Device for improving wet etching uniformity

Abstract

The utility model relates to the technical field of wet etching, and discloses a device for improving the uniformity of wet etching, which is characterized in that a convex block is propped against a semicircular block after rotating for a certain distance, so that the semicircular block pushes an L-shaped linkage plate through a sliding strip, and when the L-shaped linkage plate is pushed, a spring is stretched, so that the uniformity of wet etching is improved. A through hole formed in the surface of the L-shaped linkage plate can be aligned with the spraying nozzle, so that liquid medicine in the connecting pipe is sprayed out through the spraying nozzle, when the protruding blocks do not abut against the semicircular block after rotating by a certain distance, the compressed spring can pull the L-shaped linkage plate to reset, the spraying nozzle is sealed again, and the liquid medicine is sprayed out through the spraying nozzle along with alternate abutting of the four sets of protruding blocks. The spraying nozzle is arranged on the tray, so that the spraying nozzle only sprays the part, where a wafer is fixed, in the tray intermittently, great waste caused by the fact that liquid medicine is sprayed all the time is avoided, when the tray rotates at a high speed, the liquid medicine in the tray can be fully mixed under the action of centrifugal force, and the corrosion uniformity of the liquid medicine is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of wet etching, in particular to a device for improving the uniformity of wet etching. BACKGROUND

[0002] With the continuous reduction of the feature size of integrated circuits, the cleanliness and flatness of the oxide film on the wafer surface are required to be higher and higher. For example, if the thickness of the oxide film on the wafer surface exceeds the limit, it will directly affect the quality of the subsequent process, thereby causing the performance of the integrated circuit chip to deteriorate and the product yield to decrease. Although the flatness of the oxide film can be controlled by changing the oxidation process conditions, the uniformity of the wafer film thickness still needs to be further improved after this process. Single-wafer wet etching has become a very important technology for improving the uniformity of the film thickness due to its advantages such as no cross-contamination and regional etching. However, with the continuous increase in the size of the wafer, it becomes more and more challenging to precisely control the single-wafer wet etching rate and the uniformity of the etching.

[0003] According to a device for improving the uniformity of wafer etching (publication number: CN205428885U), in the above-mentioned application, first of all, the wafer carrier does not have any protection device, and when it rotates, it will cause the chemical liquid in the carrier to splash out, so it cannot guarantee the stability of the chemical liquid, and the instability of the concentration and content of the chemical liquid cannot improve the uniformity of wet etching, and the chemical liquid is still being sprayed, and the rotation of the carrier will cause the chemical liquid to be thrown out, causing great waste. SUMMARY

[0004] The utility model aims at providing a device for improving the uniformity of wet etching to solve the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a device for improving the uniformity of wet etching, comprising a base, the top surface of the base is fixedly connected with a fixed arm, a control part for stabilizing the wet etching of the wafer is arranged above the base, and the control part comprises:

[0006] A connecting pipe is fixedly connected to the top surface of the fixed arm, an inlet pipe is fixedly connected to the top surface of the connecting pipe, a motor is fixedly connected to the inner wall of the base, a rotating shaft is rotatably connected to the inside of the base, the bottom surface of the rotating shaft is fixedly connected with the output shaft of the motor, a tray is fixedly connected to the top surface of the rotating shaft, a supporting rod is fixedly connected to the surface of the tray, the motor is started, the output shaft of the motor drives the rotating shaft to rotate, the rotating shaft drives the tray to rotate, the supporting rod fixedly connected to the top surface of the tray drives the protruding block to rotate, the top surface of the supporting rod is rotatably connected with the bottom surface of the connecting pipe, the surface of the supporting rod is fixedly connected with a protruding block, and the top surface of the tray is provided with a liquid level sensor.

[0007] Preferably, the inner side of the connecting pipe is fixedly connected with a clamping strip, and the inner wall of the connecting pipe is penetrated by a L-shaped linkage plate and is connected with the L-shaped linkage plate through a piston.

[0008] Preferably, the surface of the L-shaped linkage plate is provided with a through hole, and a spring is fixedly connected between the L-shaped linkage plate and the inner wall of the connecting pipe; after the protruding block rotates by a certain distance, the protruding block will abut against the semicircular block, so that the semicircular block pushes the L-shaped linkage plate through the sliding strip; when the L-shaped linkage plate is pushed, the spring will be stretched.

