IPM multi-base-island lead frame

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses an IPM (intelligent power module) multi-base-island lead frame, which comprises a frame body and a lead frame unit arranged on the frame body, and is characterized in that the lead frame unit is provided with a plurality of base islands for realizing high integration; the lead frame unit is provided with a plurality of anti-overflow grooves surrounding the plurality of base islands, a plurality of chips are allowed to be integrated on a single lead frame through the design of the plurality of base islands, the requirement of IPM for multi-chip integration is met, miniaturization and multifunctionalization of electronic equipment can be achieved, more complex circuit functions can be achieved in a limited space, the structure is simple, the cost is low, and the application range is wide. And the overall performance of the system is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially to a IPM multi-base island lead frame. BACKGROUND

[0002] In the modern semiconductor packaging field, intelligent power modules (IPM) have been widely used due to their ability to achieve efficient power conversion and control functions in power electronic devices. IPM usually integrates multiple power chips and control chips, which puts higher requirements on the design of lead frames. With the continuous development of electronic devices towards miniaturization, high performance and multifunction, the demand for the integration, heat dissipation performance, electrical connection reliability and optimization of packaging process of IPM packaging is increasingly prominent.

[0003] The existing IPM lead frame has limitations in chip layout design. Usually, it can accommodate fewer chips, which is difficult to meet the demand of some complex electronic devices for highly integrated multiple chips. In some application scenarios that require simultaneous integration of multiple power chips and multiple control chips, the existing lead frame cannot achieve efficient chip layout in limited space, resulting in large packaging volume, which cannot adapt to the development trend of electronic device miniaturization, and the glue overflow may also occur when packaging the chips. SUMMARY

[0004] The present application provides a IPM multi-base island lead frame, which can realize high integration of chip layout and effectively prevent glue overflow, has good heat dissipation performance and structural stability, to meet the high performance requirements of modern electronic devices for IPM packaging.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A IPM multi-base island lead frame, comprising a frame body and a lead frame unit provided on the frame body, characterized in that a plurality of base islands are provided on the lead frame unit to realize high integration, and a plurality of anti-overflow grooves are provided on the lead frame unit to surround the plurality of base islands.

[0007] Preferably, a plurality of lead frame units are provided on the frame body in transverse equidistance, and each two lead frame units are connected by a longitudinal rib.

[0008] Preferably, the anti-overflow groove is triangular, and the included angle is 50°-70°. The triangular anti-overflow groove structure can adapt to different packaging processes and glue flow characteristics while effectively preventing glue overflow, and the included angle of 60° is optimal.

[0009] Preferably, the plurality of base islands are base island one, base island two, base island three, base island four, base island five, base island six, base island seven, base island eight and base island nine, wherein the base island four, base island five, base island six, base island seven, base island eight and base island nine form a downwardly extending column for heat dissipation.

[0010] Preferably, the base island four, base island five, base island six, base island seven, base island eight and base island nine are bent downwardly at a bending point to form a column, and the bending point has a bending angle ranging from 100° to 140°. The bending angle of 100° to 140° can ensure that the column structure will not damage the base island itself during formation, and at the same time, the shape and size of the column meet the heat dissipation requirements. The bending angle of 120° is optimal.

[0011] Preferably, the base island seven is connected to the base island five and the base island nine by a connecting rib, and the base island five and the base island nine bend downwardly with the base island seven to form a column. The design that the base island seven is connected to the base island five and the base island nine by a connecting rib ensures that the base island seven can participate in the formation of the heat dissipation structure synchronously when the base island five and the base island nine are bent to form a column. This overall structure improves the integrity and heat dissipation efficiency of the heat dissipation column.

[0012] Preferably, a plurality of pins one are arranged above the base island one, base island two and base island three, and the pins one are connected to the frame body. A plurality of pins two are arranged below the base island four, base island five, base island six, base island seven, base island eight and base island nine, and the pins two are connected to the frame body. The base island one, base island two and base island three are arranged above the base island four, base island five, base island six, base island seven, base island eight and base island nine. The base island one to base island three are connected to the frame body by the pins one, and the base island four to base island nine are connected to the frame body by the pins two. This pin layout design reasonably allocates the electrical connection path. The pins above and below are connected to different base islands, which helps to optimize the circuit layout, reduce signal interference and improve the electrical performance of the chip.

[0013] Preferably, a plurality of positioning holes are arranged on the frame body. The lead frame can be precisely positioned by the positioning holes on the frame body during the chip packaging process.

[0014] Preferably, a plurality of glue locking holes are arranged on the lead frame unit. During the chip packaging process, the glue can be better fixed at the predetermined position through the glue locking holes, preventing the chip from being short-circuited or other electrical faults caused by the flow of glue.

