Circuit board glue injection shell

Abstract

The utility model discloses a circuit board glue injection housing comprising a housing assembly, and the housing assembly comprises a bottom housing, an upper cover arranged above the bottom housing, a rib plate arranged in the middle of the bottom housing, and wire notches arranged at two ends of the bottom housing. And the adaptive sealing assembly comprises an arc-shaped opening formed in the position of the wire notch and an arc-shaped rod clamped into the arc-shaped opening. According to the utility model, through mutual cooperation of the housing assembly and the adaptive sealing assembly, two sets of dies are not needed during use, a product is formed in one step, the process is simple, the glue injection process is smooth, wires are not damaged or normal work of a circuit board is not influenced, and the reject ratio is greatly reduced; the waterproof performance is good, the arc-shaped pressing piece can be replaced through sliding of the arc-shaped rod, it is ensured that the diameter of the arc-shaped opening is smaller than that of the wire rod, and therefore after the upper cover is pressed tightly, the wire rod is squeezed by the arc-shaped pressing piece to slightly deform and better attached to the wire groove, and the sealing effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board encapsulation housing technology, specifically a circuit board encapsulation housing. Background Technology

[0002] In existing technology, the circuit board casing is injection molded twice—once with an inner mold and once with an outer mold—before being inspected. This ensures the product meets the specified electrical performance, waterproof rating, and environmental protection requirements. However, this injection molding structure requires two sets of molds, resulting in higher costs, more complex processes, and longer production cycles. The injection molding process also carries the risk of short circuits, pressure resistance issues, and poor sealing, increasing the defect rate. Furthermore, the rework process for defective products is cumbersome and wastes significant amounts of materials. Utility Model Content

[0003] Therefore, the purpose of this utility model is to provide a circuit board injection housing. Through the cooperation of the housing component and the matching sealing component, the product can be formed in one step without the need for two sets of molds. The process is simple, the injection process is smooth, and it will not damage the wires or affect the normal operation of the circuit board, greatly reducing the defect rate. The wires are arranged in a row and separated by the bottom plate groove. The top cover is pressed tightly, which has good waterproof performance. In addition, the arc-shaped pressure plate can be replaced by sliding the arc-shaped rod to ensure that the diameter of the arc opening is smaller than the wire. In this way, after the top cover is pressed, the wires are squeezed by the arc-shaped pressure plate and undergo slight deformation, which better fits the wire groove and improves the sealing effect.

[0004] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: a circuit board potting housing, comprising:

[0005] The outer shell assembly includes a bottom shell, a top cover above the bottom shell, a stiffening plate in the middle of the bottom shell, and grooves at both ends of the bottom shell.

[0006] The adapter closure component includes an arc-shaped opening at the location of the groove, an arc-shaped rod that snaps into the arc-shaped opening, an arc-shaped pressure plate connected to the arc-shaped rod, a first annular groove on the bottom shell frame, and an annular protrusion fixed to the inside of the top cover.

[0007] In a preferred embodiment of the circuit board encapsulation housing described in this utility model, the arc-shaped rod slides along the arc-shaped opening, and the outer wall of the arc-shaped pressure plate is in contact with the inner wall of the wire groove.

[0008] In a preferred embodiment of the circuit board encapsulation housing described in this utility model, the upper cover and the bottom shell fit together, and the annular protrusion engages with the first annular groove.

[0009] In a preferred embodiment of the circuit board encapsulation housing described in this utility model, the circuit board is fixed at the position of the rib plate, and the position of the circuit board is lower than the center point of the wire groove.

[0010] As a preferred embodiment of the circuit board encapsulation housing described in this utility model, it further includes a sealing assembly, which includes an annular sealing groove formed on the top surface of the bottom shell and an annular film fixed to the bottom surface of the top cover.

[0011] In a preferred embodiment of the circuit board encapsulation housing described in this utility model, the annular sealing groove and the annular film are engaged with each other, and the end of the annular film is squeezed within the annular sealing groove.

[0012] In a preferred embodiment of the circuit board encapsulation housing described in this utility model, the bottom shell and the top cover are welded together.

[0013] Compared with the prior art, the advantages of this utility model are:

[0014] 1. By combining the outer shell components and the matching sealing components, the product can be molded in one piece without the need for two sets of molds. The process is simple, the glue injection process is smooth, and it will not damage the wires or affect the normal operation of the circuit board, which greatly reduces the defect rate. The wires are arranged in a row and separated by the groove in the bottom plate. The top cover is pressed tightly, which has good waterproof performance. In addition, the arc-shaped pressure plate can be replaced by sliding the arc-shaped rod to ensure that the diameter of the arc opening is smaller than the wire. In this way, after the top cover is pressed tightly, the wires are squeezed by the arc-shaped pressure plate and undergo slight deformation, which better fits the wire groove and improves the sealing effect.

[0015] Second, the sealing components can provide a secondary seal between the bottom shell and the top cover, preventing leakage during the glue injection process. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0017] Figure 1 This is a structural diagram of the present invention;

[0018] Figure 2 This is a structural diagram of the enclosure component adapted to this utility model;

[0019] Figure 3This is a structural diagram of the sealing assembly of this utility model.

