Special-shaped stacked multilayer circuit board

Abstract

A special-shaped stacked multilayer circuit board comprises a plurality of board bodies and a connecting support. The plurality of plate bodies are stacked up and down at intervals, and the plurality of connecting brackets are respectively supported between the upper plate body and the lower plate body; a plurality of inserting grooves are formed in the plate bodies, the connecting support comprises a connecting shaft, two sets of supporting pieces and two sets of connectors, one ends of the two sets of supporting pieces are hinged to the connecting shaft, the other ends of the two sets of supporting pieces are hinged to the two sets of connectors respectively, and the two sets of connectors are assembled with the inserting grooves in the upper plate body and the lower plate body in an inserting mode respectively; hinge structures between the connecting shaft and the supporting piece and between the supporting piece and the connector can adjust rotating or locking angles, and the connecting support is further electrically connected with the upper plate body and the lower plate body respectively. According to the utility model, the telescopic and deformable multilayer circuit board is designed, so that the balance between the circuit board installation space and the heat dissipation effect is realized; the utility model has the advantages of strong practicability and strong popularization significance.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a special-shaped stack type multilayer circuit board. BACKGROUND

[0002] Circuit board is also called line circuit board, it is important electronic component, is the support body of electronic component, is the carrier of electrical interconnection of electronic component, almost every kind of electronic equipment, small to electronic watch, calculator, large to computer, communication electronic equipment, military weapon system, as long as having integrated circuit and other electronic components, in order to make the electrical interconnection between various components, all want to use circuit board. Circuit board is composed of insulating base plate, connecting wire and pad of assembly welding electronic component, has the double role of conducting wire and insulating base plate.

[0003] Multilayer circuit board belongs to one kind of circuit board, as its name implies, it is assembled by stacking multiple single-layer circuit boards. For conventional multilayer circuit boards, the stacked structure greatly increases the thickness of the circuit board, and the excessively thick board body will seriously affect the heat dissipation efficiency of the circuit board during operation. SUMMARY

[0004] Therefore, it is necessary to provide a special-shaped stack type multilayer circuit board to overcome the defects in the prior art.

[0005] A special-shaped stack type multilayer circuit board includes a plurality of board bodies and connecting supports. The plurality of board bodies are arranged in an up-down spaced stack, and the plurality of connecting supports are respectively supported between the upper and lower board bodies. The board body is provided with a plurality of insertion slots, and the connecting support includes a connecting shaft, two groups of supporting pieces and two groups of connecting heads. One end of each group of supporting pieces is hingedly connected to the connecting shaft, and the other end of each group of supporting pieces is hingedly connected to the two groups of connecting heads. The two groups of connecting heads are respectively inserted and assembled with the insertion slots on the upper and lower board bodies. The hinge structures between the connecting shaft and the supporting pieces and between the supporting pieces and the connecting heads can be adjusted in rotation or locked in angle, and the connecting support is also electrically connected to the upper and lower board bodies.

[0006] Further, the special-shaped stack type multilayer circuit board further includes a base and a supporting rod, and each of the plurality of board bodies is provided with an upper and lower through supporting hole. The base is padded on the bottom of the lowermost board body, and the supporting rod is installed on the base and passes through the plurality of supporting holes to support the plurality of board bodies.

[0007] Further, the supporting rod includes a supporting screw and a plurality of limiting nuts, the supporting screw passes through the supporting holes on the plurality of board bodies, and the plurality of limiting nuts pass through the supporting screw and respectively clamp and limit the plurality of board bodies.

[0008] Furthermore, the limiting nut includes an adjusting nut and a limiting retaining ring, both of which are threaded onto the supporting screw and are stacked vertically. The limiting retaining ring is made of a flexible cushioning material.

[0009] Furthermore, the base has a hollow structure design, with a heat dissipation cavity with openings on all four sides inside. The upper end of the base is also provided with several heat dissipation through holes, all of which are connected to the heat dissipation cavity.

[0010] Furthermore, the irregularly shaped stacked multilayer circuit board also includes several heat sinks, each of which is mounted on a support rod and located between several upper and lower plates. Both the support rod and the heat sinks are made of thermally conductive and heat-dissipating materials.

