Semiconductor integrated circuit chip detection device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor integrated circuit chip detection device which comprises a detection table, a protection frame, an X-ray detector, a fixing device, a feeding device, a discharging device and a rotating device, the protection frame is installed at the top end of the detection table, the X-ray detector is installed on the inner bottom wall of the protection frame, and the fixing device is installed on the X-ray detector. By adjusting the working states of a micro motor and a first electric telescopic rod, the number and the position of chips pushed each time can be accurately controlled, it is ensured that each containing groove can accurately receive one chip, after the chips are pushed to the containing grooves, a fixing device is started, it is ensured that the chips cannot move in the detection process, a rotating device enables a rotating disc to rotate, and the detection efficiency is improved. The chips in the containing groove are sequentially brought to the position below the X-ray detector to be detected, the X-ray detector comprehensively scans the chips, the whole process from feeding to discharging is completely automatic, manual intervention is reduced, and production efficiency and consistency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, specifically to a semiconductor integrated circuit chip detection device. BACKGROUND

[0002] It is known that with the rapid development of the semiconductor industry, the demand for integrated circuit chips (IC) not only grows in quantity but also increases in quality. Traditional chip detection methods usually rely on manual operation or semi-automated equipment, and steps such as feeding, positioning, and discharging often require a large amount of manual intervention, resulting in a time-consuming and error-prone process. In the process of chip transmission and positioning, there is a lack of effective precision control means, making it difficult to ensure the consistency of the number and position of chips pushed each time, which affects the quality and consistency of the final product. Since only one group of chips can be processed at a time, and each chip needs to go through an independent detection process, this greatly limits the speed and efficiency of detection. SUMMARY

[0003] (I) Technical problem solved

[0004] In view of the deficiencies of the prior art, the utility model provides a semiconductor integrated circuit chip detection device.

[0005] (II) Technical solution

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semiconductor integrated circuit chip detection device, comprising a detection table, a protective frame, an X-ray detector, a fixing device, a feeding device, a discharging device, and a rotating device, the top end of the detection table is provided with the protective frame, the inner bottom wall of the protective frame is provided with the X-ray detector, the top end of the detection table is provided with a turntable through the rotating device, the top end of the turntable is annularly provided with a plurality of placing grooves, the placing groove bottom wall is provided with the fixing device, the placing groove is provided with the discharging device, the front end of the protective frame is provided with a feeding port, the feeding port is provided with a feeding frame, the bottom wall of the feeding frame is provided with a conveyor belt, one end of the feeding frame close to the feeding port is provided with the feeding device, the feeding device comprises a threaded rod, a sliding block, a lifting plate, a micro motor, a first electric telescopic rod, and a first push plate, a rectangular groove is formed in the inner side wall of one end of the feeding frame, the threaded rod is rotatably installed in the rectangular groove, the top end of the threaded rod penetrates the rectangular groove top wall and is provided with the micro motor, the threaded rod is provided with the sliding block, the sliding block side wall is fixedly provided with the lifting plate, the lifting plate side wall away from the placing groove is provided with the first electric telescopic rod, the output end of the first electric telescopic rod penetrates the lifting plate and is provided with the first push plate, one end of the protective frame is provided with a discharging port, and the discharging port is provided with a discharging frame.

[0007] In order to facilitate the detection of semiconductor integrated circuit chip discharge, the utility model improves, the discharge device includes second electric telescopic link and second push board, the placing groove is close to the one end side wall of the rotating disc center and is embedded with second electric telescopic link, the output end of second electric telescopic link is installed with second push board.

[0008] In order to facilitate the fixation of semiconductor integrated circuit chip, the utility model improves, the fixing device includes transmission pipe and vacuum pump, the transmission pipe is embedded in the inner bottom wall of placing groove, the bottom wall of rotating disc is annular and is installed with a plurality of vacuum pumps, the bottom end of transmission pipe penetrates rotating disc and is connected with corresponding vacuum pump.

[0009] In order to carry out continuous detection to semiconductor integrated circuit chip, the utility model improves, the rotating device includes rotating shaft, driven gear, drive motor and driving gear, the top of detection table is rotatably installed with rotating shaft, the top wall of rotating shaft is fixedly connected with the bottom wall of rotating disc, the outer wall of rotating shaft is installed with driven gear, the top wall of detection table is installed with drive motor, the output end of drive motor is installed with driving gear, driven gear and driving gear are engagedly connected.

