Film tearing device for ultrathin wafer

Abstract

The utility model provides a film tearing device for an ultra-thin wafer, which relates to the technical field of wafer processing and comprises a wafer bearing platform for placing a wafer to be subjected to film tearing; the film tearing mechanism is arranged above the wafer bearing platform and comprises a film tearing roller which is pre-wound with an adhesive tape for tearing a film and is used for winding the adhesive tape to separate the film of the wafer to be subjected to film tearing from the wafer; the adhesive tape penetrates through the space between the film pressing roller and the wafer to be subjected to film tearing, and the adhesive tape and the wafer to be subjected to film tearing are pressed tightly before the film tearing roller is rolled; and the height adjusting mechanism adjusts the height of the film pressing roller before the film pressing roller presses the adhesive tape, so that the film pressing roller is in contact with the wafer to be subjected to film tearing at preset pressure. The device has the beneficial effects that the film pressing roller is ensured to be in contact with the wafer at the preset pressure through accurate control, the damage to the surface of the wafer caused by overlarge pressure is avoided, the adhesive tape can be ensured to be uniformly and stably attached to the surface of the wafer to be subjected to film tearing, and the adhesive tape is prevented from deviating or wrinkling in the film tearing process, so that the film tearing uniformity is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially relates to a tear film device of ultrathin wafer. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers as the basic material of integrated circuits, every step of its processing process is crucial. Especially in advanced packaging technology, temporary bonding process is widely used for temporary bonding between wafers to facilitate subsequent precision machining operations. This process involves coating a layer of special glue on the wafer surface, which solidifies during the bonding process to form a thin glue film, effectively fixing the wafer while facilitating separation between wafers in subsequent processes through dissociation steps.

[0003] The dissociation process usually relies on the application of high-viscosity adhesive tape, which can firmly adhere to the glue film, thereby physically separating the wafers while minimizing damage to the wafers themselves. However, with the continuous advancement of semiconductor technology, wafers tend to develop towards ultrathin, which poses unprecedented challenges to the dissociation process. Due to its extremely low mechanical strength and fragile physical properties, traditional adhesive film tearing devices face great difficulties in handling ultra-thin wafers.

[0004] The existing adhesive film tearing devices on the market are mainly designed for handling thicker wafers or materials, and their operating mechanisms often rely on larger mechanical forces to achieve effective separation of the adhesive tape from the wafer surface. Such force is extremely easy to cause wafer cracking, scratching or surface damage for ultra-thin wafers, thereby seriously affecting the yield and reliability of the final product. The high value of ultra-thin wafers and the strict requirement for perfect and flawless surface make any minor physical damage unacceptable.

[0005] Therefore, the main technical problem existing in the prior art is the lack of an adhesive film tearing device specially designed for ultra-thin wafers, which needs to be able to accurately and efficiently perform the dissociation operation without damaging the wafers. Due to their inherent limitations, traditional handling methods and tools cannot meet the high standards and strict requirements of ultra-thin wafer processing, and it is urgent to develop new technical solutions to overcome this problem and ensure the integrity and yield of ultra-thin wafers during the manufacturing process. SUMMARY

[0006] In view of the problems existing in the prior art, the utility model provides a tear film device for ultra-thin wafers, comprising:

[0007] A wafer support platform is provided on which the wafer to be torn is placed;

[0008] A film tearing mechanism is provided above the wafer support platform, comprising:

[0009] a film tearing roller, on which a tape for film tearing is pre-wound, for winding the tape to separate the film of the wafer to be torn from the wafer;

[0010] a film pressing roller arranged at one side of the film tearing roller, through which the tape passes between the film pressing roller and the wafer to be torn, for pressing the tape against the wafer to be torn before winding by the film tearing roller;

[0011] a height adjusting mechanism for adjusting the height of the film pressing roller so that the film pressing roller contacts the wafer to be torn at a preset pressure before the film pressing roller presses the tape.

[0012] Preferably, the height adjusting mechanism comprises:

[0013] a height adjusting plate connected with the film pressing roller, in which a plurality of precision lead screws are arranged;

[0014] a height adjusting motor connected with one end of the precision lead screws, for driving the precision lead screws to lift or lower to adjust the distance between the film pressing roller and the wafer to be torn, so that the film pressing roller contacts the wafer to be torn at a preset pressure.

[0015] Preferably, the film tearing mechanism further comprises a spring, one end of which is mounted at the bottom of the height adjusting plate.