[0009] Preferably, the bottom surface of the L-shaped linkage plate is fixedly connected with a sliding strip, and the sliding strip penetrates through the connecting pipe and is connected with the connecting pipe through sliding.

[0010] Preferably, the top surface of the base is fixedly connected with a shaft rod, the shaft rod penetrates through and is connected with a protective cover through a hinge, and the inner side of the protective cover is provided with a roller; when the tray rotates, the protective cover can ensure that the liquid medicine in the tray will not splash under the influence of centrifugal force.

[0011] Preferably, the bottom surface of the sliding strip is fixedly connected with a semicircular block, and the bottom surface of the connecting pipe is penetrated by and fixedly connected with a spraying nozzle; when the protruding block rotates by a certain distance and no longer abuts against the semicircular block, the compressed spring will pull the L-shaped linkage plate to reset, and the spraying nozzle is sealed again.

[0012] Preferably, the number of the protruding blocks is four groups; the four groups of protruding blocks are arranged in a rotation manner, so that the spraying nozzle intermittently sprays only part of the fixed wafers in the tray, liquid medicine is not sprayed all the time to avoid great waste, and the four groups of protruding blocks are symmetrically arranged about the center line of the supporting rod as the axis of symmetry, and the initial positions of the semicircular blocks are located between two groups of the protruding blocks.

[0013] Compared with the prior art, the device for improving the uniformity of wet etching has the following beneficial effects:

[0014] 1. The device for improving the uniformity of wet etching; after the protruding block rotates by a certain distance, the protruding block will abut against the semicircular block, so that the semicircular block pushes the L-shaped linkage plate through the sliding strip; when the L-shaped linkage plate is pushed, the spring will be stretched, and the through hole formed in the surface of the L-shaped linkage plate will be aligned with the spraying nozzle, so that the liquid medicine in the connecting pipe is sprayed out through the spraying nozzle; when the protruding block rotates by a certain distance and no longer abuts against the semicircular block, the compressed spring will pull the L-shaped linkage plate to reset, and the spraying nozzle is sealed again; the four groups of protruding blocks are arranged in a rotation manner, so that the spraying nozzle intermittently sprays only part of the fixed wafers in the tray, liquid medicine is not sprayed all the time to avoid great waste, and when the tray rotates at a high speed, the liquid medicine in the tray is subjected to the action of centrifugal force, the liquid medicine can be fully mixed, and the uniformity of etching of the liquid medicine is improved.

[0015] 2、 The device for improving the uniformity of wet etching, when the tray rotates, the protective cover can not only ensure that the liquid medicine in the tray will not splash under the influence of centrifugal force. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a front view structural schematic diagram of the utility model;

[0017] Figure 2 It is a protective cover expanded structural schematic diagram of the utility model;

[0018] Figure 3 It is a base sectional view structural schematic diagram of the utility model;

[0019] Figure 4 It is a connecting pipe sectional view structural schematic diagram of the utility model;

[0020] Figure 5 It is a connecting pipe sectional view expanded structural schematic diagram of the utility model.

[0021] In the drawing: 1, base; 2, control part; 21, connecting pipe; 22, liquid inlet pipe; 23, motor; 24, rotating shaft; 25, tray; 26, supporting rod; 27, protruding block; 28, clamping strip; 29, L-shaped linkage plate; 210, spring; 211, through hole; 212, sliding strip; 213, semicircular block; 214, spraying nozzle; 215, liquid level sensor; 216, shaft rod; 217, protective cover; 218, roller; 3, fixed arm. DETAILED DESCRIPTION

[0022] As Figures 1-5 shown, the utility model provides a technical scheme: a device for improving the uniformity of wet etching, including base 1, the top surface fixed connection of base 1 has fixed arm 3, the top of base 1 is provided with the control part 2 for the stable wet etching of wafer, and the control part 2 includes: connecting pipe 21, liquid inlet pipe 22, motor 23, rotating shaft 24, tray 25, supporting rod 26, protruding block 27, clamping strip 28, L-shaped linkage plate 29, spring 210, through hole 211, sliding strip 212, semicircular block 213, spraying nozzle 214, liquid level sensor 215, shaft rod 216, protective cover 217, roller 218.