[0010] Preferably, the utility model improves, the feeding frame and the discharge frame are all U type design.

[0011] Preferably, the utility model improves, the bottom wall of placing groove is polished, and the surface roughness is less than 0.1 microns.

[0012] Preferably, the utility model improves, the bottom end of detection table is installed with support leg in four corners.

[0013] Preferably, the utility model improves, the drive motor and the micro motor are all servo motors.

[0014] (Three) beneficial effects

[0015] Compared with the prior art, the utility model provides a semiconductor integrated circuit chip detection device, has the following beneficial effects:

[0016] The semiconductor integrated circuit chip detection device, through the setting of the feeding device, using micro motor, first electric telescopic rod and other precision components, can realize the accurate control of the chip position, make the semiconductor integrated circuit chip to be detected enter the placing groove, ensure that each operation is accurate, reduce the error, the automatic process ensures the consistency of the number and position of the chip pushed each time, improves the consistency and reliability of product quality, utilizes the multiple groups of placing grooves in annular arrangement design in combination with the rotating device, so that multiple chips can be operated at different processing stages at the same time, which not only increases the number of chips processed at a time, but also significantly improves the detection speed.

[0017] The semiconductor integrated circuit chip detection device, through the setting of the fixing device, uses the negative pressure environment formed by the vacuum pump and the transmission pipe to fix the chip, instead of the traditional mechanical clamp, which can effectively avoid physical damage to the chip, especially suitable for the chip without sensitive elements on the back but very fragile, the vacuum adsorption can ensure that the chip remains stable during the whole detection process and will not displace or tilt, since the chip is closely attached to the bottom of the placing groove, the position change caused by external factors (such as vibration, collision, etc.) is reduced, thereby improving the accuracy and reliability of the detection result.

[0018] The semiconductor integrated circuit chip detection device, through the setting of the discharging device, through the control system triggering the action of the second electric telescopic rod, can realize the accurate control of the discharging process, ensure that each chip can be accurately pushed out from the placing groove and enter the discharging frame, which is convenient for subsequent collection or processing, the design ensures that the chip can be quickly and effectively pushed out from the placing groove after detection, once the chip is successfully pushed out, the second electric telescopic rod is retracted, driving the second push plate back to the initial position, ready for the next detection cycle, thereby improving the overall work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the enlarged structure of part A in the utility model; Figure 1

[0021] Figure 3 It is a schematic diagram of the half-partial first angle three-dimensional structure of the protective frame of the utility model;

[0022] Figure 4 It is a schematic diagram of the half-partial second angle three-dimensional structure of the protective frame of the utility model.

