Electronic package
By introducing a combination structure of heat dissipation layer, thermal pad, and thermal pillar into electronic packaging, the problem of low thermal conductivity of traditional packaging colloids is solved, achieving more efficient heat dissipation, preventing electronic components from breaking, and improving the reliability of electronic products.
Patent Information
- Application Number
- CN202520137989.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-01-10
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Traditional encapsulating colloids have low thermal conductivity, which cannot effectively dissipate the heat generated by semiconductor chips, leading to chip damage and reliability issues in electronic products.
It adopts a combined structure of heat dissipation layer, thermal pad and thermal pillar, and conducts heat to electronic components through heat dissipation layer, and forms heat conduction path in the encapsulation layer to improve heat dissipation efficiency.
It effectively disperses thermal stress, prevents electronic components from breaking, and improves the reliability of electronic products.
Smart Images
Figure CN223816408U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a semiconductor packaging technology, in particular to an electronic package with a heat dissipation layer. BACKGROUND
[0002] With the increasing demand for functionality and processing speed of electronic products, semiconductor chips as the core components of electronic products need to have higher density of electronic components and electronic circuits, so that the semiconductor chips will generate more heat energy when operating.
[0003] However, the conventional encapsulation glue covering the semiconductor chip is a poor heat dissipation material with a thermal conductivity of only 0.8 W·m -1 ·k -1 ) (i.e. poor heat dissipation efficiency), which often cannot effectively dissipate the heat generated by the semiconductor chip, thereby causing damage to the semiconductor chip and reliability problems of the electronic product.
[0004] Therefore, how to overcome the shortcomings of the prior art has become an urgent problem to be solved. CONTENT OF THE INVENTION
[0005] In view of the various shortcomings of the prior art, the present application provides an electronic package, comprising: a heat dissipation layer; a first electronic component disposed on the heat dissipation layer, such that the heat dissipation layer thermally conducts the first electronic component, wherein the first electronic component has at least one first heat conduction pad; an encapsulation layer formed on the heat dissipation layer to cover the first electronic component; a circuit structure disposed on the encapsulation layer and comprising at least one insulating layer and a circuit layer combined with the insulating layer, such that the circuit layer is electrically connected to the first electronic component; and a first heat conduction column disposed in the encapsulation layer, such that the first heat conduction column thermally conducts the heat dissipation layer and thermally conducts the first heat conduction pad through the circuit layer.
[0006] The present application also provides a method for manufacturing an electronic package, comprising: disposing at least one first electronic component on a heat dissipation layer, such that the heat dissipation layer thermally conducts the first electronic component, wherein the first electronic component has at least one first heat conduction pad; forming an encapsulation layer on the heat dissipation layer, such that the encapsulation layer covers the first electronic component; and forming a circuit structure on the encapsulation layer and a first heat conduction column in the encapsulation layer, such that the first heat conduction column thermally conducts the heat dissipation layer, wherein the circuit structure comprises at least one insulating layer and a circuit layer combined with the insulating layer, such that the circuit layer is electrically connected to the first electronic component and the first heat conduction column thermally conducts the first heat conduction pad through the circuit layer.
[0007] The electronic package and the method of manufacturing the same further include: disposing at least one second electronic component on the heat dissipation layer, so that the heat dissipation layer thermally connects the second electronic component, and the second electronic component is electrically connected to the circuit layer, wherein the second electronic component has at least one second thermally conductive pad; and forming a second thermally conductive column in the package layer, so that the second thermally conductive column thermally connects the heat dissipation layer and thermally connects the second thermally conductive pad through the circuit layer.
[0008] For example, the width of the first thermally conductive pad is greater than or equal to the width of the second thermally conductive pad. Alternatively, the width of the first thermally conductive column is greater than or equal to the width of the second thermally conductive column. Even more, the heat generated by the first electronic component is greater than the heat generated by the second electronic component.
[0009] Further, the thickness of the heat dissipation layer at the region corresponding to the first electronic component is greater than the thickness of the heat dissipation layer at the region corresponding to the second electronic component.
[0010] In addition, the package layer can also cover the second electronic component and the second thermally conductive column.
[0011] In the electronic package and the method of manufacturing the same, the heat dissipation layer has a greater thickness at the region corresponding to the first thermally conductive column.
[0012] As can be seen from the above, in the electronic package of the present application, a first thermally conductive pad is formed on the first electronic component disposed on the heat dissipation layer, and the first thermally conductive pad thermally connects the first thermally conductive column, so that the heat of the first electronic component can be transmitted to the heat dissipation layer, thereby improving the heat dissipation efficiency of the electronic package. Compared with the prior art, the electronic package of the present application can disperse thermal stress and avoid the problem of cracking of the first electronic component, thereby improving the reliability of electronic products. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figures 1A-1D is a cross-sectional schematic view of a method of manufacturing an electronic package of the present application.
