LED product repair equipment

Abstract

The utility model discloses LED product repairing equipment. The LED product repairing equipment comprises a product bearing and moving device, a tin material supply device, a chip supply device, a spot tin removing final assembly module and a crystal taking and welding final assembly module. The product bearing and moving device comprises a workbench and a horizontal driving mechanism; the tin dispensing and removing final assembly module comprises a first moving mechanism and a first moving table, a removing mechanism and a tin dispensing mechanism are arranged on the first moving table, and the first moving mechanism is connected with the first moving table and can drive the tin dispensing mechanism to move to the position above the tin material supply device or the workbench; the crystal taking and welding general assembly module comprises a second moving mechanism and a second moving table, the second moving table is provided with a crystal taking mechanism and a laser welding mechanism, and the second moving mechanism is connected with the second moving table and can drive the crystal taking mechanism to move to the position above the chip supply device and the workbench; according to the invention, bad chips on the LED product can be removed one by one and replaced with new chips, and the repair efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED repair equipment, and particularly relates to an LED product repair equipment. BACKGROUND

[0002] In the prior art, the LED product repair equipment comprises a product moving device, a rejection mechanism, a tin-pointing mechanism, a die-attaching mechanism and a welding mechanism, wherein the product moving device can drive the LED product to move along the X-axis direction, and the rejection mechanism, the tin-pointing mechanism, the die-attaching mechanism and the welding mechanism are arranged along the X-axis direction, so that the LED product can pass through the rejection mechanism, the tin-pointing mechanism, the die-attaching mechanism and the welding mechanism in turn under the driving of the product moving device, and the rejection of the defective chip, the tin-pointing, the die-attaching of the new chip and the welding can be completed, so that the LED product can be effectively repaired; however, since the LED product can have multiple defective chips, the LED product repair equipment can only move to the next step after completing the current repair step of all the defective chips (for example, the new chip can be attached only after the rejection and tin-pointing of all the defective chips on the LED product are completed), so that in the repair process, the remaining mechanisms will be in the idle state except the mechanism corresponding to the current step, and the repair efficiency is relatively low. SUMMARY

[0003] The present application aims to at least solve one of the problems in the prior art. To this end, the present application provides an LED product repair equipment which can replace the defective chips on the LED product with new chips one by one and is beneficial to improve the repair efficiency.

[0004] The LED product repair device according to the embodiment of the present application comprises a product carrying and moving device, a tin material supply device, a chip supply device, a tin point and removal assembly module, a crystal picking and welding assembly module and a control system; the product carrying and moving device comprises a workbench and a horizontal driving mechanism, the workbench is connected to the horizontal driving mechanism and can move along the X-axis direction and the Y-axis direction under the driving of the horizontal driving mechanism; the tin material supply device is arranged on one side of the product carrying and moving device along the X-axis direction and is used for supplying tin material; the chip supply device is arranged on the side of the product carrying and moving device away from the tin material supply device and is used for supplying chips; the tin point and removal assembly module comprises a first moving mechanism and a first moving table, the first moving table is provided with a first positioning mechanism, a removal mechanism and a tin point mechanism, the first positioning mechanism is used for positioning a defective chip on an LED product, the removal mechanism is used for removing the defective chip on the LED product, the first moving mechanism is connected to the first moving table and can drive the first moving table to move along the X-axis direction, so that the tin point mechanism can move to the tin material supply device to take tin and can move to the workbench to point tin material to the area of the LED product where the chip is removed; the crystal picking and welding assembly module comprises a second moving mechanism and a second moving table, the second moving table is provided with a laser welding mechanism and a crystal picking mechanism, the second moving mechanism is connected to the second moving table and can drive the second moving table to move along the X-axis direction, so that the crystal picking mechanism can move to the chip supply device to pick up chips and can move to the workbench to mount the chips to the area of the LED product where the tin is pointed, and the laser welding mechanism is used for welding the chip mounted by the crystal picking mechanism to the LED product; and the control system is electrically connected with the horizontal driving mechanism, the tin material supply device, the chip supply device, the first moving mechanism, the first positioning mechanism, the removal mechanism, the tin point mechanism, the second moving mechanism, the laser welding mechanism and the crystal picking mechanism.

[0005] The LED product repair device according to the embodiment of the present application has at least the following beneficial effects:

[0006] The LED product repair equipment of the embodiment can move the LED product to the preset position below the tin-pointing and removing assembly module through the product carrying and moving device during the repair of the LED product, then acquire the position information of the defective chip on the LED product through the first positioning mechanism, subsequently adjust the position of the LED product through the horizontal driving mechanism so that one defective chip moves to the removing position corresponding to the removing mechanism, then remove the defective chip through the removing mechanism; subsequently drive the first moving table carrying the tin-pointing mechanism to take tin from the tin supply device through the first moving mechanism, then move the tin-pointing mechanism above the LED product, so that the tin-pointing mechanism can point the tin on the area of the removed chip of the LED product for the welding of the new chip; while removing the defective chip, taking the tin and pointing the tin, the second moving table carrying the chip picking mechanism can be moved to the chip supply device to pick the new chip through the second moving mechanism, then move the chip picking mechanism and the new chip to the waiting die bonding position on the side of the workbench to wait for the completion of the tin pointing; subsequently drive the second moving table carrying the chip picking mechanism to move above the tin-pointing area of the LED product through the second moving mechanism, and pick the new chip through the chip picking mechanism and weld the new chip on the LED product through the laser welding mechanism, so that the repair of one defective chip is completed; then the above process is repeated several times to remove all defective chips and replace them with new chips; therefore, the LED product repair equipment of the embodiment can remove the defective chips on the LED product one by one and replace them with new chips, and the chip picking mechanism can work synchronously with the removing mechanism and the tin-pointing mechanism during the repair process, so that the repair efficiency is improved.

[0007] According to some embodiments of the LED product repair equipment, the product carrying and moving device further comprises a rotating driving mechanism connected with the workbench and used for driving the workbench to rotate in the horizontal plane, and the rotating driving mechanism is electrically connected with the control system.

[0008] According to some embodiments of the LED product repair equipment, product input and output devices are arranged on the opposite sides of the product carrying and moving device in the X-axis direction, and a product receiving mechanism is arranged on the workbench and can be docked with the product input and output devices under the driving of the horizontal driving mechanism, and the product input and output devices are electrically connected with the control system.