[0023] ​In the figure: 1, detection table; 2, protective frame; 3, X-ray detector; 4, turntable; 5, placing groove; 6, feeding port; 7, feeding frame; 8, conveying belt; 9, threaded rod; 10, sliding block; 11, lifting plate; 12, micro motor; 13, first electric telescopic rod; 14, first push plate; 15, discharge port; 16, discharge frame; 17, second electric telescopic rod; 18, second push plate; 19, transmission pipe; 20, vacuum pump; 21, rotating shaft; 22, driven gear; 23, driving motor; 24, driving gear; 25, supporting leg. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] Please refer to Figures 1-4The utility model provides a semiconductor integrated circuit chip detection device, including detection stage 1, guard frame 2, X ray detector 3, fixing device, feed arrangement, discharge device and rotating device, the top of detection stage 1 is installed guard frame 2, the inside bottom wall of guard frame 2 is installed X ray detector 3, the top of detection stage 1 is installed carousel 4 through rotating device, carousel 4's top is annular and is opened with multiple groups of placement slot 5, the bottom wall of placement slot 5 is installed fixing device, is installed discharge device in placement slot 5, the front end of guard frame 2 is opened with feed port 6, is installed feed frame 7 in feed port 6, the bottom wall of feed frame 7 is installed conveying belt 8, the one end of feed frame 7 is installed feed arrangement close to feed port 6, and feed arrangement includes screw rod 9, sliding block 10, lifting plate 11, micro motor 12, first electric telescopic handle 13 and first push plate 14, the inside wall of one end of feed frame 7 is opened with rectangular slot, the rotation is installed screw rod 9 in rectangular slot, and the top of screw rod 9 is installed micro motor 12 through the penetration of rectangular slot top wall, and screw rod 9 is installed sliding block 10 with screw thread, the side wall of sliding block 10 is fixedly installed lifting plate 11, the side wall of one end of lifting plate 11 is installed first electric telescopic handle 13 away from placement slot 5, and the output of first electric telescopic handle 13 is installed first push plate 14 through the penetration of lifting plate 11, and one end of the side wall of guard frame 2 is opened with discharge port 15, is installed discharge frame 16 in discharge port 15, in the embodiment, when using, start rotating device, and the chip is sent into feed frame 7 through conveying belt 8, when the chip is transported to the end of feed frame 7, stop the operation of conveying belt 8, then start micro motor 12, and micro motor 12 drives screw rod 9 to rotate, and when screw rod 9 rotates, sliding block 10 moves up and down, and lifting plate 11 on sliding block 10 moves along, from top to bottom to the side of semiconductor integrated circuit chip, and the output of first electric telescopic handle 13 pushes first push plate 14 and pushes the chip from conveying belt 8 to placement slot 5, by adjusting the working condition of micro motor 12 and first electric telescopic handle 13, can accurately control the chip quantity and position of each push, ensure that every placement slot 5 can accurately receive a chip, when the chip is pushed to placement slot 5, fixing device starts, ensures that the chip does not move during the detection, and rotating device makes carousel 4 rotate, and the chip in placement slot 5 is taken to the detection under X ray detector 3 in turn, and X ray detector 3 scans the chip comprehensively, checks whether the internal structure has the defect or other question, after detection, rotating device again acts, and the chip of completing detection is transferred to discharge device, and discharge device pushes the chip from placement slot 5 and enters discharge frame 16, prepares to collect or further processes, and the whole process is completely automated from feeding to discharging, reduces manual intervention, improves production efficiency and consistency, utilizes micro motor 12 and electric telescopic handle and can realize the accurate control of chip position,Ensure that each step is accurate, because the design of the ring arrangement of multiple groups of placement slot 5, combined with the rotating device, so that multiple chips can be in the same time in different stages of processing, greatly improving the detection speed and efficiency.

[0026] In actual use, further facilitate the discharge of semiconductor integrated circuit chip after detection, in the embodiment, the discharge device includes a second electric telescopic rod 17 and a second push plate 18, the placement slot 5 is embedded in the side wall of the second electric telescopic rod 17 near the center of the turntable 4, the output end of the second electric telescopic rod 17 is installed with the second push plate 18, when one or more chips complete the internal structure inspection after the X-ray detector 3, the rotating device rotates the turntable 4 to a specific position, so that the placement slot 5 where the chip has completed the detection is aligned with the discharge device, the system triggers the second electric telescopic rod 17 to act, so that it extends outward, because the second electric telescopic rod 17 is installed on the side wall of the placement slot 5 near the center of the turntable 4, the second push plate 18 connected to the output end of the second electric telescopic rod 17 will move along the direction of the placement slot 5, the system triggers the second electric telescopic rod 17 to act, so that it extends outward, because the second electric telescopic rod 17 is installed on the side wall of the placement slot 5 near the center of the turntable 4, the second push plate 18 connected to the output end of the second electric telescopic rod 17 will move along the direction of the placement slot 5, once the chip is successfully pushed out, the second electric telescopic rod 17 is retracted, driving the second push plate 18 back to the initial position, ready for the next detection cycle.