[0014] Figure 2 is a cross-sectional schematic view of another embodiment of an electronic package of the present application.
[0015] Figure 3 is a cross-sectional schematic view of another embodiment of an electronic package of the present application.
[0016] REFERENCE SIGNS
[0017] 1, 2, 3 electronic package
[0018] 10 circuit structure
[0019] 100 insulating layer
[0020] 101 circuit layer
[0021] 11 first electronic component
[0022] 11a first active surface
[0023] 11b first inactive surface
[0024] 110 first electrode pad
[0025] 111 first thermally conductive pad
[0026] 12 second electronic component
[0027] 12a second active surface
[0028] 12b second inactive surface
[0029] 120 second electrode pad
[0030] 121, 221 second thermally conductive pad
[0031] 13 first thermally conductive post
[0032] 14, 24 second thermally conductive post
[0033] 15 packaging layer
[0034] 151 first via
[0035] 152 second via
[0036] 16, 26, 36 heat dissipation layer
[0037] 17 electrically conductive element
[0038] 8 circuit board
[0039] A, B, C regions
[0040] D, D1, D2, R, R1, R2 width
[0041] t1, t2, t3 thickness DETAILED DESCRIPTION
[0042] The present application is herein described, by way of example only, with the
[0043] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0044] Figures 1A-1D This is a cross-sectional schematic diagram of the manufacturing method of the electronic package 1 of this application.
[0045] like Figure 1A As shown, at least one first electronic component 11 and at least one second electronic component 12 are disposed on a heat dissipation layer 16 on a carrier (not shown), so that the heat dissipation layer 16 thermally conducts the first electronic component 11 and the second electronic component 12.
[0046] The first electronic component 11 is an active component, a passive component, or a combination thereof, and is disposed on the heat dissipation layer 16. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.
[0047] In this embodiment, the first electronic component 11 is a semiconductor chip with a first active surface 11a and a first non-active surface 11b. The first active surface 11a has a plurality of first electrode pads 110 and at least one first thermal pad 111, and the first non-active surface 11b is positioned facing the heat dissipation layer 16 to be placed on the heat dissipation layer 16, so that the heat dissipation layer 16 thermally conducts heat to the first electronic component 11. For example, the first thermal pad 111 is located close to the hot spot of the first electronic component 11.
[0048] The second electronic component 12 is an active component, a passive component, or a combination thereof, and is disposed on the heat dissipation layer 16. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.
[0049] In this embodiment, the second electronic component 12 is a semiconductor chip with a second active surface 12a and a second non-active surface 12b. The second active surface 12a has a plurality of second electrode pads 120 and at least one second thermal pad 121, and the second non-active surface 12b is positioned facing the heat dissipation layer 16 to be placed on the heat dissipation layer 16, so that the heat dissipation layer 16 thermally conducts heat to the second electronic component 12. For example, the second thermal pad 121 is located close to the hot spot of the second electronic component 12.
[0050] The heat dissipation layer 16 thermally connects the first electronic component 11 and the second electronic component 12.
[0051] In this embodiment, the heat dissipation layer 16 is a metal layer, such as a copper layer, which contacts the first electronic component 11 and the second electronic component 12.
[0052] like Figure 1B As shown, an encapsulation layer 15 is formed on the heat dissipation layer 16 to cover the first electronic component 11 and the second electronic component 12. Then, a plurality of first through holes 151 and second through holes 152 are formed in the encapsulation layer 15 to expose a portion of the surface of the heat dissipation layer 16 to the plurality of first through holes 151 and the plurality of second through holes 152.
[0053] In this embodiment, the encapsulation layer 15 is an insulating material, such as polyimide (PI), dry film, or an encapsulating colloid or molding compound such as epoxy resin.
[0054] Furthermore, the upper surface of the encapsulation layer 15 is flush with the first functional surface 11a and the second functional surface 12a, so that the first electronic component 11 and the second electronic component 12 are exposed in the encapsulation layer 15.
[0055] In addition, the plurality of first perforations 151 are located around the first electronic component 11, and the plurality of second perforations 152 are located around the second electronic component 12.
[0056] like Figure 1C As shown, a circuit structure 10 is formed on the encapsulation layer 15 to electrically connect the first electronic component 11 and the second electronic component 12. A first heat-conducting pillar 13 is formed in the first through hole 151, and a second heat-conducting pillar 14 is formed in the second through hole 152, so that one end of the first heat-conducting pillar 13 and one end of the second heat-conducting pillar 14 are thermally connected to the heat dissipation layer 16.