[0009] The LED product repair device according to some embodiments of the present application, the product receiving mechanism comprises two first belt conveying assemblies arranged in parallel and spaced apart, the two first belt conveying assemblies are respectively used for carrying two opposite edges of the LED product, a product clamping mechanism is arranged on each first belt conveying assembly, the product clamping mechanism comprises a first clamping piece and a jacking assembly, the first clamping piece is connected to a rack of the first belt conveying assembly and at least partially located above a conveying surface of the first belt conveying assembly, the jacking assembly comprises a jacking driver, a jacking synchronizer and a jacking piece, the jacking piece is slidably connected to the rack of the first belt conveying assembly in a vertical direction and located below the conveying surface of the first belt conveying assembly and the first clamping piece, the jacking synchronizer is slidably connected to the rack of the first belt conveying assembly in a horizontal direction, and a plurality of rollers are arranged on the jacking synchronizer in a spaced apart manner, a plurality of inclined sliding grooves corresponding to the rollers are arranged on the jacking piece in a one-to-one sliding fit manner, and the jacking driver is connected to the jacking synchronizer and used for driving the jacking synchronizer to slide horizontally.

[0010] The LED product repair device according to some embodiments of the present application, the product receiving mechanism is provided with a first product stopping mechanism, the first product stopping mechanism is arranged between the two first belt conveying assemblies and used for stopping the LED product to prevent the LED product from continuing to be conveyed backward.

[0011] The LED product repair device according to some embodiments of the present application, the product output device comprises a product output mechanism and a product testing mechanism, the product output mechanism comprises two second belt conveying modules arranged in parallel and spaced apart, the two second belt conveying modules are respectively used for carrying two opposite edges of the LED product, the product testing mechanism is arranged between the two second belt conveying modules and comprises a lifting driver and a jacking table, an upper surface of the jacking table is provided with a testing terminal, and the testing terminal is used for connecting with a connecting terminal on the LED product and supplying power to the LED product.

[0012] The LED product repair device according to some embodiments of the present application, the product output device further comprises a visual recognition mechanism, the visual recognition mechanism comprises a visual recognition module arranged above the product output mechanism, the visual recognition module can acquire an image of the LED product on the product output mechanism and identify whether there is a non-illuminated chip in the LED product through image recognition, and the visual recognition module is electrically connected with the control system.

[0013] The LED product repair equipment according to some embodiments of the present application, the chip supply device comprises a wafer switching platform, a wafer picking mechanism and a wafer position adjusting mechanism, the wafer switching platform comprises a rotating disc and a plurality of annular wafers connected to the periphery of the rotating disc, the annular wafers are used for supporting the film pieces densely arranged with chips, the wafer picking mechanism is arranged on one side of the rotating disc, each annular wafer can be moved to above the wafer picking mechanism under the driving of the rotating disc, the wafer picking mechanism comprises a thimble and a lifting driving module, the lifting driving module is connected to the thimble and is used for driving the thimble to lift, and the thimble can lift the chip on the film piece when the thimble is lifted, and the wafer position adjusting mechanism is connected to the wafer switching platform and is used for changing the position of the annular wafer, so that each chip on the annular wafer above the wafer picking mechanism can be moved to above the thimble.

[0014] The LED product repair equipment according to some embodiments of the present application, the wafer picking mechanism further comprises a lifting rod assembly arranged in a vertical direction, the thimble is connected to the top of the lifting rod assembly, and the lifting driving module comprises a motor and a cam connected to the output shaft of the motor, and the lower end of the lifting rod assembly abuts against the cam.

[0015] The LED product repair equipment according to some embodiments of the present application further comprises a chip angle detection device, the chip angle detection device is arranged between the product carrying moving device and the chip supply device, the chip angle detection device comprises a chip angle detection camera, the shooting direction of the chip angle detection camera is upward, the wafer picking mechanism can be moved to a wafer fixing position above the chip angle detection device under the driving of the first moving mechanism, and the chip angle detection camera is used for detecting the angle posture of the picked chip when the wafer picking mechanism is located at the wafer fixing position.

[0016] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 A structure schematic view of the LED product repair equipment according to an embodiment of the present application;

[0019] Figure 2 A structure schematic view of the LED product repair equipment according to an embodiment of the present application; Figure 1 A top view of the LED product repair equipment shown in the figure;

[0020] Figure 3 A structure schematic view of the LED product repair equipment shown in the figure after the first moving mechanism is removed; Figure 2 A structure schematic view of the LED product repair equipment shown in the figure after the first moving mechanism is removed;

[0021] Figure 4 is a structural schematic view of the removing mechanism shown in Figure 3

[0022] Figure 5 is a structural schematic view of the tin material supply device shown in Figure 2

[0023] Figure 6 is a structural schematic view of the chip supply device shown in Figure 2

[0024] Figure 7 Figure 6

[0025] Figure 8 is a structural schematic view of the connection between the lifting driving module, the lifting rod assembly, the lifting seat and the ejector pin shown in Figure 7

[0026] Figure 9 is a structural schematic view of the wafer taking and welding assembly module shown in Figure 2

[0027] Figure 10 is a structural schematic view of the chip angle detection device shown in Figure 2

[0028] Figure 11 is a structural schematic view of the product carrying and moving device shown in Figure 2

[0029] Figure 12 is a structural schematic view of the workbench shown in Figure 11

[0030] Figure 13 is a structural schematic view of the lifting assembly shown in Figure 12

[0031] Figure 14 is a structural schematic view of the product input device shown in Figure 2

[0032] Figure 15 is a structural schematic view of the product output device shown in Figure 2

[0033] Reference signs:

