Consumable chip, chip assembly and consumable box

Abstract

The utility model provides a consumable chip which is used for being installed in imaging equipment and is characterized in that the consumable chip comprises at least one conductive part which is connected with an electronic module of the consumable chip and is not used for being in contact with a probe on the side of the imaging equipment; a plurality of probe contact portions for contacting probes on the imaging device side; wherein at least one probe contact part of the consumable chip is electrically disconnected from the electronic module in an initial state; the auxiliary part is used for carrying out initialization recovery on the transformed chip when necessary, so that the technical problem that part of existing consumable chips are poor in upgrading resistance is at least solved.

Description

Technical Field

[0001] This application relates to the field of printing consumable chips, and more particularly to a consumable chip, chip assembly, and consumable box. Background Technology

[0002] Imaging equipment consumables typically refer to consumable products used in imaging devices, such as toner cartridges and ink cartridges. In smart imaging devices, consumables usually contain consumable chips used for functions such as consumable identification, printing technology, and consumable level reading. Consumable chips consist of a substrate and an integrated chip. To meet the needs of consumable chip regeneration or performance improvement, some compatible manufacturers modify or redesign the original manufacturer's consumable chips.

[0003] like Figure 1 The image shown is a front view of the substrate of an original equipment manufacturer's consumable chip in the prior art. It has multiple metal contact terminals, including: chip select terminal (RST, sometimes also called reset terminal), clock terminal (SCL), data terminal (SDA), power terminal (VCC), and ground terminal (GND).

[0004] like Figure 2 As shown, the consumable chip described in patent application 201410522659.3 is a compatible manufacturer's consumable chip. This consumable does not require a chip select terminal, avoiding many potential problems caused by using the chip select signal (RST) to control read and write operations, such as signal interference or poor contact leading to chip select signal jumps, which can cause data communication interruptions, errors, or data corruption. However, this method requires data reading and writing operations based on a clock signal. If the imaging device is upgraded and cannot perform read and write operations according to the clock signal, the solution in this application will cause the consumable chip to fail to correctly write or read data. In addition, after the imaging device is upgraded, the chip select terminal needs to be reconfigured on the consumable chip so that the consumable chip can communicate normally with the imaging device, which involves the recycling of the consumable chip, increasing time and recycling costs. Summary of the Invention

[0005] This application provides a consumable chip, a chip assembly, and a consumable box to at least solve the technical problem of poor upgrade resistance of some existing consumable chips.

[0006] To achieve the above objectives, in a first aspect, this application provides a consumable chip for installation in an imaging device, characterized in that the consumable chip includes: at least one conductive portion connected to an electronic module of the consumable chip and not used for contacting a probe on the imaging device side; a plurality of probe contact portions for contacting a probe on the imaging device side; wherein at least one of the probe contact portions of the consumable chip is electrically disconnected from the electronic module in an initial state.

[0007] Furthermore, at least one of the probe contacts, which is electrically disconnected from the electronic module, is provided with a lead-out portion that extends toward the conductive portion. In the initial state, the lead-out portion is electrically disconnected from the conductive portion.

[0008] Furthermore, at least one of the probe contacts is not copper-clad, and there is no electrical disconnect between it and the electronic module.

[0009] Furthermore, at least one of the probe contacts is provided with a positioning part, which is electrically disconnected from the electronic module.

[0010] Secondly, this application provides a chip assembly, including: the consumable chip described in this application; and an auxiliary part, the auxiliary part being used to realize an electrical connection between the conductive part and at least one probe contact part that is electrically disconnected from the electronic module in a restored state.

[0011] Furthermore, in the consumable chip installation state, two orthogonal straight lines are designated as the first imaginary line and the second imaginary line. All probe contacts and conductive parts of the consumable chip are projected onto the first imaginary line along the top view direction. The second imaginary line passes through the midpoint between the two farthest projection positions of all probe contacts. When one region is designated as the first region and the other region as the second region relative to the second imaginary line, the center projection of the conductive part is located in the region with less projection or on the second imaginary line.

[0012] Furthermore, the auxiliary part is an electrical switch or a manual switch, and the auxiliary part, the conductive part, and at least a portion of the lead-out part are disposed on the mounting surface of the consumable chip.

