Leftover material removing device

Abstract

The utility model relates to the technical field of radio frequency chip products, and discloses a leftover material removing device. Wherein a carrier unit of the leftover material removing device is used for bearing an integrated circuit; the horizontal moving unit can drive the carrier unit to move; a vertical moving assembly of the cutting unit is arranged above the horizontal moving unit and can drive a cutting head to move. The image processing part calibrates a coordinate system conversion relation between the image processing part and an image collected by the image processing part by referring to a preset calibration assembly, and performs trajectory planning based on the coordinate system conversion relation and the image of the carrier unit to obtain a target cutting trajectory and a preset descending distance; the control unit controls the horizontal moving unit and the cutting unit to act correspondingly so as to drive the cutting head to descend by a preset descending distance, and the leftover materials to be cut are cut along the target cutting track. The integrated circuit leftover material cutting and removing device can automatically cut and remove leftover materials to be cut of an integrated circuit, the automation degree and the working efficiency are higher, and meanwhile the removing effect is better.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency chip product technology, and in particular to a scrap removal device. Background Technology

[0002] After the substrate-type integrated circuits complete the electrical tests, the AOI screening and packaging equipment will pack each chip that meets the appearance and performance requirements into the tape according to the test map, waiting for shipment. Unqualified products are sorted into the defective product bin.

[0003] In existing technologies, such as Figure 1 As shown, the integrated circuit 10 of the substrate-type integrated circuit has a row or column of unpackaged scrap material 11 around its perimeter. Before winding into the tape, the scrap material 11 needs to be manually scraped off with a hand-held scraper. However, the method of manually scraping off the scrap material 11 has problems such as low efficiency and inconsistent work results, which will affect the subsequent automated screening and packaging work of the equipment. Utility Model Content

[0004] Based on the above, the purpose of this utility model is to provide a scrap removal device that can automatically cut and remove scraps from integrated circuits, with a higher degree of automation and work efficiency, and better removal effect.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Scrap removal device, including:

[0007] A carrier unit for carrying an integrated circuit, the integrated circuit including a product and scrap material to be cut located circumferentially to the product;

[0008] A horizontal moving unit, wherein the vehicle unit is disposed on the horizontal moving unit, and the horizontal moving unit can drive the vehicle unit to move;

[0009] A cutting unit includes a vertical moving component and a cutting head disposed on the vertical moving component. The vertical moving component is disposed above the horizontal moving unit and can drive the cutting head to move. The cutting head is used to cut the scrap material to be cut from the integrated circuit.

[0010] An image processing unit, referring to a preset calibration component, calibrates the coordinate system transformation relationship between the image processing unit and the image acquired by the image processing unit, and performs trajectory planning based on the coordinate system transformation relationship and the image of the vehicle unit to obtain the target cutting trajectory and the preset descent distance required for the cutting head to descend;

[0011] The control unit controls the horizontal moving unit and the cutting unit to move accordingly, so as to drive the cutting head down the preset descent distance and cut the scrap material to be cut along the target cutting trajectory.

[0012] As a preferred embodiment of the scrap removal device, the horizontal moving unit includes an X-axis moving component and a Y-axis moving component. The carrier unit is disposed on the Y-axis moving component, and the Y-axis moving component is disposed on the X-axis moving component. The X-axis moving component is used to drive the Y-axis moving component and the carrier unit to move along the X-axis, and the Y-axis moving component is used to drive the carrier unit to move along the Y-axis.

[0013] And / or, the Y-axis moving assembly includes a Y-axis mounting base, a Y-axis drive, a Y-axis lead screw, a Y-axis slider, a Y-axis mounting plate, and a Y-axis guide rail. The Y-axis drive drives the Y-axis lead screw to rotate relative to the Y-axis mounting base. Both the Y-axis lead screw and the Y-axis guide rail extend along the Y-axis. The Y-axis slider is threadedly connected to the Y-axis lead screw. The Y-axis mounting plate is disposed on the Y-axis slider and slidably connected to the Y-axis guide rail. The X-axis moving assembly is disposed on the Y-axis mounting plate.

[0014] As a preferred embodiment of the scrap removal device, the X-axis moving assembly includes an X-axis mounting base, an X-axis drive member, an X-axis lead screw, an X-axis slider, an X-axis mounting plate, and an X-axis guide rail. The X-axis mounting base is disposed at the moving end of the Y-axis moving assembly. The X-axis drive member drives the X-axis lead screw to rotate relative to the X-axis mounting base. Both the X-axis lead screw and the X-axis guide rail extend along the X-axis. The X-axis slider is threadedly connected to the X-axis lead screw. The X-axis mounting plate is disposed on the X-axis slider and slidably connected to the X-axis guide rail. The carrier unit is disposed on the X-axis mounting plate.