[0034] ​​​​​​​​​​​​​Product carrying mobile device 10; workbench 11; first belt conveying assembly 111; first clamping member 112; jacking driver 113; jacking synchronizer 114; roller 115; jacking member 116; inclined chute 117; first product stopping mechanism 12; stopping driver 121; stopping member 123; horizontal driving mechanism 13; first X-axis driver 131; first Y-axis driver 132; rotary driving mechanism 14; tin material supply device 20; cleaning pool 21; slurry tray 22; chip supply device 30; wafer tray switching platform 31; rotary tray 311; annular wafer tray 312; wafer tray position adjusting mechanism 32; second X-axis driver 321; second Y-axis driver 322; wafer lifting mechanism 33; lifting pin 331; motor 332; cam 333; lifting rod assembly 334; X-axis adjusting sliding table 335; Y-axis adjusting sliding table 336; Z-axis adjusting sliding table 337; jacking seat 338; point tin removing assembly module 40; first moving mechanism 41; first moving table 42; first camera assembly 431; height measuring assembly 432; removing mechanism 44; removing Y-axis driver 441; removing lifting driver 442; removing adsorption assembly 443; point tin mechanism 45; point tin driver 451; rubber cylinder 452; wafer picking and welding assembly module 50; second moving mechanism 51; second moving table 52; wafer picking mechanism 53; suction head 531; suction head rotary driver 532; suction head lifting driver 533; chip positioning camera 534; picking detection camera 535; chip angle detection device 60; chip angle detection camera 61; product input device 70; third belt conveying assembly 71; code scanner 72; product output device 80; product output mechanism 81; second belt conveying module 811; product testing mechanism 82; testing driver 821; jacking table 822; second product stopping mechanism 83; visual recognition mechanism 84; visual recognition module 841; cross beam 90. DETAILED DESCRIPTION

[0035] Embodiments of the present application are described in detail below with reference to the attached drawing figures, wherein the same or like reference numerals and characters throughout the figures denote the same or like elements or components. The embodiments described below are exemplary, and are not intended to be limiting of the present application.

[0036] In the description of the present application, it is to be understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, front, back, etc., is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0037] In the description of the present application, if the first, second, only for the purpose of distinguishing technical features, and can not be understood as indicating or implying the relative importance or implied indicate the number of indicated technical features or implied indicate the order of the indicated technical features.

[0038] In the description of the present application, unless otherwise expressly limited, the words set, install, connect, etc. should be broadly understood, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0039] The following refers to the accompanying drawings that Figure 1 to the accompanying drawings Figure 15 , the LED product repair equipment of the first aspect of the present application is described.

[0040] Referring to Figures 1 to 3 , and Figure 9 and Figure 11The LED product repair equipment of the embodiment comprises a product carrying and moving device 10, a tin material supply device 20, a chip supply device 30, a tin point and removal assembly module 40, a crystal picking and welding assembly module 50 and a control system. The product carrying and moving device 10 comprises a workbench 11 and a horizontal driving mechanism 13. The workbench 11 is connected to the horizontal driving mechanism 13 and can move along the X-axis direction and the Y-axis direction under the driving of the horizontal driving mechanism 13. The tin material supply device 20 is arranged on the side of the product carrying and moving device 10 along the X-axis direction and is used for supplying tin material. The chip supply device 30 is arranged on the side of the product carrying and moving device 10 away from the tin material supply device 20 and is used for supplying chips. The tin point and removal assembly module 40 comprises a first moving mechanism 41 and a first moving table 42. The first moving table 42 is provided with a first positioning mechanism, a removal mechanism 44 and a tin point mechanism 45. The first positioning mechanism is used for positioning the defective chip on the LED product. The removal mechanism 44 is used for removing the defective chip on the LED product. The first moving mechanism 41 is connected to the first moving table 42 and can drive the first moving table 42 to move along the X-axis direction, so that the tin point mechanism 45 can move to the tin material supply device 20 to take tin and can move to the workbench 11 to point the tin material on the area of the LED product where the chip is removed. The crystal picking and welding assembly module 50 comprises a second moving mechanism 51 and a second moving table 52. The second moving table 52 is provided with a laser welding mechanism (not shown in the figure) and a crystal picking mechanism 53. The second moving mechanism 51 is connected to the second moving table 52 and can drive the second moving table 52 to move along the X-axis direction, so that the crystal picking mechanism 53 can move to the chip supply device 30 to pick up the chip and can move to the workbench 11 to mount the chip on the tin point area of the LED product. The laser welding mechanism is used for welding the chip mounted by the crystal picking mechanism 53 on the LED product. The control system is electrically connected with the horizontal driving mechanism 13, the tin material supply device 20, the chip supply device 30, the first moving mechanism 41, the first positioning mechanism, the removal mechanism 44, the tin point mechanism 45, the second moving mechanism 51, the laser welding mechanism and the crystal picking mechanism 53.

[0041] It should be understood that in the process of repairing the LED product, the LED product repair equipment of the embodiment can first move the LED product to a preset position below the spot tin removal assembly module 40 through the product carrying and moving device 10, then acquire the position information of the defective chip on the LED product through the first positioning mechanism, subsequently adjust the position of the LED product through the horizontal driving mechanism 13 so that one defective chip moves to the removal position corresponding to the removal mechanism 44, and then remove the defective chip through the removal mechanism 44; subsequently, the first moving mechanism 41 drives the first moving table 42 to carry the spot tin mechanism 45 to the tin supply device 20 to take tin, then drives the spot tin mechanism 45 to move above the LED product, and then the spot tin mechanism 45 can spot tin on the area of the removed chip of the LED product for welding a new chip; while removing the defective chip, taking tin and spotting tin, the second moving mechanism 51 drives the second moving table 52 to carry the wafer picking mechanism 53 to the chip supply device 30 to pick up a new chip, and then drives the wafer picking mechanism 53 to carry the new chip to the fixed wafer position on one side of the workbench 11 to wait for the completion of the tin spotting; subsequently, the second moving mechanism 51 drives the second moving table 52 to carry the wafer picking mechanism 53 to move above the tin spotting area of the LED product, and the wafer picking mechanism 53 attaches the new chip to the tin spotting position of the LED product, and then the laser welding mechanism welds the new chip to the LED product, thereby completing the repair of one defective chip; then the above process is repeated several times to remove all defective chips and replace them with new chips; therefore, the LED product repair equipment of the embodiment can remove the defective chips on the LED product one by one and replace them with new chips, and the wafer picking mechanism 53 can work synchronously with the removal mechanism 44 and the spot tin mechanism 45 during the repair process, thereby facilitating the improvement of the repair efficiency.

[0042] It should be understood that, with reference to Figure 1 and Figure 2 in some embodiments, the first moving table 42 and the second moving table 52 are slidingly arranged on the same cross beam 90 extending along the X-axis direction, and similarly, the first moving mechanism 41 and the second moving mechanism 51 are also arranged on the cross beam 90.