[0023] The bottom surface of the connecting pipe 21 is fixedly connected with the top surface of the fixing arm 3, the top surface of the connecting pipe 21 penetrates and is fixedly connected with the liquid inlet pipe 22, the inner wall of the base 1 is fixedly connected with the motor 23, the inside of the base 1 penetrates and is rotationally connected with the rotating shaft 24, the bottom surface of the rotating shaft 24 is fixedly connected with the output shaft of the motor 23, the top surface of the rotating shaft 24 is fixedly connected with the tray 25, the surface of the tray 25 is fixedly connected with the supporting rod 26, the motor 23 is started, the output shaft of the motor 23 drives the rotating shaft 24 to rotate, so that the rotating shaft 24 drives the tray 25 to rotate, and the supporting rod 26 fixedly connected with the top surface of the tray 25 drives the protruding block 27 to rotate together, the top surface of the supporting rod 26 is rotationally connected with the bottom surface of the connecting pipe 21, the surface of the supporting rod 26 is fixedly connected with the protruding block 27, and the top surface of the tray 25 is provided with the liquid level sensor 215. The inner side of the connecting pipe 21 is fixedly connected with the clamping strip 28, and the inner wall of the connecting pipe 21 penetrates and is pistonically connected with the L-shaped linkage plate 29. The surface of the L-shaped linkage plate 29 is provided with the through hole 211, the spring 210 is fixedly connected between the L-shaped linkage plate 29 and the inner wall of the connecting pipe 21, and after the protruding block 27 rotates by a certain distance, the semicircular block 213 is abutted, so that the semicircular block 213 pushes the L-shaped linkage plate 29 through the sliding strip 212, and the L-shaped linkage plate 29 is stretched when being pushed. The bottom surface of the L-shaped linkage plate 29 is fixedly connected with the sliding strip 212, and the sliding strip 212 penetrates and is slidingly connected with the connecting pipe 21. The top surface of the base 1 is fixedly connected with the shaft rod 216, the shaft rod 216 penetrates and is hingedly connected with the protective cover 217, the inner side of the protective cover 217 is provided with the roller 218, and when the tray 25 rotates, the protective cover 217 can ensure that the liquid medicine in the tray 25 is not splashed under the influence of centrifugal force, the roller 218 in the inner side of the protective cover 217 can enable the protective cover 217 and the tray 25 to stably rotate, and the protective cover 217 can be prevented from being stuck.

[0024] The bottom surface of the sliding strip 212 is fixedly connected with the semicircular block 213, the bottom surface of the connecting pipe 21 penetrates and is fixedly connected with the spraying nozzle 214, the L-shaped linkage plate 29 is stretched when being pushed, the through hole 211 provided on the surface of the L-shaped linkage plate 29 is aligned with the spraying nozzle 214, the liquid medicine in the connecting pipe 21 is sprayed out through the spraying nozzle 214, when the protruding block 27 rotates by a certain distance and no longer abuts against the semicircular block 213, the compressed spring 210 pulls the L-shaped linkage plate 29 to reset, and the spraying nozzle 214 is sealed again. The number of the protruding blocks 27 is four groups, the spraying nozzle 214 is intermittently sprayed only on the part of the fixed wafer in the tray 25 through the rotation of the four groups of protruding blocks 27 in turn, great waste caused by the liquid medicine being sprayed all the time is avoided, and the four groups of protruding blocks 27 are symmetrically arranged with the center line of the supporting rod 26 as the axis of symmetry, and the initial positions of the semicircular blocks 213 are located between two groups of protruding blocks 27.

