Anti-crystallization mechanism and etching device

Abstract

The utility model discloses an etching device and an anti-crystallization mechanism used for the etching device, the etching device comprises a first chamber and a second chamber, the second chamber is an etching chamber, a spacing board is arranged between the first chamber and the second chamber, a gate is arranged on the spacing board, and the first chamber and the second chamber are communicated with each other. The anti-crystallization mechanism comprises an installation support, at least one spraying assembly fixed to the installation support and used for spraying water mist to the gate position and a baffle, the installation support is arranged on the side, close to the second cavity, in the first cavity, the installation support is fixed to the partition plate and located above the gate, and the baffle is fixed to the installation support or the partition plate. The at least one spraying assembly is located between the partition plate and the baffle, the spraying assemblies are arranged in the first direction, and the first direction is parallel to the gate. According to the utility model, the humidity at the gate between the first chamber and the etching chamber is increased, so that the oxalic acid concentration is reduced, and oxalic acid crystals are prevented from being generated.

Description

TECHNICAL FIELD

[0001] The utility model relates to display panel processing equipment technical field, especially relate to a kind of anticrystallization mechanism and etching device. BACKGROUND

[0002] Wet etching is a common means in the manufacturing process of thin film transistor liquid crystal display (TFT-LCD), and it is necessary to etch several film layers in the array substrate manufacturing process. In the array substrate manufacturing process, ITO (indium tin oxide) is widely used in the manufacture of transparent electrodes, such as pixel electrodes or common electrodes / touch electrodes, etc. In the process of manufacturing ITO transparent electrodes, a whole layer of ITO film is first formed, then exposed to light, and then the required pattern is formed by wet etching. The etching solution is, for example, oxalic acid solution. Oxalic acid is prone to crystallization. To prevent the oxalic acid solution in the etching chamber from escaping into the dry section chamber and crystallizing, the gate between the dry section chamber and the etching chamber is in a constant closed state. When the glass substrate is transferred from the dry section chamber to the etching chamber, the gate is opened, and the acidic gas in the etching chamber inevitably escapes, and as the water in the acidic gas evaporates or the acidic gas cools, it will crystallize and gradually accumulate at the gate, forming crystals that can scratch the surface of the glass substrate during the transfer process, causing defects and resulting in product scrap. Therefore, it is necessary to regularly clean the oxalic acid crystals at the gate between the dry section chamber and the etching chamber.

[0003] Currently, the cleaning method is usually to manually flush the gate position at regular intervals to dissolve the oxalic acid crystals, but manual cleaning requires manpower, and the cleaning and downtime are long, increasing costs and wasting production capacity. On the other hand, different operating personnel may also affect the cleaning effect of oxalic acid crystals and cause residual oxalic acid crystals to scratch the surface of the glass substrate. SUMMARY

[0004] The utility model aims to provide a kind of anticrystallization mechanism and etching device, by increasing the humidity at the gate between the etching chamber and the adjacent chamber, to reduce the concentration of oxalic acid and avoid the formation of oxalic acid crystals.

[0005] In order to achieve the above object, the utility model provides a kind of anti-crystallization mechanism for etching device, the etching device includes first chamber and second chamber, the second chamber is etching chamber, and the first chamber and the second chamber have spacing plate between, gate is provided on the spacing plate, the anti-crystallization mechanism includes mounting bracket, at least one spray assembly and baffle, the mounting bracket is set in the first chamber and is close to the second chamber in one side, and the mounting bracket is fixed on the spacing plate and is located above the gate;At least one spray assembly is fixed on the mounting bracket;The baffle is fixed on the mounting bracket or the spacing plate, and at least one spray assembly is located between the spacing plate and the baffle;Wherein, each spray assembly is arranged along first direction, and the first direction is parallel to the gate, and at least one spray assembly is used to spray water mist to the gate position.

[0006] As an optional technical scheme, each spray assembly is two-fluid atomizing nozzle, the two-fluid atomizing nozzle has spray port, water inlet and air inlet, the anti-crystallization mechanism also includes connecting pipeline, the connecting pipeline includes water pipe and gas pipe, one end of the water pipe is connected with the water inlet, the other end is connected with water source, one end of the gas pipe is connected with the air inlet, the other end is connected with compressed air source, when at least one spray assembly operates, water provided by the water source and air provided by the compressed air source are contacted and mixed in the two-fluid atomizing nozzle after being contacted and mixed to form water mist from each spray port to the gate position.

