Chip mass production test socket capable of being quickly disassembled and assembled

Abstract

The utility model provides a chip mass production test socket capable of being quickly disassembled and assembled, which comprises a test base, a floating support, a chip holding seat and a top cover, the bottom of the floating support is slidably buckled on a floating convex part at the top of the test base, the chip holding seat is arranged close to the upper surface of the floating support, and the top cover is arranged close to the top of the chip holding seat. According to the utility model, the top cover is covered on the chip holding seat and is pressed downwards until the buckling teeth at the bottoms of the buckling pieces arranged at the two sides of the top cover are buckled with the buckling grooves at the two sides of the test base, and the pins of the chip to be tested are inserted into the pin jacks arranged on the pin jack supports in a matched manner in the pressing process, so that the assembly connection of the chip to be tested is realized; the assembly is simple.

Description

TECHNICAL FIELD

[0001] The utility model relates to the socket technical field for chip test especially relates to a socket for chip mass production test of quick dismounting. BACKGROUND

[0002] Chip mass production test is an important link in integrated circuit chip production process, and the good and bad of corresponding chips are selected through a special test machine and corresponding test procedures. UTILITY MODEL CONTENTS

[0003] In order to solve the above problem, the utility model provides a socket for chip mass production test of quick dismounting to more exactly solve the above problem.

[0004] The utility model discloses a following technical scheme realizes:

[0005] The utility model discloses a socket for chip mass production test of quick dismounting, including test base, floating support, chip holding seat and top cap, the test base is integrally formed with the pin jack support on the upper portion, is equipped with the pin jack on the upper surface of pin jack support, is equipped with the test mainboard in the test base, and the test mainboard is electrically connected with pin jack, the floating convex portion is integrally formed on the upper portion of test base, and the floating support bottom is buckled on the floating convex portion of test base top, and the floating support is equipped with the pin jack support cooperation slot that is matched with pin jack support on the upper portion, four guide bolts that are vertically arranged are screwed in the four end angle positions of test base, and the floating support is equipped with the guide sliding hole that corresponds four guide bolts's position, and the upper portion cooperation of four guide bolts of test base is matched with the guide sliding hole cooperation sliding connection on the upper portion of floating support, and the upper surface of the floating support is equipped with the chip holding seat, and the chip holding seat is connected with the floating support through a plurality of screws, and the upper surface of chip holding seat is equipped with the chip cooperation slot that is matched with the appearance of chip to be measured in the middle part, and the middle part of chip cooperation slot is equipped with the through -hole that is used for the pin of chip to be measured to pass through, and the top of chip holding seat is equipped with the top cap, and the both sides of top cap are hinged with a buckle respectively, the bottom of buckle is equipped with the buckle groove that corresponds buckle's position in the bottom of test base, and the buckle tooth of buckle bottom end is buckled with buckle groove, and the top of buckle is equipped with the press head end.

[0006] Further, the hinge point of the fastener and the top cover is matched with a torsion spring, and two ends of the torsion spring are connected with the top cover and the fastener respectively.

[0007] Further, a pair of spring assembly grooves are arranged on the floating convex part of the test base, a pressure spring is arranged in the spring assembly groove, and upper and lower ends of the pressure spring are in abutment with the bottom of the spring assembly groove and the bottom of the floating support respectively.

[0008] Further, a pressure plate movable cavity is arranged on the bottom of the top cover, a pressure plate is matched in the pressure plate movable cavity, and a plurality of elastic spring telescopic rod assemblies are connected between the pressure plate and the top of the inner cavity of the pressure plate movable cavity.

[0009] Further, an external thread cylinder seat is integrally formed on the top of the top cover, a position adjusting rotating wheel is connected to the external thread cylinder seat, a plurality of vertical pressure rods are connected to the pressure plate, the plurality of pressure rods are arranged in a ring array along the center of the external thread cylinder seat, the upper ends of the pressure rods penetrate into the top of the top cover, and the upper ends of the pressure rods are in abutment with the bottom of the position adjusting rotating wheel.

[0010] The utility model discloses the beneficial effect that:

[0011] 1, the utility model discloses a top cover is arranged on the chip holding seat and is pressed down, until the buckle tooth of the bottom of the fastener arranged on the both sides of the top cover is buckled with the buckle groove on the both sides of the test base, in the pressing process, the pin of the chip to be measured is inserted into the pin insertion hole arranged on the pin insertion hole support, thereby realizing the assembly connection of the chip to be measured, and the assembly is simple, when disassembling, the pin of the chip to be measured is separated from the pin insertion hole by pressing the head end of the fastener top inwards, thereby the buckle tooth of the bottom of the fastener is separated from the buckle groove, and the top cover is removed, the pin of the chip to be measured is separated from the pin insertion hole by pulling the floating support and the chip holding seat, and no deviation is generated in the assembly and disassembly process, thereby effectively avoiding the breakage of the pin of the chip to be measured.

