Circuit board hole filling system

Abstract

The utility model discloses a circuit board hole filling system, which relates to the field of circuit board production and comprises a fixed seat, an immersion liquid tank group and a travelling crane device are arranged on the fixed seat, the travelling crane device is arranged above the immersion liquid tank group, an electroplating flying bar is arranged at the bottom of the travelling crane device, a hanging basket is detachably connected onto the electroplating flying bar, and the hanging basket is matched with the immersion liquid tank group in an inserting manner. The immersion liquid tank group comprises a hole filling tank, the hole filling tank is connected with a liquid stabilizing device, and the liquid stabilizing device can keep copper ions in a solution in the hole filling tank stable; according to the circuit board hole filling system, through the liquid stabilizing device, the concentration of copper ions in the hole filling reaction liquid in the hole filling groove can be accurately controlled, the stability of the copper ions in the hole filling reaction liquid is maintained, the problem of uneven hole filling caused by concentration fluctuation is reduced, the hole filling effect is improved, and the quality of a circuit board is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit board production, concretely to a circuit board hole filling system. BACKGROUND

[0002] In the process of manufacturing circuit boards, it is usually necessary to fill holes in the circuit board, aiming to fill the small holes or micro-holes with conductive materials to enhance the conductive performance and mechanical strength of the circuit board. The existing hole filling method generally utilizes the principle of chemical reaction to immerse the circuit board in a hole filling tank containing hole filling reaction liquid. In this process, the circuit board reacts with the reaction liquid, thereby electroplating a layer of copper on the hole wall to realize hole filling.

[0003] However, in actual operation, as the electroplating process proceeds, the concentration of copper ions in the hole filling tank gradually decreases. The decrease in the concentration of copper ions leads to instability in the supply of copper ions in the electroplating process, thereby causing uneven hole filling effect and affecting the quality of the circuit board and reducing production efficiency. SUMMARY

[0004] The utility model aims to provide a circuit board hole filling system, which can realize accurate control of the concentration of copper ions in the hole filling reaction liquid in the hole filling tank through a liquid stabilizing device, maintain the stability of copper ions in the hole filling reaction liquid, reduce the problem of uneven hole filling caused by concentration fluctuation, improve the hole filling effect, and ensure the quality of the circuit board.

[0005] The above-mentioned optimized structure of the utility model is realized through the following technical scheme: a circuit board hole filling system, comprising a fixed seat, a liquid immersion tank group is arranged on the fixed seat, a travelling crane device is arranged above the liquid immersion tank group, an electroplating flying bar is arranged at the bottom of the travelling crane device, a hanging basket is detachably connected to the electroplating flying bar, the hanging basket is inserted and matched with the liquid immersion tank group, the liquid immersion tank group comprises a hole filling tank, a liquid stabilizing device is connected to the hole filling tank, and the liquid stabilizing device can maintain the stability of copper ions in the solution of the hole filling tank.

[0006] In some embodiments, the liquid stabilizing device comprises a liquid stabilizing tank, a heating coil is arranged in the liquid stabilizing tank, a first conveying pump is connected between the liquid inlet of the liquid stabilizing tank and the hole filling tank, and a second conveying pump is connected between the liquid outlet of the liquid stabilizing tank and the hole filling tank.

[0007] In some embodiments, a gas collecting hood is arranged at the top of the liquid stabilizing tank, and a recovery tank is connected to the gas collecting hood.

[0008] In some embodiments, a liquid storage tank is connected to the hole filling tank, the liquid storage tank stores hole filling reaction liquid, and a third conveying pump is connected between the liquid storage tank and the hole filling tank.

[0009] In some embodiments, a first flow meter is connected between the first delivery pump and the liquid stabilizing tank, a second flow meter is connected between the second delivery pump and the filling slot, and a third flow meter is connected between the third delivery pump and the filling slot.

[0010] In some embodiments, two supporting members are symmetrically arranged on both sides of the filling slot, and the two supporting members are respectively inserted and matched with both ends of the hanging basket.

[0011] In some embodiments, a swinging device is arranged on the periphery of the filling slot, and the supporting member is arranged on the swinging device.

[0012] In some embodiments, a vibrating device is arranged between the filling slot and the supporting member.

[0013] In summary, the utility model has the following beneficial effects:

[0014] The filling system for the circuit board can realize accurate control of the copper ion concentration in the filling reaction liquid in the filling slot through the liquid stabilizing device, maintain the stability of the copper ions in the filling reaction liquid, reduce the filling unevenness caused by the concentration fluctuation, improve the filling effect, and ensure the quality of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 The figure is a structural schematic diagram of the utility model;

[0016] Fig. 2 The figure is a connection structure schematic diagram of the liquid stabilizing device and the filling slot of the utility model.