[0025] Based on the above embodiment, when the oxide film or plating film layer on the wafer surface is removed by etching, first, the protective cover 217 is opened, the wafer is placed in the partition in the tray 25, then the chemical liquid cooperating with the etching solution is poured into the tray 25, then the protective cover 217 is closed, so that the protective cover 217 seals the tray 25, at the same time, the inner rollers 218 of the protective cover 217 are in close contact with the edges of the tray 25, then the chemical liquid cooperating with the etching solution is poured into the connecting pipe 21 through the liquid inlet pipe 22, but the initial position of the L-shaped linkage plate 29 blocks the spray nozzle 214, then the motor 23 is started, the output shaft of the motor 23 drives the rotating shaft 24 to rotate, so that the rotating shaft 24 drives the tray 25 to rotate, the fixed connecting rod 26 on the top surface of the tray 25 drives the protruding block 27 to rotate together, after the protruding block 27 rotates a certain distance, it touches the semicircular block 213, so that the semicircular block 213 pushes the L-shaped linkage plate 29 through the sliding strip 212, when the L-shaped linkage plate 29 is pushed, the spring 210 is stretched, and the through hole 211 opened on the surface of the L-shaped linkage plate 29 is aligned with the spray nozzle 214, so that the liquid in the connecting pipe 21 is sprayed out through the spray nozzle 214, when the protruding block 27 rotates a certain distance and no longer touches the semicircular block 213, the compressed spring 210 pulls the L-shaped linkage plate 29 to reset, and the spray nozzle 214 is sealed again, with the rotation of the four groups of protruding blocks 27 in turn, the spray nozzle 214 intermittently sprays only the part of the tray 25 where the wafer is fixed, avoiding the waste caused by the liquid spraying all the time, and when the tray 25 rotates at high speed, the liquid inside is mixed sufficiently under the action of centrifugal force, so that the uniformity of the etching of the liquid is improved.

[0026] And when the tray 25 rotates, the protective cover 217 not only can ensure that the liquid in the tray 25 will not splash under the influence of centrifugal force, but also the rollers 218 inside the protective cover 217 can make the protective cover 217 and the tray 25 rotate stably and avoid being stuck.

[0027] The above is a detailed description of the present application, but some modifications or improvements can be made on the basis of the present application, which is obvious to those skilled in the art. Therefore, without departing from the spirit and principles of the present application, the modifications or improvements are within the scope of the present application.

Claims

1. A device for improving the uniformity of wet etching comprising a base (1), characterised in that: The top surface of the base (1) is fixedly connected with a fixed arm (3), and the upper portion of the base (1) is provided with a control portion (2) for stabilizing wafer wet etching, the control portion (2) comprises: a connecting pipe (21), the bottom surface of the connecting pipe (21) is fixedly connected with the top surface of the fixed arm (3), the top surface of the connecting pipe (21) penetrates and is fixedly connected with a liquid inlet pipe (22), the inner wall of the base (1) is fixedly connected with a motor (23), the inside of the base (1) penetrates and is rotatably connected with a rotating shaft (24), the bottom surface of the rotating shaft (24) is fixedly connected with the output shaft of the motor (23), the top surface of the rotating shaft (24) is fixedly connected with a tray (25), the surface of the tray (25) is fixedly connected with a supporting rod (26), the top surface of the supporting rod (26) is rotatably connected with the bottom surface of the connecting pipe (21), the surface of the supporting rod (26) is fixedly connected with a protruding block (27), and the top surface of the tray (25) is provided with a liquid level sensor (215).

2. The device for improving the uniformity of wet etching according to claim 1, characterized in that: The inner side of the connecting pipe (21) is fixedly connected with a clamping strip (28), and the inner wall of the connecting pipe (21) penetrates and is piston-connected with an L-shaped linkage plate (29).

3. The device for improving the uniformity of wet etching according to claim 2, characterized in that: The surface of the L-shaped linkage plate (29) is provided with a through hole (211), and the spring (210) is fixedly connected between the L-shaped linkage plate (29) and the inner wall of the connecting pipe (21).

4. The device for improving the uniformity of wet etching according to claim 2, characterized in that: The bottom surface of the L-shaped linkage plate (29) is fixedly connected with a sliding strip (212), and the sliding strip (212) penetrates and is slidingly connected with the connecting pipe (21).

5. The device for improving the uniformity of wet etching according to claim 1, wherein: The top surface of the base (1) is fixedly connected with a shaft rod (216), the shaft rod (216) penetrates and is hingedly connected with a protective cover (217), and the inner side of the protective cover (217) is provided with a roller (218).

6. The device for improving the uniformity of wet etching according to claim 4, characterized in that: The bottom surface of the sliding strip (212) is fixedly connected with a semicircular block (213), and the bottom surface of the connecting pipe (21) penetrates and is fixedly connected with a spray nozzle (214).

7. The device for improving the uniformity of wet etching according to claim 6, characterized in that: The number of the protruding blocks (27) is four groups, and the four groups of protruding blocks (27) are symmetrically arranged with the center line of the supporting rod (26) as the axis of symmetry, and the initial position of the semicircular block (213) is located between two groups of protruding blocks (27).

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