[0013] Furthermore, in the initial state, the auxiliary part is a separable independent component relative to the consumable chip; in the restored state, the auxiliary part is disposed on the consumable chip; wherein, the auxiliary part is a conductive component and has a first connection end electrically connected to at least one of the probe contacts and a second connection end electrically connected to the conductive part, the probe contact surface of the first connection end is provided with copper plating; the first connection end and the second connection end are electrically connected.

[0014] Furthermore, the auxiliary part is a PCB board, and no electronic module is provided on the PCB board. The auxiliary part is also provided with other third connection terminals that are not electrically connected to the second connection terminal. The third connection terminal is provided with conductive double-sided contacts. In the restored state, one side of the double-sided contact is used to electrically connect to the probe on the imaging device side, and the other side of the double-sided contact is electrically connected to at least one probe contact of the consumable chip other than the probe contact portion. The other probe contact portions are electrically connected to the electronic module of the consumable chip.

[0015] Thirdly, this application provides a consumable box, including the consumable chip or chip assembly described in this application.

[0016] This application provides a consumable chip, chip assembly, and consumable box, which, through an auxiliary part, restores the modified consumable chip when necessary (such as during imaging equipment upgrades), allowing the consumable chip to enter a restored state.

[0017] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by a chip read / write device provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a prior art original consumable chip provided in the embodiments of this application;

[0020] Figure 2 A schematic diagram of a modified consumable chip for the prior art provided in this application embodiment;

[0021] Figure 3a This is a schematic diagram of a consumable chip assembly structure provided in an embodiment of this application;

[0022] Figure 3b This is a schematic diagram of a consumable chip assembly upgrade and repair structure provided in an embodiment of this application;

[0023] Figure 4a A schematic diagram of the front structure of a consumable chip assembly provided in another embodiment of this application;

[0024] Figure 4b This is a schematic diagram of the back structure of a consumable chip assembly provided in another embodiment of this application;

[0025] Figure 4c This is a schematic diagram of a consumable chip assembly upgrade and repair structure provided in another embodiment of this application;

[0026] Figure 5a This is a schematic diagram of the consumable chip assembly structure provided in another embodiment of this application;

[0027] Figure 5b This is a schematic diagram of a consumable chip assembly upgrade and repair structure provided in another embodiment of this application;

[0028] Figure 6a This is a schematic diagram of the consumable chip assembly structure provided in another embodiment of this application;

[0029] Figure 6b This is a schematic diagram of a consumable chip assembly upgrade and repair structure provided in another embodiment of this application;

[0030] Figure 7a This is a schematic diagram of the consumable chip assembly structure provided in another embodiment of this application;

[0031] Figure 7b This is a schematic diagram of a consumable chip assembly upgrade and repair structure provided in another embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1-Consumable chip; 2-Consumable chip substrate; 21-Probe contact; 22-First conductive part; 231-First lead-out part; 232-First auxiliary part; 233-Second lead-out part; 235-Second auxiliary part;

[0034] 236-Third auxiliary part; 237-First auxiliary contact part; 238-Fourth auxiliary part; 2381-Auxiliary conductive part; 2382-Second auxiliary contact part; 2383-Conductive connection part; 24-Electronic module;

[0035] 25 - Positioning section; 3 - Original chip. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] like Figure 1 The image shown is a front view of the substrate of the original manufacturer's chip 3 in the prior art. It has multiple metal contact terminals, including: chip select terminal (RST, sometimes also called reset terminal or strobe terminal), clock terminal (SCL), data terminal (SDA), power supply terminal (VCC) and ground terminal (GND).

[0038] like Figure 2 As shown, the consumable chip described in patent application 201410522659.3 is a modified consumable chip from a compatible manufacturer. This consumable does not require a chip select terminal, avoiding many potential problems caused by using the chip select signal (RST) to control read and write operations, such as signal interference or poor contact leading to chip select signal jumps, which in turn cause data communication interruptions, errors, or data corruption. However, this method requires data reading and writing operations based on a clock signal. Once the imaging device is upgraded and can no longer perform read and write operations according to the clock signal, the solution in this application will cause the consumable chip to be unable to correctly write or read data. In addition, after the imaging device is upgraded, the chip select terminal needs to be re-set on the consumable chip so that the consumable chip can communicate normally with the imaging device, which will involve the recycling of the consumable chip, increasing manufacturing time and recycling costs.