[0012] 2, the utility model discloses that the position adjusting rotating wheel is rotated, the pressure rod is pressed from the position adjusting rotating wheel, thereby adjusting the amount of the pressure plate protruding from the pressure plate movable cavity, the thickness of the chip to be measured can be adjusted, the effective conduction pressure of the chip to be measured is guaranteed, and the chip to be measured is not excessively pressed and broken. ACCURATE DRAWINGS

[0013] Figure 1 It is the three-dimensional structure explosion schematic diagram of the utility model;

[0014] Figure 2 It is the three-dimensional structure schematic diagram of the utility model;

[0015] Figure 3 It is the overhead view of the structure of the utility model;

[0016] Figure 4 It is Figure 3Cross-sectional view at A-A.

[0017] In the figure: 1, test base; 101, pin jack support; 102, pin jack; 103, test mainboard; 104, guide bolt; 105, pressure spring; 106, buckle groove; 2, floating support; 201, pin jack support matching notch; 202, guide sliding hole; 3, chip holding seat; 301, chip matching groove; 302, pin notch; 303, screw; 4, top cover; 401, pressing plate movable cavity; 402, pressing plate; 403, elastic spring telescopic rod piece; 404, fastener; 405, torsion spring; 406, outer thread cylinder seat; 407, position adjusting rotating wheel; 408, pressing rod; 5, chip to be tested. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] Example 1

[0020] The utility model provides a chip mass production test socket of quick dismounting, including test base 1, floating support 2, chip holder 3 and top 4, the integral moulding has pin jack support 101 on test base 1, the upper surface of pin jack support 101 is equipped with pin jack 102, the inside of test base 1 is equipped with test mainboard 103, and test mainboard 103 is electrically connected with pin jack 102, and the integral moulding has floating convex part on the upper portion of test base 1, and the bottom of floating support 2 is slidably buckled on the floating convex part of the top of test base 1, and the upper of floating support 2 is equipped with pin jack support groove 201 matched with pin jack support 101, and the four end angle positions of test base 1 are screwed with four vertical guide bolts 104, and the position of floating support 2 corresponds four guide sliding holes 202 of guide bolt 104, and the upper portion of four guide bolts 104 on test base 1 is matched with the sliding connection of corresponding guide sliding hole 202 on floating support 2, and the upper surface of floating support 2 is equipped with chip holder 3, and chip holder 3 is connected with floating support 2 through a plurality of screws 303, and the upper surface of chip holder 3 is equipped with chip groove 301 matched with the appearance of the chip 5 to be tested in the middle, and the middle of chip groove 301 is equipped with through hole for the pin of chip 5 to be tested to pass through, and the top of chip holder 3 is equipped with top 4, and the both sides of top 4 are hinged with a buckle 404, and the bottom of buckle 404 is equipped with buckle tooth, and the bottom of buckle tooth is buckled with buckle groove 106, and the top of buckle 404 is equipped with pressing head end.

[0021] The hinged point of buckle 404 and top 4 is matched with torsion spring 405, and the both ends of torsion spring 405 are connected with top 4 and buckle 404 respectively, and under the action of torsion spring 405, the buckle tooth of buckle 404 bottom can be tightly buckled with buckle groove 106 and not separated, and by pressing the pressing head end of buckle 404 top inward, the buckle tooth of buckle 404 bottom can be separated from buckle groove 106.

[0022] Combining Figure 1 And Figure 4 As shown in the drawings, a pair of spring assembly grooves are arranged on the floating convex part of test base 1, a pressure spring 105 is arranged in the spring assembly groove, and the upper and lower ends of the pressure spring 105 respectively abut against the bottom of the spring assembly groove and the bottom of the floating support 2. Under the action of the pressure spring 105, the floating support 2 is lifted up, and the floating support 2 is reset.

[0023] The technical scheme in the embodiment of the application has at least the following technical effects or advantages: the top cover 4 is arranged on the chip holder 3 and pressed downward until the clamping teeth at the bottom of the buckle 404 on both sides of the top cover 4 are buckled with the buckle groove 106 on both sides of the test base 1, in the pressing process, the pin of the chip under test 5 is inserted into the pin insertion hole 102 arranged on the pin insertion hole support 101, thereby realizing the assembly connection of the chip under test 5, and the assembly is simple, when disassembling, the clamping teeth at the bottom of the buckle 404 are separated from the buckle groove 106 by pressing the head end of the buckle 404 inward, thereby dismounting the top cover 4, the pin of the chip under test 5 is separated from the pin insertion hole 102 by pulling the floating support 2 and the chip holder 3, no deviation is generated in the assembly and disassembly process, thereby effectively avoiding the breakage of the pin of the chip under test 5.