[0043] It should be understood that, in some embodiments, with reference to Figure 3The first positioning mechanism includes a first camera assembly 431 and two height measuring assemblies 432 fixedly arranged on the first moving table 42, so as to obtain the accurate position information of the LED product in the height direction, the X-axis direction and the Y-axis direction through the first camera assembly 431 and the two height measuring assemblies 432. Before the LED product is returned, the power-on detection is performed and the position point information of each defective chip on the LED product is obtained. Then, the accurate position information of each defective chip on the LED product in the LED product returning equipment is obtained according to the accurate position information of the LED product in the height direction, the X-axis direction and the Y-axis direction in the returning equipment and the position point information of each defective chip on the LED product.

[0044] It can be understood that, in some embodiments, the first moving mechanism 41 includes a first moving drive 411 and a first moving table 42, wherein the first moving drive 411 is connected to the first moving table 42 and can drive the first moving table 42 to move along the X-axis direction. Figure 3 The point tin mechanism 45 includes a point tin drive 451 and a glue cylinder 452, wherein the point tin drive 451 is connected to the glue cylinder 452 and can drive the glue cylinder 452 to move up and down. Figure 5 The tin material supply device 20 includes a cleaning pool 21 and a slurry disc 22, wherein the slurry disc 22 stores the tin material, the cleaning pool 21 is used for cleaning the point glue head of the glue cylinder 452, and Figure 1 and Figure 2 The cleaning pool 21 and the slurry disc 22 are arranged on one side of the product carrying moving device 10 along the X-axis direction, so that the point tin mechanism 45 can pass above the cleaning pool 21 and the slurry disc 22 under the driving of the first moving mechanism 41. When the point tin mechanism 45 moves above the cleaning pool 21, the point tin drive 451 drives the glue cylinder 452 to move down, and the point glue needle of the glue cylinder 452 enters the cleaning pool 21, so as to clean the point glue needle before taking the tin material, thereby avoiding the impurities from entering the slurry disc 22 to pollute the tin material. When the point tin mechanism 45 moves above the slurry disc 22, the point tin drive 451 drives the glue cylinder 452 to move down, and the point glue needle of the glue cylinder 452 enters the slurry disc 22, so that the glue cylinder 452 can suck the tin material in the slurry disc 22 through the point glue needle.

[0045] It can be understood that, in some embodiments, the first moving mechanism 41 includes a first moving drive 411 and a first moving table 42, wherein the first moving drive 411 is connected to the first moving table 42 and can drive the first moving table 42 to move along the X-axis direction. Figure 4The removing mechanism 44 comprises a removing Y-axis driver 441, a removing lifting driver 442 and a removing adsorption assembly 443, wherein the removing lifting driver 442 is connected to the driving end of the removing Y-axis driver 441, and the removing adsorption assembly 443 is connected to the driving end of the removing lifting driver 442. Before removing the defective chip, the horizontal driving mechanism 13 drives the workbench 11 to move according to the position information of the defective chip to be removed, so as to adjust the position of the LED product, so that the chip to be removed can be located at the removing position on the side of the Y-axis direction below the removing mechanism 44. When removing the defective chip, the removing adsorption assembly 443 is first moved to the side of the Y-axis direction of the chip to be removed under the driving of the removing lifting driver 442, and then the defective chip is removed from the LED product under the driving of the removing Y-axis driver 441. Meanwhile, the removing adsorption assembly 443 can also adsorb and remove the removed defective chip and solder scraps, so as to avoid the defective chip and solder scraps remaining on the LED product to affect the mounting and welding of the new chip. It should be understood that the removing adsorption assembly 443 is a prior art, and thus will not be described in detail herein.

[0046] It can be understood that in some embodiments, reference is made to Figure 6The chip supply device 30 includes a wafer switching platform 31 and a top crystal mechanism 33. The wafer switching platform 31 includes a turntable 311 and multiple annular wafers 312 connected to the periphery of the turntable 311. The top crystal mechanism 33 is located on one side of the turntable 311. Each annular wafer 312 can move to the top of the top crystal mechanism 33 under the drive of the turntable 311. The top crystal mechanism 33 includes a pin 331 and a lifting drive module. The lifting drive module is connected to the pin 331 and is used to drive the pin 331 to rise and fall. When the pin 331 is lifted, it can lift the chip on the diaphragm, which facilitates the separation of the chip from the diaphragm when the chip picking mechanism 53 picks the chip, thereby improving the success rate of chip picking. It should be understood that LED products typically include multiple chips that emit different colors of light. Therefore, after rejecting defective chips, it is necessary to remount chips of the same type with the same light-emitting color as the defective chips onto the LED product. Different annular crystal disks 312 are used to carry chip films of different light colors. Based on the light color of the rejected defective chip, the annular crystal disk 312 with the corresponding light-colored chip can be switched above the top crystal mechanism 33 via the turntable 311, so that the chip of the corresponding light color can be lifted by the ejector pin 331. Furthermore, since the film is densely covered with chips, to ensure that each chip on the film can be picked up by the chip picking mechanism 53, the chip supply device 30 also includes a crystal disk position adjustment mechanism 32. The crystal disk position adjustment mechanism 32 is connected to the crystal disk switching platform 31 and is used to adjust the position of the annular crystal disk 312, so that each chip on the annular crystal disk 312 above the top crystal mechanism 33 can move above the ejector pin 331, thereby allowing each chip on the film to be lifted by the ejector pin 331.

[0047] It should be understood that, in one embodiment, reference is made to... Figure 6 The disk position adjustment mechanism 32 includes a second X-axis driver 321 and a second Y-axis driver 322. The second X-axis driver 321 is connected to the driving part of the second Y-axis driver 322, and the disk switching platform 31 is connected to the driving part of the second Y-axis driver 322. Thus, the disk switching platform 31 can be moved along the X-axis and Y-axis respectively by the second X-axis driver 321 and the second Y-axis driver 322.

