Small temperature control welding furnace for COB (Chip On Board) lamp strip substrate die bonding

Abstract

The utility model discloses a COB lamp strip substrate die bonding small temperature control welding furnace, which comprises a rack, a detector, a baking mechanism, a feeding track and a driving mechanism, the rack is provided with a baking table, the baking mechanism and the baking table are matched to form a baking channel, the feeding track extends downwards from one side of the input end of the baking channel, and the driving mechanism is arranged on the feeding track. The substrate is driven by the driving mechanism to move towards the baking channel along the feeding track, the detector is arranged at the lower end of the feeding track and used for detecting whether the substrate moves along the feeding track or not, and the driving mechanism is controlled to be closed when the detector detects that the substrate does not move along the feeding track. The feeding track is arranged on one side of the baking channel, the detector is arranged at the lower end of the feeding track, the driving mechanism is arranged on one side of the baking channel, and the driving mechanism is controlled to be closed when the detector detects that the substrate does not move along the feeding track, so that the driving mechanism can be closed in time when the core pasting equipment breaks down and stops running; no cache configuration is needed, the COB assembly line is simplified, the occupied area is reduced, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of die bonding welding furnace equipment, especially to COB lamp strip substrate die bonding small temperature control welding furnace. BACKGROUND

[0002] The die bonding welding furnace is a kind of equipment that chip is welded on lamp strip substrate, and the die bonding welding furnace is arranged behind the die bonding equipment, and the die bonding welding furnace and the die bonding equipment are configured with buffer equipment, and the buffer equipment is used to buffer the die-bonded substrate output by the die bonding equipment, and the buffer equipment is configured between the die bonding welding furnace and the die bonding equipment, which can effectively avoid the damage caused by the die-bonded substrate not entering the die bonding welding furnace in time when the die bonding equipment fails to stop and the die bonding welding furnace fails to stop in time. SUMMARY

[0003] The utility model discloses a COB lamp strip substrate die bonding small temperature control welding furnace, which solves the problem that the existing COB flow line is long and occupies a large area by configuring buffer equipment between the die bonding welding furnace and the die bonding equipment to avoid damage caused by the substrate entering the die bonding welding furnace when the die bonding equipment fails to stop.

[0004] The utility model is realized through the following technical schemes:

[0005] The COB lamp strip substrate die bonding small temperature control welding furnace comprises a rack, a detector, a baking mechanism, a feeding track and a driving mechanism, the rack is provided with a baking table, the baking mechanism cooperates with the baking table to form a baking channel, the feeding track extends downward from one side of the input end of the baking channel, the substrate is driven by the driving mechanism to move along the feeding track towards the baking channel, the detector is arranged at the lower end of the feeding track and is used to detect whether the substrate moves along the feeding track, and the driving mechanism is controlled to be closed when the detector detects that the substrate does not move along the feeding track.

[0006] Further, the baking mechanism can move close to or away from the baking table, and the baking mechanism is controlled to move away from the baking table when the detector detects that the substrate does not move along the feeding track.

[0007] Further, the baking mechanism comprises two baking mechanisms, and the two baking mechanisms are opposite to each other on the baking table, and the baking table is provided with a baking hole communicating the two baking channels.

[0008] Further, the extension direction of the baking channel is defined as the front-back direction, a plurality of supporting rods are arranged in the baking hole, the plurality of supporting rods extend forward and backward and are arranged alternately left and right, or the plurality of supporting rods extend left and right and are arranged alternately forward and backward.

[0009] Further, the baking mechanism has a baking frame and a heating element, the baking frame forms the baking channel with the baking table and can move close to or away from the baking table, and the heating element is arranged on the baking frame and located in the baking channel.

[0010] Further, the heating element has an inner heating element and an outer heating element, the baking frame has a receiving cavity and a communication hole, the receiving cavity communicates with the baking channel through the communication hole, the inner heating element is arranged in the receiving cavity, and the outer heating element is arranged outside the receiving cavity and between the inner heating element and the baking table.

[0011] Further, the baking mechanism further has a baking fan arranged on the baking frame for driving the gas flow in the baking channel.

[0012] Further, the baking table is provided with a lifting mechanism for driving the baking mechanism to move, the lifting mechanism has a support frame and a lifting cylinder, the support frame is arranged on the baking table, and the lifting cylinder is arranged on the support frame and connected with the baking mechanism at the output end.

