Special jig for auxiliary cathode in chemical anodic oxidation of semiconductor

Abstract

The utility model discloses a special jig for a semiconductor chemical anodizing auxiliary cathode, which belongs to the technical field of anodizing auxiliary cathode jigs, and comprises a first cathode auxiliary jig, a second cathode auxiliary jig, a third cathode auxiliary jig and a fourth cathode auxiliary jig, the second cathode auxiliary jig is suspended in the to-be-plated product, is connected with the first auxiliary cathode jig and is used for being matched with the first cathode auxiliary jig and an anode connected to the to-be-plated product to carry out electroplating treatment on the interior of the to-be-plated product; wherein the to-be-plated product comprises a first barrel, a second barrel and a through groove, the second barrel is fixedly connected into the first barrel and is communicated with the first barrel, and the through groove is formed in the bottom of the first barrel; according to the utility model, the complex inner cavity of the product to be plated can be electroplated.

Description

Technical Field

[0001] This utility model belongs to the technical field of anodic oxidation auxiliary cathode fixtures, and particularly relates to a special fixture for semiconductor chemical anodic oxidation auxiliary cathodes. Background Technology

[0002] During the anodizing process, due to the current characteristics and the external cathode lead plate, there is less charge movement and weak current inside the cavity, which prevents effective anodizing. Therefore, it is necessary to add a cathode to achieve auxiliary oxidation and increase the internal current intensity.

[0003] When the product is anodized, the cathode plate is placed on both sides of the chemical solution tank. The current inside the cavity is small and cannot achieve the quality of normal oxidation. If conventional oxidation is still used, the inside of the cavity cannot fully contact the cathode plates on both sides of the tank. As a result, the film formation and dissolution rate during electrolysis is not proportional to that outside the cavity, resulting in uneven film layer and inconsistent film thickness, especially for products with complex inner cavity surfaces. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a special fixture for auxiliary cathodes in semiconductor chemical anodizing, thus solving the aforementioned problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a special fixture for auxiliary cathode in semiconductor chemical anodizing, comprising:

[0006] The first cathode auxiliary fixture is suspended in the middle of the product to be plated in the electroplating bath;

[0007] The second cathode auxiliary fixture is suspended inside the product to be plated and connected to the first auxiliary cathode fixture. It is used to cooperate with the first cathode auxiliary fixture and the anode connected to the product to be plated to perform electroplating treatment on the inside of the product to be plated.

[0008] The product to be plated includes a first cylinder, a second cylinder, and a through groove. The second cylinder is fixedly connected to and communicates with the first cylinder. The through groove is located at the bottom of the first cylinder.

[0009] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0010] A further technical solution: the through groove is a fan-shaped groove, the outer arc of the through groove fits the inner wall of the first cylinder, and the inner arc of the through groove fits the outer wall of the second cylinder.

[0011] Further technical solution: The second cylinder is in the shape of a triangular plate, and the three protrusions are connected by a circular arc wall.

[0012] Further technical solution: The first cathode auxiliary fixture includes a first cathode plate and a first through hole. Four first cathode plates are arranged to form a rectangular cylinder and are suspended in the middle of the second cylinder. Several first through holes are provided on the first cathode plate to facilitate the flow of electroplating liquid.

[0013] Further technical solution: The second cathode auxiliary fixture includes a second cathode plate, a third cathode plate, and a pin. The two second cathode plates are symmetrically arranged on both sides of the rectangular cylinder, and the third cathode plate is arranged on the front of the rectangular cylinder. The second cathode plate and the third cathode plate are detachably connected to the rectangular cylinder through the pin. The third cathode plate and the two second cathode plates are correspondingly inserted into the fan-shaped cavity formed by the first cylinder and the second cylinder. The second cathode plate and the third cathode plate are electrically connected to the cathode.

[0014] Further technical solution: Several channels for the flow of electroplating liquid are provided on both the second and third cathode plates.

[0015] A further technical solution: The cross-sections of the second cathode plate and the third cathode plate are both L-shaped, and the second cathode plate is fan-shaped overall.

[0016] A further technical solution: The second cathode plate and the third cathode plate are located at the same height and are arranged in a triangular shape.

[0017] A further technical solution: The pin, through a first through hole on the first cathode plate and second through holes on the second and third cathode plates, respectively, defines the second and third cathode plates on the corresponding first cathode plates.