[0007] As an optional technical scheme, the two-fluid atomizing nozzle also has water mist adjusting valve, and the water mist adjusting valve is used to adjust the flow of water mist sprayed from the spray port.

[0008] As an optional technical scheme, the anti-crystallization mechanism is provided with one mounting sheet corresponding to each spray assembly, and each spray assembly is fixed on the mounting bracket by the corresponding mounting sheet.

[0009] As an optional technical scheme, each mounting sheet includes connected first sheet and second sheet, the first sheet and the second sheet form a first angle, the first sheet is fixed on the mounting bracket, and the second sheet is fixed on the corresponding spray assembly.

[0010] As an optional technical scheme, the anti-crystallization mechanism includes a plurality of spaced spray assemblies, and the distance between adjacent spray assemblies is equal.

[0011] As an optional technical scheme, each spray assembly is inclined relative to the gate and forms a second angle with the plane where the gate is located.

[0012] As an optional technical scheme, the second angle is 30-60 °.

[0013] As an optional technical solution, the baffle is L-shaped and comprises a first baffle and a second baffle connected with each other, the first baffle is fixed to the partition plate or the mounting bracket and located above the at least one spraying assembly, and the second baffle is located on a side of the at least one spraying assembly away from the second chamber, so that a radiation area of water mist sprayed by the at least one spraying assembly is isolated from other areas in the first chamber.

[0014] The utility model discloses still provide a kind of etching device, include the anti-crystallization mechanism as above.

[0015] The anti-crystallization mechanism and etching device of the utility model, at least one spraying assembly included by anti-crystallization mechanism is arranged above the gate between first chamber and second chamber, humidity at gate is increased by spraying water mist to gate position, to reduce oxalic acid concentration, avoid generating oxalic acid crystallization, reduce manpower cost and improve machine efficiency, at the same time, avoid oxalic acid crystallization accumulation at gate and scratch the surface of conveyed glass substrate, improve product yield.

[0016] The utility model is described in detail below in combination with drawings and specific embodiments, but not as the limitation to the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is partial schematic view of etching device of the utility model;

[0018] Figure 2 It is schematic view of spraying assembly included by anti-crystallization mechanism of the utility model. DETAILED DESCRIPTION

[0019] To make further understanding to the purpose, structure, features and functions of the utility model, detailed description is as follows with example.

[0020] Please refer to Figures 1-2 , Figure 1 It is partial schematic view of etching device of the utility model; Figure 2 It is schematic view of spraying assembly included by anti-crystallization mechanism of the utility model. Figure 1As shown, the utility model provides a kind of anti-crystallization mechanism 200 for etching device 100, etching device 1 includes first chamber 110 and second chamber 120, second chamber 120 is etching chamber, etching chamber can be wet etching chamber, and the etching liquid used therein is for example the etching liquid containing oxalic acid.In an embodiment, first chamber 110 is dry section chamber or isolation chamber, and first chamber 110 and second chamber 120 have spacing plate 130 between, spacing plate 130 is provided with gate 131, anti-crystallization mechanism 200 includes at least one spray assembly 210, mounting bracket 220 and baffle 230, mounting bracket 220 is set to one side of first chamber 110 close to second chamber 120, and mounting bracket 220 is fixed on spacing plate 130 and located above gate 130;At least one spray assembly 210 is fixed on mounting bracket 220;Baffle 230 is fixed on mounting bracket 220 or spacing plate 130, such as Figure 1 As shown, in the embodiment, baffle 230 is fixed on spacing plate 130, in other embodiments, baffle 230 can also be fixed on mounting bracket 220.The at least one spray assembly 210 is located between spacing plate 130 and baffle 230.Each spray assembly 210 is arranged along the first direction (not shown, for example, the direction perpendicular to the paper surface), and the first direction is parallel to gate 131, and at least one spray assembly 210 is used to spray water mist to gate 131 to avoid forming crystallization at gate 131.

[0021] The anti-crystallization mechanism 200 of the utility model is arranged above gate 131, and water mist is sprayed towards gate 131 between first chamber 110 and second chamber (etching chamber) by anti-crystallization mechanism 200, which increases the humidity at gate 131 to reduce the concentration of oxalic acid, avoids the formation of oxalic acid crystallization at gate 131, reduces the labor cost for removing oxalic acid crystallization in the prior art and improves the efficiency of machine use.In actual operation, glass substrate 300 is conveyed from first chamber 110 to second chamber 120 along the second direction F2, and since no oxalic acid crystallization is formed at gate 131, the surface of the conveyed glass substrate 300 can be prevented from being scratched, and the product yield is improved.