[0039] In the embodiments of this application, a consumable chip 1 is proposed, such as... Figures 3a-3b As shown, the consumable chip 1 includes a consumable chip substrate 2. An electronic module 24 (not shown) for communication with an imaging device and multiple probe contacts 21 for contacting probes on the imaging device side are disposed on the substrate. In a preferred embodiment, the electronic module 24 is disposed on a first side (back side) of the substrate 2, and the multiple probe contacts 21 are disposed on a second side (front side) of the substrate. The first and second sides are arranged opposite to each other. The multiple probe contacts 21 include: a chip select terminal (RST), a clock terminal (SCL), a data terminal (SDA), a power terminal (VCC), and a ground terminal (GND). At least one probe contact 21 is not connected to the electronic module 24; that is, at least one probe contact 21 (NC) on the consumable chip substrate 2 is disconnected from the electronic module 24. Figure 3a As shown, the probe contact 21 (NC), which is originally in contact with the probe used to transmit RST signals on the imaging device side, is electrically isolated from the electronic module 24 on the back of the consumable chip substrate 2 (or other places).

[0040] like Figure 3aAs shown, the probe contact surface of the consumable chip substrate 2 is also provided with a conductive part 22 that does not contact the probe on the imaging device side. Taking the example of at least one probe contact part 21 that is disconnected from the electronic module 24 in the embodiment of this application as an RST contact part, the conductive part 22 is a reserved RST terminal, and the conductive part 22 is electrically connected to the electronic module 24 disposed on the consumable chip substrate 2.

[0041] Preferably, the probe contact portion 21 may be provided with a first lead-out portion 231, which is a lead wire or conductive sheet or the like, leading out the probe contact portion 21 (NC) terminal that is not connected to the electronic module 24 to the vicinity of the conductive portion 22.

[0042] When the original manufacturer has not upgraded, the probe contact 21 (NC) that was originally in contact with the probe used to transmit the RST signal on the imaging device side has no signal transmission to the electronic module 24. The RST signal of the consumable chip 1 is generated by one or more combinations of other terminals (SCL, SDA, VCC, GND) of the chip 1 or an external non-probe RST signal source is introduced. In a preferred embodiment, the RST signal sent by the imaging device is simulated by extracting the clock signal of a specific time period and sent to the electronic module 24, thereby realizing the control of the consumable chip 1.

[0043] In the embodiments of this application, the electronic module 24 is used to store information of the consumable box, such as identity information and ink volume information. The electronic module can be implemented by integrated circuits, microcontrollers, etc. The electronic module further includes a control unit and a storage unit. The storage unit can adopt common non-volatile memory units, such as FUSE, EPROM, EEPROM, FLASH, ferroelectric memory units, phase change memory units, etc., or it can adopt a scheme of volatile memory units plus a power supply, such as SRAM plus a battery or capacitor, DRAM plus a battery or capacitor, etc. The control unit is used to control the communication between the consumable chip 1 and the imaging device. The imaging device reads information from the electronic module and stores information in the electronic module. The control unit can specifically be a microcontroller (MCU), microcontroller, FPGA, logic circuit (ASIC), etc. The composition of the electronic module can be selected according to actual needs, and is not limited here. The electronic module can be completely embedded in a wafer, or it can be implemented by external circuit modules.

[0044] In some embodiments of this application, at least one probe contact 21 that is not electrically connected to the electronic module 24 is not limited to the RST chip select terminal, but may also be the GND ground terminal. The GND signal of the consumable chip 1 is generated inside the chip or introduced from other places in the imaging device. In other embodiments, it may also be one or more of the SDA data terminal, SCL clock terminal, and VCC power terminal. There is no limitation here. The probe contact 21 that is not electrically connected to the electronic module 24 may be one or more.

[0045] Conductive part 22 Conductive part 22 Conductive part 22 Conductive part 22 In some embodiments of this application, a chip assembly is also provided, including the consumable chip 1 and auxiliary part described in any of the above embodiments. When the imaging equipment manufacturer upgrades, the previous method of simulating the RST signal by clock signal or other signals will no longer be applicable (taking the RST contact as an example, not limited to the implementation of other contact parts, such as simulating the GND ground signal). The previous chip solution will cause the consumable chip 1 to be unable to correctly write or read data information. At this time, it is necessary to set the RST contact on the consumable chip 1 so that the consumable chip 1 can communicate normally with the imaging equipment. In order to solve this technical problem, such as Figure 3b As shown, a first auxiliary part 232 is provided in the chip assembly. The first auxiliary part 232 is used to electrically connect the conductive part 22 and the probe contact part 21 (NC terminal) that is not connected to the electronic module 24, so that the probe contact part 21 is reconnected to the electronic module 24. In the embodiments of this application, by providing the auxiliary part, it is possible to prevent the consumable chip 1 modified after the imaging device is upgraded from being unusable.