[0057] In this embodiment, the circuit structure 10 includes an insulating layer 100 and a circuit layer 101 combined with the insulating layer 100. For example, the circuit structure 10 is formed by a redistribution layer (RDL) manufacturing method, and the material of the circuit layer 101 is copper, and the material of the insulating layer 100 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder mask material such as green paint, ink, etc.
[0058] Furthermore, the circuit layer 101 electrically connects the plurality of first electrode pads 110 and the plurality of second electrode pads 120, and thermally connects the first thermal conductive pad 111, the first thermal conductive pillars 13, the second thermal conductive pad 121, and the second thermal conductive pillars 14, so that the other end of the first thermal conductive pillars 13 is thermally connected to the first thermal conductive pad 111 through the circuit layer 101, and the other end of the second thermal conductive pillars 14 is thermally connected to the second thermal conductive pad 121 through the circuit layer 101.
[0059] In addition, the plurality of first thermal conductive pillars 13 surround the first electronic component 11, and the plurality of second thermal conductive pillars 14 surround the second electronic component 12. For example, the material of the first thermal conductive pillars 13 and the second thermal conductive pillars 14 is a metal material such as copper or a solder material.
[0060] Furthermore, as shown in FIG. 1A, the width D of the first thermal conductive pad 111 is equal to the width D of the second thermal conductive pad 121. Alternatively, as shown in FIG. 1B, the width D1 of the first thermal conductive pad 111 can also be selected to be greater than the width D2 of the second thermal conductive pad 221. Figure 1C Figure 2
[0061] In addition, as shown in FIG. 1A, the width R of the first thermal conductive pillars 13 is equal to the width R of the second thermal conductive pillars 14. Alternatively, as shown in FIG. 1B, the width R1 of the first thermal conductive pillars 13 can also be selected to be greater than the width R2 of the second thermal conductive pillars 24. Figure 1C Figure 2
[0062] Therefore, the electronic package 1 of the present application mainly has the first and second heat-conductive pads 111 and 121 on the first and second electronic elements 11 and 12, and connects the first and second heat-conductive columns 13 and 14 through the circuit layer 101, so that the heat of the first and second electronic elements 11 and 12 can be transferred to the heat-dissipating layer 16 through the first and second non-acting surfaces 11b and 12b, and through the first and second heat-conductive columns 13 and 14. Thus, the heat-dissipating efficiency of the electronic package 1 is greatly improved by using two heat transfer paths. Compared with the prior art, the electronic package 1 of the present application can disperse the thermal stress and avoid the problem of cracking of the first and second electronic elements 11 and 12, thereby improving the reliability of electronic products.
[0063] Further, the thickness of different regions of the heat-dissipating layer 16 can be designed according to the heat-dissipating requirement. For example, as shown in the electronic package 2, when the heat generated by the first electronic element 11 is greater than the heat generated by the second electronic element 12, the thickness t1 of the heat-dissipating layer 26 on the region A corresponding to the first electronic element 11 is greater than the thickness t2 of the heat-dissipating layer 26 on the region B corresponding to the second electronic element 12. Figure 2 Alternatively, as shown in the electronic package 3, the heat-dissipating layer 36 has a greater thickness t3 on the region C corresponding to the first heat-conductive column 13. Figure 3
[0064] In addition, in subsequent processes, as shown in the electronic package 1, a plurality of conductive elements 17 such as soldering material can be formed on the circuit structure 10, so that the electronic package 1 can be mounted on an external device such as a circuit board 8. Figure 1D
[0065] The present application also provides an electronic package 1, 2, 3, which comprises a heat-dissipating layer 16, 26, 36, a first electronic element 11, a packaging layer 15, a circuit structure 10, and a first heat-conductive column 13.
[0066] The first electronic element 11 is arranged on the heat-dissipating layer 16, 26, 36, so that the heat-dissipating layer 16, 26, 36 thermally connects the first electronic element 11, wherein the first electronic element 11 has at least one first heat-conductive pad 111.
[0067] The packaging layer 15 is formed on the heat-dissipating layer 16, 26, 36 to cover the first electronic element 11.
[0068] The circuit structure 10 is arranged on the packaging layer 15 and comprises at least one insulating layer 100 and a circuit layer 101 combined with the insulating layer 100, so that the circuit layer 101 is electrically connected to the first electronic element 11.
[0069] The first heat-conductive column 13 is arranged in the encapsulation layer 15, so that the first heat-conductive column 13 is in thermal conduction with the heat-dissipation layer 16, 26, 36 and the first heat-conductive pad 111 through the circuit layer 101.