[0015] As a preferred embodiment of the scrap removal device, the vertical moving assembly includes a vertical mounting base, a vertical driving component, a vertical lead screw, a vertical slider, and a vertical guide rail. The vertical driving component drives the vertical lead screw to rotate relative to the vertical mounting base. Both the vertical lead screw and the vertical guide rail extend vertically. The vertical slider is threadedly connected to the vertical lead screw and slidably connected to the vertical guide rail. The cutting head is disposed on the vertical slider.

[0016] As a preferred embodiment of the scrap removal device, the vertical moving component is further provided with an adapter plate, which is disposed on the vertical slider, and the cutting head is detachably connected to the vertical slider.

[0017] As a preferred embodiment of the scrap removal device, the carrier unit includes a platform and a frame, the frame being detachably mounted on the platform, the frame including an annular chuck and a UV film, the integrated circuit being disposed on the UV film, and the UV film being disposed on the annular chuck.

[0018] As a preferred embodiment of the scrap removal device, the stage includes a vacuum suction cup and at least three grippers disposed around the vacuum suction cup. The vacuum suction cup is used to adsorb the UV film, and the at least three grippers are used to hold the annular chuck.

[0019] As a preferred embodiment of the scrap removal device, the scrap removal device is further provided with a mounting bracket, the cutting unit and the image processing component are both disposed on the mounting bracket, and the horizontal moving unit is disposed below the mounting bracket.

[0020] As a preferred embodiment of the scrap removal device, the mounting bracket includes a mounting beam and support beams disposed at both ends of the mounting beam, the mounting beam extending horizontally; the vertical moving component and the image processing component are slidably disposed on the mounting beam in a vertical direction; and / or, the vertical moving component and the image processing component are slidably disposed on the mounting beam; and / or, the mounting bracket is movable in a horizontal direction.

[0021] As a preferred embodiment of the scrap removal device, the calibration component includes a calibration plate, and the image processing component can acquire images of the calibration plate placed at different positions, and perform position calibration transformation of image coordinates, camera coordinate system and world coordinate system through hand-eye calibration algorithm, thereby realizing calibration.

[0022] The beneficial effects of this utility model are as follows:

[0023] This invention utilizes a carrier unit to support the integrated circuit, a horizontal moving unit to drive the carrier unit and the integrated circuit to move horizontally, and a vertical moving component to drive the cutting head to move vertically. The cutting head cuts the scrap material at the edge of the integrated circuit. Simultaneously, an image processing unit calibrates and obtains the target cutting trajectory and the preset descent distance required for the cutting head. The control unit controls the actions of the horizontal and vertical moving components, ensuring the cutting head descends the preset distance and cuts along the target trajectory, guaranteeing cutting accuracy. Furthermore, the movement of the integrated circuit and cutting head via the horizontal and vertical moving units replaces manual labor, resulting in higher efficiency and accuracy, greater automation, and effectively reduced labor costs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of an integrated circuit provided by existing technology;

[0026] Figure 2 This is a schematic diagram of the scrap removal device provided in a specific embodiment of this utility model;

[0027] Figure 3 This is a schematic diagram of the X-axis moving component or the Y-axis moving component of the scrap removal device provided in a specific embodiment of this utility model;

[0028] Figure 4 This is a schematic diagram of the cutting unit of the scrap removal device provided in a specific embodiment of this utility model;

[0029] Figure 5 This is a schematic diagram of the frame and integrated circuit of the scrap removal device provided in a specific embodiment of this utility model;

[0030] Figure 6 This is a schematic diagram of the platform of the scrap removal device provided in a specific embodiment of this utility model;

[0031] Figure 7 This is a flowchart illustrating the scrap removal device provided in a specific embodiment of the present invention for removing scrap.

