Rapid feeding and separating mechanism

By designing a rapid feeding and separation mechanism, the problem of poor pick-up effect of microelectronic components during tape packaging was solved, achieving stable separation and efficient packaging, and improving packaging efficiency and the stability of the pick-up device.

CN223822114UActive Publication Date: 2026-01-23SUZHOU DONGYIKE PRECISION INTELLIGENT MFG CO LTD
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Patent Information

Application Number
CN202520299829.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2026-01-23
Estimated Expiration
2035-02-25

AI Technical Summary

Technical Problem

During the tape and reel packaging process, the placement of microelectronic components can easily lead to poor suction effect of the suction device, or even cause them to fall off midway, affecting packaging efficiency.

Method used

Design a rapid feeding and separation mechanism, including a spiral bowl feeder, a linear track, a material distribution block and a drive assembly. Through the cooperation of the suction port and the drive assembly, stable separation and horizontal placement of microelectronic components can be achieved, which is convenient for the suction device to pick up.

Benefits of technology

It improves the packaging efficiency of microelectronic components, ensures the stability and efficiency of the suction device, reduces the risk of dropping, and facilitates regular maintenance and monitoring.

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Abstract

The utility model belongs to the technical field of separating devices, and discloses a rapid feeding and separating mechanism which comprises a spiral bowl feeder used for containing microelectronic components, a linear rail connected with a discharging port of the spiral bowl feeder and a tool support arranged on one side of the linear rail. A conveying channel for sequentially conveying microelectronic components is arranged in the linear rail, and a material distributing block and a driving assembly used for driving the material distributing block to move towards the side away from the linear rail are arranged on the tool support in a sliding mode. A bearing groove used for bearing the microelectronic components is formed in the side, close to the linear rail, of the top of the material distributing block, a first air suction hole used for preventing the microelectronic components from continuing to advance is formed in the position, close to the material distributing block, of the bottom of the linear rail, and the first air suction hole is communicated with an external air suction system. The suction device can suck the separated microelectronic components into the carrier boxes of the carrier tape conveniently, and the packaging efficiency of the microelectronic components can be improved.
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Description

Technical Field

[0001] This utility model relates to the field of separation device technology, and in particular to a rapid feeding separation mechanism. Background Technology

[0002] For ease of use and transportation, and to meet the needs of automated production lines for modern electronic equipment assembly, microelectronic components generally require taping and packaging, hence the existence of taping and packaging machines.

[0003] After microelectronic components are manufactured, they are usually stored in a centralized manner. When the tape and reel machine is packaging microelectronic components, it usually uses a suction device to pick up the microelectronic components and place them into the carrier box of the carrier tape. Different placement positions of the microelectronic components may affect the suction effect of the suction device, which may easily lead to the microelectronic components falling off midway. Utility Model Content

[0004] To address the aforementioned problems, this invention provides a rapid feeding and separation mechanism.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a rapid feeding and separation mechanism, comprising a spiral bowl feeder for placing microelectronic components, a linear track connected to the discharge port of the spiral bowl feeder, and a tooling bracket disposed on one side of the linear track. The linear track is provided with a transmission channel for sequential transmission of microelectronic components. A material distribution block and a driving component for driving the material distribution block to move toward the side away from the linear track are slidably disposed on the tooling bracket. A receiving groove for receiving microelectronic components is provided on the top side of the material distribution block near the linear track. A first suction hole for preventing the microelectronic components from continuing to advance is provided at the bottom of the linear track near the material distribution block. The first suction hole is connected to an external suction system.

[0006] By adopting the above technical solution, after the microelectronic components are produced, they are placed in a spiral bowl feeder. The spiral bowl feeder is a commonly used product in the existing technology. After the spiral bowl feeder starts working, it vibrates the microelectronic components one by one into the transmission channel of the linear track (this part is the existing technology and does not need to be described in detail). When the microelectronic component at the front vibrates into the receiving groove of the material distribution block, the external suction system extracts the air from the first suction hole, causing the microelectronic component to stop moving forward. The drive component controls the material distribution block to separate from the linear track, thereby separating the microelectronic components. The microelectronic components are placed horizontally in the receiving groove, which makes it easy for the suction device to pick up the separated microelectronic components into the carrier box of the carrier belt, which helps to improve the packaging efficiency of microelectronic components.