[0048] It can be understood that in some embodiments, the top crystal mechanism 33 further comprises a top rod assembly 334 which is vertically telescopic, the top pin 331 is connected to the top of the top rod assembly 334, the top lifting driving module comprises a motor 332 and a cam 333 connected to the output shaft of the motor 332, and the lower end of the top rod assembly 334 abuts against the cam 333. It should be understood that by using the motor 332 and the cam 333 to cooperate to drive the top pin 331 to lift, the consistency of each lifting stroke of the top pin 331 can be ensured, so as to improve the lifting precision, and further improve the success rate of the wafer picking mechanism 53 picking up the chip. For example, in some embodiments, referring to Figure 7 and Figure 8 , the top crystal mechanism 33 comprises an X-axis adjustment sliding table 335, a Y-axis adjustment sliding table 336, a Z-axis adjustment sliding table 337 and a lifting seat 338, wherein the X-axis adjustment sliding table 335 is connected to the driving part of the Y-axis adjustment sliding table 336, the Z-axis adjustment sliding table 337 is connected to the driving part of the X-axis adjustment sliding table 335, the lifting seat 338 is connected to the driving part of the Z-axis adjustment sliding table 337, the motor 332 in the top lifting driving module is fixedly connected to the lifting seat 338, and the top rod assembly 334 is slidably arranged in the lifting seat 338 in the vertical direction, so that the X-axis, Y-axis and height direction positions of the top pin 331 can be adjusted by the X-axis adjustment sliding table 335, the Y-axis adjustment sliding table 336 and the Z-axis adjustment sliding table 337 respectively, and the top pin 331 can be accurately adjusted to the position set below the center of one of the annular wafer disks 312.

[0049] It can be understood that in some embodiments, referring to Figure 9The crystal taking mechanism 53 comprises a suction assembly, a chip positioning camera 534 and a suction detection camera 535. The suction assembly comprises a suction head 531, a suction head rotating driver 532 and a suction head lifting driver 533. The suction head 531 is connected to the output shaft of the suction head rotating driver 532, and the suction head rotating driver 532 is connected to the driving part of the suction head lifting driver 533. When the crystal taking mechanism 53 moves to the corresponding position above the crystal pushing mechanism 33, the suction head 531 can be driven to move downward by the suction head lifting driver 533 to suck the chip pushed out of the film by the push pin 331 on the annular wafer 312, and when the chip sucked by the suction head 531 has an angle posture deviation, the chip can be rotated by the suction head 531 to adjust the angle posture by driving the suction head rotating driver 532. The chip positioning camera 534 is connected to one side of the suction assembly and has a downward shooting direction to obtain the position of the chip in the annular wafer 312 above the crystal pushing mechanism 33, so that the wafer position adjusting mechanism 32 can adjust any one chip to the position above the push pin 331 according to the position of the chip detected by the chip positioning camera 534. The suction detection camera 535 is also arranged on one side of the suction assembly and has a shooting direction towards the suction end of the suction head 531 and is used to detect whether the suction head 531 is adsorbed to the chip, so that when it is detected that the suction head 531 is not successfully adsorbed to the chip, the crystal taking mechanism 53 can repeatedly pick up the chip again until the chip is successfully sucked.

[0050] It can be understood that in some embodiments, reference is made to Figure 10 The LED product repair equipment further comprises a chip angle detection device 60 arranged between the product carrying moving device 10 and the chip supply device 30. The chip angle detection device 60 comprises a chip angle detection camera 61 having an upward shooting direction. The crystal taking mechanism 53 can move to a wafer fixing position above the chip angle detection device 60 under the driving of the first moving mechanism 41. The chip angle detection camera 61 is used to detect the angle posture of the chip picked up by the crystal taking mechanism 53 when the crystal taking mechanism 53 is located at the wafer fixing position. The chip angle detection camera 61 is electrically connected to the control system, so that the control system can control the suction head rotating driver 532 to drive the suction head 531 to rotate to adjust the angle of the chip according to the angle posture of the chip detected by the chip angle detection camera 61.

[0051] It can be understood that the laser welding mechanism is a prior art and will not be described in detail here.

[0052] It can be understood that the chips on different LED products can have different arrangement orientations. In order to enable the LED product repair equipment to repair different LED products, in some embodiments, the product carrying moving device 10 further comprises a rotating driving mechanism 14 connected to the workbench 11 and configured to drive the workbench 11 to rotate in the horizontal plane. The rotating driving mechanism 14 is electrically connected to the control system, so that the control system can control the rotating driving mechanism 14 to drive the workbench 11 to rotate according to the mounting orientation of the chips in the LED product to be repaired, thereby adjusting the attitude angle of the LED product, so that the attitude and angle of the defective chips on the LED product can correspond to the rejecting mechanism 44, the tin dotting mechanism 45, the crystal taking mechanism 53, the laser welding mechanism, and the like. For example, in one embodiment, referring to Figure 11 The horizontal driving mechanism 13 comprises a first X-axis driver 131 arranged along the X-axis direction and a first Y-axis driver 132 arranged along the Y-axis direction, and the first X-axis driver 131 is arranged on the driving part of the first Y-axis driver 132. The rotating driving mechanism 14 is connected to the driving part of the first X-axis driver 131, and the workbench 11 is connected to the driving part of the rotating driving mechanism 14. Thus, the workbench 11 can be driven to move along the X-axis and the Y-axis by the first X-axis driver 131 and the first Y-axis driver 132 respectively, and the workbench 11 can be driven to rotate in the horizontal plane by the rotating driving mechanism 14, thereby realizing the position and attitude adjustment of the LED product in three degrees of freedom in the horizontal plane.

[0053] It can be understood that, in some embodiments, referring to Figure 1 and Figure 2The LED product repair equipment further comprises a product input device 70 and a product output device 80, wherein the product input device 70 is used for inputting the LED product into the LED product repair equipment, and the product output device 80 is used for outputting the LED product after repair to the outside of the LED product repair equipment; specifically, the product input device 70 and the product output device 80 are arranged on opposite sides of the product carrying moving device 10 along the X-axis direction, and the workbench 11 is provided with a product receiving mechanism which can be docked with the product input device 70 or the product output device 80 under the drive of the horizontal drive mechanism 13, and the product input device 70 and the product output device 80 are electrically connected with the control system; through the above structure, when the LED product is repaired, the LED product can be first placed on the product input device 70, and then the LED product will be moved to the side close to the product carrying moving device 10 under the conveying of the product input device 70, at the same time, the product receiving mechanism is turned to a posture capable of being docked with the product input device 70 under the drive of the rotary drive mechanism 14, then the product receiving mechanism is docked with the product input device 70 at one end under the drive of the horizontal drive mechanism 13, thereby receiving the LED product conveyed by the product input device 70, and finally moved to a preset position below the tin point removal assembly module 40 in a suitable posture under the drive of the horizontal drive mechanism 13 and the rotary drive mechanism 14 to wait for removal of the defective chip. When the LED product repair is completed, the product receiving mechanism is turned to a posture capable of being docked with the product output device 80 under the drive of the rotary drive mechanism 14, then the product receiving mechanism is docked with the product output device 80 at one end under the drive of the horizontal drive mechanism 13, and the LED product is conveyed to the product output device 80, and finally the LED product is moved out of the LED product repair equipment under the conveying of the product output device 80.