[0015] Preferably, the lead frame unit is provided with a plurality of electroplating areas, the electroplating areas have a plurality of different electroplating modes, so that the lead frame can select the most suitable electroplating treatment according to different application requirements, improve the versatility and adaptability of the lead frame, can meet the performance requirements of the lead frame of different electronic devices in different working environments, and guarantee the reliability and performance stability of the product.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The design of the plurality of base islands (including base island one to base island nine) allows a plurality of chips to be integrated on a single lead frame, meeting the demand of IPM for multi-chip integration. This helps to realize miniaturization and multifunctionalization of electronic equipment, realize more complex circuit functions in limited space, and improve the overall performance of the system.

[0018] The anti-overflow groove is provided, which can effectively prevent glue overflow during chip packaging, and the product provides a plurality of electroplating modes for selection, so that the lead frame can be customized for electroplating treatment according to different application scenarios and user requirements. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor on the premise of not paying creative labor.

[0020] Figure 1 It is the overall structure schematic view of the utility model;

[0021] Figure 2 It is the lead frame unit structure view of the utility model;

[0022] Figure 3 It is the anti-overflow groove structure view of the utility model;

[0023] Figure 4 It is the electroplating mode one view of the utility model;

[0024] Figure 5 It is the electroplating mode two view of the utility model;

[0025] Figure 6 It is the electroplating mode three view of the utility model;

[0026] Figure 7 It is the electroplating mode four view of the utility model;

[0027] Figure 8The sixth view of the electroplating mode of the utility model.

[0028] Figure 9 The sixth view of the electroplating mode of the utility model.

[0029] Figure number explanation: 1, frame body; 11, positioning hole; 2, longitudinal rib; 3, lead frame unit; 31, base island one; 32, base island two; 33, base island three; 34, base island four; 35, base island five; 36, base island six; 37, base island seven; 38, base island eight; 39, base island nine; 310, bending point; 311, anti-overflow groove; 312, glue locking hole; 313, lead one; 314, lead two; 315, electroplating area. DETAILED DESCRIPTION

[0030] The utility model will be further described in detail below in combination with the drawings.

[0031] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments in the following description are only as examples, and other obvious modifications can be thought of by those skilled in the art. The basic principles defined in the following description can be used in other implementation, modification, improvement, equivalent and other technical solutions without departing from the spirit and scope of the utility model.

[0032] Those skilled in the art should understand that in the disclosure of the utility model, the orientation or position indicated by the terms "longitudinal", "transverse", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, which is only for the convenience of the simplified description of the utility model, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore the above-mentioned terms cannot be understood as a limitation of the utility model.

[0033] It can be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element can be one, and in another embodiment, the number of the element can be multiple, and the term "one" cannot be understood as a limitation on the number. EMBODIMENT

[0034] Please refer to Figures 1-9 An IPM multi-base island lead frame, comprising a frame body 1, a plurality of lead frame units 3 are arranged transversely and equidistantly on the frame body 1, and the lead frame units 3 are connected through longitudinal ribs 2.

[0035] Each lead frame unit 3 is provided with a plurality of base islands for placing chips, including base island one 31, base island two 32, base island three 33, base island four 34, base island five 35, base island six 36, base island seven 37, base island eight 38 and base island nine 39. The periphery of the plurality of base islands is provided with a plurality of anti-overflow grooves 311 surrounding them, which are triangular with an included angle of 50°-70°, and the optimal included angle is 60°. The anti-overflow grooves 311 can effectively prevent glue overflow during packaging, ensuring packaging quality. The arrangement of multiple base islands realizes high integration and meets the demand of IPM for multiple chip integration.

[0036] Base island four 34, base island five 35, base island six 36, base island seven 37, base island eight 38 and base island nine 39 form piers downward for chip heat dissipation. Base island four 34, base island five 35, base island six 36, base island eight 38 and base island nine 39 are bent downward at bending points 310 to form piers, and the optimal bending angle is 120°. Base island seven 37 is connected to base island five 35 and base island nine 39 through connecting ribs and is integrated with them. When base island five 35 and base island nine 39 are bent downward, base island seven 37 is also bent downward to form a pier. These pier structures help chip heat dissipation and ensure that the temperature of the chip during work is within a reasonable range.

[0037] Base island one 31, base island two 32 and base island three 33 are provided with a plurality of pins one 313 above and connected to the frame body 1 through the pins one 313. Base island four 34, base island five 35, base island six 36, base island seven 37, base island eight 38 and base island nine 39 are provided with a plurality of pins two 314 below and connected to the frame body 1 through the pins two 314. The pins are used to realize electrical connection between the chip and the external circuit.

[0038] The frame body 1 is provided with a plurality of positioning holes 11 for accurately fixing the position of the lead frame during packaging, ensuring the accuracy of chip placement and electrical connection.