[0007] Furthermore, the side wall of the material distribution block is provided with a second suction hole that communicates with the external suction system and a connecting hole for connecting the second suction hole with the bottom wall of the receiving groove.

[0008] By adopting the above technical solution, the external suction system can adsorb the microelectronic components located in the receiving groove through the second suction hole and the connecting hole, ensuring the stability of the drive component in the process of driving the material block away from the linear slide rail.

[0009] Furthermore, at least two first air intake holes are provided.

[0010] Furthermore, the drive assembly includes a guide rail fixed to the tooling bracket, a sliding seat that slides with the top of the guide rail, a mounting bracket fixed to the top of the sliding seat, a motor fixed to the tooling bracket, a rotating block fixed to the output end of the motor, and an eccentric wheel rotatably mounted on the rotating block; the length direction of the guide rail is parallel to the length direction of the linear track, the top of the mounting bracket is provided with a mounting groove for mounting the material distribution block on the side near the linear track, the rotation shaft of the eccentric wheel is located near the edge of the rotating block, and a groove that mates with the eccentric wheel is provided on one side of the sliding seat.

[0011] By adopting the above technical solution, after the motor works, it drives the rotating block and the eccentric wheel to rotate. Since the eccentric wheel is located near the edge of the rotating block, it pushes the sliding seat through the groove, so that the sliding seat moves back and forth along the guide rail. The sliding seat, the mounting frame and the material distribution block move synchronously, completing the separation action of microelectronic components. This is beneficial for the suction device to pick up the separated microelectronic components and improves the packaging efficiency of microelectronic components.

[0012] Furthermore, the motor is a servo motor.

[0013] Furthermore, the linear track includes a track body and splicing strips detachably connected to the track body, both of which have transmission channels.

[0014] By adopting the above technical solution, it is convenient for staff to regularly clean or maintain the transmission channel.

[0015] Furthermore, a C-shaped frame is fixed on the track body. The upper and lower frames of the C-shaped frame are located on the upper and lower sides of the track body, respectively. A laser emitter is fixed at the bottom of the upper frame of the C-shaped frame, and a laser receiver is fixed at the position corresponding to the laser emitter on the lower frame of the C-shaped frame. A through hole is provided at the position corresponding to the incident light beam of the laser emitter on the track body.

[0016] By adopting the above technical solution, the laser emitted by the laser emitter can pass through the through hole and be received by the laser receiver, which facilitates the control center of the equipment to monitor the microelectronic components in the transmission channel, so that the staff can replenish the microelectronic components in time when there is no material in the spiral bowl feeder.

[0017] In summary, this utility model has the following beneficial effects:

[0018] 1. This application facilitates the suction device to pick up the separated microelectronic components into the carrier box of the carrier tape, which is beneficial to improving the packaging efficiency of microelectronic components.

[0019] 2. In this application, the external suction system can adsorb the microelectronic components located in the receiving groove through the second suction hole and the connecting hole, which ensures the stability of the drive component in driving the material distribution block away from the linear slide rail. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the structure used to highlight the through hole in an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram illustrating the structure of microelectronic components in an embodiment of this utility model;

[0023] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0024] Figure 5 This is a schematic diagram of the material distribution block in an embodiment of this utility model;

[0025] Figure 6 This is a cross-sectional view of an embodiment of the present invention to highlight the connecting hole;

[0026] Figure 7 This is a schematic diagram illustrating the structure of the drive component in an embodiment of this utility model;

[0027] Figure 8 yes Figure 7 Enlarged diagram of point B in the middle.

[0028] In the diagram: 1. Microelectronic components; 2. Spiral bowl feeder; 3. Linear track; 30. Conveyor channel; 31. Track body; 32. Splicing strip; 33. First suction hole; 34. Through hole; 4. Material distribution block; 41. Receiving groove; 42. Second suction hole; 43. Connecting hole; 5. Drive assembly; 51. Guide rail; 52. Sliding seat; 521. Groove; 53. Mounting bracket; 531. Mounting groove; 54. Motor; 55. Rotating block; 56. Eccentric wheel; 6. C-shaped frame; 61. Laser emitter; 62. Laser receiver; 7. Tooling bracket. Detailed Implementation