[0022] In an embodiment, each spray assembly 210 is a two-fluid atomizing nozzle 210.As Figure 2As shown, the two-fluid atomizing nozzle 210 has a spraying port 211, a water inlet 212, and an air inlet 213. The anti-crystallization mechanism 200 further comprises a connecting pipeline (not shown) comprising a water pipe and an air pipe. One end of the water pipe is connected to the water inlet 212, and the other end is connected to a water source. One end of the air pipe is connected to the air inlet 213, and the other end is connected to a compressed air source. When at least one spraying assembly is in operation, water provided by the water source and air provided by the compressed air source are mixed in the two-fluid atomizing nozzle 210 to form a water mist that radiates from the spraying port 211 to the position of the gate 131 from top to bottom. In an embodiment, the water mist radiated by each two-fluid atomizing nozzle 210 has an umbrella shape, covers a large area, and is uniformly distributed, which can effectively increase the humidity at the gate 131. Since the sprayed is a water mist, by effectively controlling the water output, crystallization can be effectively avoided, and the opening of the second chamber 120 for a long time does not affect the concentration of oxalic acid in the second chamber 120, and water droplets will not fall on the glass substrate 300 to affect the glass substrate 300.

[0023] In an embodiment, the two-fluid atomizing nozzle 210 further has a water mist adjusting valve 214 for adjusting the flow of the water mist sprayed from the spraying port 211. Different etching machines can be correspondingly provided with different water mist flows according to actual use. When different products or different film layers on the products are etched by using the etching device, the water mist flow can be correspondingly set according to actual conditions.

[0024] In an embodiment, the baffle 230 is L-shaped and comprises a first baffle 231 and a second baffle 232 connected to each other. The first baffle 231 is fixed to the spacing plate 130 or the mounting bracket 220 and located above the spraying assembly 210. The second baffle 232 is located on the side of the spraying assembly 210 away from the second chamber 120, so that the radiation area of the water mist sprayed by the spraying assembly 210 is isolated from other areas in the first chamber 110.

[0025] As shown, Figure 1 In the embodiment, the first baffle 231 and the second baffle 232 are perpendicular to each other, but this is not limited in other embodiments. In an embodiment, the second baffle 232 can be provided with an opening (not shown) at each spraying assembly 210, so that the aforementioned water mist adjusting valve 214 is exposed from the opening, facilitating the user to adjust the flow of the water mist. In an embodiment, the second baffle 232 is a flexible transparent baffle, but this is not limited.

[0026] Continuing to refer to Figure 1The mounting bracket 220 of the anti-crystallization mechanism 200 is a square structure, and one side surface of the mounting bracket 220 is fixed, for example, by screws, to the partition plate 130 between the first chamber 110 and the second chamber 120. Specifically, the anti-crystallization mechanism 200 is provided with one mounting piece 240 corresponding to each spray assembly 210, and each spray assembly 210 is fixed to the mounting bracket 220 by the corresponding mounting piece 240. Each mounting piece 240 includes a first piece and a second piece connected to each other, the first piece and the second piece form a first included angle, the first piece is fixed to the mounting bracket 220, and the second piece is fixed to the corresponding spray assembly 210. For example, the first piece is fixed to the mounting bracket 220 by screws, and the second piece is provided with a slot for clamping the corresponding spray assembly 210. In an embodiment, the first included angle can be an obtuse angle.

[0027] In an embodiment, in the first direction, the anti-crystallization mechanism 200 includes a plurality of spray assemblies 210 arranged at intervals, and the distance between each adjacent spray assembly 210 is equal. In this embodiment, the mounting bracket 220 is fixed with six groups of spray assemblies 210 at intervals by the mounting pieces 240. Each spray assembly 210 is arranged obliquely relative to the gate 131 and forms a second included angle with the plane on which the gate 131 is located, that is, the spray port 211 of the spray assembly 210 forms an included angle with the plane on which the partition plate 130 between the first chamber 110 and the second chamber 120 is located. In actual operation, the second included angle can be 30-60°, for example, the second included angle is 45°.

