparation.
[0016] Other features and advantages of the utility model will be described in the subsequent specification, and some of them will become apparent from the specification, or be understood by implementing the utility model. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0018] Figure 1 A perspective view of a pre-press suction head for sucking a chip of an inkjet head is provided for an embodiment of the present application.
[0019] Figure 2 A front view of a pre-press suction head for sucking a chip of an inkjet head is provided for an embodiment of the present application.
[0020] Figure 3 A sectional view of a pre-press suction head for sucking a chip of an inkjet head is provided for an embodiment of the present application.
[0021] Figure 4 A perspective view of another view angle of the pre-press suction head.
[0022] Figure 5 、 Figure 6 A different deformation example of a bottom view of a pre-press suction head for sucking a chip of an inkjet head is provided for an embodiment of the present application.
[0023] Reference signs:
[0024] 1 - suction head body; 1a - working surface; 10 - suction hole; 11 - opening part; 12 - through part; 20 - convex rib; 1b - ring groove; 30 - elastic buffer pad; 41 - micro groove; 42 - micro convex. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. The technical features designed in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] In the description of the utility model, it is necessary to explain that all the terms (including technical terms and scientific terms) used in the utility model have the same meaning as that generally understood by the ordinary skilled person in the field to which the utility model belongs, and cannot be understood as limiting the utility model; it should be further understood that the terms used in the utility model should be understood as having the same meaning as the meaning of these terms in the context of the specification and the related field, and should not be understood in an idealized or overly formal sense, except as explicitly defined in the utility model.
[0027] Please refer to Figures 1-5 The utility model provides a kind of for suction ink-jet head chip's pre-press suction head, for suction ink-jet head chip's pre-press suction head at least include suction head body 1.
[0028] Because in ink-jet head chip packaging process, pre-press suction head carries out pre-pressing ink-jet head chip, lower bearing seat is in heating state to facilitate ink-jet head chip and tape flexible circuit board adhesion fixed. However, the existing pre-press suction head has the following problems: (1) when temperature conduction to pre-press suction head, it is easy to make heat distribution uneven and cause uneven line compression problem;(2) due to the influence of heating temperature, pre-press suction head is prone to expansion in long-term use, and then cause the problem of poor alignment accuracy to chip;(3) the existing pre-press suction head generally adopts metal material, but the pre-press suction head of metal material is easy to remain static electricity generated by friction, thereby easy to cause the problem of static electricity accumulation damage to the circuit on chip or tape flexible circuit board. In particular, the existing suction head body generally adopts superhard metal such as die steel after heat treatment, high carbon steel or tungsten carbon steel and other materials, which utilizes the high mechanical strength characteristics of metal, high hardness and wear resistance after heat treatment to make the suction head body can withstand long-time compression impact and wear. It not only has the above problems, but also has the problem that impurities or residual glue in production process are easy to stick to the suction head body.
[0029] Based on the above problems, the heat conduction coefficient of the suction head body 1 of the embodiment is preferably 100~350w / mk. Among them, the heat conduction performance of the suction head body 1 with higher heat conduction coefficient is better, which can make the heat distribution uniform, avoid the problem of uneven line compression. Preferably, the hardness of the suction head body 1 is 1500~2000N / mm 2 , so that the suction head body 1 has better wear resistance, can withstand long-term wear, impact and pressure, and will not produce deformation and burr, effectively prolongs the service life of the pre-press suction head, and maintains the better contact surface precision for a long time. Preferably, the thermal expansion coefficient of the suction head body 1 is , smaller thermal expansion coefficient can make the overall thermal expansion coefficient of the suction head body 1 after heating when heat contact compression is very small, which will not affect the precision of packaging process.
[0030] Preferably, the material of the suction head body 1 is an aluminum nitride ceramic material or a silicon carbide ceramic material. Among them, the thermal conductivity coefficient, hardness and thermal expansion coefficient of the aluminum nitride ceramic material and the silicon carbide ceramic material are high, which can achieve the above effects. At the same time, the aluminum nitride ceramic material and the silicon carbide ceramic material will not generate static electricity due to friction, and have excellent electrical insulation performance, so as to reduce the influence of static electricity accumulation during production.
[0031] The suction head body 1 has a working surface 1a for contacting the inkjet head chip. In order to meet the more precise structure of the existing inkjet head chip for suction, the surface roughness Ra of the working surface 1a is preferably less than 0.1 microns, and the flatness of the working surface 1a is less than or equal to 0.3 microns, so that the flatness of the working surface 1a reaches microns or even nanometers, thereby ensuring that the precise inkjet head chip will not be damaged during the suction process. Specifically, the suction head body made of traditional metal material cannot achieve micron-level machining flatness, therefore, the ceramic is preferably used as the material of the suction head body 1 in the embodiment to achieve micron-level or even nanometer-level machining flatness of the working surface 1a.
[0032] Further, the working surface 1a is a mirror surface treated by polishing to ensure that impurities or residual glue in the production process are not easily adhered to the working surface 1a. Similarly, the aluminum nitride ceramic material or the silicon carbide ceramic material is preferably used as the material of the suction head body 1 in the embodiment to utilize the polishing characteristics for mirror surface treatment, and the working surface 1a can be maintained in a mirror state for a long time due to good wear resistance. In addition, the corners of the working surface 1a are designed as arcs to avoid damaging the inkjet head chip.