[0032] In the picture:

[0033] 10. Integrated circuits; 11. Scrap materials to be cut;

[0034] 100. Carrier unit; 110. Stage; 111. Vacuum suction cup; 112. Gripper; 120. Frame; 121. Annular chuck; 122. UV film;

[0035] 200. Horizontal movement unit; 210. X-axis movement assembly; 211. X-axis mounting base; 212. X-axis drive component; 213. X-axis lead screw; 214. X-axis mounting plate; 215. X-axis guide rail; 220. Y-axis movement assembly; 221. Y-axis mounting base; 222. Y-axis drive component; 223. Y-axis lead screw; 224. Y-axis mounting plate; 225. Y-axis guide rail;

[0036] 300. Cutting unit; 310. Vertical moving assembly; 311. Vertical mounting base; 312. Vertical drive unit; 313. Vertical lead screw; 314. Vertical slider; 315. Vertical guide rail; 320. Cutting head; 330. Adapter plate;

[0037] 400. Control unit;

[0038] 500. Install the bracket;

[0039] 600. Image processing components; 610. Calibration components. Detailed Implementation

[0040] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0041] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0042] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0045] like Figures 1-6 As shown, this embodiment provides a scrap removal device, which includes a carrier unit 100, a horizontal moving unit 200, a cutting unit 300, a control unit 400, and an image processing unit 600. The carrier unit 100 is used to carry an integrated circuit 10. The carrier unit 100 is disposed on the horizontal moving unit 200 and can drive the carrier unit 100. The cutting unit 300 includes a vertical moving component 310 and a cutting head 320 disposed on the vertical moving component 310. The vertical moving component 310 is disposed above the horizontal moving unit 200 and can drive the cutting head 320. 0. The cutting head 320 is used to cut the scrap material 11 to be cut from the integrated circuit 10. The image processing unit 600 refers to the preset calibration component 610 to calibrate the coordinate system transformation relationship between the image processing unit 600 and the image acquired by the image processing unit 600. Based on the coordinate system transformation relationship and the image of the carrier unit 100, the trajectory is planned to obtain the target cutting trajectory and the preset descent distance required for the cutting head 320 to descend. The control unit 400 controls the horizontal movement unit 200 and the cutting unit 300 to move accordingly, so as to drive the cutting head 320 to descend the preset descent distance and cut the scrap material 11 to be cut along the target cutting trajectory.

[0046] By setting up a carrier unit 100 to support the integrated circuit 10, a horizontal moving unit 200 drives the carrier unit 100 and the integrated circuit 10 to move horizontally, and a vertical moving component 310 drives the cutting head 320 to move vertically. The cutting head 320 cuts the scrap material 11 to be cut from the edge of the integrated circuit 10. Simultaneously, the image processing unit 600 can calibrate and obtain the target cutting trajectory and the preset descent distance required for the cutting head 320. The control unit 400 controls the movement of the horizontal moving unit 200 and the vertical moving component 310, causing the cutting head 320 to descend the preset distance and cut along the target cutting trajectory, ensuring cutting accuracy. Furthermore, by using the horizontal moving unit 200 and the vertical moving component 310 to move the integrated circuit 10 and the cutting head 320, manual operation is replaced, resulting in higher efficiency and accuracy, a higher degree of automation, and effectively reduced labor costs.

[0047] It is worth noting that the calibration component 610 includes a calibration plate, and the image processing unit 600 can acquire images of the calibration plate placed at different positions, and perform position calibration transformation between image coordinates, camera coordinate system, and world coordinate system using a hand-eye calibration algorithm, thereby achieving calibration. The specific calibration method is existing technology and will not be elaborated here.

[0048] In this embodiment, the X and Y directions are vertically aligned. The horizontal movement unit 200 includes an X-direction movement component 210 and a Y-direction movement component 220. The carrier unit 100 is disposed on the Y-direction movement component 220, and the Y-direction movement component 220 is disposed on the X-direction movement component 210. The X-direction movement component 210 drives the Y-direction movement component 220 and the carrier unit 100 to move along the X direction, and the Y-direction movement component 220 drives the carrier unit 100 to move along the Y direction. Both the X-direction movement component 210 and the Y-direction movement component 220 are configured as linear modules, which have high repeatability and high gain response feedback, and can meet the requirements of the integrated circuit 10 during cutting operations.

[0049] Specifically, the Y-axis moving assembly 220 includes a Y-axis mounting base 221, a Y-axis drive member 222, a Y-axis lead screw 223, a Y-axis slider, a Y-axis mounting plate 224, and a Y-axis guide rail 225. The Y-axis mounting base 221 is located at the moving end of the X-axis moving assembly 210. The Y-axis drive member 222 drives the Y-axis lead screw 223 to rotate relative to the Y-axis mounting base 221. Both the Y-axis lead screw 223 and the Y-axis guide rail 225 extend along the Y-axis. The Y-axis slider is threadedly connected to the Y-axis lead screw 223. The Y-axis mounting plate 224 is located on the Y-axis slider and slidably connected to the Y-axis guide rail 225. The carrier unit 100 is located on the Y-axis mounting plate 224. Two Y-axis guide rails 225 are provided, located on opposite sides of the Y-axis lead screw 223.