[0013] Further, the baking table has a driving and moving hole, the driving and moving mechanism has two driving and moving rollers, the two driving and moving rollers are arranged on the upper and lower sides of the driving and moving hole and cooperate to drive the substrate, and at least one of the driving and moving rollers can rotate relative to the baking table in the vertical plane.

[0014] Further, the rack further has an outer shell, the baking table is arranged in the outer shell, and the outer shell has a heat preservation layer.

[0015] The technical scheme has the advantages that the feeding track extending upward and downward is arranged on one side of the input end of the baking channel, the detector for detecting whether the substrate moves along the feeding track is arranged at the lower end of the feeding track, the driving and moving mechanism for driving the substrate to move along the feeding track towards the baking channel is arranged on one side of the baking channel, the driving and moving mechanism is controlled to be closed when the detector detects that the substrate does not move along the feeding track, the driving and moving mechanism can be timely stopped when the core pasting device fails to operate, and the un-pasted substrate can be prevented from entering the baking channel to cause damage, so that the buffer setting between the core pasting device and the COB lamp strip substrate die bonding small temperature control furnace is not needed, the COB assembly line is simplified, the floor area is reduced, and the cost is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced.

[0018] Figure 1 is a perspective view of the COB lamp strip substrate die bonding small temperature control soldering furnace disclosed in the embodiment Figure 1 ;

[0019] Figure 2 is a perspective view of the COB lamp strip substrate die bonding small temperature control soldering furnace disclosed in the embodiment Figure 2 (hide the shell);

[0020] Figure 3 is Figure 2 the partial enlarged view of A in the figure;

[0021] Figure 4 is a sectional view of the COB lamp strip substrate die bonding small temperature control soldering furnace disclosed in the embodiment (hide the shell);

[0022] Figure 5 is Figure 4 the partial enlarged view of B in the figure;

[0023] Figure 6 is Figure 4 the partial enlarged view of C in the figure;

[0024] Figure 7 is a schematic view of the COB lamp strip substrate die bonding small temperature control soldering furnace in the embodiment when used with the core pasting equipment (the core pasting equipment is normally running, and the position state of the COB lamp strip substrate);

[0025] Figure 8 is a schematic view of the COB lamp strip substrate die bonding small temperature control soldering furnace in the embodiment when used with the core pasting equipment (the core pasting equipment is normally running, and the position state of the COB lamp strip substrate); DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0027] Embodiment: as Figures 1-6As shown, the COB LED strip substrate die bonding miniature temperature-controlled soldering furnace includes a frame 1, a detector 2, a baking mechanism 3, a loading track 4, a driving mechanism 5, and a controller (not shown in the figure). The frame 1 has a baking table 101. The baking mechanism 3 is mounted on the baking table 101 and cooperates with the baking table 101 to form a baking channel 6. The loading track 4 extends downward from the input end of the baking channel 6. The driving mechanism 5 is located on one side of the baking channel 6 and is controlled by the controller. The substrate is driven by the driving mechanism 5 to move along the loading track 4 towards the baking channel 6. The detector 2 is located at the lower end of the loading track 4 to detect whether the substrate is moving along the loading track 4. The detector 2 is electrically connected to the controller. The driving mechanism 5 is controlled to shut down when the detector 2 detects that the substrate is not moving along the loading track 4. The detector 2 is an existing sensor, and the controller is an existing control circuit board.

[0028] like Figure 7 As shown, when the bonding equipment 100 is operating normally, the substrate 200 is bonded to the feeding track 4 and moves along the feeding track 4 toward the baking channel 6. At this time, the detector 2 detects the substrate 200 and determines that the substrate 200 is moving along the feeding track 4.

[0029] like Figure 8 As shown, when the bonding equipment 100 malfunctions and stops operating, the bonding equipment 100 stops feeding while the drive mechanism 5 continues to feed, causing the substrate 200 to lift up and leave the feeding track 4. At this time, the detector 2 fails to detect the substrate 200 and determines that the substrate 200 has not moved along the feeding track 4.