[0070] In an embodiment, the electronic package 1, 2, 3 further comprises a second electronic element 12 arranged on the heat-dissipation layer 16, 26, 36, so that the heat-dissipation layer 16, 26, 36 is in thermal conduction with the second electronic element 12, and the second electronic element 12 is electrically connected to the circuit layer 101, wherein the second electronic element 12 has at least one second heat-conductive pad 121, 221; and a second heat-conductive column 14, 24 arranged in the encapsulation layer 15, so that the second heat-conductive column 14, 24 is in thermal conduction with the heat-dissipation layer 16, 26, 36 and the second heat-conductive pad 121, 221 through the circuit layer 101.
[0071] For example, the width D1 of the first heat-conductive pad 111 is greater than the width D2 of the second heat-conductive pad 221. Alternatively, the width D of the first heat-conductive pad 111 is equal to the width D of the second heat-conductive pad 121.
[0072] For example, the width R1 of the first heat-conductive column 13 is greater than the width R2 of the second heat-conductive column 24. Alternatively, the width R of the first heat-conductive column 13 is equal to the width R of the second heat-conductive column 14.
[0073] Evenly, the heat generated by the first electronic element 11 is greater than the heat generated by the second electronic element 12.
[0074] Further, the thickness t1 of the heat-dissipation layer 26 at the region A corresponding to the first electronic element 11 is greater than the thickness t2 of the heat-dissipation layer 26 at the region B corresponding to the second electronic element 12.
[0075] In addition, the encapsulation layer 15 also covers the second electronic element 12 and the plurality of second heat-conductive columns 14, 24.
[0076] In an embodiment, the heat-dissipation layer 36 has a greater thickness t3 at the region C corresponding to the first heat-conductive column 13.
[0077] In summary, the electronic package of the present application has the first heat-conductive pad 111 and the second heat-conductive pad 121 formed on the first electronic element 11 and the second electronic element 12 arranged on the heat-dissipation layer, and the first heat-conductive pad and the second heat-conductive pad are in thermal conduction with the first heat-conductive column and the second heat-conductive column, so that the heat of the first electronic element and the second electronic element is transferred to the heat-dissipation layer, thereby improving the heat-dissipation efficiency of the electronic package. Therefore, the electronic package of the present application can disperse the thermal stress and avoid the problem of cracking of the first electronic element and the second electronic element, thereby improving the reliability of the electronic product.
[0078] The above examples are intended to illustrate the principles of the application and its best mode and are not intended to limit its scope. Since the application can be practiced with modification and alteration within the spirit and scope of the present disclosure, the applicant hereby gives permission to make, use, and / or sell many embodiments only as examples of the application and as specific examples of embodiments disclosed. The application is not limited to these embodiments, but the scope of the application is to be accorded the broadest interpretation of the principles and features disclosed herein and / or illustrated in the examples.
Claims
1. An electronic package, characterized by Comprising: a heat dissipation layer; a first electronic component disposed on the heat dissipation layer such that the heat dissipation layer thermally conducts the first electronic component, wherein the first electronic component has a first thermally conductive pad; a packaging layer formed on the heat dissipation layer to cover the first electronic component; a circuit structure disposed on the packaging layer and including an insulating layer and a circuit layer combined with the insulating layer, such that the circuit layer electrically connects the first electronic component; and a first thermally conductive column disposed in the packaging layer such that the first thermally conductive column thermally conducts the heat dissipation layer and thermally conducts the first thermally conductive pad through the circuit layer.
2. The electronic package of claim 1, wherein, The electronic package further comprises: a second electronic component disposed on the heat dissipation layer such that the heat dissipation layer thermally conducts the second electronic component, and the second electronic component electrically connects the circuit layer, wherein the second electronic component has a second thermally conductive pad; and a second thermally conductive column disposed in the packaging layer such that the second thermally conductive column thermally conducts the heat dissipation layer and thermally conducts the second thermally conductive pad through the circuit layer.
3. The electronic package of claim 2, wherein, The width of the first thermally conductive pad is greater than or equal to the width of the second thermally conductive pad.
4. The electronic package of claim 2, wherein, The width of the first thermally conductive column is greater than or equal to the width of the second thermally conductive column.
5. The electronic package of claim 2, wherein, The first electronic component generates more heat than the second electronic component.
6. The electronic package of claim 2, wherein, The thickness of the heat dissipation layer at the region corresponding to the first electronic component is greater than the thickness of the heat dissipation layer at the region corresponding to the second electronic component.
7. The electronic package of claim 2, wherein, The packaging layer also covers the second electronic component and the second thermally conductive column.
8. The electronic package of claim 1 or 2, wherein, The heat dissipation layer has a greater thickness at the region corresponding to the first thermally conductive column.