[0054] It should be understood that in some embodiments, reference is made to Figure 14 The product input device 70 comprises two third belt conveying assemblies 71 arranged at intervals and oppositely, and a code scanner 72 is further arranged above the two third belt conveying assemblies 71, the two first belt conveying assemblies 111 are respectively used for carrying two opposite edges of the LED product, the code scanner can scan the code of the LED product conveyed by the two third belt conveying assemblies 71, and the code scanner 72 is electrically connected with the control system, thereby being capable of transmitting the information of the current LED product obtained by scanning (such as the code information of the current LED product and the position point information of each defective chip on the LED product detected by the upstream detection process) to the control system.

[0055] It can be understood that before the defective chips on the LED products are removed, the LED products need to be positioned to avoid the LED products moving on the product receiving mechanism, which results in the inaccurate removal and replacement of the defective chips. For example, in one embodiment, referring to Figures 11 to 13 , the product receiving mechanism includes two first belt conveying assemblies 111 arranged in parallel and spaced apart, and each of the two first belt conveying assemblies 111 is used to carry two opposite edges of the LED product. Each of the first belt conveying assemblies 111 is provided with a product clamping mechanism, which includes a first clamping piece 112 and a jacking assembly. The first clamping piece 112 is connected to the rack of the first belt conveying assembly 111 and at least partially located above the conveying surface of the first belt conveying assembly 111. The jacking assembly includes a jacking driver 113, a jacking synchronizer 114, and a jacking piece 116. The jacking piece 116 is slidably connected to the rack of the first belt conveying assembly 111 in the vertical direction and located below the conveying surface of the first belt conveying assembly 111 and the first clamping piece 112. The jacking synchronizer 114 is slidably connected to the rack of the first belt conveying assembly 111 in the horizontal direction, and the jacking synchronizer 114 is provided with a plurality of spaced rollers 115. The jacking piece 116 is provided with a plurality of oblique sliding grooves 117 that slide and fit with the rollers 115 one by one. The jacking driver 113 is connected to the jacking synchronizer 114 and used to drive the jacking synchronizer 114 to slide horizontally. Through the above structure, when the LED product is conveyed to the product receiving mechanism, the jacking driver 113 pushes the jacking synchronizer 114 to slide forward (for example, the jacking synchronizer 114 slides towards the first product stop mechanism 12), and then the jacking piece 116 is driven upward by the cooperation of the rollers 115 and the oblique sliding grooves 117, so that the jacking piece 116 can clamp and lock the LED product on the product receiving mechanism together with the first clamping piece 112. When the LED product is repaired, the jacking driver 113 pushes the jacking synchronizer 114 to slide reversely, and then the jacking piece 116 is driven downward by the cooperation of the rollers 115 and the oblique sliding grooves 117, so that the jacking piece 116 moves away from the first clamping piece 112 to release the LED product on the product receiving mechanism, so that the LED product can be conveyed to the product output device 80 by the first belt conveying assembly 111.

[0056] It should be understood that compared with the way of directly connecting the jacking piece 116 with the vertically arranged jacking driver 113, the way of driving the jacking piece 116 by the cooperation of the jacking synchronizer 114, the rollers 115, and the oblique sliding grooves 117 with the jacking driver 113 can ensure that each part of the jacking piece 116 in the length direction can be synchronously jacked, thereby improving the stability of clamping and locking the LED product.

[0057] It is appreciated that in some embodiments, the product receiving mechanism is provided with a first product stopping mechanism 12, which is arranged between the two first belt conveying assemblies 111 and is used to stop the LED products from being conveyed backward, so as to position the LED products in a predetermined position of the product receiving mechanism, and then the product clamping mechanism can clamp and lock the LED products in the predetermined position. For example, referring to Figure 12 and Figure 13 In one embodiment, the first product stopping mechanism 12 comprises a stopping driver 121 and a stopping piece 123, the end of the lifting piece 116 away from the product input device 70 is opposite to the position of the stopping piece 123, the stopping driver 121 is connected to the stopping piece 123 and is used to drive the stopping piece 123 to lift between a stopping position and a avoiding position, when in the stopping position, the top of the stopping piece 123 is higher than the conveying surface of the first belt conveying assembly 111 to stop the LED products conveyed by the first belt conveying assembly 111, when in the avoiding position, the stopping piece 123 is lower than the conveying surface, so as to allow the LED products to continue to be conveyed backward.

[0058] It is appreciated that in order to detect whether the LED products are repaired qualifiedly, in some embodiments, the product output device 80 comprises a product output mechanism 81 and a product testing mechanism 82, wherein the product output mechanism 81 can receive the LED products conveyed from the product receiving mechanism, and the product testing mechanism 82 is used to test the LED products on the product output mechanism 81 by electrifying, so as to evaluate whether the LED products are repaired qualifiedly by the lighting of each chip on the LED products.

[0059] For example, in one embodiment, referring to Figure 15The product output mechanism 81 includes two second belt conveyor modules 811 that are spaced apart and arranged opposite to each other. The two second belt conveyor modules 811 are respectively used to carry the two opposite edges of the LED product. The product testing mechanism 82 is arranged between the two second belt conveyor modules 811 and includes a test driver 821 and a lifting platform 822. The upper surface of the lifting platform 822 is provided with test terminals (not shown in the figure). The test terminals are used to connect to the connection terminals on the LED product and supply power to the LED product. Similarly, a second product blocking mechanism 83 is provided on the product output mechanism 81. The second product blocking mechanism 83 has the same structure as the first product blocking mechanism 12 and is located between the two second belt conveyor modules 811, on the side of the product output mechanism 81 away from the product carrying moving device 10. Thus, the second product blocking mechanism 83 can block the LED product from continuing to be conveyed backward, thereby pre-positioning the LED product in the set position of the product output mechanism 81, and making the connection terminal on the LED product above the test terminal on the lifting platform 822. Thus, after the test driver 821 drives the lifting platform 822 to lift, the test terminal can be correctly connected to the connection terminal of the LED product.