[0017] In the figure, 1 is a fixed seat, 2 is a liquid immersion groove group, 21 is a filling slot, 22 is a supporting member, 3 is a travelling crane device, 4 is an electroplating flying bar, 5 is a hanging basket, 6 is a liquid stabilizing device, 61 is a liquid stabilizing tank, 62 is a first delivery pump, 63 is a second delivery pump, 64 is a gas collecting cover, 65 is a recovery tank, 66 is a liquid storage tank, 67 is a third delivery pump, 68 is a first flow meter, 69 is a third flow meter, 7 is a swinging device, and 8 is a vibrating device. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0019] REFERENCE Figs. 1-2A kind of circuit board hole filling system, including fixed seat 1, immersion tank group 2, travelling device 3, electroplating fly bar 4, hanging basket 5, liquid stabilizing device 6, swing device 7, vibration device 8 and operation platform 9, fixed seat 1 is used to support entire production line, can include fixed frame and transparent cover, by transparent cover can make fixed seat 1 whole in relatively sealed state, reduce the influence to outside during processing, facilitate observation the working condition inside production line, fixed seat 1 is equipped with immersion tank group 2, travelling device 3, immersion tank group 2 is filled with different processing liquid, such as copper deposition solution, deslagging solution, pure water, city water etc., different processing of circuit board can be realized.

[0020] Travelling device 3 is located above immersion tank group 2, travelling device 3 bottom is equipped with electroplating fly bar 4, and electroplating fly bar 4 is detachably connected with hanging basket 5, hanging basket 5 can load the circuit board to be handled, and the detachable connecting structure between electroplating fly bar 4 and hanging basket 5 is prior art, which will not be described hereinafter, travelling device 3 can drive electroplating fly bar 4 and hanging basket 5 to move above immersion tank group 2, and can also drive electroplating fly bar 4 and hanging basket 5 to lift, so that hanging basket 5 is inserted and matched with immersion tank group 2, by placing hanging basket 5 with circuit board in different immersion tanks, different processing of circuit board is realized, and travelling device 3 can include moving motor, moving slide rail, lifting slide rail and other mechanisms, which are prior art and will not be described hereinafter.

[0021] Immersion tank group 2 includes hole filling tank 21, and the hole filling tank 21 is an immersion tank in the plurality of immersion tanks of the immersion tank group 2 for hole filling operation

[0022] The liquid stabilizing device 6 includes a liquid stabilizing tank 61, and the liquid stabilizing tank 61 is provided with a heating coil pipe, and a first conveying pump 62 is connected between the liquid inlet of the liquid stabilizing tank 61 and the hole filling tank 21, and a second conveying pump 63 is connected between the liquid outlet of the liquid stabilizing tank 61 and the hole filling tank 21, the hole filling reaction liquid after reaction is conveyed into the liquid stabilizing tank 61 by the first conveying pump 62, the hole filling reaction liquid flowing into the liquid stabilizing tank 61 is heated by the heating coil pipe, and is evaporated, so as to increase the copper ion solubility in the hole filling reaction liquid in the liquid stabilizing tank 61, and the temperature of the solution is also increased, and the hole filling reaction liquid with increased copper ion solubility is conveyed back into the hole filling tank 21 by the second conveying pump 63, so as to maintain the stability of the copper ions in the hole filling reaction liquid, reduce the problem of uneven hole filling caused by concentration fluctuation, improve the hole filling effect, and ensure the quality of the circuit board.

[0023] In some embodiments, the liquid stabilizing tank 61 is provided with a gas collecting hood 64, and the gas collecting hood 64 is connected with a recovery tank 65, which can be used for recovering the steam in the liquid stabilizing tank 61, saving resources.

[0024] In some embodiments, the filling hole tank 21 is connected with a liquid storage tank 66, the liquid storage tank 66 stores filling hole reaction liquid, a third conveying pump 67 is connected between the liquid storage tank 66 and the filling hole tank 21, the filling hole reaction liquid is conveyed to the filling hole tank 21 through the third conveying pump 67, so as to supplement the filling hole reaction liquid in the filling hole tank 21. The connection points of the filling hole tank 21, the liquid storage tank 66 and the liquid stabilizing tank 61 are all arranged on the bottom and symmetrically arranged, so that when the liquid storage tank 66 and the liquid stabilizing tank 61 convey the filling hole reaction liquid to the filling hole tank 21, the two streams of solution collide, the liquidity of the liquid in the filling hole tank 21 is increased, and the mixing uniformity of the solution is improved.

[0025] In some embodiments, a first flow meter 68 is connected between the first conveying pump 62 and the liquid stabilizing tank 61, a second flow meter is connected between the second conveying pump 63 and the filling hole tank 21, the first flow meter 68 and the second flow meter cooperate to monitor and control the flow of the solution between the liquid stabilizing tank 61 and the filling hole tank 21, a third flow meter 69 is connected between the third conveying pump 67 and the liquid immersion tank group 2, the third flow meter 69 can monitor and control the flow of the solution between the liquid stabilizing tank 61 and the filling hole tank 21, and the copper ions in the filling hole reaction liquid in the filling hole tank 21 can be further controlled through the first flow meter 68 and the third flow meter 69.

