Substrate adsorption jig

Abstract

The utility model discloses a substrate adsorption jig, and relates to the technical field of jigs, and the substrate adsorption jig comprises a vacuum chuck which is used for placing a PCB and is provided with a limiting position, the PCB is arranged at the limiting position, and the PCB is provided with a plurality of blank first areas; and the jacking column is detachably mounted on the vacuum suction cup, is positioned in the limiting position, and is propped against the first area of the PCB placed on the vacuum suction cup. According to the technical scheme, the problem that an existing adsorption jig is poor in universality can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to jig technical field, especially a substrate adsorption jig. BACKGROUND

[0002] The substrate of Mini LED is a PCB board, and the PCB board needs to be flat during processing to ensure the processing precision. In the prior art, the edge of the PCB board is adsorbed by an adsorption jig, and a protrusion or a post provided in the adsorption jig supports the area of the PCB board other than the component to realize the flatness of the PCB board.

[0003] However, the protrusion or the post in the adsorption jig in the prior art cannot be detached from the adsorption jig, and when adsorbing PCB boards of different models with the same structure, the entire adsorption jig needs to be replaced, and the existing adsorption jig has poor universality. UTILITY MODEL CONTENTS

[0004] The utility model discloses a substrate adsorption jig, which aims to solve the problem of poor universality of the existing adsorption jig.

[0005] To achieve the above-mentioned purpose, the substrate adsorption jig provided by the utility model comprises:

[0006] A vacuum chuck is used to place a PCB board, and a limiting position is provided, the PCB board is arranged in the limiting position, and the PCB board has a plurality of first areas with no components.

[0007] A post is detachably mounted on the vacuum chuck and located inside the limiting position and abuts against the first area of the PCB board placed on the vacuum chuck.

[0008] In an embodiment, a limiting structure is further included, which is used to limit the post to a preset position in the limiting position.

[0009] In an embodiment, the post is configured as a plurality of posts and is magnetically connected to the vacuum chuck.

[0010] The limiting structure comprises a limiting plate and a plurality of mounting holes formed in the limiting plate, and the plurality of mounting holes are arranged corresponding to the plurality of first areas, the limiting plate is fixedly arranged on the vacuum chuck, and the post is located in the mounting hole.

[0011] In an embodiment, the limiting plate and the vacuum chuck are connected by screw locking.

[0012] And / or, the post is configured as a stepped structure.

[0013] In an embodiment, the vacuum chuck further comprises a second suction hole and a plurality of first suction holes, the plurality of first suction holes are arranged in the limiting position and close to the edge of the limiting position, and the second suction hole is used to attract the PCB board so that the middle part of the PCB board has a tendency to approach the top column.

[0014] In an embodiment, the limiting position is configured as a stepped groove opened on the vacuum chuck, the stepped groove comprises a first step and a second step arranged below the first step, and the top column is arranged in the second step, and the first step is used to place the PCB board.

[0015] In an embodiment, the vacuum chuck is detachably mounted on an adjusting seat, and the adjusting seat is used to level the vacuum chuck.

[0016] In an embodiment, the adjusting seat comprises a bottom plate, an adjusting plate and a multi-axis adjusting structure, the multi-axis adjusting structure is mounted on the bottom plate, the adjusting plate is mounted on the multi-axis adjusting structure, and the vacuum chuck is detachably connected to the adjusting plate.

[0017] In an embodiment, the multi-axis adjusting structure comprises a plurality of driving telescopic rods, one end of the driving telescopic rod is hinged to the bottom plate, and the other end is hinged to the adjusting plate.

[0018] In an embodiment, the adjusting seat further comprises a pressure gauge and a pressure regulating gauge.

[0019] The technical scheme of the utility model discloses a top column detachably mounted on a vacuum chuck, when corresponding to the PCB board of the same structure and different models, only need to replace different top columns, so that the whole vacuum chuck does not need to be replaced, the universality of the vacuum chuck can be improved, and the technical problems in the prior art can be solved. ACCURACY

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in the drawings without creative labor.

[0021] Figure 1 The structural schematic diagram of an embodiment of the substrate suction jig provided by the utility model is shown in the figure.

[0022] Figure 2 The structural schematic diagram of an embodiment of the substrate suction jig provided by the utility model is shown in the figure. Figure 1 The structural schematic diagram of an embodiment of the substrate suction jig provided by the utility model is shown in the figure.