[0029] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0030] like Figure 1-8 As shown in the figure, this application discloses a rapid feeding and separation mechanism, including a spiral cup feeder 2 for placing microelectronic components 1, a linear track 3 connected to the discharge port of the spiral cup feeder 2, and a tooling bracket 7 disposed on one side of the linear track 3. The linear track 3 is provided with a transmission channel 30 for sequentially transmitting microelectronic components 1. A material distribution block 4 and a driving component 5 for driving the material distribution block 4 to move toward the side away from the linear track 3 are slidably disposed on the tooling bracket 7. The top of the material distribution block 4 is provided with a receiving groove 41 for receiving microelectronic components 1 on the side near the linear track 3. The bottom of the linear track 3 is provided with a first suction hole 33 for preventing the microelectronic components 1 from continuing to move forward at a position near the material distribution block 4. The first suction hole 33 is connected to an external suction system, and at least two first suction holes 33 are provided.

[0031] After the microelectronic component 1 is produced, it is placed in the spiral bowl feeder 2. The spiral bowl feeder 2 is a commonly used product in the prior art. After the spiral bowl feeder 2 starts working, it vibrates the microelectronic component 1 one by one into the transmission channel 30 of the linear track 3 (this part is prior art and does not need to be described in detail). When the microelectronic component 1 at the front vibrates into the receiving groove 41 of the material distribution block 4, the external suction system extracts the air in the first suction hole 33, so that the microelectronic component 1 stops moving forward. The drive component 5 controls the material distribution block 4 to separate from the linear track 3, so that the microelectronic component 1 can be separated. The microelectronic component 1 is placed horizontally in the receiving groove 41, which makes it easy for the suction device to pick up the separated microelectronic component 1 into the carrier box of the carrier belt, which helps to improve the packaging efficiency of the microelectronic component 1.

[0032] The side wall of the material distribution block 4 is provided with a second suction hole 42 that communicates with the external suction system and a connecting hole 43 for connecting the second suction hole 42 with the bottom wall of the receiving groove 41. The external suction system can adsorb the microelectronic components 1 located in the receiving groove 41 through the second suction hole 42 and the connecting hole 43, ensuring the stability of the driving component 5 in driving the material distribution block 4 away from the linear slide rail.

[0033] The drive assembly 5 includes a guide rail 51 fixed on the tooling bracket 7, a sliding seat 52 that slides with the top of the guide rail 51, a mounting bracket 53 fixed to the top of the sliding seat 52, a motor 54 (the motor 54 is a servo motor) fixed on the tooling bracket 7, a rotating block 55 fixed to the output end of the motor 54, and an eccentric wheel 56 rotatably mounted on the rotating block 55. The length direction of the guide rail 51 is parallel to the length direction of the linear track 3. The top of the mounting bracket 53 is provided with a mounting groove 531 for mounting the material distribution block 4 on the side near the linear track 3. The rotation axis of the eccentric wheel 56 is located near the edge of the rotating block 55. The sliding seat 52 is provided with a groove 521 that cooperates with the eccentric wheel 56 on one side.

[0034] After the motor 54 starts working, it drives the rotating block 55 and the eccentric wheel 56 to rotate. Since the eccentric wheel 56 is located near the edge of the rotating block 55, the eccentric wheel 56 pushes the sliding seat 52 through the groove 521, so that the sliding seat 52 moves back and forth along the guide rail 51. The sliding seat 52, the mounting bracket 53 and the material separating block 4 move synchronously, completing the separation action of the microelectronic component 1. This is beneficial for the suction device to pick up the separated microelectronic component 1, and improves the packaging efficiency of the microelectronic component 1.

[0035] The linear track 3 includes a track body 31 and a splicing strip 32 that is detachably connected to the track body 31. Both the track body 31 and the splicing strip 32 have transmission channels 30, which facilitates regular cleaning or maintenance of the transmission channels 30 by the staff.

[0036] A C-shaped frame 6 is fixed on the track body 31. The upper and lower frames of the C-shaped frame 6 are located on the upper and lower sides of the track body 31, respectively. A laser emitter 61 is fixed at the bottom of the upper frame of the C-shaped frame 6. A laser receiver 62 is fixed at the position corresponding to the laser emitter 61 on the lower frame of the C-shaped frame 6. A through hole 34 is provided on the track body 31 at the position corresponding to the incident light of the laser emitter 61.

