Curing device for Micro-LED backlight module processing

Abstract

The utility model discloses a curing device for processing a Micro-LED (Light Emitting Diode) backlight module. The curing device comprises a curing box; a turnover mechanism is arranged on the upper side of the curing box, and the turnover mechanism comprises an open groove, a turnover cover and a threaded rod; a lifting mechanism is arranged on the right side of the curing box and comprises a connecting groove, a baffle and a first electric telescopic rod, the connecting groove is fixedly connected with the curing box, and the connecting groove is in front-back symmetry about the vertical central axis of the curing box. According to the curing device for Micro-LED backlight module processing, the open groove and the flip cover are connected together in a clamped mode, heat emitted by a heating lamp can be prevented from being lost from the open groove, the baffle moves towards the upper left portion, and therefore the backlight module can be conveniently placed on the placing plate to be cured, the sealing performance can be further enhanced through the connecting mode, and the curing effect is improved. And the dredging plate is obliquely arranged upwards, and when the fan works, the dredging plate can guide air to be conveyed to the lower side of the heating lamp, so that the flowability of the air in the curing box is enhanced, and curing is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of Micro-LED processing technology, specifically a curing device for Micro-LED backlight module processing. Background Technology

[0002] Micro-LED, or micro-light-emitting diode, refers to a high-density integrated LED array. The distance between LED pixels in the array is on the order of 10 micrometers, and each LED pixel is self-emissive. Curing the Micro-LED backlight module is a crucial step in the manufacturing process of Micro-LED display technology. The curing process ensures that the materials in the Micro-LED backlight module form a good protective layer, thereby improving its display performance such as brightness, contrast, and color saturation. By optimizing the curing process, the failure rate of Micro-LED backlight modules during use can be reduced, thus extending their lifespan and reducing maintenance costs. Through optimizing the curing process and technological innovation, the display performance and lifespan of Micro-LED backlight modules can be continuously improved, promoting their application and development in various fields.

[0003] Referring to Chinese Patent Publication No. CN216605947U, with the publication date of the publication date being May 27, 2022, a curing system for processing Micro-LED backlight modules is disclosed. This utility model can not only conveniently clean the surface of the heating lamp, but also effectively prevent the loss of heat inside the heating cover, thereby ensuring the curing effect and making it easy to promote and use.

[0004] However, although this utility model can clean the surface of the heating lamp during use, the heating lamp cannot be seen during cleaning, which is inconvenient. Moreover, although it can prevent some heat from escaping from inside the heating cover, heat will still be lost from the conveyor belt. Therefore, there is still room for further optimization and improvement.

[0005] Therefore, we propose a curing apparatus for Micro-LED backlight module processing to solve the problems mentioned above. Utility Model Content

[0006] The purpose of this invention is to provide a curing device for Micro-LED backlight module processing, in order to solve the problems mentioned in the background art. In the current invention, although it can clean the surface of the heating lamp, the heating lamp cannot be seen during cleaning, which is inconvenient. Moreover, although it can prevent some heat from escaping from inside the heating cover, heat will still be lost from the conveyor belt. Therefore, there is still room for further optimization and improvement.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a curing device for processing Micro-LED backlight modules, comprising: a curing chamber;

[0008] Also includes:

[0009] The curing chamber is provided with a flipping mechanism on its upper side, which includes a slot, a flip cover and a threaded rod. The slot is engaged with the flip cover and is located on the upper side of the curing chamber.

[0010] A lifting mechanism is provided on the right side of the curing box. The lifting mechanism includes a connecting groove, a baffle and a first electric telescopic rod. The connecting groove is fixedly connected to the curing box and is symmetrical about the vertical central axis of the curing box.

[0011] Preferably, the curing chamber is rotatably connected to the flip cover, and the upper side of the flip cover is provided with an ear plate, which is slidably connected to the threaded rod, and the threaded rod is threadedly connected to the curing chamber.

[0012] Preferably, the lower side of the flip cover is provided with claws, which are arranged in an array and are engaged with the heating lamp.

[0013] Preferably, the connecting groove is engaged with the baffle, and the baffle is fixedly connected to the first electric telescopic rod, and a roller is provided on the lower side of the first electric telescopic rod.

[0014] Preferably, the roller is slidably connected to the trough, and the trough is located on the upper side of the curing box. The trough is symmetrical about the vertical central axis of the curing box, and the first electric telescopic rod, the roller and the trough correspond one-to-one.

[0015] Preferably, a second electric telescopic rod is provided on the lower inner side of the curing box, and the second electric telescopic rod is fixedly connected to the placement plate, and the placement plate is slidably connected to the curing box.

