Shell side sound inlet silicon microphone

Abstract

The utility model relates to the technical field of acoustics, in particular to a silicon microphone with sound entering from the side of a shell. Comprising a cover plate and a PCB, a containing cavity is formed in the cover plate, inner chamfers are arranged at the four bottom corners of the containing cavity, a plurality of sound inlet holes are formed in one end of the cover plate, the cover plate is bonded with the PCB and located above the PCB, holes are formed in a laser drilling mode, and compared with a traditional side sound inlet shell, the holes of the structure are smaller; a multi-hole mode is adopted, and a sound inlet channel is optimized, so that a part can be effectively prevented from entering in a production link, meanwhile, the probability that the part enters in the use process of a terminal client is greatly reduced, the service life of the whole machine is prolonged, and the problems that the hole is very large and the cost is low as the shell of an existing side sound inlet product is firstly provided with a hole and then enters a mold for pressing are effectively solved in the mode. And the production and terminal use links are easy to enter the particle, so that the microphone loses efficacy.

Description

Technical Field

[0001] This utility model relates to the field of acoustic technology, and in particular to a silicon microphone with a side-entry housing. Background Technology

[0002] The function of a side-entry microphone is to enable the microphone to receive sound from the side. This is very useful in certain specific application scenarios, such as when the device needs to be placed near a wall or other obstacles. It is mainly used in TWS earphones, mobile phones, etc. By changing the way the sound enters the channel, the risk of particles entering the product is reduced, and the side-entry function of the silicon microphone is finally realized.

[0003] However, current side-entry microphone products have holes pre-drilled in the outer shell before being molded and pressed together, resulting in large openings that can easily allow particles to enter during production and end-use, causing microphone failure. Utility Model Content

[0004] The purpose of this invention is to provide a side-entry silicon microphone with a housing, which aims to solve the technical problem that in the current side-entry products, the housing is first opened and then pressed into the mold, resulting in a large opening that makes it easy for particles to enter during production and end-use, leading to microphone failure.

[0005] To achieve the above objectives, this utility model employs a side-entry silicon microphone with a shell, comprising a cover plate and a PCB board. The cover plate has a receiving cavity, and the four bottom corners of the receiving cavity have inner chamfers. One end of the cover plate has multiple sound inlet holes. The cover plate is bonded to the PCB board and is located above the PCB board.

[0006] The distribution shape of the plurality of sound inlets is one or more combinations of rectangles, squares and circles.

[0007] The outer side of the cover plate has a bevel.

[0008] The cover plate has outward chamfers at its four apex corners.

[0009] The adhesive used to bond the cover plate to the PCB board is an adhesive.

[0010] The PCB board is made of one or more of the following materials: FR-4, polypropylene, polytetrafluoroethylene, CEM-3, aluminum-based PCB, ceramic substrate, flexible board, high TG FR-4, metal substrate, radio frequency board, Rogers, and carbon fiber.

[0011] This utility model discloses a side-entry silicon microphone, comprising a cover plate and a PCB board. The cover plate has a receiving cavity with inward chamfers at its four bottom corners. Multiple sound inlet holes are formed at one end of the cover plate. The cover plate is bonded to the PCB board and positioned above it. The holes are formed using laser drilling, resulting in smaller holes compared to traditional side-entry housings. The multiple-hole design optimizes the sound inlet channel, effectively preventing particle entry during production and significantly reducing the likelihood of particle entry during end-user use, thus extending the overall lifespan of the microphone. This method effectively solves the technical problem of current side-entry products where the housing is pre-drilled before molding, resulting in large holes that easily allow particles to enter during production and end-user use, leading to microphone failure. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a front view of the side-entry silicon microphone of this utility model.

[0014] Figure 2 This is the utility model Figure 1 A cross-sectional view along line AA in the middle.

[0015] Figure 3 This is a three-dimensional perspective view of the side-entry silicon microphone of this utility model.

[0016] 1-Cover plate, 2-PCB board, 3-Receiving cavity, 4-Inner chamfer, 5-Sound inlet hole, 6-Bevel, 7-Outer chamfer. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0018] Please see Figures 1 to 3This utility model provides a side-entry silicon microphone with a shell, including a cover plate 1 and a PCB board 2. The cover plate 1 has a receiving cavity 3, and the four bottom corners of the receiving cavity 3 have an inner chamfer 4. One end of the cover plate 1 is provided with a plurality of sound inlet holes 5. The cover plate 1 is bonded to the PCB board 2 and is located above the PCB board 2.

[0019] In this embodiment, laser drilling is used to create the openings, resulting in smaller openings compared to traditional side-entry housings. The multiple openings further optimize the sound intake channel, effectively preventing particle entry during production and significantly reducing the likelihood of particle entry during end-user use, thus extending the overall lifespan of the device. This method effectively solves the technical problem of current side-entry products where the housing is pre-drilled before molding, resulting in large openings that easily allow particles to enter during production and end-user use, leading to microphone failure.

[0020] Furthermore, the distribution shape of the plurality of sound inlets 5 is one or more combinations of rectangles, squares, and circles.

[0021] Furthermore, the outer side of the cover plate 1 has a bevel 6.

[0022] In this embodiment, the design of the inclined surface 6 can prevent scratches on the contacting components, and the modern design of the inclined surface 6 can enhance the overall aesthetics.

[0023] Furthermore, the four apex corners of the cover plate 1 have outward chamfers 7.

[0024] In this embodiment, the outer chamfer 7 can prevent the expansion of cracks, improve the service life of parts, and also improve the appearance quality of the product, making it look more refined and professional.

[0025] Furthermore, the adhesive used to bond the cover plate 1 to the PCB board 2 is an adhesive.

[0026] In this embodiment, the adhesive connects different materials together through adhesion and cohesive strength, forming a strong whole while improving sealing.

[0027] Furthermore, the PCB board 2 is made of one or more combinations of FR-4, polypropylene, polytetrafluoroethylene, CEM-3, aluminum-based PCB, ceramic substrate, flexible board, high TG FR-4, metal substrate, radio frequency board, Rogers and carbon fiber.

[0028] In this embodiment, the PCB board 2 can be cut by water jet cutting, which can effectively reduce costs; or it can be cut by laser cutting, which can prevent dust from entering the product.

[0029] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A side-entry silicon microphone with a housing, characterized in that, The device includes a cover plate and a PCB board. The cover plate has a receiving cavity, and the four bottom corners of the receiving cavity have inner chamfers. One end of the cover plate has multiple sound inlet holes. The cover plate is bonded to the PCB board and is located above the PCB board.

2. The shell-side sound-entry silicon microphone as described in claim 1, characterized in that, The distribution shape of the plurality of sound inlets is one or more combinations of rectangles, squares, and circles.

3. The shell-side sound-entry silicon microphone as described in claim 2, characterized in that, The outer side of the cover plate has a slope.

4. The shell-side sound-entry silicon microphone as described in claim 3, characterized in that, The cover plate has outward chamfers at its four apex corners.

5. The shell-side sound-entry silicon microphone as described in claim 4, characterized in that, The adhesive used to bond the cover plate to the PCB board is an adhesive.

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