[0060] It is understandable that, in order to automatically identify whether LED products are qualified for repair, in some embodiments, reference is made to... Figure 15 The product output device 80 also includes a visual recognition mechanism 84, which includes a visual recognition module 841 disposed above the product output mechanism 81. The visual recognition module 841 can acquire images of LED products on the product output mechanism 81 and identify whether there are unlit chips in the LED products through the images, as well as obtain the position information of the unlit chips in the LED products. The visual recognition module 841 is electrically connected to the control system. When the visual recognition module 841 identifies that there are unlit chips in the LED products, it can transmit the current LED product's encoding information and the position information of the unlit chips in the current LED products to the control system, and then transmit it to the downstream process equipment so that the downstream process equipment can distinguish between qualified and unqualified LED products.

[0061] The following describes a rework method according to some embodiments of the second aspect of the present invention. The rework method of this embodiment is applied to the LED product rework equipment of the first aspect embodiment described above. The rework method of this embodiment includes, but is not limited to, the following steps S100 to S800.

[0062] S100: Control the horizontal drive mechanism 13 to drive the worktable 11 to move the LED product to a preset position below the soldering rejection assembly module 40.

[0063] S200: controlling the first positioning mechanism to acquire position information of the defective chips on the LED product;

[0064] S300: controlling the horizontal driving mechanism 13 to adjust the position of the LED product according to the position information of the defective chips, so that one of the defective chips moves to a rejection position corresponding to the rejection mechanism 44, and then the defective chip is rejected by the rejection mechanism 44.

[0065] S400: controlling the first moving mechanism 41 to drive the first moving table 42 to carry the tin-pointing mechanism 45 to move to the tin supply device 20 to take tin, and then controlling the first moving mechanism 41 to drive the first moving table 42 to carry the tin-pointing mechanism 45 to move above the LED product, and then the tin-pointing mechanism 45 points tin on the area of the rejected chip of the LED product.

[0066] S500: controlling the second moving mechanism 51 to drive the second moving table 52 to carry the chip-picking mechanism 53 to move to the chip supply device 30 to pick up a chip, and then controlling the second moving mechanism 51 to drive the second moving table 52 to carry the chip-picking mechanism 53 to move to a position to be fixed between the product-carrying moving device and the chip supply device 30.

[0067] It should be understood that, as to the above-mentioned step S500, the step S500 can be executed synchronously in the process of executing steps S300 and S400.

[0068] S600: controlling the horizontal driving mechanism 13 to drive the workbench 11 to move to the side close to the chip-picking mechanism 53, so that the area of the LED product on which tin is pointed moves to the fixed position, and synchronously controlling the second moving mechanism 51 to drive the second moving table 52 to carry the chip-picking mechanism 53 to move above the fixed position;

[0069] S700: mounting the chip on the area of the LED product on which tin is pointed by the chip-picking mechanism 53, and then welding the chip mounted on the area of the LED product on which tin is pointed by the laser welding mechanism;

[0070] S800: repeating the above-mentioned steps S300 to S700 until all the defective chips are replaced by new chips.

[0071] It should be understood that, by adopting the repair method of the embodiment, the defective chips on the LED product can be rejected and replaced by new chips one by one, and the chip-picking mechanism 53 can work synchronously with the rejection mechanism 44 and the tin-pointing mechanism 45 during the repair process, so as to facilitate improving the repair efficiency.

[0072] It can be understood that, for the LED product repair equipment provided with the product input device 70, before the above step S100 is performed, the following step S010 is further included: placing the LED product on the product input device 70, then controlling the product input device 70 to transport the LED product to the side close to the product carrying movement device 10, at the same time, controlling the rotary drive mechanism 14 to rotate and adjust the product receiving mechanism to an angular posture capable of being docked with the product input device 70, then adjusting the position of the product receiving mechanism by the horizontal drive mechanism 13, so that the product receiving mechanism is docked with the product input device 70 and receives the LED product.

[0073] It can be understood that, for the LED product repair equipment provided with the product output device 80, after the above step S800 is performed, the following steps S910 and S920 are further included.

[0074] S910: controlling the rotary drive mechanism 14 to rotate and adjust the product receiving mechanism to an angular posture capable of being docked with the product output device 80, then adjusting the position of the product receiving mechanism by the horizontal drive mechanism 13, so that the product receiving mechanism is docked with the product output device 80, controlling the product receiving mechanism to transport the LED product to the product output device 80.

[0075] S920: controlling the product output device 80 to output the LED product to the outside of the LED product repair equipment.

[0076] It should be understood that, for the product output device 80 including the product testing mechanism 82 and the visual recognition mechanism 84, the above step S920 includes the following sub-steps.

[0077] S921: controlling the test driver 821 to drive the jacking table 822 to rise and make the test terminal on the jacking table 822 connected with the connecting terminal on the LED product, then supplying power to the LED product through the test terminal;

[0078] S922: controlling the visual recognition module 841 to acquire the image of the LED product on the product output mechanism 81, and identifying whether there is an unlit chip in the LED product through the image, and acquiring the position information of the unlit chip in the LED product, and when the visual recognition module 841 identifies that the LED product has an unlit chip, transmitting the encoding information of the current LED product and the position information of the unlit chip in the current LED product to the control system, and then transmitting to the equipment of the downstream process through the control system.

[0079] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the application. The scope of the application is not to be limited by the embodiments shown and described, but only by the claims and their equivalents.