[0050] Furthermore, the X-axis moving assembly 210 includes an X-axis mounting base 211, an X-axis drive member 212, an X-axis lead screw 213, an X-axis slider, an X-axis mounting plate 214, and an X-axis guide rail 215. The X-axis drive member 212 drives the X-axis lead screw 213 to rotate relative to the X-axis mounting base 211. Both the X-axis lead screw 213 and the X-axis guide rail 215 extend along the X-axis. The X-axis slider is threadedly connected to the X-axis lead screw 213. The X-axis mounting plate 214 is disposed on the X-axis slider and slidably connected to the X-axis guide rail 215. The Y-axis moving assembly 220 is disposed on the X-axis mounting plate 214. Two X-axis guide rails 215 are provided, located on opposite sides of the Y-axis lead screw 223.

[0051] Preferably, the X-direction moving assembly 210 further includes an X-direction limiting member for limiting the extreme positions of both ends of the X-direction mounting plate 214 along the X direction, to ensure reliable movement of the X-direction mounting plate 214 in the X direction; and / or the Y-direction moving assembly 220 further includes a Y-direction limiting member for limiting the extreme positions of both ends of the Y-direction mounting plate 224 along the Y direction, to ensure reliable movement of the Y-direction mounting plate 224 in the Y direction. Exemplarily, the limiting member can be a mechanical limiting member, such as a limiting block disposed on the mounting base, guide rail, or lead screw, which achieves limiting through the contact between the limiting block and the mounting plate; or the limiting member can be a sensor or proximity switch, and correspondingly communicate with the driving component, thereby improving the reliability of movement and also enhancing the automation level of the moving assembly.

[0052] In this embodiment, the scrap removal device is further provided with a mounting bracket 500. The cutting unit 300 and the image processing unit 600 are both mounted on the mounting bracket 500, and the horizontal moving unit 200 is located below the mounting bracket 500. This arrangement facilitates the image processing unit 600 in acquiring images of the integrated circuit 10 placed on the horizontal moving unit 200, and also facilitates the descent of the cutting head 320 to cut the integrated circuit 10. Preferably, the image processing unit 600 is positioned close to the cutting unit 300, resulting in a larger overlap between the field of view of the image processing unit 600 and the cuttable range of the cutting head 320, thus improving positioning accuracy and increasing the working range.

[0053] Optionally, the vertical moving assembly 310 includes a vertical mounting base 311, a vertical drive member 312, a vertical lead screw 313, a vertical slider 314, and a vertical guide rail 315. The vertical drive member 312 drives the vertical lead screw 313 to rotate relative to the vertical mounting base 311. Both the vertical lead screw 313 and the vertical guide rail 315 extend vertically. The vertical slider 314 is threadedly connected to the vertical lead screw 313 and slidably connected to the vertical guide rail 315. The cutting head 320 is disposed on the vertical slider 314. The vertical mounting base 311 is disposed on the mounting bracket 500.

[0054] Preferably, the vertical moving component 310 is further provided with an adapter plate 330, which is disposed on the vertical slider 314, and the cutting head 320 is detachably connected to the vertical slider 314. Exemplarily, the adapter plate 330 is L-shaped. By providing the adapter plate 330, the installation between the cutting head 320 and the vertical moving component 310 is facilitated, reducing interference between them. Simultaneously, the detachable cutting head 320 facilitates replacement, improving the service life of the scrap removal device.

[0055] For example, the mounting bracket 500 includes a mounting beam and support beams disposed at both ends of the mounting beam, the mounting beam extending horizontally. That is, the mounting bracket 500 is in the form of a gantry and spans above the carrier unit 100 and the horizontal moving unit 200. In this embodiment, the mounting beam extends along the Y direction and is arranged parallel to the Y guide rail 225.

[0056] It is worth noting that, to further increase the working range of the cutting head 320 and the image processing unit 600, the vertical moving component 310 and the image processing unit 600 are slidably mounted on the mounting beam in the vertical direction; and / or, the vertical moving component 310 and the image processing unit 600 are slidably mounted on the mounting beam. This arrangement increases the adjustable range of the cutting head 320 and the image processing unit 600 relative to the integrated circuit 10, adapting to more scrap removal scenarios and improving the practicality of the scrap removal device. The drive component can be configured with reference to the X-axis moving component 210, the Y-axis moving component 220, or the vertical moving component 310; no specific limitation is made here.