[0030] When this COB LED strip substrate die bonding miniature temperature-controlled soldering furnace is used in a COB production line, it is located after the bonding equipment 100. When the bonding equipment 100 malfunctions and stops operating, the substrate 200 is lifted and removed from the feeding track 4. The detector 2 detects that the substrate 200 has not moved along the feeding track 4, and the drive mechanism 5 is shut down in a controlled manner to prevent the unbonded substrate from entering the baking channel 6 and causing damage. Since the drive mechanism 5 is shut down in a controlled manner when the bonding equipment 100 malfunctions and stops operating, there is no need to configure a buffer between the bonding equipment 100 and the COB LED strip substrate die bonding miniature temperature-controlled soldering furnace, simplifying the COB production line, reducing the floor space, and effectively reducing costs.

[0031] In conclusion, the embodiment provides a COB lamp strip substrate die bonding small temperature control welding furnace to solve the problem that the existing COB pipeline avoids the substrate from entering the die bonding welding furnace to cause damage when the chip mounting device fails to stop, which makes the COB pipeline long and occupies a large area. The problem is mainly solved by configuring an upper feeding track 4 extending upward and downward on one side of the input end of the baking channel 6, configuring a detector 2 at the lower end of the feeding track 4 to detect whether the substrate 200 moves along the feeding track 4, and configuring a driving and moving mechanism 5 on one side of the baking channel 6 to drive the substrate to move along the feeding track 4 towards the baking channel 6. The driving and moving mechanism 5 is controlled to be closed when the detector 2 detects that the substrate does not move along the feeding track 4, so that the driving and moving mechanism 5 can be turned off in time when the chip mounting device 100 fails to stop running, thereby avoiding the un-chip-mounted substrate from entering the baking channel 6 to cause damage. Therefore, it is not necessary to configure a buffer device between the chip mounting device 100 and the COB lamp strip substrate die bonding small temperature control welding furnace, which simplifies the COB pipeline, reduces the occupied area, and effectively reduces the cost.

[0032] In the embodiment of the utility model, the upper feeding track 4 is inclined from top to bottom towards the direction away from the baking table 101. The above-mentioned setting is configured to be inclined from top to bottom towards the direction away from the baking table 101, so that the substrate is well combined with the feeding track 4 and has good conveying effect when moving along the feeding track 4.

[0033] In the embodiment of the utility model, the baking mechanism 3 is controlled by the controller, the baking mechanism 3 can move close to or away from the baking table 101, and the baking mechanism 3 is controlled to move away from the baking table 101 when the detector 2 detects that the substrate does not move along the feeding track 4. The baking table 101 holds the substrate when the substrate enters the baking channel 6. The above-mentioned setting is configured to move away from the baking table 101 when the detector 2 detects that the substrate does not move along the feeding track 4, so as to avoid the substrate remaining in the baking channel 6 from being over-welded when the chip mounting device 100 fails and the driving and moving mechanism 5 stops pulling.

[0034] In the embodiment of the utility model, the baking mechanism 3 is two, the two baking mechanisms 3 are opposite to each other on the baking table 101, the baking table 101 has a baking hole 102 communicating two baking channels 6, among the two baking mechanisms 3, one baking mechanism 3 is defined as an upper baking mechanism 301, and the other baking mechanism 3 is defined as a lower baking mechanism 302, the baking channel 6 formed by the upper baking mechanism 301 and the baking table 101 is defined as an upper baking channel 601, the baking channel 6 formed by the lower baking mechanism 302 and the baking table 101 is defined as a lower baking channel 602, and the upper baking channel 601 is for the substrate to pass through. The above-mentioned setting is configured to be two, the two baking mechanisms 3 are opposite to each other on the baking table 101 to form the baking channel 6 communicating through the baking hole 102, so that the COB lamp strip substrate die bonding small temperature control welding furnace has good welding effect.

[0035] In the embodiment of the utility model, the extension direction of the baking channel 6 is defined as the front-back direction, a plurality of supporting rods 103 are arranged in the baking hole 102, the plurality of supporting rods 103 extend front-back and left-right alternately, or the plurality of supporting rods 103 extend left-right and front-back alternately. The above-mentioned setting is configured by arranging a plurality of supporting rods 103 in the baking hole 102, so that the substrate obtains good support in the baking channel 6 and is not easy to collapse.