[0011] In summary, the beneficial effects of this utility model of an irregularly shaped stacked multilayer circuit board are as follows: by designing a stretchable and deformable multilayer circuit board, the circuit board can adjust the degree of stretching and deformation according to different installation scenarios, thereby achieving a balance between the circuit board installation space and heat dissipation effect; the addition of a base and support rod to the circuit board can better support and protect the circuit board, preventing accidental deformation from affecting normal operation; the hollow design of the base and the addition of heat sinks and other structures can further improve the heat dissipation effect of the circuit board; this utility model is highly practical and has strong promotional value. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of an irregularly shaped stacked multilayer circuit board according to the present invention;

[0013] Figure 2 for Figure 1 A schematic diagram of the decomposed structure;

[0014] Figure 3 for Figure 2 Schematic diagram of the middle plate structure;

[0015] Figure 4 for Figure 2 Exploded view of the connecting bracket;

[0016] Figure 5 for Figure 2 Schematic diagram of the middle base;

[0017] Figure 6 for Figure 2 Exploded view of the middle support rod. Detailed Implementation

[0018] In order to make the utility model purposes, technical solutions and advantages more clearly, the utility model is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.

[0019] As shown in Figures 1 to 6 The utility model provides a special-shaped stacked multilayer circuit board 100, which comprises a plurality of plate bodies 10 and connecting supports 20. The plurality of plate bodies 10 are arranged in an up-down interval stacked manner, and the plurality of connecting supports 20 are respectively supported between the up-down plate bodies 10.

[0020] The plate body 10 is provided with a plurality of plug-in grooves 11, and the connecting support 20 comprises a connecting shaft 21, two groups of supporting plates 22 and two groups of connecting heads 23. One end of each of the two groups of supporting plates 22 is hingedly connected to the connecting shaft 21, and the other end of each of the two groups of supporting plates 22 is hingedly connected to the two groups of connecting heads 23 respectively. The two groups of connecting heads 23 are respectively plugged and assembled with the plug-in grooves 11 on the up-down plate bodies 10. The hinge structures between the connecting shaft 21 and the supporting plates 22 and between the supporting plates 22 and the connecting heads 23 can be adjusted in rotation or locked in angle. The connecting support 20 is also electrically connected to the up-down plate bodies 10 respectively.

[0021] When installing the circuit board, since the connecting supports 20 between the plate bodies 10 have the functions of fixing support and adjusting deformation at the same time, the spacing between the plate bodies 10 can be adjusted according to the size of the installation space, so that the circuit board can adapt to the size of the installation space and also reserve sufficient heat dissipation space between the plate bodies 10, finally realizing the balance of the circuit board installation and heat dissipation effect. The connecting supports 20 also undertake the function of electrical signal transmission between the plate bodies 10, which does not affect the normal working function of the circuit board.

[0022] The special-shaped stacked multilayer circuit board 100 further comprises a base 30 and a supporting rod 40, and each of the plurality of plate bodies 10 is provided with an up-down penetrating supporting through hole 12. The base 30 is padded on the bottom of the lowermost plate body 10, and the supporting rod 40 is arranged on the base 30 and penetrates the plurality of supporting through holes 12 to support the plurality of plate bodies 10. The structure of the added base 30 and supporting rod 40 can better support and fix the plate bodies 10 between the layers, greatly improving the structural strength of the circuit board and enhancing its anti-shock and anti-falling ability.

[0023] The support rod 40 comprises a support screw 41 and a plurality of limiting nuts 42, the support screw 41 is arranged in the support through hole 12 of the plurality of boards 10, and the plurality of limiting nuts 42 are arranged on the support screw 41 and clamped and limited to the plurality of boards 10 respectively. The limiting nut 42 comprises an adjusting nut 421 and a limiting snap ring 422, the adjusting nut 421 and the limiting snap ring 422 are arranged on the support screw 41 and are arranged in an upper and lower superposition mode. The material of the limiting snap ring 422 is a flexible buffer material.

[0024] The support rod 40 with the limiting nut 42 can limit and fix each layer of the board 10 of the circuit board, and further improve the support stability of the support rod 40 to the board 10. The limiting nut 42 is designed as a combined structure of the adjusting nut 421 and the limiting snap ring 422, the limiting snap ring 422 made of a flexible buffer material directly abuts and contacts the surface of the board 10, and the problem that the board 10 is cracked and damaged due to abutting and limiting can be avoided.