[0023] Figure 3 For Figure 1 Local enlarged view at A in the middle.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 100, vacuum chuck; 110, limiting position; 120, first suction hole; 130, stepped groove; 131, first step; 132, second step; 140, second suction hole;

[0026] 200, top column;

[0027] 300, limiting structure; 310, limiting plate; 320, mounting hole;

[0028] 400, adjusting seat; 410, bottom plate; 420, adjusting plate; 430, multi-axis adjusting structure; 431, driving telescopic rod;

[0029] 500, air pressure gauge;

[0030] 600, pressure regulating gauge.

[0031] The implementation, functional features and advantages of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] It should be noted that if the present application embodiments involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications will also change accordingly.

[0034] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0035] The utility model provides a kind of substrate adsorption fixture, applied in Mini LED mass transfer equipment. Wherein in the present application, Mini LED mass transfer equipment is only one application scenario of the present application. The present application can also be applied in other scenarios, such as the transfer of other chips (micro), circuit board repair, circuit board face cutting and the like.

[0036] Please refer to Figure 1 In an embodiment of the present application, the substrate adsorption fixture comprises:

[0037] The vacuum chuck 100 is used to place the PCB board, and is provided with a limiting position 110. The PCB board is arranged in the limiting position 110. The PCB board has a plurality of blank first areas. In this embodiment, the blank first areas in the PCB board are the first areas without components on the PCB board and the circuit used to connect the components in the PCB board.

[0038] The top column 200 is detachably mounted on the vacuum chuck 100 and located inside the limiting position 110 and abuts against the first area of the PCB board placed on the vacuum chuck 100. Since the top column 200 is detachably mounted on the vacuum chuck 100, when corresponding to PCB boards of different models with the same structure, only different top columns 200 need to be replaced, so that the vacuum chuck 100 as a whole does not need to be replaced, the versatility of the vacuum chuck 100 can be improved, and the technical problems existing in the prior art can be solved. In this embodiment, the structure of the top column 200 can be a heterogeneous structure, and the number can be one. The heterogeneous structure is arranged according to the first area of the corresponding model of the PCB board, so that when the PCB board is placed on the adsorption fixture, the top column 200 can abut against the first area in the PCB board. At the same time, in this embodiment, the area of the top column 200 in contact with the first area accounts for at least 30% of the area of the first area.

[0039] In an embodiment, referring to Figure 1 , the substrate adsorption jig further comprises a limiting structure 300, which is used to limit the top column 200 to a preset position in the limiting position 110. In order to facilitate the detachable connection between the top column 200 and the vacuum chuck 100, when the top column 200 is configured as one, the limiting member can be configured as a screw, that is, the top column 200 is installed in the vacuum chuck 100 by screw locking. If it is necessary to replace the top column 200, the limiting member only needs to contact the top column 200 at this time.

[0040] In an embodiment, referring to Figure 1 , the top column 200 is configured as a plurality, and is magnetically connected with the vacuum chuck 100;

[0041] The limiting structure 300 comprises a limiting plate 310 and a plurality of mounting holes 320 opened in the limiting plate 310, and the plurality of mounting holes 320 are arranged corresponding to the plurality of first areas. The limiting plate 310 is fixedly arranged on the vacuum chuck 100, and the top column 200 is arranged in the mounting hole 320. In this embodiment, the plurality of mounting holes 320 and the plurality of top columns 200 can be arranged one by one, or can not be arranged one by one. When the plurality of mounting holes 320 and the plurality of top columns 200 are arranged one by one, the top column 200 arranged in the mounting hole 320 can correspond to the plurality of first areas on the PCB one by one. When the plurality of mounting holes 320 and the plurality of top columns 200 are not arranged one by one, that is, the plurality of top columns 200 can be arranged in all the mounting holes 320 in the limiting plate 310, or can be arranged in part of the mounting holes 320 in the limiting plate 310.

[0042] In an embodiment, referring to Figure 1 When the top column 200 is configured as a plurality, the top column 200 is configured as a stepped structure, wherein one end of the top column 200 magnetically connected with the vacuum chuck 100 is a large step, and the other end abutting against the first area is a small step. In this way, under the action of the large step, the contact area between the top column 200 and the vacuum chuck 100 can be increased, thereby improving the connection stability between the top column 200 and the vacuum chuck 100. Under the action of the small step, the top column 200 can be conveniently abutted against the first area, avoiding that the structure of the top column 200 abutting against the first area is too large, which causes the top column 200 to top the circuit or component on the PCB.