[0057] Optionally, the vertical moving component 310 and the image processing component 600 are slidably connected to the mounting beam via different drive components. During use, the operator can adjust the positions of the vertical moving component 310 and the image processing component 600 relative to the mounting beam as needed. Alternatively, the vertical moving component 310 and the image processing component 600 can be relatively fixed, which reduces the number of drive components and simplifies the structure.

[0058] In other embodiments, the mounting bracket 500 is configured to move horizontally. For example, the mounting bracket 500 is configured to move along the X direction. This configuration can effectively reduce the extension length of the X-direction moving component 210 in the X direction while ensuring the working distance in the X direction, thereby reducing the size of the scrap removal device in the X direction.

[0059] In this embodiment, the carrier unit 100 includes a platform 110 and a frame 120. The frame 120 is detachably mounted on the platform 110 and includes an annular chuck 121 and a UV film 122. The integrated circuit 10 is mounted on the UV film 122, and a deviation of ±2.5° is allowed during attachment. The UV film 122 is fixedly mounted on the annular chuck 121 by tension. The frame 120 is used to realize the installation and positioning of the integrated circuit 10 and the carrier unit 100.

[0060] Specifically, the stage 110 includes a vacuum suction cup 111 and at least three grippers 112 disposed around the vacuum suction cup 111. The vacuum suction cup 111 is used to adsorb the UV film 122, and the at least three grippers 112 are used to hold the annular chuck 121. By simultaneously positioning and fixing the UV film 122 and the annular chuck 121, the accuracy and reliability of the installation and positioning of the integrated circuit 10 in the carrier unit 100 are effectively improved.

[0061] Furthermore, the image processing unit 600 is configured as a CCD camera, and the control unit 400 also includes a PLC control box, an industrial computer, and software. The aforementioned CCD camera, Y-axis drive unit 222, X-axis drive unit 212, vertical drive unit 312, and the drive units of the vacuum suction cup 111 and gripper 112 are all communicatively connected to the PLC control box to realize the automated control of the scrap removal device by the control unit 400.

[0062] like Figure 7 As shown, this embodiment also discloses a scrap removal method, employing any of the above-described scrap removal devices. The scrap removal method includes: resetting the horizontal moving unit 200 and the cutting unit 300 to their initial positions; calibrating the cutting head 320 with the image processing unit 600; placing the integrated circuit 10 on the carrier unit 100, and moving the carrier unit 100 below the cutting unit 300 with the horizontal moving unit 200; acquiring an image of the integrated circuit 10 with the image processing unit 600 and obtaining the target cutting trajectory and a preset descent distance; driving the cutting head 320 to descend the preset descent distance with the vertical moving component 310, and moving the horizontal moving unit 200 to cut according to the target cutting trajectory; resetting the horizontal moving unit 200 and the cutting unit 300 to their initial positions again, and removing the integrated circuit 10 from the carrier unit 100.

[0063] It is worth noting that after the scrap 11 of an integrated circuit 10 is cut and removed, it is not necessary to recalibrate it. The next integrated circuit 10 can be placed directly in the carrier unit 100 for movement and cutting until the end.

[0064] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A scrap removal device, characterized in that, include: A carrier unit (100) is used to carry an integrated circuit (10), the integrated circuit (10) including a product and a scrap piece (11) to be cut located around the product; A horizontal moving unit (200) is provided, wherein the vehicle unit (100) is disposed on the horizontal moving unit (200), and the horizontal moving unit (200) is capable of driving the vehicle unit (100) to move; The cutting unit (300) includes a vertical moving component (310) and a cutting head (320) disposed on the vertical moving component (310). The vertical moving component (310) is disposed above the horizontal moving unit (200) and can drive the cutting head (320) to move. The cutting head (320) is used to cut the scrap material (11) to be cut from the integrated circuit (10). An image processing unit (600) refers to a preset calibration component (610) to calibrate the coordinate system transformation relationship between the image processing unit (600) and the image acquired by the image processing unit (600), and performs trajectory planning based on the coordinate system transformation relationship and the image of the vehicle unit (100) to obtain the target cutting trajectory and the preset descent distance required for the cutting head (320) to descend; The control unit (400) controls the horizontal moving unit (200) and the cutting unit (300) to perform corresponding actions, so as to drive the cutting head (320) to descend the preset descent distance and cut the scrap material (11) to be cut along the target cutting trajectory.