[0033] Optionally, the color of the suction head body 1 is dark, and the chroma area of the color in the CIE Lab color space is less than 40. Among them, The color with a value less than 40 can be better recognized by image vision, effectively avoiding the problem of reflection or interference in the computer when determining the position of the joint point, thereby causing image recognition failure. For example, the existing suction head body 1 also uses, for example, an aluminum oxide ceramic material or a zirconium oxide ceramic material, which is white in color, and the value is usually 100, which is easy to cause reflection and light interference and cause alignment failure. Similarly, the aluminum nitride ceramic material or the silicon carbide ceramic material is preferably used as the material of the suction head body 1 in the embodiment, which is gray or gray-green or black in color, and can be better recognized, facilitating precise alignment.
[0034] Please refer to Figure 3 , Figure 4The suction head body 1 is provided with a plurality of suction holes 10, the suction holes 10 penetrate at least part of the suction head body 1 from the working surface 1a to sequentially form an opening part 11 and a penetrating part 12; the cross-sectional area of the opening part 11 gradually increases from the end of the penetrating part 12 to the side close to the working surface 1a.
[0035] The cross-sectional area of the opening part 11 gradually increases from the end of the penetrating part 12 to the side close to the working surface 1a to form a horn structure, which can increase the contact area with the chip, so that the suction hole 10 provides greater suction force while optimizing the airflow distribution during suction, making the suction force more uniform, helping to form a stable negative pressure when sucking the inkjet head chip, ensuring that the inkjet head chip has good bonding force with the suction head body 1, reducing the movement and loosening of the chip on the suction head, while also protecting the chip from damage and improving suction accuracy.
[0036] Preferably, the shapes of the opening part 11 and the penetrating part 12 are both axisymmetric structures. The sidewall of the opening part 11 of the horn structure can be an axisymmetric structure composed of one or more planes and / or curved surfaces, and the specific shape can be designed according to actual needs, which is not limited in this embodiment. The shape of the penetrating part 12 can also be an axisymmetric structure. The penetrating part 12 is also connected to the negative pressure channel to achieve vacuum negative pressure of the suction hole 10.
[0037] Further, the suction hole 10 and the working surface 1a are connected by a curved surface. The curved surface connection can reduce the stress concentration between the negative pressure of the suction hole 10 and the working surface 1a at the edge, which helps to avoid damage to the inkjet head chip.
[0038] In a preferred embodiment, please continue to refer to Figure 3 、 Figure 4 The suction hole 10 is further formed with at least one convex rib 20 extending from the sidewall of the suction hole 10 to the center of the suction hole 10. The shape of the convex rib 20 can be a right triangle, a cross, a straight line, a semicircle or other suitable geometric shapes, such as Figure 4 The convex rib 20 is a right triangle, such as Figure 6 The convex rib 20 is a cross. The specific shape, height, width and number of the convex rib 20 are reasonably designed according to the size of the suction hole 10, the negative pressure suction force and the need for airflow control, which is not limited in this embodiment. Through the design of the convex rib 20, on the one hand, the airflow direction inside the suction hole 10 can be changed, and the turbulence degree of the airflow can be increased, on the other hand, the stress distribution on the surface of the chip during vacuum suction can also be effectively improved, preventing the chip from deforming and reducing potential damage to the inkjet head chip.
[0039] Preferably, the ribs 20 are located at the opening part 11 and the end face of the ribs 20 near the working face 1a is flush with the working face 1a. With this design, the ribs 20 can be in contact with the chip, further ensuring the stable contact between the pre-pressing head and the chip of the inkjet head during the suction process, and reducing the risk of damage to the chip during the suction process.
[0040] In another alternative embodiment, referring to Figure 4 、 Figure 5 , a plurality of ring grooves 1b are formed on the working face 1a, the ring grooves 1b are located on the outer periphery of the suction hole 10, and the ring grooves 1b are embedded with elastic buffer pads 30. The elastic buffer pad 30 can be made of, but not limited to, silicone rubber, fluororubber, heat-resistant nylon, high-temperature vulcanized silicone rubber, polyimide, and other materials with good heat resistance. The depth and width of the ring groove 1b should accommodate the elastic buffer pad 30 and not affect the normal operation of the suction hole 10.
[0041] Through the design of the ring groove 1b and the elastic buffer pad 30, effective buffering can be provided when the pre-pressing head is pre-pressed with the chip of the inkjet head, reducing the impact and wear on the pre-pressing head and the chip of the inkjet head during the suction process.
[0042] Preferably, as shown in Figure 4 , a plurality of micro-grooves 41 and / or micro-protrusions 42 are formed on the working face 1a; the projection of the micro-groove 41 on the working face 1a does not overlap with the suction hole 10, the projection of the micro-protrusion 42 on the working face 1a does not overlap with the suction hole 10, and the highest point of the micro-protrusion 42 is flush with the end face of the suction hole 10 near the working face 1a.