[0027] In actual use, further facilitate the fixation of semiconductor integrated circuit chip, in the embodiment, the fixing device includes a transmission pipe 19 and a vacuum pump 20, the transmission pipe 19 is embedded in the inner bottom wall of the placement slot 5, the bottom wall of the turntable 4 is annularly installed with multiple vacuum pumps 20, the bottom end of the transmission pipe 19 penetrates the turntable 4 and is connected with the corresponding vacuum pump 20, when the chip is correctly positioned in the placement slot 5, the control system activates the corresponding vacuum pump 20, the vacuum pump 20 starts to work, and the air in the placement slot 5 is extracted through the transmission pipe 19, thereby generating a negative pressure environment at the bottom of the placement slot 5, as the vacuum pump 20 continues to run, the generated negative pressure makes the chip tightly adhere to the bottom of the placement slot 5, ensuring that the chip remains stable during the entire detection process and does not displace or tilt, after the detection is completed, the vacuum pump 20 stops working, releasing the negative pressure, allowing the discharge device to push the chip out of the placement slot 5, using vacuum adsorption to fix the chip avoids physical damage to the chip that may be caused by traditional mechanical clamps, and is particularly suitable for chips that have no sensitive elements on the back but are very fragile, vacuum adsorption can provide uniform and stable fixing force, which helps to maintain the accurate position of the chip during detection, which is particularly important for applications that require high-precision detection, such as X-ray detection.

[0028] In actual use, further continuous detection is carried out on the semiconductor integrated circuit chip, in the embodiment, the rotating device comprises a rotating shaft 21, a driven gear 22, a driving motor 23 and a driving gear 24, the rotating shaft 21 is rotatably installed at the top end of the detection table 1, the top wall of the rotating shaft 21 is fixedly connected with the bottom wall of the rotating disc 4, the outer wall of the rotating shaft 21 is installed with the driven gear 22, the top wall of the detection table 1 is installed with the driving motor 23, the output end of the driving motor 23 is installed with the driving gear 24, the driven gear 22 and the driving gear 24 are meshingly connected, before detection starts, the semiconductor integrated circuit chip has been placed in the plurality of placing grooves 5 on the rotating disc 4 and is stably fixed by the fixing device (such as the vacuum pump 20 and the transmission pipe 19), when everything is ready, the control system starts the driving motor 23 installed at the top wall of the detection table 1, the output end of the driving motor 23 is connected with the driving gear 24, with the driving motor 23 driving the driving gear 24 to rotate, the driven gear 22 rotates through the meshing action between the gears, and in turn drives the rotating shaft 21 to rotate, with the continuous rotation of the rotating disc 4, the chip in each placing groove 5 will pass below the X-ray detector 3 in turn to complete the detection of the internal structure thereof, when one chip completes the detection, the next chip will be automatically positioned to the detection position, realizing the continuous detection process, after the detection is completed, the control system can control the driving motor 23 to stop running, so that the rotating disc 4 stops at a specific position, facilitating the discharging device to push the detected chip out of the placing groove 5 and into the discharging frame 16, through the rotating device, simultaneous processing and continuous detection of multiple chips are realized, the detection efficiency is greatly improved, and the waiting time of a single chip is reduced.

[0029] Preferably, in the embodiment, the feeding frame 7 and the discharging frame 16 are both designed in a U shape, the U-shaped design provides an open inlet and outlet, so that the chip is more easily sent in or taken out, reduces the operation difficulty of the mechanical arm or other automatic tools, and improves the work efficiency.

[0030] Preferably, in the embodiment, the bottom wall of the placing groove 5 is subjected to polishing treatment, and the surface roughness is less than 0.1 microns, the smooth surface after polishing can significantly reduce the friction when contacting with the chip, which is particularly important for the case that the chip needs to be moved by mechanical means (such as the feeding and discharging process), and the low friction coefficient helps to reduce the risk of wear on the surface of the chip and protect the semiconductor integrated circuit chip from physical damage.

[0031] Preferably, in this embodiment, the bottom corners of the detection table 1 are provided with supporting legs 25, which can provide stable base support and ensure that the entire detection device does not shake or shift even during operation, which is particularly important for high-precision operations such as accurate positioning and detection of chips, as any slight movement can affect the final detection results.

[0032] Preferably, in this embodiment, the driving motor 23 and the micro motor 12 are both servo motors, which are known for their high-precision position control capabilities and can achieve very accurate position positioning, which is crucial for situations that require accurate positioning, such as accurately placing chips in the placement slots 5 to ensure that each chip can be properly detected, and the servo motor can adjust its position in real time through a feedback system to ensure consistency and accuracy of each operation.