[0016] a pressure sensor arranged on the mounting plate of the film pressing roller, the other end of the spring being connected with the pressure sensor.

[0017] Preferably, the height adjusting plate and the spring are further provided with a locking structure at the connection position, the locking structure being used for locking the spring when the pressure sensor reaches the preset pressure.

[0018] Preferably, the locking structure comprises:

[0019] a locking rod, one end of which penetrates the height adjusting plate and the spring along the thickness direction of the height adjusting plate and is connected with the pressure sensor;

[0020] a locking member arranged at the other end of the locking rod.

[0021] Preferably, the film tearing mechanism further comprises a reciprocating driving member connected with the film pressing roller, for driving the film pressing roller to reciprocate to press the tape against the wafer to be torn.

[0022] Preferably, the film tearing mechanism further comprises an angle adjusting member for fixing the film tearing roller on one side of the film pressing roller and adjusting the distance between the film tearing roller and the wafer to be torn, thereby adjusting the angle formed by the adhesive tape and the wafer to be torn.

[0023] Preferably, the film pressing roller is provided with a first fixing plate at both ends, the film tearing roller is provided with a second fixing plate at both ends, and the angle adjusting member comprises:

[0024] a plurality of angle adjusting rods, one end of each of the angle adjusting rods being rotatably fixed on the first fixing plate, and the other end of each of the angle adjusting rods being rotatably fixed on the second fixing plate.

[0025] Preferably, at least two angle adjusting rods are provided at the same end of the film pressing roller and the film tearing roller.

[0026] The lengths of the angle adjusting rods at the same end are different.

[0027] The angle adjusting rods at the same end are not parallel to each other.

[0028] Preferably, the film tearing mechanism is provided with a film tearing motor arranged at one end of the film tearing roller for driving the film tearing roller to wind the adhesive tape to separate the film from the wafer to be torn.

[0029] The above technical solution has the following advantages or beneficial effects:

[0030] 1. The height adjusting mechanism allows accurate adjustment of the height of the film pressing roller before the film pressing roller presses the adhesive tape, according to the specific conditions of the wafer and the required film tearing pressure. This precise control ensures that the film pressing roller contacts the wafer at a preset pressure, avoiding damage to the wafer surface caused by excessive pressure. At the same time, the use of adhesive tape instead of mechanical scraping to tear the film further reduces the risk of wafer damage.

[0031] 2. The device ensures that the adhesive tape can be uniformly and stably attached to the surface of the wafer to be torn through the cooperation of the film tearing roller and the film pressing roller. The film pressing roller first presses the adhesive tape against the wafer before the film tearing roller winds the adhesive tape, which helps to avoid displacement or wrinkling of the adhesive tape during the film tearing process, thereby ensuring the uniformity of film tearing. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 In a preferred embodiment of the present application, a side view of a film tearing device for an ultra-thin wafer is shown.

[0033] Figure 2 In a preferred embodiment of the present application, a structure diagram of a film pressing roller and a height adjusting mechanism is shown.

[0034] Figure 3 For the preferred embodiment of the present application, a front structure schematic diagram of a film tearing device for ultra-thin wafers is provided. DETAILED DESCRIPTION

[0035] The present application will be described in detail below with reference to the drawings and specific embodiments. The present application is not limited to this embodiment, as long as it conforms to the spirit of the present application, other embodiments can also fall within the scope of the present application.

[0036] In the preferred embodiment of the present application, based on the above problems existing in the prior art, a film tearing device for ultra-thin wafers is provided, as shown in the figure, comprising: Figure 1

[0037] Wafer supporting platform 1, the wafer supporting platform 1 is placed on the wafer to be torn off the film 100;

[0038] Film tearing mechanism 2, the film tearing mechanism 2 is arranged above the wafer supporting platform 1, comprising:

[0039] Film tearing roller 21, the film tearing roller 21 is pre-wound with adhesive tape 22 for tearing film, which is used to wind the adhesive tape to separate the film of the wafer to be torn off from the wafer;

[0040] Film pressing roller 23, arranged on one side of the film tearing roller 21, the adhesive tape passes between the film pressing roller 23 and the wafer to be torn off, used to press the adhesive tape 22 and the wafer to be torn off 100 before winding by the film tearing roller 21;

[0041] Height adjusting mechanism 24, used to adjust the height of the film pressing roller 23 before the film pressing roller 23 presses the adhesive tape 22, so that the film pressing roller 23 contacts the wafer to be torn off 100 with a preset pressure.