[0043] In an embodiment, the limiting plate 310 is connected with the vacuum chuck 100 by screw locking, so that the limiting plate 310 is fixed to the vacuum chuck 100 by screw locking, which can facilitate the installation and disassembly of the limiting plate 310 and the vacuum chuck 100. When the suction jig of the present application is used to suck the same structure but different models of PCBs, the positions of the components on the PCBs of different models are different, which also leads to the different positions of the first area on the PCBs of different models. In order to improve the universality of the suction jig of the present application and solve the problem of poor universality of the suction jig in the prior art, the limiting plate 310 in the embodiment can be replaced, so that the mounting hole 320 on the limiting plate 310 after replacement corresponds to the first area on the PCB to be processed. At this time, the top post 200 provided in the mounting hole 320 also corresponds to the first area of the PCB to be processed, which can effectively provide support. However, the design is not limited thereto, and in other embodiments, the limiting plate 310 and the vacuum chuck 100 can also be connected by a clamping block.

[0044] In an embodiment, referring to Figure 1 , Figure 3The vacuum chuck 100 further comprises a second suction hole 140 and a plurality of first suction holes 120, the plurality of first suction holes 120 are arranged in the limiting position 110 and close to the edge of the limiting position 110, and the second suction hole 140 is used to attract the PCB board so that the middle part of the PCB board has a tendency to approach the top column; in this way, when the PCB board is placed in the limiting position 110, the PCB board can be adsorbed and fixed by the plurality of first suction holes 120, and since the plurality of first suction holes 120 are arranged close to the edge of the limiting position 110, that is, the first suction hole 120 can adsorb the edge of the PCB board, at this time, after the first suction hole 120 adsorbs the edge of the PCB board, the middle part of the PCB board may be stretched, in order to make the PCB board more flat, at this time, when the first suction hole 120 adsorbs the PCB board, the second suction hole 140 can make the middle part of the PCB board have a tendency to approach the top column when adsorbing the PCB board, solve the situation that the middle part of the PCB board is stretched, so that the PCB board is more flat; in this application, the middle part of the PCB board should be understood as the four peripheral edges of the PCB board, not the absolute middle position of the PCB board; when the PCB board approaches the top column, the top column 200 arranged in the limiting position 110 supports the middle position of the PCB board to avoid the middle position of the PCB board from being concave downward, so that the PCB board can be flatly arranged on the vacuum chuck 100, thereby facilitating the processing of the PCB board. At the same time, in this embodiment, the second suction hole 140 can be arranged as one or multiple, which is not limited herein, when arranged as multiple, the plurality of second suction holes 140 can be evenly distributed on the vacuum chuck 100.

[0045] In an embodiment, referring to Figure 1The limiting position 110 is configured as a stepped groove 130 opened on the vacuum chuck 100, the stepped groove 130 includes a first step 131 and a second step 132 arranged below the first step 131, the top column 200 is arranged on the second step 132, the first step 131 is used for placing the PCB board, further, the first adsorption hole 120 is opened on the first step 131, and the second adsorption hole 140 is opened on the second step 132, that is, the second adsorption hole 140 is arranged below the first adsorption hole 120, when the PCB board is placed on the first step 131, the first adsorption hole 120 can adsorb the PCB board, and when the first adsorption hole 120 adsorbs the edge of the PCB board, the second adsorption hole 140 adsorbs the middle part of the PCB board. However, the design is not limited to this, in other embodiments, the limiting position 110 can be configured as a stepped ring convex arranged on the vacuum chuck 100, at the same time, the stepped ring convex is provided with a first step and a second step, the first adsorption hole 120 is opened on the first step of the stepped ring convex, and the second adsorption hole 140 is opened on the second step of the stepped ring convex, specifically, the second adsorption hole 140 is arranged below the first adsorption hole 120, and at the same time, the first step is used for placing the PCB board.

[0046] In an embodiment, referring to Figure 2 After the above-mentioned vacuum chuck 100 flattens the PCB board, in order to further improve the accuracy of the PCB board in the processing process, the application can also be provided with the following structure, the substrate adsorption jig further includes an adjusting seat 400, the vacuum chuck 100 is detachably mounted on the adjusting seat 400, and the adjusting seat 400 is used to level the vacuum chuck 100. The vacuum chuck 100 is leveled by the adjusting seat 400, so that the flatness of the PCB board mounted on the vacuum chuck 100 is better at the same time, and is more horizontal.