[0046] The first auxiliary part 232 is a conductive component and has a first connection end electrically connected to the probe contact part 21 and a second connection end electrically connected to the conductive part 22. The probe contact surface of the first connection end is provided with copper plating; the first connection end and the second connection end are electrically connected.

[0047] In the embodiments of this application, the first auxiliary part 232 is a conductive object. Since the probe contact part 21 has been led out to the vicinity of the conductive part 22 through the pre-set first lead-out part 231 before the imaging device manufacturer upgrades, when the imaging device manufacturer upgrades, the lead-out process only requires connecting the first lead-out part 231 and the conductive part 22 by soldering. At this time, the first auxiliary part 232 can be solder. Preferably, a solder bath can be provided between the first lead-out part 231 and the conductive part 22, or the first lead-out part 231 can be in the form of an extension groove. When the imaging device manufacturer upgrades, solder is used as the first auxiliary part 232 to fill the solder bath or extension groove. Using solder as the first auxiliary part 232 makes the rework and upgrade of the consumable chip 1 more convenient, and the user can rework it himself using soldering tools.

[0048] In the embodiments of this application, the first auxiliary part 232 can also be conductive silver paste, which replaces soldering by coating conductive silver paste, making the operation simpler.

[0049] It is understandable that the first auxiliary part 232 may also include conductive tape, conductive patch, etc., to connect the two by wrapping or applying.

[0050] It should be noted that, in the embodiments of this application, the state in which the probe contact 21 is reconnected to the electronic module 24 is called the restored state; the state in which at least one probe contact 21 of the consumable chip 1 is disconnected from the electronic module 24 is called the initial state, and the initial state may not be applicable to the upgraded imaging device.

[0051] In one embodiment of this application, such as Figures 4a-4c As shown, the chip assembly includes a second auxiliary part 235, at least one probe contact part 21 led out through a second lead-out part 233, and a conductive part 22 electrically connected to the electronic module 24. Preferably, the conductive part 22 is in the form of a lead wire or a conductive contact. The initial state (un-upgraded state) of the second lead-out part 233 and the conductive part 22 is an open circuit. The second lead-out part 233 and the conductive part 22 can be disposed on the back side (mounting surface of the consumable box) or the front side (contact surface of the probe contact part 21) of the consumable chip substrate 2. Preferably, for the aesthetics of the consumable chip substrate 2, it can be disposed on the back side of the consumable chip substrate 2, and the second lead-out part 233 extends to the back side of the consumable chip substrate 2 through a via.

[0052] In the embodiments of this application, the second lead-out portion 233 and the conductive portion 22 are initially provided with a second auxiliary portion 235. Preferably, the second auxiliary portion 235 is an electronic switch. The electronic switch is initially open. When the imaging device manufacturer upgrades, the consumable chip 1 detects a communication abnormality and switches the electronic switch to a closed state. The probe contact portion 21 (NC terminal) provided on the consumable chip substrate 2 is reconnected to the electronic module 24 so that the consumable chip 1 can communicate normally with the imaging device. At this time, the consumable chip 1 is restored to the "original" mode (i.e., the restored state). Figure 4c As shown.

[0053] In the embodiments of this application, the second auxiliary part 235 may also be a mechanical switch (such as a micro switch), conductive tape, conductive sheet, etc. When the imaging equipment manufacturer upgrades, the second lead-out part 233 and the conductive part 22 are manually switched to a conduction mode.

[0054] In one embodiment of this application, such as Figures 5a-5bAs shown, the chip assembly includes a third auxiliary part 236, which is conductive. Preferably, the third auxiliary part 236 is conductive tape or other adhesive conductive sheet. If the imaging equipment manufacturer has not upgraded the device when the printing consumables are used, the third auxiliary part 236 can be discarded. In this case, at least one probe contact 21 (NC terminal) is disconnected from the electronic module 24. If the imaging equipment manufacturer upgrades the device, the third auxiliary part 236 can be attached to the probe contact 21 (NC terminal) and the conductive part 22.