Claims

1. An LED product rework apparatus, characterized by, The application relates to a product carrying and moving device, a tin material supplying device, a chip supplying device, a point tin and removing assembly module, a crystal picking and welding assembly module, a control system, a rotating driving mechanism, a product input device and a product output device. The product carrying and moving device comprises a workbench and a horizontal driving mechanism, the workbench is connected to the horizontal driving mechanism and can move along the X-axis direction and the Y-axis direction under the driving of the horizontal driving mechanism. The tin material supplying device is arranged on the side of the product carrying and moving device along the X-axis direction and is used for supplying tin material. The chip supplying device is arranged on the side of the product carrying and moving device away from the tin material supplying device and is used for supplying chips. The point tin and removing assembly module comprises a first moving mechanism and a first moving table, the first moving table is provided with a first positioning mechanism, a removing mechanism and a point tin mechanism, the first positioning mechanism is used for positioning the defective chip on the LED product, the removing mechanism is used for removing the defective chip on the LED product, the first moving mechanism is connected to the first moving table and can drive the first moving table to move along the X-axis direction, so that the point tin mechanism can move to the tin material supplying device to take tin and can move to the workbench to point tin on the area of the removed chip on the LED product. The crystal picking and welding assembly module comprises a second moving mechanism and a second moving table, the second moving table is provided with a laser welding mechanism and a crystal picking mechanism, the second moving mechanism is connected to the second moving table and can drive the second moving table to move along the X-axis direction, so that the crystal picking mechanism can move to the chip supplying device to pick up chips and can move to the workbench to mount the chips on the tin pointed area of the LED product, and the laser welding mechanism is used for welding the crystal picking mechanism mounted on the tin pointed area of the LED product. The control system is electrically connected with the horizontal driving mechanism, the tin material supplying device, the chip supplying device, the first moving mechanism, the first positioning mechanism, the removing mechanism, the point tin mechanism, the second moving mechanism, the laser welding mechanism and the crystal picking mechanism.

2. The LED product rework apparatus according to claim 1, wherein The product carrying and moving device further comprises a rotating driving mechanism, the rotating driving mechanism is connected to the workbench and is used for driving the workbench to rotate in the horizontal plane, and the rotating driving mechanism is electrically connected with the control system.

3. The LED product rework apparatus of claim 2, wherein The product input device and the product output device are arranged on the opposite sides of the product carrying and moving device along the X-axis direction, the workbench is provided with a product receiving mechanism, the product receiving mechanism can be docked with the product input device or the product output device under the driving of the horizontal driving mechanism, and the product input device and the product output device are electrically connected with the control system.

4. The LED product rework apparatus of claim 3, wherein The product receiving mechanism comprises two first belt conveying assemblies which are spaced apart and oppositely arranged, and are respectively used for carrying two opposite edges of the LED product; each of the first belt conveying assemblies is provided with a product clamping mechanism, the product clamping mechanism comprises a first clamping member and a lifting assembly, the first clamping member is connected to a rack of the first belt conveying assembly and is located above a conveying surface of the first belt conveying assembly at least partially, the lifting assembly comprises a lifting driver, a lifting synchronizer and a lifting member, the lifting member is slidably connected to the rack of the first belt conveying assembly in a vertical direction and is located below the conveying surface of the first belt conveying assembly and the first clamping member, the lifting synchronizer is slidably connected to the rack of the first belt conveying assembly in a horizontal direction, and a plurality of spaced rollers are arranged on the lifting synchronizer, a plurality of oblique sliding grooves corresponding to the rollers are arranged on the lifting member in a one-to-one sliding fit mode, and the lifting driver is connected to the lifting synchronizer and is used for driving the lifting synchronizer to slide horizontally.

5. The LED product rework apparatus of claim 4, wherein The product receiving mechanism is provided with a first product stopping mechanism, the first product stopping mechanism is arranged between the two first belt conveying assemblies and is used for stopping the LED product to prevent the LED product from continuing to be conveyed backward.

6. The LED product rework apparatus of claim 3, wherein The product output device comprises a product output mechanism and a product testing mechanism, the product output mechanism comprises two second belt conveying modules which are spaced apart and oppositely arranged, and are respectively used for carrying two opposite edges of the LED product, the product testing mechanism is arranged between the two second belt conveying modules and comprises a lifting driver and a lifting platform, and an upper surface of the lifting platform is provided with testing terminals which are used for being connected with connecting terminals on the LED product and supplying power to the LED product.

7. The LED product rework apparatus of claim 6, wherein The product output device further comprises a visual identification mechanism, the visual identification mechanism comprises a visual identification module which is arranged above the product output mechanism, the visual identification module can acquire an image of the LED product on the product output mechanism and identify whether there is a non-illuminated chip in the LED product through image recognition, and the visual identification module is electrically connected with the control system.

8. The LED product rework apparatus of claim 1, wherein, The chip supply device comprises a wafer switching platform, a wafer lifting mechanism and a wafer position adjusting mechanism, the wafer switching platform comprises a rotating disc and a plurality of annular wafers which are connected to a periphery of the rotating disc, the annular wafers are used for supporting a film piece on which chips are arranged densely, the wafer lifting mechanism is arranged on one side of the rotating disc, each of the annular wafers can be moved to above the wafer lifting mechanism under the driving of the rotating disc, the wafer lifting mechanism comprises a lifting pin and a lifting driving module, the lifting driving module is connected to the lifting pin and is used for driving the lifting pin to lift, and the lifting pin can lift the chip on the film piece when the lifting pin is lifted, and the wafer position adjusting mechanism is connected to the wafer switching platform and is used for changing the positions of the annular wafers, so that each chip on the annular wafer above the wafer lifting mechanism can be moved to above the lifting pin.

9. The LED product rework apparatus of claim 8, wherein, The top crystal mechanism further comprises a top rod assembly arranged in a vertical telescopic manner, the top pin is connected to the top of the top rod assembly, the top lifting driving module comprises a motor and a cam connected to the output shaft of the motor, and the lower end of the top rod assembly abuts against the cam.

10. The LED product rework apparatus according to any one of claims 1 to 9, characterized in that, Further comprising a chip angle detection device, the chip angle detection device is arranged between the product carrying moving device and the chip supply device, the chip angle detection device comprises a chip angle detection camera, the shooting direction of the chip angle detection camera is upward, the crystal taking mechanism can be driven by the first moving mechanism to move to a waiting die bonding position above the chip angle detection device, and the chip angle detection camera is used for detecting the angle posture of the picked chip when the crystal taking mechanism is located at the waiting die bonding position.

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