[0016] Preferably, a fan and a cover are provided on the inner rear side of the curing chamber, and a guide plate is provided on the front side of the cover, and the guide plate is distributed in an array.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: the curing device for Micro-LED backlight module processing has a slotted and flip-top snap-fit ​​connection, which can prevent the heat emitted by the heating lamp from being lost through the slot. The baffle moves to the upper left, which makes it convenient to place the backlight module on the placement plate for curing. This connection method can also further enhance the airtightness. The guide plate is set at an upward angle. When the fan is working, the guide plate will guide the air to be delivered to the lower side of the heating lamp, thereby enhancing the airflow inside the curing box and facilitating curing.

[0018] 1. It is equipped with a curing chamber, a slot, and a flip cover. The upper side of the curing chamber has a slot, which is connected to the flip cover to prevent the heat emitted by the heating lamp from being lost through the slot, thus facilitating curing.

[0019] 2. It is equipped with a flip cover, ear plates and threaded rods. The rear side of the flip cover is rotatably connected to the curing chamber, and the front side of the flip cover is connected to the curing chamber through the ear plates and threaded rods, thereby preventing the flip cover from opening accidentally and enhancing the airtightness;

[0020] 3. It is equipped with a connecting groove, a baffle and a first electric telescopic rod. The baffle can slide inside the connecting groove. When the first electric telescopic rod is working, the baffle will move to the upper left, which makes it easier to place the backlight module on the placement plate for curing. This connection method can also further enhance the airtightness.

[0021] 4. It is equipped with a first electric telescopic rod, rollers and a trough. When the first electric telescopic rod is working, its position on the upper side of the curing box will change. At this time, the rollers will move in the trough, thereby preventing damage to the first electric telescopic rod. The trough also limits the rollers and prevents the rollers from disconnecting from the curing box.

[0022] 5. It is equipped with a fan, a cover, and a guide plate. The guide plate is tilted upwards. When the fan is working, the guide plate will guide the air to the lower side of the heating lamp, thereby enhancing the airflow inside the curing chamber and facilitating curing. Attached Figure Description

[0023] Figure 1 This is a top-view three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the connection structure between the connecting groove and the baffle of this utility model;

[0025] Figure 3 This is a schematic diagram of the curing box and the flip-top connection structure of this utility model;

[0026] Figure 4 This utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0027] Figure 5 This utility model Figure 3 Enlarged structural diagram at point B;

[0028] Figure 6 This is a schematic diagram of the connection structure between the cover and the guide plate of this utility model;

[0029] Figure 7 This is a cross-sectional view of the curing box of this utility model.

[0030] In the diagram: 1. Curing box; 2. Slotted opening; 3. Flip-top; 4. Ear plate; 5. Threaded rod; 6. Claw; 7. Heating lamp; 8. Connecting slot; 9. Baffle; 10. First electric telescopic rod; 11. Roller; 12. Tank body; 13. Second electric telescopic rod; 14. Placement plate; 15. Fan; 16. Cover body; 17. Guide plate. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Specific Implementation Example 1

[0033] This embodiment is a curing device for processing Micro-LED backlight modules.

[0034] like Figure 1 , Figure 3 and Figure 4 As shown, the upper side of the curing chamber 1 has a slot 2, which is engaged with the flip cover 3. The curing chamber 1 is rotatably connected to the flip cover 3. The upper side of the flip cover 3 has an ear plate 4, which is slidably connected to the threaded rod 5. The threaded rod 5 is threadedly connected to the curing chamber 1. The lower side of the flip cover 3 has a claw 6, which is arranged in an array and is engaged with the heating lamp 7.

[0035] like Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, the right side of the curing box 1 is fixedly connected to the connecting groove 8. The connecting groove 8 is symmetrical about the vertical central axis of the curing box 1. The connecting groove 8 is engaged with the baffle 9. The baffle 9 is fixedly connected to the first electric telescopic rod 10. A roller 11 is provided on the lower side of the first electric telescopic rod 10. The roller 11 is slidably connected to the tank body 12. The tank body 12 is located on the upper side of the curing box 1. The tank body 12 is symmetrical about the vertical central axis of the curing box 1. The first electric telescopic rod 10, the roller 11 and the tank body 12 correspond one-to-one. A second electric telescopic rod 13 is provided on the lower inner side of the curing box 1. The second electric telescopic rod 13 is fixedly connected to the placement plate 14. The placement plate 14 is slidably connected to the curing box 1. A fan 15 and a cover 16 are provided on the rear inner side of the curing box 1. A guide plate 17 is provided on the front side of the cover 16. The guide plates 17 are arranged in an array.

[0036] It should be noted that an observation window is provided on the front side of the curing chamber 1. The curing status of the Micro-LED backlight module located on the upper side of the placement plate 14 inside the curing chamber 1 can be observed through the observation window. Before use, the second electric telescopic rod 13 needs to be activated to move the placement plate 14 to the right side of the curing chamber 1. Then, after placing the Micro-LED backlight module on the upper side of the placement plate 14, the second electric telescopic rod 13 is activated to move the placement plate 14 to the lower side of the heating lamp 7. The upper side of the curing chamber 1 has a slot 2, and the rear side of the flip cover 3 is rotatably connected to the curing chamber 1. The slot 2 and the flip cover 3 are engaged together. Rotating the threaded rod 5 disconnects the threaded rod 5 from the curing chamber 1. This method can prevent the heat emitted by the heating lamp 7 from being lost through the slot 2, thus facilitating curing.