[0055] In one embodiment of this application, such as Figures 6a-6b As shown, at least one probe contact 21 on the consumable chip substrate 2 is not provided with conductive material (copper plating), and the third auxiliary part 236 is made of conductive material, including a first connection terminal and a second connection terminal that are electrically connected. The first connection terminal is provided with a first auxiliary contact 237, and the probe contact surface of the first auxiliary contact 237 is provided with copper plating for contacting the probe on the imaging device side. Preferably, at least one probe contact 21 on the consumable chip substrate 2 is provided with a positioning part 25, such as a groove, text mark, color mark, graphic mark, etc. When the imaging device manufacturer upgrades, the first auxiliary contact 237 is connected to the positioning part 25 to contact the probe on the imaging device side, and the second connection terminal of the third auxiliary part 236 is electrically connected to the conductive part 22. If the imaging device manufacturer upgrades, the RST signal on the imaging device side is transmitted to the electronic module 24 on the consumable chip 1 in sequence through the first connection terminal (first auxiliary contact 237), the second connection terminal, and the conductive part 22 to resist the upgrade.

[0056] In one embodiment of this application, copper plating may be provided on the consumable chip substrate 2 (at the position corresponding to the positioning part 25), and the copper plating structure itself may be used as the positioning part 25.

[0057] In one embodiment of this application, such as Figures 7a-7b As shown, Figure 7a As shown, the chip assembly provides a fourth auxiliary part 238. Preferably, the fourth auxiliary part 238 is a PCB board without electronic modules, and more preferably a flexible PCB. The fourth auxiliary part 238 has a second auxiliary contact part 2382 that matches the number and position of probes corresponding to the probes on the imaging device side (e.g., Figure 7aAs shown, it includes an "NC" terminal, an SDA terminal, an SCL terminal, a VCC terminal, and a GND terminal, as well as an auxiliary conductive part 2381 corresponding to the position of the conductive part 22 on the consumable chip substrate 2. At least one second auxiliary contact part 2382 and the auxiliary conductive part 2381 are electrically connected through a conductive connection part 2383. Other second auxiliary contacts 2382 that are not electrically connected to the auxiliary conductive part 2381 are double-sided contacts (i.e., third connection ends that are conductive at both ends). When the imaging device is upgraded, it is only necessary to attach the fourth auxiliary part 238 to the consumable chip substrate 2 so that the probe contact part 21 and the second auxiliary contact part 2382 are set accordingly.

[0058] Preferably, in the embodiments of this application, the auxiliary conductive part 2381 is disposed on the back side of the fourth auxiliary part 238 (the side opposite to the side where the second auxiliary contact part 2382 of the fourth auxiliary part 238 is located, and the auxiliary conductive part 2381 is connected to the second auxiliary contact part 2382 through a via), or the auxiliary conductive part 2381 is a double-sided conductive contact (the back side is electrically connected to the conductive part 22 on the consumable chip substrate 2, and the front side is electrically connected to the second auxiliary contact part 2382).

[0059] In the embodiments of this application, it is preferred that, unlike 5a-5b, at least one probe contact portion 21 on the consumable chip substrate 2 may not be provided with conductive material (copper plating), making the consumable chip substrate 2 simpler. During the upgrade, the fourth auxiliary portion 238 directly covers the consumable chip substrate 2, and the "NC" contact on the fourth auxiliary portion 238 forms the probe contact portion 21.

[0060] In the embodiments of this application, it is preferable to set the fourth auxiliary part 238 to be consistent with the shape of the consumable chip substrate 2, or to set a positioning part on either the fourth auxiliary part 238 or the consumable chip substrate 2, so as to facilitate the pasting of the fourth auxiliary part 238 when upgrading the imaging device.

[0061] In the embodiments of this application, such as Figure 3a As shown, preferably, if the conductive part 22 is disposed on the probe contact surface of the consumable chip substrate 2, and the consumable chip 1 is in the mounted state, two orthogonal straight lines are designated as the first imaginary line S1 and the second imaginary line S2, and all probe contact parts 21 and conductive parts 22 of the consumable chip substrate 2 are projected onto the first imaginary line along the top view direction; in the embodiments of this application, the top view direction is the gravity direction of the imaging device ( Figure 3a (in the F direction); and the second imaginary line passes through the middle of the two farthest projection positions among all the projection positions of the probe contact portions 21 of the consumable chip substrate 2. When one region is designated as the first region and the other region as the second region relative to the second imaginary line, the center projection of the conductive portion 22 is located in the region with the fewest probe contact portions, or on the second imaginary line.