[0047] In an embodiment, referring to Figure 2 The adjusting seat 400 can adopt the following structure, the adjusting seat 400 includes a bottom plate 410, an adjusting plate 420 and a multi-axis adjusting structure 430, the multi-axis adjusting structure 430 is mounted on the bottom plate 410, the adjusting plate 420 is mounted on the multi-axis adjusting structure 430, and the vacuum chuck 100 is detachably connected to the adjusting plate 420. In this embodiment, the adjusting plate 420 is leveled by the multi-axis adjusting structure 430, so as to balance the vacuum chuck 100 mounted on the adjusting plate 420 and the PCB board mounted on the mounting chuck.

[0048] In an embodiment, referring to Figure 2The multi-axis adjusting structure 430 comprises a plurality of driving telescopic rods 431, one end of the driving telescopic rod 431 is hinged to the bottom plate 410, and the other end is hinged to the adjusting plate 420, further, in the embodiment, the driving telescopic rod 431 can be configured as an electric driving telescopic rod 431, and can also be configured as a pneumatic driving telescopic rod 431, which is not limited here, and the number of the driving telescopic rod 431 in the application is configured as six, the horizontal of the adjusting plate 420 is adjusted through the six driving telescopic rods 431, so as to adjust the balance of the vacuum chuck 100 mounted on the adjusting plate 420.

[0049] In an embodiment, referring to Figure 1 The substrate adsorption jig further comprises a gas pressure gauge 500 and a pressure regulating gauge 600, the gas pressure gauge 500 and the pressure regulating gauge 600 are installed on the adjusting seat 400, in the embodiment, the adsorption jig of the application is convenient for the user to operate through the gas pressure gauge 500 and the pressure regulating gauge 600, and the pressure regulating gauge 600 and the gas pressure gauge 500 are installed on the bottom plate 410 in the adjusting seat 400, so that the space occupied by the components of the application can be reduced.

[0050] The above is only an exemplary embodiment of the application, and does not limit the patent range of the application, and any equivalent structural transformation, direct / indirect application in other related technical fields within the technical concept of the application, or the contents of the application specification and drawings are included in the patent protection range of the application.

Claims

1. A substrate chucking jig, characterized by comprising: The vacuum chuck is used to place a PCB board, and is provided with a limiting position, the PCB board is arranged in the limiting position, and the PCB board has a plurality of first regions with blank spaces. A top column is detachably mounted on the vacuum chuck and located inside the limiting position and abuts against the first regions of the PCB board placed on the vacuum chuck. A limiting structure is further included to limit the top column to a preset position in the limiting position. The top column is configured in a plurality and is magnetically connected with the vacuum chuck.

2. The substrate chucking jig according to claim 1, wherein The limiting structure includes a limiting plate and a plurality of mounting holes formed in the limiting plate, the plurality of mounting holes are arranged in correspondence with the plurality of first regions, the limiting plate is fixedly arranged on the vacuum chuck, and the top column is located in the mounting hole.

3. The substrate chucking jig according to claim 2, wherein The limiting plate is connected with the vacuum chuck by screw locking. And / or, the top column is configured in a stepped structure.

4. The substrate chucking jig according to claim 3, wherein The vacuum chuck further includes a second suction hole and a plurality of first suction holes, the plurality of first suction holes are arranged in the limiting position and close to the edge of the limiting position, and the second suction hole is used to attract the PCB board so that the middle part of the PCB board has a tendency to approach the top column. The limiting position is configured as a stepped groove formed on the vacuum chuck, the stepped groove includes a first step and a second step arranged below the first step, the top column is arranged in the second step, and the first step is used to place the PCB board.

5. The substrate chucking jig according to claim 1, wherein An adjusting seat is further included, the vacuum chuck is detachably mounted on the adjusting seat, and the adjusting seat is used to level the vacuum chuck.

6. The substrate chucking jig according to claim 1, wherein The adjusting seat includes a bottom plate, an adjusting plate and a multi-axis adjusting structure, the multi-axis adjusting structure is mounted on the bottom plate, the adjusting plate is mounted on the multi-axis adjusting structure, and the vacuum chuck is detachably connected with the adjusting plate.

7. The substrate chucking jig according to claim 1, wherein The multi-axis adjusting structure includes a plurality of driving telescopic rods, one end of the driving telescopic rod is hinged to the bottom plate, and the other end is hinged to the adjusting plate.

8. The substrate chucking jig according to claim 7, wherein A pressure gauge and a pressure regulating gauge are further included, and the pressure gauge and the pressure regulating gauge are mounted on the adjusting seat.

9. The substrate chucking jig according to claim 8, wherein ​ 10. The substrate chucking jig according to claim 7, wherein ​

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