[0026] In some embodiments, two supporting members 22 are symmetrically arranged on the two sides of the liquid immersion tank group 2, and the two supporting members 22 are respectively inserted and matched with the two ends of the hanging basket 5. The supporting member 22 can be a fixed block with a groove, and the two ends of the hanging basket 5 can be provided with a protrusion matched with the groove. Through the insertion and matching of the protrusion and the groove, the hanging basket 5 and the supporting member 22 can be quickly installed and disassembled, so as to facilitate the insertion and separation between the circuit board on the hanging basket 5 and the liquid immersion tank. This is prior art, which will not be described here.

[0027] In some embodiments, a swinging device 7 is arranged on the periphery of the liquid immersion tank group 2, and the supporting member 22 is arranged on the swinging device 7. The swinging improves the uniformity of the liquid immersion, thereby improving the reaction speed and effect. The swinging device can include a driving cylinder, a sliding frame and the like. This is prior art, which will not be described here.

[0028] In some embodiments, a vibrating device 8 is arranged between the filling hole tank 21 and the supporting member 22. The vibrating device 8 can be arranged on the top of the filling hole tank 21. The vibrating device 8 can drive the supporting member to vibrate in the height direction, so that the hanging basket inserted and matched with the supporting member vibrates in the height direction, and then the circuit board in the liquid immersion tank group 2 vibrates, helping the medicine to better penetrate into the hole and improving the reaction effect. The vibrating device 8 can include a vibrating motor, a vibrating spring and the like. This is prior art, which will not be described here.

[0029] The specific working principle is as follows:

[0030] In the specific processing, the circuit board to be processed is placed in the hanging basket 5, the hanging basket 5 loaded with the circuit board is connected with the electroplating flying bar 4, so that the hanging basket 5 is connected with the travelling device 3, the travelling device 3 drives the hanging basket 5 to move horizontally above the filling hole groove 21, and the hanging basket 5 is lowered into the filling hole groove 21 by the travelling device 3 to perform the filling hole operation of the circuit board.

[0031] After the electroplating is completed, the first conveying pump 62 extracts part of the electroplating liquid from the filling hole groove 21 into the liquid stabilizing tank 61, the heating coil heats and processes the filling hole reaction liquid, the filling hole reaction liquid is heated and evaporated, the copper ion solubility in the filling hole reaction liquid is improved, and then the processed filling hole reaction liquid is returned to the immersion tank through the second conveying pump 63 to form a closed loop circulation, so as to ensure the stability of the copper ions in the electroplating liquid.

[0032] With the electroplating, the filling hole reaction liquid in the filling hole groove 21 is reduced as a whole, and the filling hole reaction liquid in the liquid storage tank 66 is supplemented to the filling hole groove 21 by the third conveying pump 67 as needed to maintain the volume and composition of the filling hole reaction liquid.

[0033] The flow of the liquid stabilization circulation is monitored by the first flow meter 68, and the flow of the filling hole reaction liquid supplement is monitored by the third flow meter 69, so as to ensure the accuracy of the operation.

[0034] The above examples are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board via filling system, comprising a mounting base (1), wherein the mounting base (1) is provided with an immersion tank assembly (2) and a traveling device (3), wherein the traveling device (3) is disposed above the immersion tank assembly (2), characterized in that: The bottom of the traveling device (3) is provided with an electroplating fly bar (4), and a hanging basket (5) is detachably connected to the electroplating fly bar (4). The hanging basket (5) is inserted into the immersion tank group (2). The immersion tank group (2) includes a filling tank (21), and the filling tank (21) is connected to a liquid stabilizing device (6). The liquid stabilizing device (6) can maintain the stability of copper ions in the solution of the filling tank (21).

2. The circuit board via filling system according to claim 1, characterized in that: The liquid stabilizing device (6) includes a liquid stabilizing tank (61), which is equipped with a heating coil. A first delivery pump (62) is connected between the liquid inlet of the liquid stabilizing tank (61) and the filling groove (21), and a second delivery pump (63) is connected between the liquid outlet of the liquid stabilizing tank (61) and the filling groove (21).

3. A circuit board via filling system according to claim 2, characterized in that: The top of the liquid stabilizer (61) is provided with a gas collection hood (64), and the gas collection hood (64) is connected to a recovery tank (65).

4. A circuit board via filling system according to claim 2, characterized in that: The filling tank (21) is connected to a storage tank (66), which stores the filling reaction liquid. A third delivery pump (67) is connected between the storage tank (66) and the filling tank (21).

5. A circuit board via filling system according to claim 4, characterized in that: A first flow meter (68) is connected between the first delivery pump (62) and the liquid stabilizing tank (61), a second flow meter is connected between the second delivery pump (63) and the filling groove (21), and a third flow meter (69) is connected between the third delivery pump (67) and the filling groove (21).

6. A circuit board via filling system according to claim 1, characterized in that: The filling groove (21) is symmetrically provided with support members (22) on both sides, and the two support members (22) are respectively inserted into the two ends of the hanging basket (5).

7. A circuit board via filling system according to claim 6, characterized in that: The periphery of the filling groove (21) is provided with a rocking device (7), and the rocking device (7) is provided with the support member (22).

8. A circuit board via filling system according to claim 6, characterized in that: A vibration device (8) is provided between the filling groove (21) and the support member (22).

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