[0062] In the embodiments of this application, the positional relationship between the imaginary line and each projection is omitted in the drawings of other embodiments, but the actual implementation also satisfies the above results. The center projection of the conductive part 22 is located in the area with the fewest probe contacts, or on the second imaginary line.

[0063] In the embodiments of this application, the projection of the conductive part 22 is avoided to be located in an area with a large number of probe contacts, so that the consumable chip substrate 2 has more space for the wiring of the conductive part 22, and the design is more reasonable.

[0064] Furthermore, since at least one probe contact 21 (e.g., RST contact) on the consumable chip substrate 2 that is not electrically connected to the electronic module is located in an area with a large number of probe contacts, setting the conductive part 22 away from this area can reduce the risk of short circuit between the conductive part 22 and the probe contact 21 in an environment contaminated by foreign matter such as ink droplets.

[0065] Embodiments of this application also provide a consumable box, which includes the consumable chip 1 or consumable chip assembly provided in the embodiments of this application.

[0066] In the description of this application, it should be understood that the terms “center,” “length,” “width,” “thickness,” “top,” “bottom,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “inner,” “outer,” “axial,” and “circumferential” used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the location or original must have a specific orientation, or a specific construction and operation, and therefore should not be construed as a limitation of this application.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0068] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0069] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A consumable chip for installation in an imaging device, characterized in that, The consumable chip includes: At least one conductive part is connected to the electronic module of the consumable chip and is not used to contact the probe on the imaging device side; Multiple probe contacts are provided for contacting probes on the imaging device side. In this configuration, at least one of the probe contacts of the consumable chip is electrically disconnected from the electronic module in the initial state.

2. The consumable chip according to claim 1, characterized in that, At least one of the probe contacts, which is electrically disconnected from the electronic module, is provided with a lead-out portion that extends toward the conductive portion. In the initial state, the lead-out portion is electrically disconnected from the conductive portion.

3. The consumable chip according to claim 1, characterized in that, There is no copper plating on at least one of the probe contacts, which is electrically disconnected from the electronic module.

4. The consumable chip according to claim 1 or 3, characterized in that, At least one of the probe contacts is provided with a positioning part, which is electrically disconnected from the electronic module.

5. A chip assembly, characterized in that, Including the consumable chip as described in any one of claims 1-4; and An auxiliary part is provided for establishing an electrical connection between the conductive part and at least one probe contact that is electrically disconnected from the electronic module in the restored state.

6. The chip assembly according to claim 5, characterized in that, In the installed state of the consumable chip, two orthogonal straight lines are designated as the first imaginary line and the second imaginary line. All probe contacts and conductive parts of the consumable chip are projected onto the first imaginary line along the top view direction. The second imaginary line passes through the midpoint between the two farthest projection positions of all probe contacts. When one region is designated as the first region and the other region as the second region relative to the second imaginary line, the center projection of the conductive part is located in the region with less projection or on the second imaginary line.

7. The chip assembly according to claim 6, characterized in that, The auxiliary part is an electrical switch or a manual switch, and the auxiliary part, the conductive part, and at least a portion of the lead-out part are disposed on the mounting surface of the consumable chip.

8. The chip assembly according to claim 6, characterized in that, In the initial state, the auxiliary part is a separable independent component relative to the consumable chip. In the restored state, the auxiliary part is disposed on the consumable chip. The auxiliary part is a conductive component and has a first connection end electrically connected to at least one of the probe contacts and a second connection end electrically connected to the conductive part. The probe contact surface of the first connection end is provided with copper plating. The first connection end and the second connection end are electrically connected.

9. The chip assembly according to claim 8, characterized in that, The auxiliary part is a PCB board, on which no electronic module is provided. The auxiliary part is also provided with other third connection terminals that are not electrically connected to the second connection terminal. The third connection terminal is provided with conductive double-sided contacts. In the restored state, one side of the double-sided contact is used to electrically connect to the probe on the imaging device side, and the other side of the double-sided contact is electrically connected to at least one probe contact of the consumable chip other than the probe contact portion. The other probe contact portions are electrically connected to the electronic module of the consumable chip.

10. A consumable box, characterized in that, include: The consumable chip according to any one of claims 1-4 or the chip assembly according to any one of claims 5-9.

Images