[0042] Specifically, in the present embodiment, by controlling the force of the film tearing roller 21 and the wafer supporting platform 1 with high precision, the adhesive film separation function on the ultra-thin wafer can be realized, which has the characteristics of high operation precision and higher protection effect on the wafer.

[0043] The design of the height adjusting mechanism 24 allows the height of the film pressing roller 23 to be adjusted accurately before the film pressing roller 23 presses the adhesive tape 22, according to the specific situation of the wafer and the required film tearing pressure. This precise control ensures that the film pressing roller 23 contacts the wafer to be torn off 100 with a preset pressure, avoiding damage to the wafer surface caused by excessive pressure.

[0044] At the same time, using adhesive tape 22 instead of mechanical scraping to tear off the film can further reduce the risk of damage to the wafer to be torn off 100.

[0045] ​The cooperation of the film tearing roller 21 and the film pressing roller 23 ensures that the adhesive tape 22 can be uniformly and stably attached to the surface of the wafer 100 to be torn. The film pressing roller 23 first presses the adhesive tape 22 against the wafer 100 to be torn before the film tearing roller 21 winds the adhesive tape 22, which helps to avoid the deviation or wrinkling of the adhesive tape 22 during the film tearing process, thereby ensuring the uniformity of film tearing.

[0046] The film tearing device for ultra-thin wafers effectively solves the technical problems of uneven film tearing, wafer damage, and contamination during the film tearing process through its unique design, including the wafer holding platform 1, the film tearing mechanism 2 (including the film tearing roller 21 and the film pressing roller 23), and the height adjustment mechanism 24. This device not only improves the accuracy and efficiency of film tearing, but also helps to protect the integrity of ultra-thin wafers during the film tearing process, thereby meeting the demand for high-quality processing in semiconductor manufacturing.

[0047] In the preferred embodiment of the present application, as shown in Figure 1 and Figure 2 , the height adjustment mechanism 24 includes:

[0048] The height adjustment plate 241 is connected to the film pressing roller 23, and a plurality of precision lead screws 242 are arranged in the height adjustment plate 241.

[0049] The height adjustment motor 243 is connected to one end of the precision lead screw 242 and is used to drive each precision lead screw 242 to lift and lower to adjust the distance between the film pressing roller 23 and the wafer 100 to be torn, so as to contact the wafer 100 to be torn with a preset pressure.

[0050] Specifically, in the present embodiment, the use of precision lead screws 242 enables the mechanism to perform very subtle and precise lifting actions. This is crucial for applications that require strict control of the distance between the film pressing roller 23 and the wafer 100 to be torn, as it ensures accurate contact with the wafer at a preset pressure every time, avoiding film tearing quality problems or wafer damage caused by improper spacing.

[0051] The introduction of the height adjustment motor 243 realizes the automation of height adjustment, reduces the dependence on manual operation, and improves production efficiency and consistency. The motor can accurately control the lifting speed and position of the lead screw, making the height adjustment process more controllable and predictable.

[0052] In the preferred embodiment of the present application, as shown in Figure 2 , the film tearing mechanism also includes a spring 244, one end of which is installed at the bottom of the height adjustment plate 241.

[0053] The pressure sensor 245 is arranged on the mounting plate of the film pressing roller 23, and the other end of the spring is connected to the pressure sensor 245.

[0054] In the preferred embodiment of the utility model, as shown in Figure 2 The locking structure 246 is arranged at the connection between the height adjusting plate and the spring 244, and is used for locking the spring 244 when the pressure sensor 245 reaches the preset pressure.

[0055] Specifically, in the embodiment, the introduction of the spring 244 allows the film pressing roller 23 to have a certain elastic buffering capacity when contacting the wafer 100 to be torn. This not only can adapt to the slight unevenness of the wafer surface, reduce the risk of wafer damage caused by rigid contact, but also can provide more uniform and stable pressure distribution during the film tearing process.

[0056] The arrangement of the pressure sensor 245 makes it possible to monitor the actual pressure applied by the film pressing roller 23 on the wafer in real time. By comparing with the preset pressure value, the action of the height adjusting mechanism 24 can be accurately controlled to ensure that each film tearing operation can be carried out under the best pressure condition.