[0039] The frame body 1 is also provided with a plurality of glue locking holes 312 for fixing the position of the glue during packaging, further preventing glue overflow.

[0040] Please refer to Figures 4-9 , the lead frame unit 3 is provided with a plurality of electroplating areas 315, including Figure 4 double-sided plating as shown, Figure 5 single-sided plating as shown, and Figures 6-9 other different electroplating methods as shown. Different electroplating methods can be selected for electroplating according to user needs.

[0041] When the frame body 1 is processed by precision stamping process, the structures such as horizontally equidistant lead frame units 3, longitudinal ribs 2, positioning holes 11 and glue locking holes 312 are accurately formed.

[0042] The base islands are finely processed to form the pier structures of base island four 34 to base island nine 39 according to the design requirements of the bending points 310 angle and the connecting ribs, while ensuring the connection reliability of base island one 31 to base island three 33 with the pin one 313, and base island four 34 to base island nine 39 with the pin two 314.

[0043] According to the product application scene, the frame is electroplated, the appropriate electroplating area 315 electroplating mode is selected, the oxidation resistance and corrosion resistance of the lead frame are improved, and different electroplating modes can be used for electroplating treatment according to customer requirements when selecting the electroplating mode. Figures 4-9

[0044] When IPM packaging is performed, the chip is accurately placed on each base island, and the positioning hole 11 is used to ensure the position accuracy of the lead frame in the packaging equipment.

[0045] When the glue is applied, the anti-overflow groove 311 effectively prevents the glue from overflowing, and the glue locking hole 312 helps to fix the position of the glue.

[0046] After subsequent packaging process steps such as soldering pins, packaging material filling, etc., the IPM packaging is completed. In this process, the longitudinal rib 2 ensures the structural stability of the frame, and the pier structure of the base island helps the chip to dissipate heat, and finally a high-performance IPM packaging product is obtained.

[0047] It should be understood by those skilled in the art that the embodiments of the utility model shown in the above description and the drawings are only used as examples and do not limit the utility model. The purpose of the utility model has been completely and effectively achieved. The function and structural principle of the utility model have been demonstrated and explained in the embodiments, and the embodiments of the utility model can have any deformation or modification without departing from the principle.​

Claims

1. An IPM multi-base island lead frame comprising a frame body (1) and a lead frame unit (3) provided on the frame body (1), characterized in that, The lead frame unit (3) is provided with a plurality of base islands to realize high integration, and the lead frame unit (3) is provided with a plurality of anti-overflow grooves (311) surrounding the plurality of base islands.

2. The IPM multi-base island lead frame according to claim 1, wherein: A plurality of lead frame units (3) are horizontally and equidistantly arranged on the frame body (1), and each two lead frame units (3) are connected through a longitudinal rib (2).

3. The IPM multi-base island lead frame according to claim 2, wherein: The anti-overflow groove (311) is triangular, and the included angle is 50°-70°.

4. The IPM multi-base island lead frame according to claim 3, wherein: The plurality of base islands are base island one (31), base island two (32), base island three (33), base island four (34), base island five (35), base island six (36), base island seven (37), base island eight (38), and base island nine (39), wherein the base island four (34), the base island five (35), the base island six (36), the base island seven (37), the base island eight (38), and the base island nine (39) form a plinth downward for heat dissipation.

5. The IPM multi-base island lead frame according to claim 4, wherein: The base island four (34), the base island five (35), the base island six (36), the base island seven (37), the base island eight (38), and the base island nine (39) are downwardly bent to form a plinth at the bending point (310), and the bending angle of the bending point (310) ranges from 100° to 140°.

6. The IPM multi-base island lead frame according to claim 5, wherein: The base island seven (37) is connected with the base island five (35) and the base island nine (39) through a connecting rib, and the base island five (35) and the base island nine (39) form a plinth downward with the base island seven (37) when being bent downward.

7. The IPM multi-base island lead frame according to claim 6, wherein: The base island one (31), the base island two (32), and the base island three (33) are provided with a plurality of pins one (313) above and connected with the frame body (1) through the pins one (313), and the base island four (34), the base island five (35), the base island six (36), the base island seven (37), the base island eight (38), and the base island nine (39) are provided with a plurality of pins two (314) below and connected with the frame body (1) through the pins two (314).

8. The IPM multi-base island lead frame according to claim 7, wherein: The frame body (1) is provided with a plurality of positioning holes (11).

9. The IPM multi-base island lead frame according to claim 8, wherein: The lead frame unit (3) is provided with a plurality of glue locking holes (312).

10. The IPM multi-base island lead frame according to claim 9, wherein: The lead frame unit (3) is provided with a plurality of electroplating areas (315), and the electroplating areas (315) have a plurality of different electroplating modes.

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