[0037] Then, power on the heating lamp 7 and start the fan 15. The fan 15 will accelerate the air circulation inside the curing chamber 1. In addition, a guide plate 17 is provided on the front side of the cover 16, and the guide plate 17 is inclined upward. When the fan 15 is working, the guide plate 17 will guide the air to the lower side of the heating lamp 7, and the heat generated by the heating lamp 7 will be directly carried away, thereby enhancing the airflow inside the curing chamber 1 and facilitating curing. Specific Implementation Example 2

[0039] This embodiment is designed to address the inconvenience of cleaning the heating lamp 7.

[0040] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, flipping the cover 3 over reveals the claw 6 and heating lamp 7 located on the underside of the cover 3. The heating lamp 7 can be removed from inside the claw 6 for cleaning, or it can be wiped directly. This method can clean all the dirt on the outside of the heating lamp 7. Then, the cover 3 is engaged with the slot 2, and the ear plate 4 is tightly fitted with the curing box 1. Then, the threaded rod 5 is rotated to further secure the connection between the curing box 1 and the cover 3, thereby greatly enhancing the airtightness and preventing the cover 3 from being opened accidentally. Specific Implementation Example 3

[0042] This embodiment is designed to address the problem of heat loss when using a conveyor belt to transport the backlight module.

[0043] like Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7As shown, the baffle 9 can slide inside the connecting groove 8. When the first electric telescopic rod 10 is activated, it will move the baffle 9 to the upper left, making it easier to place the backlight module on the placement plate 14 for curing. When the first electric telescopic rod 10 is working, its position on the upper side of the curing box 1 will change. At this time, the roller 11 will also move within the groove 12, thus preventing damage to the first electric telescopic rod 10. In addition, the groove 12 also limits the roller 11, preventing it from disconnecting from the curing box 1. When the first electric telescopic rod 10 retracts, the roller 11 will also move to the right, and the baffle 9 will also move to the lower right within the connecting groove 8. This connection method can further enhance the airtightness.

[0044] The contents not described in detail in this specification are existing technologies known to those skilled in the art. All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0045] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A curing apparatus for processing Micro-LED backlight modules, comprising: Curing box(1); Its characteristic is that it further includes: The curing box (1) is provided with a flipping mechanism on the upper side, wherein the flipping mechanism includes a slot (2), a flip cover (3) and a threaded rod (5). The slot (2) is engaged with the flip cover (3), and the slot (2) is opened on the upper side of the curing box (1). A lifting mechanism is provided on the right side of the curing box (1), wherein the lifting mechanism includes a connecting groove (8), a baffle (9) and a first electric telescopic rod (10). The connecting groove (8) is fixedly connected to the curing box (1), and the connecting groove (8) is symmetrical about the vertical central axis of the curing box (1).

2. The curing apparatus for processing Micro-LED backlight modules according to claim 1, characterized in that: The curing box (1) is rotatably connected to the flip cover (3), and the upper side of the flip cover (3) is provided with an ear plate (4), and the ear plate (4) is slidably connected to the threaded rod (5), and the threaded rod (5) is threadedly connected to the curing box (1).

3. The curing apparatus for processing Micro-LED backlight modules according to claim 2, characterized in that: The flip cover (3) is provided with claws (6) on the lower side, and the claws (6) are arranged in an array, and the claws (6) are engaged with the heating lamp (7).

4. The curing apparatus for processing Micro-LED backlight modules according to claim 1, characterized in that: The connecting groove (8) is engaged with the baffle (9), and the baffle (9) is fixedly connected to the first electric telescopic rod (10), and a roller (11) is provided on the lower side of the first electric telescopic rod (10).

5. The curing apparatus for processing Micro-LED backlight modules according to claim 4, characterized in that: The roller (11) is slidably connected to the tank (12), and the tank (12) is set on the upper side of the curing box (1). The tank (12) is symmetrical about the vertical central axis of the curing box (1), and the first electric telescopic rod (10), the roller (11) and the tank (12) correspond one-to-one.

6. The curing apparatus for processing Micro-LED backlight modules according to claim 1, characterized in that: A second electric telescopic rod (13) is provided on the lower inner side of the curing box (1), and the second electric telescopic rod (13) is fixedly connected to the placement plate (14), and the placement plate (14) is slidably connected to the curing box (1).

7. The curing apparatus for processing Micro-LED backlight modules according to claim 1, characterized in that: A fan (15) and a cover (16) are provided on the inner rear side of the curing box (1), and a guide plate (17) is provided on the front side of the cover (16), and the guide plate (17) is arranged in an array.

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