[0057] The design of the locking structure 246 is very critical. It can automatically lock the spring 244 when the pressure sensor 245 detects that the preset pressure is reached, and at the same time stop the height adjusting motor 243 to prevent the pressure from further increasing. This not only ensures the accuracy and stability of the film tearing operation, but also increases the safety of the equipment, avoiding wafer damage or equipment failure caused by excessive pressure.

[0058] In the preferred embodiment of the utility model, as shown in Figure 2 The locking structure 246 comprises:

[0059] The locking rod 2461 penetrates the height adjusting plate 241 and the spring 244 along the thickness direction of the height adjusting plate 241, and is connected with the pressure sensor 245 at one end of the locking rod 2461;

[0060] The locking piece 2462 is arranged at the other end of the locking rod 2461.

[0061] Specifically, in the embodiment, the design of the locking rod 2461 allows it to directly penetrate the height adjusting plate 241 and the spring 244, and be connected with the pressure sensor 245. This direct connection reduces intermediate links, improves the reliability and response speed of the locking. During the descent of the height adjusting mechanism 24, after the film pressing roller 23 touches the wafer 100 to be torn, the spring 244 gradually contracts, and the locking rod 2461 gradually extends from the locking piece 2462 (in the upward direction in the figure). When the pressure sensor 245 detects that the preset pressure is reached (a locking level signal is sent, for example, one of high level or low level), the locking piece 2462 can quickly respond to the locking level signal to clamp and fix the locking rod 2461, and lock the spring 244 in the appropriate position.

[0062] Through the precise control of the locking structure 246, it can be ensured that the film pressing roller 23 contacts the wafer with constant pressure during the film tearing process, thereby improving the stability and durability of the equipment. This precise control reduces the risk of wafer damage caused by pressure fluctuations and prolongs the service life of the equipment.

[0063] In the preferred embodiment of the present application, the film tearing mechanism 2, as shown in Figure 1 , further comprises a back-and-forth driving member 25 connected to the film pressing roller 23 for driving the film pressing roller 23 to reciprocate and press the adhesive tape 22 against the wafer 100 to be torn.

[0064] Specifically, the back-and-forth driving member 25 can drive the film pressing roller 23 to reciprocate (along the left-right direction in Figure 1 ) during the film tearing process. This movement helps to ensure that the adhesive tape 22 can be more evenly attached to the surface of the wafer 100 to be torn. Through multiple reciprocating pressings, the possibility of the adhesive tape shifting or wrinkling during the film tearing process can be reduced, thereby improving the uniformity and consistency of the film tearing.

[0065] In the preferred embodiment of the present application, the film tearing mechanism 2, as shown in Figure 1 , further comprises an angle adjusting member 26 for fixing the film tearing roller 21 on one side of the film pressing roller 23 and adjusting the distance between the film tearing roller 21 and the wafer 100 to be torn, thereby adjusting the angle formed by the adhesive tape 22 and the wafer 100 to be torn.

[0066] Specifically, in this embodiment, by adjusting the position and angle of the film tearing roller 21, the cooperation between the film tearing roller 21 and the adhesive tape can be optimized. This helps to reduce the problems of the adhesive tape shifting, wrinkling or breaking during the film tearing process, and improves the stability and reliability of the film tearing operation. The precise adjustment function of the angle adjusting member 26 enables the film tearing mechanism to complete the film tearing task with higher efficiency. By quickly adjusting the angle, different film tearing requirements can be quickly adapted, reducing the operation time and cost.

[0067] Adjusting the film tearing angle within the range of 80-175° can ensure that the adhesive tape forms an appropriate contact area and friction with the surface of the wafer. This angle range helps to achieve better adhesion and higher film tearing efficiency during the film tearing process. At the same time, this angle range can also reduce the risk of damage to the wafer surface, protecting the integrity of the wafer.

[0068] In the preferred embodiment of the present application, as shown in Figure 1 , the film pressing roller 23 is provided with a first fixed plate 3 at both ends, the film tearing roller 21 is provided with a second fixed plate 4 at both ends, and the angle adjusting member 26 comprises:

[0069] A plurality of angle adjustment rods 261, one end of each angle adjustment rod 261 is rotatably fixed on the first fixed plate 3, the other end of each angle adjustment rod 261 is rotatably fixed on the second fixed plate 4.