[0036] In the embodiment of the utility model, the baking mechanism 3 has a baking frame 303 and a heating element 304, the baking frame 303 cooperates with the baking table 101 to form the baking channel 6 and can move close to or away from the baking table 101, the heating element 304 is arranged on the baking frame 303 and located in the baking channel 6, and the heating element 304 is an electric heating element. The above-mentioned setting is configured by arranging the baking mechanism 3 into the baking frame 303 which cooperates with the baking table 101 to form the baking channel 6 and can move close to or away from the baking table 101, and the heating element 304 arranged on the baking frame 303, so that the substrate can realize welding in the baking channel 6.

[0037] In the embodiment of the utility model, the heating element 304 has an inner heating element 305 and an outer heating element 306, the baking frame 303 has a containing cavity 307 and a communication hole (not marked in the figure), the containing cavity 307 is communicated with the baking channel 6 through the communication hole, the inner heating element 305 is contained in the containing cavity 307, and the outer heating element 306 is arranged outside the containing cavity 307 and located between the inner heating element 305 and the baking table 101. The above-mentioned setting is configured by arranging the heating element 304 into the inner heating element 305 contained in the containing cavity 307 and the outer heating element 306 arranged outside the containing cavity 307 and located between the inner heating element 305 and the baking table 101, so that the COB lamp strip substrate die bonding small temperature control welding furnace has good welding effect.

[0038] In the embodiment of the utility model, the baking mechanism 3 further has a baking fan 309, the baking fan 309 is arranged on the baking frame 303 and used for driving the gas flow in the baking channel 6. The above-mentioned setting is configured by arranging the baking fan 309 on the baking frame 303 to drive the gas flow in the baking channel 6, so that the temperature in the baking channel 6 is uniform and the welding effect is good.

[0039] In the embodiment of the utility model, the baking table 101 is equipped with the lifting mechanism 7 that drives the baking mechanism 3 to move up and down, the lifting mechanism 7 has the support frame 701 and the lifting cylinder 702, the support frame 701 is equipped on the baking table 101, the lifting cylinder 702 is equipped on the support frame 701 and the output end is connected with the baking mechanism 3. The above-mentioned setting is through the lifting mechanism 7 that drives the baking mechanism 3 to move up and down on the baking table 101, and the lifting mechanism 7 is configured to be equipped on the support frame 701 on the baking table 101 and the lifting cylinder 702 that is equipped on the support frame 701 and connected with the baking mechanism 3, the baking mechanism 3 can move close to or away from the baking table 101, and the driving structure is simple, convenient to implement.

[0040] More preferably, the lifting mechanism 7 is 2, and the two lifting mechanisms 7 are oppositely arranged in the length direction of the baking rack 303.

[0041] In the embodiment of the utility model, the baking table 101 has the drive displacement hole 104, the drive displacement mechanism 5 has two drive displacement rollers 501, and the two drive displacement rollers 501 are separately arranged on the upper and lower sides of the drive displacement hole 104 and cooperate with the driving base plate, and at least one drive displacement roller 501 can rotate on the vertical plane relative to the baking table 101. The above-mentioned setting is through the drive displacement mechanism 5 that is configured as two drive displacement rollers 501 that are separately arranged on the upper and lower sides of the drive displacement hole 104, and one drive displacement roller 501 can rotate on the vertical plane relative to the baking table 101 and cooperate with the other drive displacement roller 501 to drive the base plate, so that the base plate can move along the feeding track 4 towards the baking channel 6, and the drive displacement structure is simple and convenient to implement.

[0042] In the embodiment of the utility model, the rack 1 further has the shell 105, the baking table 101 is accommodated in the shell 105, the shell 105 has the exposed hole (not marked in the drawing), one end of the feeding track 4 is connected on the baking table 101 and the other end extends out of the shell 105 from the exposed hole, and the shell 105 has the heat preservation layer (not marked in the drawing). The above-mentioned setting is through the rack 1 that is configured to have the shell 105, the baking table 101 is accommodated in the shell 105, and the shell 105 has the heat preservation layer, so that the COB lamp strip substrate die bonding small temperature control welding furnace has good heat insulation effect, can be configured in the same space with the core lamination device 100, does not need to separately configure the room for placing the COB lamp strip substrate die bonding small temperature control welding furnace, simplifies the COB production line and saves the cost.