[0018] This invention provides a special fixture for auxiliary cathodes in semiconductor chemical anodizing, which has the following advantages compared with the prior art:

[0019] 1. This invention enables the uniform electroplating of the complex internal surface of the product to be plated by placing the product in an electroplating tank containing an electroplating solution. At this time, skilled personnel use an external insulating hanger to suspend a first cathode auxiliary fixture connected to a second cathode auxiliary fixture inside the product. This causes a rectangular cylinder formed by four first cathode plates to be suspended in the middle of a second cylinder, and a third cathode plate and two second cathode plates to be suspended correspondingly within the three fan-shaped cavities formed by the first and second cylinders. The first cylinder is then connected to the anode, and the first, second, and third cathode plates are connected to the cathode. This achieves the technical effect of uniformly electroplating the internal surface of the product, which has a complex structure. Specifically, by adding cathodes inside the cavities of the product, the internal current is increased, thereby improving the efficiency and quality of anodizing. Attached Figure Description

[0020] Figure 1This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 This is a schematic diagram of the overall structure of this utility model.

[0022] Figure 3 This is an enlarged schematic diagram of the structure of the product to be plated according to this utility model.

[0023] Figure reference numerals: 1. First cathode auxiliary fixture; 101. First cathode plate; 102. First through hole; 2. Second cathode auxiliary fixture; 201. Second cathode plate; 202. Third cathode plate; 203. Pin; 301. First cylinder; 302. Second cylinder. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0025] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0026] Please see Figures 1-3 The present invention provides a special fixture for an auxiliary cathode in semiconductor chemical anodizing, comprising:

[0027] The first cathode auxiliary fixture 1 is suspended in the middle of the product 3 to be plated, located in the electroplating bath;

[0028] The second cathode auxiliary fixture 2 is suspended inside the product to be plated 3 and connected to the first auxiliary cathode fixture. It is used to cooperate with the first cathode auxiliary fixture and the anode connected to the product to be plated 3 to perform electroplating treatment on the inside of the product to be plated 3.

[0029] The product to be plated 3 includes a first cylindrical body 301, a second cylindrical body 302, and a through groove (not shown in the figure). The second cylindrical body 302 is fixedly connected inside the first cylindrical body 301 and communicates with the first cylindrical body 301. The through groove is opened at the bottom of the first cylindrical body 301.

[0030] The through groove is a fan-shaped groove, the outer arc of the through groove is attached to the inner wall of the first cylinder 301, and the inner arc of the through groove is attached to the outer wall of the second cylinder 302;

[0031] The second cylindrical body 302 is generally in the shape of a triangular plate, and the three protrusions are connected by a circular arc wall.

[0032] The first cathode auxiliary fixture 1 includes a first cathode plate 101 and a first through hole 102. Four first cathode plates 101 are arranged to form a rectangular cylinder and are suspended in the middle of the second cylinder 302. Several first through holes 102 are provided on the first cathode plate 101 to facilitate the flow of electroplating liquid. The purpose of this arrangement is to cooperate with the anode to electroplat the inner wall of the second cylinder 302 and part of the inner wall of the first cylinder 301.

[0033] The second cathode auxiliary fixture 2 includes a second cathode plate 201, a third cathode plate 202, and a pin 203. The two second cathode plates 201 are symmetrically arranged on both sides of the rectangular cylinder, and the third cathode plate 202 is arranged on the front of the rectangular cylinder. The second cathode plate 201 and the third cathode plate 202 are detachably connected to the rectangular cylinder through the pin 203. The third cathode plate 202 and the two second cathode plates 201 are correspondingly inserted into the fan-shaped cavity formed by the first cylinder 301 and the second cylinder 302. The second cathode plate 201 and the third cathode plate 202 are electrically connected to the cathode. The purpose of this arrangement is to use the second cathode plate 201 and the third cathode plate 202 in conjunction with the anode to perform electroplating treatment on the inner wall of the fan-shaped cavity formed by the second cylinder 302 and the first cylinder 301.

[0034] Preferably, both the second cathode plate 201 and the third cathode plate 202 have a plurality of second through holes 204 for the flow of the plating liquid.