[0033] To better illustrate the possible application scenarios, technical principles, specific implementation schemes, and the purposes and effects that can be achieved, the following will be described in detail in conjunction with the specific embodiments listed and the accompanying drawings. The embodiments described in this paper are only used to more clearly illustrate the technical solutions of the present application, therefore only serve as examples, and cannot limit the protection scope of the present application.

[0034] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor integrated circuit chip detection device, comprising a detection table (1), a protective frame (2), an X-ray detector (3), a fixing device, a feeding device, a discharging device and a rotating device, characterized in that: The top end of the detection platform (1) is provided with the protective frame (2), the inner bottom wall of the protective frame (2) is provided with the X-ray detector (3), the top end of the detection platform (1) is provided with the rotating disc (4) through the rotating device, the top end of the rotating disc (4) is provided with a plurality of groups of placing grooves (5) in a ring shape, the bottom wall of the placing groove (5) is provided with the fixing device, the placing groove (5) is provided with the discharging device, the front end of the protective frame (2) is provided with the feeding port (6), the feeding port (6) is provided with the feeding frame (7), the bottom wall of the feeding frame (7) is provided with the conveying belt (8), one end of the feeding frame (7) close to the feeding port (6) is provided with the feeding device, the feeding device comprises a threaded rod (9), a sliding block (10), a lifting plate (11), a micro motor (12), a first electric telescopic rod (13) and a first push plate (14), the inner side wall of one end of the feeding frame (7) is provided with a rectangular groove, the threaded rod (9) is rotatably installed in the rectangular groove, the top end of the threaded rod (9) penetrates through the top wall of the rectangular groove and is provided with the micro motor (12), the threaded rod (9) is provided with the sliding block (10), the side wall of the sliding block (10) is fixedly provided with the lifting plate (11), the side wall of one end of the lifting plate (11) away from the placing groove (5) is provided with the first electric telescopic rod (13), the output end of the first electric telescopic rod (13) penetrates through the lifting plate (11) and is provided with the first push plate (14), one end of the side wall of the protective frame (2) is provided with the discharging port (15), the discharging port (15) is provided with the discharging frame (16).

2. The semiconductor integrated circuit chip detection apparatus according to claim 1, characterized by: The discharging device comprises a second electric telescopic rod (17) and a second push plate (18), one end of the side wall of the placing groove (5) close to the center of the rotating disc (4) is embeddedly provided with the second electric telescopic rod (17), the output end of the second electric telescopic rod (17) is provided with the second push plate (18).

3. The semiconductor integrated circuit chip detection apparatus according to claim 2, characterized by: The fixing device comprises a transmission pipe (19) and a vacuum pump (20), the transmission pipe (19) is embeddedly installed in the bottom wall of the placing groove (5), a plurality of groups of the vacuum pump (20) are annularly installed on the bottom wall of the rotating disc (4), the bottom end of the transmission pipe (19) penetrates through the rotating disc (4) and is connected with the corresponding vacuum pump (20).

4. The semiconductor integrated circuit chip detection apparatus according to claim 3, characterized by: The rotating device comprises a rotating shaft (21), a driven gear (22), a driving motor (23) and a driving gear (24), the top end of the detection platform (1) is rotatably provided with the rotating shaft (21), the top wall of the rotating shaft (21) is fixedly connected with the bottom wall of the rotating disc (4), the outer wall of the rotating shaft (21) is provided with the driven gear (22), the top wall of the detection platform (1) is provided with the driving motor (23), the output end of the driving motor (23) is provided with the driving gear (24), the driven gear (22) and the driving gear (24) are meshedly connected.

5. The semiconductor integrated circuit chip detection apparatus according to claim 4, characterized by: The feeding frame (7) and the discharging frame (16) are both designed in a U shape.

6. The semiconductor integrated circuit chip detection apparatus according to claim 5, wherein The bottom wall of the placing groove (5) is polished, and the surface roughness is less than 0.1 microns.

7. The semiconductor integrated circuit chip detection apparatus according to claim 6, wherein The support legs (25) are arranged at the four corners of the bottom end of the detection table (1).

8. The semiconductor integrated circuit chip detection apparatus according to claim 7, characterized by: The driving motor (23) and the micro motor (12) are both servo motors.

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