[0043] In the embodiment of the utility model, the baking channel 6 has a feeding port 603 for moving the substrate in, the feeding port 603 is equal in width with the feeding track 4 and the width is less than 20 cm. The above setting is through the feeding port 603 is configured to be equal in width with the feeding track 4 and the width is less than 20 cm, the feeding port 603 is adapted to the existing COB lamp strip substrate, at the same time, the volume and operating power of the COB lamp strip substrate die bonding small temperature control welding furnace are effectively reduced, the COB lamp strip substrate die bonding small temperature control welding furnace can be used for city power, the existing die bonder feeding port diameter is 50-60 cm, the volume is large, the energy consumption is large, the 380v high voltage electricity needs to be connected for use, and the independent space configured with high voltage electricity and thermal insulation layer is needed to be placed, the COB production line is simplified, and the cost is saved.

[0044] It should be understood that the utility model uses the terms "first", "second" and the like to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, the "first" information can also be referred to as "second" information without departing from the scope of the utility model, and similarly, the "second" information can also be referred to as "first" information. In addition, the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only used to facilitate the description of the utility model and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0045] As described above, one or more embodiments are provided in conjunction with specific content, and it is not intended that the specific implementation of the utility model is limited to these descriptions. Any approximation, similarity or replacement of the method and structure of the utility model, or any technical deduction or substitution under the concept of the utility model, should be considered as the protection of the utility model.

Claims

1. A small temperature-controlled die bonding furnace for COB LED strip substrates, characterized in that, The device includes a frame, a detector, a baking mechanism, a feeding track, and a driving mechanism. The frame has a baking table, and the baking mechanism cooperates with the baking table to form a baking channel. The feeding track extends downward from the input end of the baking channel. The substrate is driven by the driving mechanism to move along the feeding track toward the baking channel. The detector is located at the lower end of the feeding track to detect whether the substrate is moving along the feeding track. The driving mechanism is controlled to close when the detector detects that the substrate is not moving along the feeding track.

2. The COB LED strip substrate die bonding miniature temperature-controlled soldering furnace according to claim 1, characterized in that, The baking mechanism can move closer to or further away from the baking table, and when the detector detects that the substrate has not moved along the feeding track, the baking mechanism is controlled to move in a direction away from the baking table.

3. The COB LED strip substrate die bonding miniature temperature-controlled soldering furnace according to claim 1 or 2, characterized in that, There are two baking mechanisms, which are positioned opposite each other on the baking table. The baking table has baking holes that connect the two baking channels.

4. The small temperature-controlled die bonding furnace for COB LED strip substrates according to claim 3, characterized in that, The extension direction of the baking channel is defined as the front-to-back direction. The baking hole is provided with a number of support rods, which extend front-to-back and alternate left-to-right; or the support rods extend left-to-right and alternate front-to-back.

5. The small temperature-controlled die bonding furnace for COB LED strip substrates according to claim 1, characterized in that, The baking mechanism has a baking rack and a heating element. The baking rack cooperates with the baking table to form the baking channel and can move closer to or away from the baking table. The heating element is disposed on the baking rack and located in the baking channel.

6. The small temperature-controlled die bonding furnace for COB LED strip substrates according to claim 5, characterized in that, The heating element has an internal heating element and an external heating element. The baking rack has a receiving cavity and a communicating hole. The receiving cavity is connected to the baking channel through the communicating hole. The internal heating element is housed in the receiving cavity. The external heating element is located outside the receiving cavity and between the internal heating element and the baking table.

7. The COB LED strip substrate die bonding miniature temperature-controlled soldering furnace according to claim 5, characterized in that, The baking mechanism also includes a baking fan, which is mounted on the baking rack to drive the gas flow within the baking channel.

8. The small temperature-controlled die bonding furnace for COB LED strip substrates according to claim 1, characterized in that, The baking platform is equipped with a lifting mechanism that drives the baking mechanism to move. The lifting mechanism has a support frame and a lifting cylinder. The support frame is mounted on the baking platform, and the lifting cylinder is mounted on the support frame and its output end is connected to the baking mechanism.

9. The small temperature-controlled die bonding furnace for COB LED strip substrates according to claim 1, characterized in that, The baking table has a driving hole, and the driving mechanism has two driving rollers. The two driving rollers are respectively arranged on the upper and lower sides of the driving hole to cooperate with the driving base plate. At least one of the driving rollers can rotate relative to the baking table in the vertical plane.

10. The small temperature-controlled die bonding furnace for COB LED strip substrates according to claim 1, characterized in that, The frame also has an outer shell, the baking table is housed within the outer shell, and the outer shell has an insulation layer.

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