[0020] In the diagram: 11. Bottom shell; 12. Top cover; 13. Rib plate; 14. Groove; 21. Arc-shaped opening; 22. Arc-shaped rod; 23. Arc-shaped pressure plate; 24. First annular groove; 25. Annular protrusion; 31. Annular sealing groove; 32. Annular film. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0025] This utility model provides a circuit board injection housing. Through the cooperation of the housing component and the matching sealing component, the product can be formed in one step without the need for two sets of molds. The process is simple, the injection process is smooth, and it will not damage the wires or affect the normal operation of the circuit board, greatly reducing the defect rate. The wires are arranged in a row and separated by the groove in the bottom plate. The top cover is pressed tightly, which has good waterproof performance. In addition, the arc-shaped pressure plate can be replaced by sliding the arc-shaped rod to ensure that the diameter of the arc opening is smaller than the wire. In this way, after the top cover is pressed, the wires are squeezed by the arc-shaped pressure plate and undergo slight deformation, which better fits the wire groove and improves the sealing effect.

[0026] Figure 1 , Figure 2 , Figure 3 The diagram shown is an overall structural schematic of one embodiment of the circuit board potting shell of this utility model. Please refer to [link / reference]. Figure 1 , Figure 2 , Figure 3 The main structure of this embodiment includes: a housing assembly and an adapter enclosure assembly.

[0027] The housing assembly is used in conjunction with the adapter enclosure assembly. Specifically, the housing assembly includes a bottom shell 11, a top cover 12 located above the bottom shell 11, a stiffening plate 13 located in the middle of the bottom shell 11, and wire grooves 14 opened at both ends of the bottom shell 11.

[0028] In practical use, the user fixes the circuit board at the position of the reinforcing plate 13, and the circuit board's pipeline passes through the wire slot 14. At this time, the glue is injected. After the glue is fully filled and leveled, the top cover 12 is placed on the bottom shell 11 and soldered. After solidification, the position of the circuit board to be inspected is lower than the center point of the wire slot 14 to ensure that the glue can fully wrap the circuit board during injection.

[0029] The adapter sealing component is used to fit the wire groove 14 and prevent the adhesive from leaking out through the wire groove 14. Specifically, the adapter sealing component includes an arc-shaped opening 21 at the position of the wire groove 14, an arc-shaped rod 22 that is inserted into the arc-shaped opening 21, an arc-shaped pressure plate 23 connected to the arc-shaped rod 22, a first annular groove 24 on the side of the bottom shell 11, and an annular protrusion 25 fixed to the inside of the top cover 12.

[0030] In practical use, the arc-shaped rod 22 slides along the arc-shaped opening 21, and the outer wall of the arc-shaped pressure plate 23 fits against the inner wall of the wire groove 14. This allows for the free selection of arc-shaped pressure plates 23 that are compatible with the diameter of the wire groove 14, ensuring that the diameter of the circuit board's pipeline is larger than the diameter of the arc-shaped opening 21. When the upper cover 12 and the bottom shell 11 are pressed together, the pipeline deforms, better fitting the wire groove 14 and preventing leakage. Furthermore, the replaceable structure of the arc-shaped pressure plate 23 allows it to be used with pipelines of different diameters.

[0031] Furthermore, it also includes a sealing assembly, which includes an annular sealing groove 31 opened on the top surface of the bottom shell 11 and an annular film 32 fixed on the bottom surface of the top cover 12.

[0032] In actual use, during the process of the upper cover 12 and the bottom shell 11 being closed, the annular sealing groove 31 and the annular film 32 engage with each other, and the end of the annular film 32 is squeezed inside the annular sealing groove 31, thus forming a seal. Furthermore, since the annular protrusion 25 engages with the first annular groove 24, a double seal is formed. Since the first annular groove 24 is located on the side wall of the bottom shell 11 and the annular sealing groove 31 is located at the top of the bottom shell 11, there is a space between the two seals. Even if liquid leaks at the first annular groove 24, the space between the two seals and the annular sealing groove 31 provide a secondary seal, further preventing liquid leakage.

[0033] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A circuit board encapsulation housing, characterized in that, include: The outer shell assembly includes a bottom shell (11), a top cover (12) above the bottom shell (11), a stiffening plate (13) in the middle of the bottom shell (11), and grooves (14) at both ends of the bottom shell (11). The adapter closure component includes an arc-shaped opening (21) at the location of the groove (14), an arc-shaped rod (22) inserted into the arc-shaped opening (21), an arc-shaped pressure plate (23) connected to the arc-shaped rod (22), a first annular groove (24) on the frame of the bottom shell (11), and an annular protrusion (25) fixed to the inside of the top cover (12).

2. The circuit board encapsulation housing according to claim 1, characterized in that, The arc-shaped rod (22) slides along the arc-shaped opening (21), and the outer wall of the arc-shaped pressure plate (23) fits against the inner wall of the groove (14).

3. The circuit board encapsulation housing according to claim 2, characterized in that, The upper cover (12) and the bottom shell (11) fit together, and the annular protrusion (25) engages with the first annular groove (24).

4. The circuit board encapsulation housing according to claim 3, characterized in that, The rib (13) is fixed with a circuit board, and the position of the circuit board is lower than the center point of the groove (14).

5. A circuit board encapsulation housing according to claim 4, characterized in that, It also includes a sealing assembly, which includes an annular sealing groove (31) formed on the top surface of the bottom shell (11) and an annular film (32) fixed to the bottom surface of the top cover (12).

6. The circuit board potting housing according to claim 5, characterized in that: The annular sealing groove (31) engages with the annular film (32), and the end of the annular film (32) is squeezed inside the annular sealing groove (31).

7. A circuit board encapsulation housing according to claim 6, characterized in that: The bottom shell (11) and the top cover (12) are welded together.

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