2. The scrap removal device according to claim 1, characterized in that, The horizontal moving unit (200) includes an X-axis moving component (210) and a Y-axis moving component (220). The vehicle unit (100) is disposed on the Y-axis moving component (220), and the Y-axis moving component (220) is disposed on the X-axis moving component (210). The X-axis moving component (210) is used to drive the Y-axis moving component (220) and the vehicle unit (100) to move along the X-axis, and the Y-axis moving component (220) is used to drive the vehicle unit (100) to move along the Y-axis.

3. The scrap removal device according to claim 2, characterized in that, The Y-axis moving assembly (220) includes a Y-axis mounting base (221), a Y-axis drive (222), a Y-axis lead screw (223), a Y-axis slider, a Y-axis mounting plate (224), and a Y-axis guide rail (225). The Y-axis mounting base (221) is disposed at the moving end of the X-axis moving assembly (210). The Y-axis drive (222) drives the Y-axis lead screw (223) to rotate relative to the Y-axis mounting base (221). The Y-axis lead screw (223) and the Y-axis guide rail (225) both extend along the Y-axis. The Y-axis slider is threadedly connected to the Y-axis lead screw (223). The Y-axis mounting plate (224) is disposed on the Y-axis slider and slidably connected to the Y-axis guide rail (225). The carrier unit (100) is disposed on the Y-axis mounting plate (224). And / or, the X-axis moving assembly (210) includes an X-axis mounting base (211), an X-axis drive (212), an X-axis lead screw (213), an X-axis slider, an X-axis mounting plate (214), and an X-axis guide rail (215). The X-axis drive (212) drives the X-axis lead screw (213) to rotate relative to the X-axis mounting base (211). The X-axis lead screw (213) and the X-axis guide rail (215) both extend along the X-axis. The X-axis slider is threadedly connected to the X-axis lead screw (213). The X-axis mounting plate (214) is disposed on the X-axis slider and slidably connected to the X-axis guide rail (215). The Y-axis moving assembly (220) is disposed on the X-axis mounting plate (214).

4. The scrap removal device according to claim 1, characterized in that, The vertical moving assembly (310) includes a vertical mounting base (311), a vertical drive member (312), a vertical lead screw (313), a vertical slider (314), and a vertical guide rail (315). The vertical drive member (312) drives the vertical lead screw (313) to rotate relative to the vertical mounting base (311). Both the vertical lead screw (313) and the vertical guide rail (315) extend vertically. The vertical slider (314) is threadedly connected to the vertical lead screw (313) and slidably connected to the vertical guide rail (315). The cutting head (320) is disposed on the vertical slider (314).

5. The scrap removal device according to claim 4, characterized in that, The vertical moving component (310) is also provided with an adapter plate (330), which is disposed on the vertical slider (314), and the cutting head (320) is detachably connected to the vertical slider (314).

6. The scrap removal device according to claim 1, characterized in that, The carrier unit (100) includes a platform (110) and a frame (120). The frame (120) is detachably disposed on the platform (110). The frame (120) includes an annular chuck (121) and a UV film (122). The integrated circuit (10) is disposed on the UV film (122), and the UV film (122) is disposed on the annular chuck (121).

7. The scrap removal device according to claim 6, characterized in that, The stage (110) includes a vacuum chuck (111) and at least three grippers (112) disposed around the vacuum chuck (111). The vacuum chuck (111) is used to adsorb the UV film (122), and the at least three grippers (112) are used to hold the annular chuck (121).

8. The scrap removal device according to any one of claims 1-7, characterized in that, The scrap removal device is also provided with a mounting bracket (500), the cutting unit (300) and the image processing unit (600) are both provided on the mounting bracket (500), and the horizontal moving unit (200) is provided below the mounting bracket (500).

9. The scrap removal device according to claim 8, characterized in that, The mounting bracket (500) includes a mounting beam and support beams disposed at both ends of the mounting beam, the mounting beam extending in a horizontal direction; the vertical moving component (310) and the image processing component (600) are slidably disposed on the mounting beam in a vertical direction; And / or, the vertical moving component (310) and the image processing component (600) are slidably disposed on the mounting beam; And / or, the mounting bracket (500) is movable in the horizontal direction.

10. The scrap removal device according to any one of claims 1-7, characterized in that, The calibration component (610) includes a calibration plate. The image processing component (600) can acquire images of the calibration plate placed at different positions and perform position calibration transformation of image coordinates, camera coordinate system and world coordinate system through hand-eye calibration algorithm, thereby realizing calibration.

Images