[0070] In the preferred embodiment of the utility model, as shown in Figure 1 The same end of the film pressing roller 23 and the film tearing roller 21 is provided with at least two angle adjustment rods 261;

[0071] The length of the angle adjustment rods 261 at the same end is different;

[0072] The angle adjustment rods 261 at the same end are not parallel.

[0073] Specifically, by arranging a plurality of angle adjustment rods 261 on the first fixed plate 3 and the second fixed plate 4 respectively, a more stable support structure can be formed. This design helps to maintain the stability and rigidity of the whole when adjusting the angle between the film tearing roller 21 and the film pressing roller 23, thereby ensuring the accuracy of angle adjustment.

[0074] The angle adjustment rods 261 at the same end adopt different lengths and non-parallel design, which provides more adjustment options. The operator can select different angle adjustment rods 261 or adjust their relative positions according to actual needs to achieve more precise angle adjustment.

[0075] By adopting the design of a plurality of angle adjustment rods 261, stress and load can be dispersed, reducing the risk of wear and damage of single components. This helps to enhance the overall durability of the equipment and reduce maintenance costs.

[0076] In the preferred embodiment of the utility model, as shown in Figure 3 The film tearing mechanism 2 is provided with a film tearing motor 211 arranged at one end of the film tearing roller 21, which is used to drive the film tearing roller 21 to wind the adhesive tape 22 to separate the film of the wafer to be torn from the wafer.

[0077] Specifically, in the preferred embodiment of the utility model, the wafer supporting platform 1 is made of microporous ceramic. Microporous ceramic is a ceramic body containing a large number of open or closed micropores on the inside or surface of the ceramic, with a pore size generally in the micrometer or sub-micrometer range. A vacuum suction device is arranged at the bottom of the wafer supporting platform 1, which can transfer vacuum through its microporous structure, achieving more uniform suction force. This helps to ensure the stability of the wafer during the film tearing process, avoiding displacement or deformation caused by uneven suction. Since the microporous ceramic has a small and uniform pore size, using the vacuum suction device for suction can form a more delicate suction force distribution on the wafer surface, thereby avoiding leaving obvious suction marks on the wafer. This is crucial for maintaining the surface quality and integrity of the wafer.

[0078] A plurality of liftable supporting shafts are arranged at the bottom of the wafer supporting platform 1, which are used to adjust the height of the wafer supporting platform 1, and can also satisfy the horizontal adjustment of the wafer supporting platform 1, and ensure that the contact force between the film pressing roller 23 and the wafer is uniformly distributed during the movement of the film pressing roller 23 in a stable state.

[0079] The overall working process of the ultra-thin wafer film tearing device in the utility model is as follows:

[0080] 1. Initial preparation:

[0081] The wafer to be torn off the film 100 is placed on the wafer supporting platform 1. The wafer supporting platform 1 ensures the stability of the wafer during the film tearing process.

[0082] 2. Height adjustment and film pressing preparation:

[0083] The height adjustment mechanism 24 starts to work, and the precision lead screw 242 is driven to rise or fall by the height adjustment motor 243, so as to adjust the height of the film pressing roller 23.

[0084] When the film pressing roller 23 contacts the wafer to be torn off the film 100 with a preset pressure, the height adjustment stops. During this process, the spring 244 and the pressure sensor 245 jointly monitor and control the pressure between the film pressing roller 23 and the wafer.

[0085] When the pressure sensor 245 reaches the preset pressure value, the locking structure 246 is started, and the spring 244 is locked by the locking rod 2461 and the locking piece 2462, so as to ensure the stability of the film pressing roller 23 during the film tearing process.

[0086] 3. Film pressing action:

[0087] The film pressing roller 23 is driven to move back and forth by the reciprocating driving piece 25 in the locked state, so as to press the adhesive tape 22 pre-wound on the film tearing roller 21 and the wafer to be torn off the film 100.

[0088] At the beginning of the film tearing at the edge of the wafer, the film pressing roller 23 will repeatedly perform the film pressing action many times, so as to ensure that the adhesive tape 22 and the film on the wafer can be fully adhered.

[0089] 4. Film tearing preparation:

[0090] The angle adjusting piece 26 adjusts the distance and angle between the film tearing roller 21 and the wafer to be torn off the film 100 according to the needs, so as to ensure that the angle formed by the adhesive tape 22 and the wafer is suitable for the film tearing operation.