[0024] Embodiment 2

[0025] In combination Figure 2 And Figure 4 As shown in the figure, the bottom of the top cover 4 is provided with a pressing plate movable cavity 401, and the pressing plate movable cavity 401 is matched with a pressing plate 402, a plurality of sets of elastic spring telescopic rod members 403 are connected between the pressing plate 402 and the inner cavity top of the pressing plate movable cavity 401, the elastic spring telescopic rod members 403 have a tendency to pull back the pressing plate 402 into the inside of the pressing plate movable cavity 401, the top of the top cover 4 is integrally formed with an external thread cylinder seat 406, the external thread cylinder seat 406 is connected with a position adjusting rotating wheel 407, the pressing plate 402 is connected with a plurality of vertically arranged pressing rods 408, the plurality of pressing rods 408 are arranged in a ring array along the center of the external thread cylinder seat 406, the upper end of the pressing rod 408 penetrates to the top of the top cover 4, and the upper end of the pressing rod 408 abuts against the bottom of the position adjusting rotating wheel 407, the position adjusting rotating wheel 407 is rotated to press the pressing rod 408, thereby adjusting the amount of the pressing plate 402 protruding out of the pressing plate movable cavity 401, the thickness of the chip under test 5 can be adjusted to ensure effective conduction pressure on the chip under test 5, and the chip under test 5 is not excessively pressed to cause breakage of the chip under test 5.

[0026] The technical scheme in the embodiment of the application has at least the following technical effects or advantages: the position adjusting rotating wheel 407 is rotated to press the pressing rod 408, thereby adjusting the amount of the pressing plate 402 protruding out of the pressing plate movable cavity 401, the thickness of the chip under test 5 can be adjusted to ensure effective conduction pressure on the chip under test 5, and the chip under test 5 is not excessively pressed to cause breakage of the chip under test 5.

[0027] Of course, the utility model also can have other various implementation manners, based on this implementation manner, other implementation manners obtained by the ordinary skilled person in the art without making any creative labor all belong to the range of the utility model.

Claims

1. A quick-assembly and disassembly chip mass production test socket, comprising a test base (1), a floating support (2), a chip holder (3), and a top cover (4), characterized in that, The test base (1) is integrally formed with a pin socket support (101), and the upper surface of the pin socket support (101) is provided with a pin socket (102). The test base (1) is provided with a test main board (103), and the test main board (103) is electrically connected to the pin socket (102). The upper part of the test base (1) is integrally formed with a floating protrusion. The bottom of the floating support (2) is slidably fastened to the floating protrusion on the top of the test base (1). The floating support (2) is provided with a pin socket support mating groove (201) that mates with the pin socket support (101). Four vertically arranged guide bolts (104) are screwed to the four corners of the test base (1). The floating support (2) is provided with guide sliding holes (202) at the positions corresponding to the four guide bolts (104). The four guide bolts (104) on the test base (101) are also provided with guide sliding holes (202). 4) The upper part is slidably connected to the guide sliding hole (202) corresponding to the floating support (2). A chip holder (3) is provided close to the upper surface of the floating support (2). The chip holder (3) is connected to the floating support (2) by several screws (303). A chip mating groove (301) matching the shape of the chip under test (5) is opened in the middle of the upper surface of the chip holder (3). A through hole for the pin of the chip under test (5) to pass through is opened in the middle of the chip mating groove (301). A top cover (4) is provided close to the top of the chip holder (3). A fastener (404) is hinged on each side of the top cover (4). A buckle groove (106) is provided at the bottom of the test base (1) and at the position corresponding to the fastener (404). The buckle teeth at the bottom of the fastener (404) are engaged with the buckle groove (106). A pressing head end is provided at the top of the fastener (404).

2. The quick-release chip mass production test socket according to claim 1, characterized in that, The fastener (404) is fitted with a torsion spring (405) at the hinge point of the top cover (4), and the two ends of the torsion spring (405) are connected to the top cover (4) and the fastener (404) respectively.

3. The quick-release chip mass production test socket according to claim 1, characterized in that, The test base (1) has a pair of spring assembly slots on its floating protrusion. A pressure spring (105) is provided in the spring assembly slot, and the upper and lower ends of the pressure spring (105) abut against the bottom of the spring assembly slot and the bottom of the floating support (2), respectively.

4. The quick-release chip mass production test socket according to claim 1, characterized in that, The bottom of the top cover (4) is provided with a pressure plate movable cavity (401), and a pressure plate (402) is fitted in the pressure plate movable cavity (401). Several sets of elastic spring telescopic rods (403) are connected between the pressure plate (402) and the top of the inner cavity of the pressure plate movable cavity (401).

5. A quick-release chip mass production testing socket according to claim 4, characterized in that, The top of the top cover (4) is integrally formed with an outer threaded tube seat (406), and an adjusting wheel (407) is connected to the outer threaded tube seat (406). Several vertically arranged pressure rods (408) are connected to the pressure plate (402). The pressure rods (408) are arranged in a ring array along the center of the outer threaded tube seat (406). The upper end of the pressure rod (408) extends through to the top of the top cover (4), and the upper end of the pressure rod (408) abuts against the bottom of the adjusting wheel (407).

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