[0028] In an embodiment, a humidity sensor (not shown) is installed at the gate 131, and the anti-crystallization mechanism 200 further includes a PLC controller (not shown), the humidity sensor is in communication connection with the PLC controller, and the PLC controller is also in communication connection with each spray assembly 210. The temperature sensor is used to monitor the humidity at the gate 131 in real time and send it to the PLC controller, when the measured humidity is greater than a preset maximum value, the PLC controller controls the spray assembly 210 to stop running or reduce the water mist flow; when the measured humidity is less than a preset minimum value, the PLC controller controls the spray assembly 210 to run or increase the water mist flow. The preset maximum value and the preset minimum value can be specifically set in combination with the crystallinity of oxalic acid at the current temperature.

[0029] The utility model further provides an etching device 100, including above-mentioned anti-crystallization mechanism 200.

[0030] The anti-crystallization mechanism 200 and the etching device 100, at least one spraying assembly 210 contained in the anti-crystallization mechanism 200 is arranged above the gate 131 between the first chamber 110 and the second chamber 120, the humidity at the gate 131 is increased by spraying water mist to the position of the gate 131, so as to reduce the oxalic acid concentration, avoid generating oxalic acid crystallization, reduce the labor cost and improve the use efficiency of the machine, at the same time, avoid the oxalic acid crystallization from being accumulated at the gate 131 to scratch the surface of the conveyed glass substrate 300, and improve the product yield.

[0031] Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformation according to the utility model without departing from the spirit and essence of the utility model, but these corresponding changes and deformation should all belong to the protection scope of the claims attached to the utility model.

Claims

1. A crystallization-preventing mechanism for an etching apparatus, the etching apparatus comprising a first chamber and a second chamber, the second chamber being an etching chamber, and having a partition plate between the first chamber and the second chamber, a gate being provided on the partition plate, characterized in that The anti-crystallization mechanism comprises, a mounting bracket arranged in the first chamber near one side of the second chamber, and fixed to the partition plate above the gate; at least one spraying assembly fixed to the mounting bracket; and a baffle fixed to the mounting bracket or the partition plate, and the at least one spraying assembly is located between the partition plate and the baffle; wherein each spraying assembly is arranged along a first direction, and the first direction is parallel to the gate, and the at least one spraying assembly is used to spray water mist to the gate position.

2. The anti-crystallization mechanism for an etching apparatus as claimed in claim 1, wherein Each spraying assembly is a two-fluid atomizing nozzle having a spraying port, a water inlet and an air inlet, and the anti-crystallization mechanism further comprises a connecting pipeline comprising a water pipe and an air pipe, one end of the water pipe is connected to the water inlet, and the other end is connected to a water source, one end of the air pipe is connected to the air inlet, and the other end is connected to a compressed air source, when the at least one spraying assembly is running, the water provided by the water source and the air provided by the compressed air source are mixed after contacting in the two-fluid atomizing nozzle to form water mist which is radiated from each spraying port to the gate position.

3. The anti-crystallization mechanism for an etching apparatus according to claim 2, wherein The two-fluid atomizing nozzle further has a water mist adjusting valve for adjusting the flow of water mist sprayed from the spraying port.

4. The anti-crystallization mechanism for an etching apparatus as claimed in claim 1, wherein The anti-crystallization mechanism is provided with one mounting sheet corresponding to each spraying assembly, and each spraying assembly is fixed to the mounting bracket through the corresponding mounting sheet.

5. The anti-crystallization mechanism for an etching apparatus according to claim 4, wherein Each mounting sheet comprises a first sheet and a second sheet connected, the first sheet and the second sheet form a first angle, the first sheet is fixed to the mounting bracket, and the second sheet is fixed to the corresponding spraying assembly.

6. The anti-crystallization mechanism for an etching apparatus as claimed in claim 1, wherein The anti-crystallization mechanism comprises a plurality of spaced spraying assemblies, and the distance between adjacent spraying assemblies is equal.

7. The anti-crystallization mechanism for an etching apparatus as claimed in claim 1, wherein Each spraying assembly is arranged obliquely relative to the gate and forms a second angle with the plane where the gate is located.

8. The anti-crystallization mechanism for an etching apparatus as claimed in claim 7, wherein The second angle is 30-60°.

9. The anti-crystallization mechanism for an etching apparatus as claimed in claim 1, wherein The baffle is L-shaped and comprises a first baffle and a second baffle connected, the first baffle is fixed to the partition plate or the mounting bracket and located above the at least one spraying assembly, and the second baffle is located on the side of the at least one spraying assembly away from the second chamber, so that the radiation area of the water mist sprayed by the at least one spraying assembly is isolated from other areas in the first chamber.

10. An etching apparatus characterized by comprising: The anti-crystallization mechanism as claimed in any one of claims 1-9.

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