[0043] Specifically, the micro-groove 41 is designed to avoid the position of the suction hole 10, and its specific size and depth can be reasonably set according to actual needs. In this embodiment, the design of the micro-groove 41 can avoid excessive contact between the pre-pressing head and the chip of the inkjet head, which may potentially damage the chip of the inkjet head during the suction process, and also improve the heat dissipation effect.
[0044] The micro-protrusion 42 is designed to avoid the position of the suction hole 10, and the shape of the micro-protrusion 42 can be circular, oval, rectangular, or any suitable shape. More importantly, the highest point of the micro-protrusion 42 is in the same plane as the end face of the suction hole 10 near the working face 1a. In this embodiment, the design of the micro-protrusion 42 is used to provide support and fixation between the pre-pressing head and the chip of the inkjet head, improve the adhesion between the pre-pressing head and the chip of the inkjet head, reduce the deformation of the chip of the inkjet head after heating, improve the mounting precision, ensure the close fit between the chip of the inkjet head and the flexible circuit board, and also improve the heat dissipation effect.
[0045] It should be noted that according to the actual functional requirements, the pre-press suction head can also include other components, such as a pressure sensing component and / or a gas cooling component provided on the pre-press suction head, for cooperating with the control of the pressure sensing or gas cooling of the chip by the pre-press suction head.
[0046] The utility model also provides a kind of ink-jet head chip packaging equipment, pre-press suction head for sucking ink-jet head chip described in any one of the above embodiments is used, can effectively improve suction precision, reduce chip movement and vibration in suction process, to reduce damage risk, while also can ensure the uniform distribution of suction force, avoid damage caused by local stress concentration.
[0047] In addition, those skilled in the art should understand that although there are many problems in the prior art, each embodiment or technical solution of the utility model can only be improved in one or several aspects, and it is not necessary to solve all technical problems listed in the prior art or background art at the same time. Those skilled in the art should understand that the content not mentioned in a claim should not be regarded as a limitation of the claim.
[0048] Although terms such as suction head body, working surface, suction hole, opening part, through part, convex rib, ring groove, elastic buffer pad, micro recess, micro bump, etc. are used more frequently in this document, the possibility of using other terms is not excluded. The use of these terms is only to facilitate the description and explanation of the essence of the utility model; any additional limitation is contrary to the spirit of the utility model; the terms "first", "second", etc. (if any) in the specification and claims of the utility model embodiments and the above drawings are used to distinguish similar objects, and do not have to describe a specific order or sequence.
[0049] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the utility model, but not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solutions of the embodiments of the utility model.
Claims
1. A pre-press suction head for sucking an inkjet head chip, characterized by, Comprising: A suction head body; the suction head body has a working surface for contacting the inkjet head chip; the suction head body is also provided with a plurality of suction holes, the suction holes penetrate at least part of the suction head body from the working surface to sequentially form an opening part and a penetrating part; the cross-sectional area of the opening part gradually increases from the end of the penetrating part to the side close to the working surface; at least one convex rib is formed inside the suction hole, the convex rib extends from the side wall of the suction hole to the center of the suction hole.
2. The pre-press head for sucking an inkjet head chip according to claim 1, characterized in that: The convex rib is located at the opening part and the end surface of the convex rib close to the side of the working surface is flush with the working surface.
3. The pre-press head for sucking an inkjet head chip according to claim 1, characterized in that: A plurality of ring grooves are formed on the working surface, the ring grooves are located on the outer periphery of the suction hole, and an elastic buffer pad is embedded in the ring groove.
4. The pre-press head for sucking an inkjet head chip according to claim 1, characterized in that: At least one micro-groove is formed on the working surface, and the projection of the micro-groove on the working surface does not overlap the suction hole.
5. The pre-press head for sucking an inkjet head chip according to claim 1, characterized in that: A plurality of micro-protrusions are formed on the working surface; the projection of the micro-protrusion on the working surface does not overlap the suction hole, and the highest point of the micro-protrusion is flush with the end surface of the suction hole close to the working surface.
6. The pre-press head for sucking an inkjet head chip according to claim 1, wherein: The material of the suction head body is aluminum nitride ceramic material or silicon carbide ceramic material.
7. The pre-pickup head for picking up an inkjet head chip according to claim 1, wherein: The color of the tip body is dark, the chroma area of which color presents in the CIE Lab color space is less than 40.
8. The pre-press head for sucking an inkjet head chip according to claim 1, wherein: The connection between the suction hole and the working surface is curved; the working surface is a mirror surface treated by polishing, the surface roughness Ra of the working surface is less than 0.1 microns, and the flatness of the working surface is less than or equal to 0.3 microns.
9. The pre-press head for sucking an inkjet head chip according to claim 1, wherein: The heat conductivity of the suction head body is between 100 and 350 w / mk, the hardness of the suction head body is between 1500 and 2000 N / mm 2 , the coefficient of thermal expansion of the suction head body is between .
10. An inkjet head chip packaging apparatus characterized by comprising: The pre-pressing suction head for sucking the inkjet head chip according to any one of claims 1-9 is adopted.