[0037] The laser emitted by the laser emitter 61 can pass through the through hole 34 and be received by the laser receiver 62, so that the control center of the equipment can monitor the microelectronic components 1 in the transmission channel 30, so that the staff can replenish the microelectronic components 1 in time when there is no material in the spiral bowl feeder 2.

[0038] The operating principle of the rapid feeding and separation mechanism in this embodiment is as follows: After the microelectronic component 1 is produced, it is placed in the spiral bowl feeder 2. The spiral bowl feeder 2 is a commonly used product in the prior art. After the spiral bowl feeder 2 works, it vibrates the microelectronic component 1 one by one into the transmission channel 30 of the linear track 3 (this part is prior art and does not need to be described in detail). When the microelectronic component 1 at the front vibrates into the receiving groove 41 of the separating block 4, the external suction system extracts the air in the first suction hole 33, so that the microelectronic component 1 stops moving forward. The drive component 5 controls the separating block 4 to separate from the linear track 3, so that the microelectronic component 1 can be separated. The microelectronic component 1 is placed horizontally in the receiving groove 41, which makes it easy for the suction device to pick up the separated microelectronic component 1 into the carrier box of the carrier belt, which is beneficial to improving the packaging efficiency of the microelectronic component 1.

[0039] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A rapid feeding and separation mechanism, characterized in that: The device includes a spiral cup feeder (2) for placing microelectronic components (1), a linear track (3) connected to the discharge port of the spiral cup feeder (2), and a tooling bracket (7) set on one side of the linear track (3). The linear track (3) is provided with a transmission channel (30) for sequential transmission of microelectronic components (1). A material distribution block (4) and a drive assembly (5) for driving the material distribution block (4) to move toward the side away from the linear track (3) are slidably arranged on the tooling bracket (7). A receiving groove (41) for receiving microelectronic components (1) is provided on the top of the material distribution block (4) near the side of the linear track (3). A first suction hole (33) for preventing microelectronic components (1) from moving forward is provided at the bottom of the linear track (3) near the position of the material distribution block (4). The first suction hole (33) is connected to an external suction system.

2. The rapid feeding and separating mechanism according to claim 1, characterized in that: The side wall of the material distribution block (4) is provided with a second suction hole (42) that communicates with the external suction system and a connecting hole (43) for connecting the second suction hole (42) with the bottom wall of the receiving groove (41).

3. The rapid feeding and separating mechanism according to claim 2, characterized in that: The first air intake hole (33) has at least two.

4. The rapid feeding and separating mechanism according to claim 2, characterized in that: The drive assembly (5) includes a guide rail (51) fixed on the tooling bracket (7), a sliding seat (52) that slides with the top of the guide rail (51), a mounting bracket (53) fixed with the top of the sliding seat (52), a motor (54) fixed on the tooling bracket (7), a rotating block (55) fixed with the output end of the motor (54), and an eccentric wheel (56) rotatably mounted on the rotating block (55). The length direction of the guide rail (51) is parallel to the length direction of the linear track (3). The top of the mounting bracket (53) is provided with a mounting groove (531) for mounting the material distribution block (4) on the side near the linear track (3). The rotation shaft of the eccentric wheel (56) is located near the edge of the rotating block (55). The sliding seat (52) is provided with a groove (521) that cooperates with the eccentric wheel (56) on one side.

5. A rapid feeding and separating mechanism according to claim 4, characterized in that: The motor (54) is a servo motor.

6. A rapid feeding and separating mechanism according to claim 4, characterized in that: The linear track (3) includes a track body (31) and a splicing strip (32) detachably connected to the track body (31). Both the track body (31) and the splicing strip (32) have transmission channels (30).

7. A rapid feeding and separating mechanism according to claim 6, characterized in that: A C-shaped frame (6) is fixed on the track body (31). The upper and lower frames of the C-shaped frame (6) are located on the upper and lower sides of the track body (31), respectively. A laser emitter (61) is fixed at the bottom of the upper frame of the C-shaped frame (6). A laser receiver (62) is fixed at the position corresponding to the laser emitter (61) on the lower frame of the C-shaped frame (6). A through hole (34) is provided at the position corresponding to the incident light of the laser emitter (61) on the track body (31).