[0025] The base 30 is designed in a hollow structure, and a heat dissipation cavity 31 with openings on four sides is arranged in the base 30. The upper end of the base 30 is further provided with a plurality of heat dissipation through holes 32, and the plurality of heat dissipation through holes 32 are in communication with the heat dissipation cavity 31. The special-shaped stacked multilayer circuit board 100 further comprises a plurality of heat dissipation discs 50, and the plurality of heat dissipation discs 50 are arranged on the support rod 40 and are located between the plurality of upper and lower boards 10 respectively. The materials of the support rod 40 and the heat dissipation disc 50 are heat-conducting and heat-dissipating materials.

[0026] The base 30 with the hollow heat dissipation cavity 31 structure can effectively improve the heat dissipation effect of the bottom layer board 10, and the heat dissipation disc 50 and the support rod 40 made of heat-conducting and heat-dissipating materials are combined to quickly conduct the heat generated by the boards 10 between the layers during work and dissipate to the outside, thereby further improving the overall heat dissipation effect of the circuit board.

[0027] In summary, the special-shaped stacked multilayer circuit board 100 has the following advantages: by designing the telescopic and deformable multilayer circuit board, the circuit board can adjust the telescopic and deformation degree according to different installation scenes, so as to balance the installation space and heat dissipation effect of the circuit board; the base 30 and the support rod 40 added to the circuit board can better support and protect the circuit board, and avoid affecting the normal work due to accidental deformation; the base 30 is designed in a hollow structure and is further provided with a heat dissipation disc 50, which can further improve the heat dissipation effect of the circuit board; the utility model has strong practicability and strong popularization significance.

[0028] The above-described embodiments only express one implementation of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the utility model patent scope. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the utility model, a number of variations and improvements can be made, which belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A shaped stacked multilayer circuit board, characterized by: Including several plate bodies and connecting supports; several said plate bodies are arranged in an up-down spaced stacked manner, and several said connecting supports are respectively supported between the upper and lower plate bodies; the plate body is provided with several plug-in slots, the connecting support includes a connecting shaft, two groups of supporting pieces and two groups of connecting heads, one end of the two groups of supporting pieces is hingedly connected with the connecting shaft, the other end of the two groups of supporting pieces is respectively hingedly connected with the two groups of connecting heads, and the two groups of connecting heads are respectively inserted and assembled with the plug-in slots on the upper and lower plate bodies; the hinge structures between the connecting shaft and the supporting pieces and the supporting pieces and the connecting heads can be adjusted to rotate or lock the angle, and the connecting support is also respectively electrically connected with the upper and lower plate bodies.

2. The shaped stacked multilayer circuit board of claim 1, wherein: It also includes a base and a support rod, and each of the plurality of plate bodies is provided with an upper and lower through support hole; the base is padded on the bottom of the lowermost plate body, and the support rod is installed on the base and passes through the support holes to support the plurality of plate bodies.

3. The shaped stacked multilayer circuit board of claim 2, wherein: The support rod includes a support screw and a plurality of limiting nuts, the support screw passes through the support holes on the plurality of plate bodies, and the plurality of limiting nuts pass through the support screw and respectively clamp and limit the plurality of plate bodies.

4. The shaped stacked multilayered circuit board of claim 3, wherein: The limiting nut includes an adjusting nut and a limiting snap ring, the adjusting nut and the limiting snap ring are both threaded on the support screw and arranged in an up-down stacked manner; the material of the limiting snap ring is a flexible and cushioning material.

5. The shaped stacked multilayered circuit board of claim 2, wherein: The base is designed in a hollow structure, and a heat dissipation cavity with openings on four sides is arranged inside the base. The upper end of the base is also provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are in communication with the heat dissipation cavity.

6. The shaped stacked multilayered circuit board of claim 2, wherein: It also includes a plurality of heat dissipation discs, and the plurality of heat dissipation discs are threaded on the support rod and respectively located between the plurality of upper and lower plate bodies; the materials of the support rod and the heat dissipation disc are both heat-conducting and heat-dissipating materials.

Images