[0091] This is achieved by a plurality of angle adjusting rods 261 with different lengths and not parallel to each other, one end of the angle adjusting rod 261 is fixed on the first fixed plate 3 of the film pressing roller 23, and the other end is fixed on the second fixed plate 4 of the film tearing roller 21.

[0092] 5. Film tearing action:

[0093] When the adhesive tape 22 is fully adhered to the film on the wafer, the film tearing motor 211 is started to drive the film tearing roller 21 to start winding the adhesive tape 22.

[0094] In order to ensure the film tearing effect, during the winding of the adhesive tape 22 by the film tearing roller 21, the reciprocating driving member 25 also drives the film tearing roller 21, the film pressing roller 23 and other components connected as a whole to move away from the film tearing starting position, the adhesive tape 22 takes the film on the wafer away, and the film tearing operation is completed.

[0095] The above is only the preferred embodiment of the present application, and does not limit the implementation and protection scope of the present application. For those skilled in the art, it should be realized that any equivalent replacement and obvious change made according to the content of the present application should be included in the protection scope of the present application.

Claims

1. An apparatus for peeling a film of an ultra-thin wafer, characterized by comprising: The application relates to a wafer film tearing device. The wafer film tearing device comprises a wafer supporting platform on which a wafer to be torn is placed, and a film tearing mechanism arranged above the wafer supporting platform. The film tearing mechanism comprises a film tearing roller on which a tape for tearing film is pre-wound, and the tape is used to wind the film to separate the film from the wafer. A film pressing roller is arranged on one side of the film tearing roller, and the tape passes between the film pressing roller and the wafer to be torn, and the film pressing roller is used to press the tape against the wafer to be torn before the film tearing roller winds the tape. A height adjusting mechanism is used to adjust the height of the film pressing roller so that the film pressing roller contacts the wafer to be torn with a preset pressure before the film pressing roller presses the tape. The height adjusting mechanism comprises a height adjusting plate connected with the film pressing roller, and a plurality of lead screws are arranged in the height adjusting plate.

2. The film tearing device of claim 1, wherein, A height adjusting motor is connected with one end of the lead screws and is used to drive the lead screws to lift or lower so as to adjust the distance between the film pressing roller and the wafer to be torn, and the film pressing roller contacts the wafer to be torn with a preset pressure. A spring is arranged in the film tearing mechanism, and one end of the spring is arranged at the bottom of the height adjusting plate. A pressure sensor is arranged on the mounting plate of the film pressing roller, and the other end of the spring is connected with the pressure sensor.

3. The film tearing device of claim 2, wherein, Locking structures are arranged at the connection between the height adjusting plate and the spring, and the locking structures are used to lock the spring when the pressure sensor reaches the preset pressure. The locking structures comprise a locking rod, one end of the locking rod penetrates the height adjusting plate and the spring and is connected with the pressure sensor along the thickness direction of the height adjusting plate, and a locking piece is arranged at the other end of the locking rod.

4. The film tearing device of claim 3, wherein, A back-and-forth driving piece is arranged in the film tearing mechanism and is connected with the film pressing roller, and the back-and-forth driving piece is used to drive the film pressing roller to move back and forth to press the tape against the wafer to be torn.

5. The film tearing device of claim 4, wherein, An angle adjusting piece is arranged in the film tearing mechanism and is used to fix the film tearing roller on one side of the film pressing roller and adjust the distance between the film tearing roller and the wafer to be torn so as to adjust the angle formed by the tape and the wafer to be torn. First fixing plates are arranged at the two ends of the film pressing roller, second fixing plates are arranged at the two ends of the film tearing roller, and the angle adjusting piece comprises a plurality of angle adjusting rods. One end of each of the angle adjusting rods is rotatably fixed on the first fixing plate, and the other end of each of the angle adjusting rods is rotatably fixed on the second fixing plate.

6. The film tearing device of claim 1, wherein, At least two angle adjusting rods are arranged at the same end of the film pressing roller and the film tearing roller.

7. The film tearing device of claim 1, wherein, The lengths of the angle adjusting rods at the same end are different.

8. The film tearing device of claim 7, wherein, The angle adjusting rods at the same end are not parallel. A film tearing motor is arranged in the film tearing mechanism and is arranged at one end of the film tearing roller, and the film tearing motor is used to drive the film tearing roller to wind the tape to separate the film from the wafer to be torn.

9. The film tearing device of claim 8, wherein, ​ ​ ​ 10. The film tearing device of claim 1, wherein, ​

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