[0035] Preferably, the cross-sections of the second cathode plate 201 and the third cathode plate 202 are both L-shaped, and the second cathode plate 201 is fan-shaped in general. The purpose of this arrangement is to facilitate the connection of the second cathode plate 201 and the third cathode plate 202 to the corresponding first cathode plate 101 and to allow the second cathode plate 201 and the third cathode plate 202 to be inserted into the fan-shaped cavity formed by the first cylinder 301 and the second cylinder 302.

[0036] Preferably, the second cathode plate 201 and the third cathode plate 202 are located at the same height and are arranged in a triangular shape.

[0037] The pin 203 uses a first through hole 102 on the first cathode plate 101 and a second through hole 204 on the second cathode plate 201 and the third cathode plate 202 to respectively limit the second cathode plate 201 and the third cathode plate 202 to the corresponding first cathode plate 101.

[0038] In this embodiment of the present invention, the product to be plated 3 is placed in an electroplating tank containing electroplating solution. At this time, relevant technicians use an external insulating hanger to suspend the first cathode auxiliary fixture 1 connected to the second cathode auxiliary fixture 2 inside the product to be plated 3. This causes the rectangular cylinder formed by the four first cathode plates 101 to be suspended in the middle of the second cylinder 302, and causes the third cathode plate 202 and the two second cathode plates 201 to be suspended in the three fan-shaped cavities formed by the first cylinder 301 and the second cylinder 302. At this time, the first cylinder 301 is connected to the anode, and the first cathode plate 101, the second cathode plate 201 and the third cathode plate 202 are connected to the cathode, thereby achieving the technical effect of uniform electroplating treatment on the complex internal surface of the product to be plated 3.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A special fixture for auxiliary cathode in semiconductor chemical anodizing, characterized in that, include: The first cathode auxiliary fixture (1) is suspended in the middle of the product to be plated (3) located in the electroplating bath; The second cathode auxiliary fixture (2) is suspended inside the product to be plated (3) and connected to the first auxiliary cathode fixture. It is used to cooperate with the first cathode auxiliary fixture and the anode connected to the product to be plated (3) to perform electroplating treatment on the inside of the product to be plated (3). The product to be plated (3) includes a first cylinder (301), a second cylinder (302) and a through groove. The second cylinder (302) is fixedly connected inside the first cylinder (301) and communicates with the first cylinder (301). The through groove is opened at the bottom of the first cylinder (301).

2. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 1, characterized in that, The through groove is a fan-shaped groove, the outer arc of the through groove is attached to the inner wall of the first cylinder (301), and the inner arc of the through groove is attached to the outer wall of the second cylinder (302).

3. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 1, characterized in that, The second cylindrical body (302) is generally shaped like a triangular plate, and the three protrusions are connected by a circular arc wall.

4. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 1, characterized in that, The first cathode auxiliary fixture (1) includes a first cathode plate (101) and a first through hole (102). The four first cathode plates (101) are arranged to form a rectangular cylinder and are suspended in the middle of the second cylinder (302). The first cathode plate (101) has several first through holes (102) to facilitate the flow of electroplating liquid.

5. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 4, characterized in that, The second cathode auxiliary fixture (2) includes a second cathode plate (201), a third cathode plate (202), and a pin (203). The two second cathode plates (201) are symmetrically arranged on both sides of the rectangular cylinder. The third cathode plate (202) is arranged on the front of the rectangular cylinder. The second cathode plate (201) and the third cathode plate (202) are detachably connected to the rectangular cylinder through the pin (203). The third cathode plate (202) and the two second cathode plates (201) are inserted into the fan-shaped cavity formed by the first cylinder (301) and the second cylinder (302). The second cathode plate (201) and the third cathode plate (202) are electrically connected to the cathode.

6. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 5, characterized in that, Both the second cathode plate (201) and the third cathode plate (202) have several second through holes (204) for the flow of the power plating liquid.

7. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 5, characterized in that, The cross-sections of the second cathode plate (201) and the third cathode plate (202) are both L-shaped, and the second cathode plate (201) is fan-shaped overall.

8. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 5, characterized in that, The second cathode plate (201) and the third cathode plate (202) are located at the same height and are arranged in a triangular shape.

9. The special fixture for auxiliary cathode in semiconductor chemical anodizing according to claim 5, characterized in that, The pin (203) secures the second cathode plate (201) and the third cathode plate (202) to the corresponding first cathode plate (101) through the first through hole (102) on the first cathode plate (101) and the second through hole (204) on the second cathode plate (201) and the third cathode plate (202).

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