Glue storage device and glue storage system

By employing vacuum and environmental control technologies in the glue storage device, the problems of contamination and coagulation in glue storage have been solved, achieving efficient preservation and purity of the glue and extending its service life.

CN223822438UActive Publication Date: 2026-01-23GOERTEK OPTICAL TECH CO LTD
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Patent Information

Application Number
CN202520142157.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-21
Publication Date
2026-01-23
Estimated Expiration
2035-01-21

AI Technical Summary

Technical Problem

Existing methods of storing adhesives can easily lead to contamination and coagulation, affecting storage efficiency and purity.

Method used

The device employs a glue storage unit, including a glue storage mechanism, a vacuuming mechanism, and a glue inlet. The vacuum level of the glue storage chamber is adjusted by vacuuming. When the vacuum level is higher than the set vacuum level, the glue from the glue supply mechanism is input into the glue storage chamber. It is also equipped with a pressurization mechanism and a filter to control the storage environment parameters. Combined with a cleaning mechanism, the device improves the preservation efficiency and purity of the glue.

Benefits of technology

It achieves efficient preservation of adhesive, reduces the risk of contamination, ensures the purity and efficiency of the adhesive, and extends its service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a glue storage device and a glue storage system, the glue storage device comprises a glue storage mechanism, the glue storage mechanism is internally provided with a glue storage cavity, and the glue storage mechanism is provided with a glue inlet and an extraction opening which are communicated with the glue storage cavity; the vacuumizing mechanism is communicated to the extraction opening and is used for adjusting the vacuum degree of the glue storage cavity; the glue inlet is used for being connected with the glue supply mechanism, under the condition that the vacuum degree of the glue storage cavity is higher than or equal to the set vacuum degree, glue in the glue supply mechanism can be input into the glue storage cavity through the glue inlet, and after the vacuumizing mechanism conducts vacuumizing treatment on the glue storage cavity, the glue supply mechanism can supply glue to the glue storage cavity; and the glue in the glue storage cavity can be conveniently stored, so that the storage efficiency and the purity of the glue are ensured.
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Description

Technical Field

[0001] This application belongs to the field of liquid storage technology, specifically, this application relates to a glue storage device and a glue storage system. Background Technology

[0002] The common way to store glue is to put it in a glue bottle. As the glue is used, users need to open the glue bottle cap frequently. This not only increases the risk of glue contamination, but also, for devices that use glue pipelines to deliver glue, the glue outlet is exposed to the air for a long time, which can easily cause the glue to coagulate, affecting the storage efficiency and purity of the glue. Utility Model Content

[0003] One objective of this application is to provide a new technical solution for a glue storage device and a glue storage system.

[0004] According to a first aspect of the embodiments of this application, a glue storage device is provided, comprising:

[0005] A glue storage mechanism, wherein the glue storage mechanism has a glue storage cavity inside, and the glue storage mechanism is provided with a glue inlet and a vent that communicate with the glue storage cavity;

[0006] A vacuuming mechanism, which is connected to the air extraction port and used to adjust the vacuum level of the glue storage chamber;

[0007] The glue inlet is used to connect to the glue supply mechanism. When the vacuum degree of the glue storage chamber is higher than or equal to the set vacuum degree, the glue in the glue supply mechanism can be input into the glue storage chamber through the glue inlet.

[0008] Optionally, the set vacuum degree is 0.05MPa-0.098MPa.

[0009] Optionally, the glue inlet is connected to a glue inlet pipe, and the end of the glue inlet pipe away from the glue inlet is used to connect and cooperate with the glue supply mechanism.

[0010] Optionally, the glue storage mechanism is provided with a glue outlet communicating with the glue storage chamber, and a glue dispensing device is detachably connected to the glue outlet;

[0011] The dispensing device is used to dispense glue to the glue-using mechanism.

[0012] Optionally, a dispensing pipe is connected to the dispensing port, and the end of the dispensing pipe away from the dispensing port is screwed to the dispensing device.

[0013] Optionally, the glue storage mechanism includes a filter, which is connected to the output end of the glue dispensing device.

[0014] Optionally, the filter includes a filter screen having a plurality of mesh openings with a pore size of 0.03 μm to 5 μm.

[0015] Optionally, it also includes a pressurizing mechanism, wherein the glue storage mechanism is provided with a pressurizing port communicating with the glue storage cavity, and the pressurizing mechanism is connected to the pressurizing port and used to input protective gas into the glue storage cavity;

[0016] When the pressure in the glue storage chamber is greater than or equal to the set pressure, the glue in the glue storage chamber is delivered to the glue dispensing device through the glue outlet.

[0017] Optionally, it also includes a control mechanism, which has a receiving space, and the glue storage mechanism is disposed in the receiving space;

[0018] The control mechanism includes a control device for controlling the environmental parameters of the accommodating space.

[0019] Optionally, the environmental parameters include temperature and humidity parameters, wherein the temperature parameter is in the range of 20℃-30℃ and the humidity parameter is in the range of 45%-60%.

[0020] According to a second aspect of the embodiments of this application, a glue storage system is provided, the glue storage system including a cleaning mechanism and the glue storage device described in the first aspect;

[0021] The glue in the glue storage chamber can be output to the glue application mechanism, and the cleaning mechanism is used to clean the glue application mechanism.

[0022] Optionally, the cleaning mechanism includes a support, a brush body, and a pipeline, wherein the brush body is disposed on the support, and at least a portion of the pipeline is disposed on the brush body;

[0023] The brush body surface is provided with bristles, the inlet of the pipeline is used to input cleaning solvent, and the outlet of the pipeline is located on the surface of the brush body.

[0024] One technical advantage of this application is:

[0025] This application provides a glue storage device, which includes a glue storage mechanism with a glue storage chamber inside. The glue storage mechanism is provided with a glue inlet and a vacuum port connected to the glue storage chamber. A vacuuming mechanism is connected to the vacuum port and used to adjust the vacuum degree of the glue storage chamber. The glue inlet is used to connect to a glue supply mechanism. When the vacuum degree of the glue storage chamber is higher than or equal to a set vacuum degree, the glue in the glue supply mechanism can be input into the glue storage chamber through the glue inlet. After the vacuuming mechanism evacuates the glue storage chamber, it can realize the glue supply mechanism to the glue storage chamber and facilitate the preservation of the glue in the glue storage chamber, ensuring the storage efficiency and purity of the glue.

[0026] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0028] Figure 1 This is a schematic diagram of a glue storage device provided in one embodiment of this application;

[0029] Figure 2 A schematic diagram of the glue inlet mechanism of a glue storage device provided in one embodiment of this application;

[0030] Figure 3 A schematic diagram of the dispensing mechanism of a glue storage device provided in one embodiment of this application;

[0031] Figure 4 This is a schematic diagram of a cleaning mechanism for cleaning adhesive application mechanisms;

[0032] Figure 5 This is a schematic diagram of a process for cleaning an adhesive application mechanism.

[0033] The components include: 1. Glue storage mechanism; 11. Glue inlet; 111. Glue inlet pipeline; 12. Air extraction port; 13. Glue outlet; 14. Glue dispensing device; 15. Filter; 16. Pressurization port; 17. Drainage port; 2. Vacuuming mechanism; 3. Pressurization mechanism; 4. Control mechanism; 5. Drainage mechanism;

[0034] 101. Glue supply mechanism; 102. Glue application mechanism;

[0035] 201, Support; 202, Brush body; 2021, Brush bristles; 203, Pipeline; 2031, Liquid outlet. Detailed Implementation

[0036] Various exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application.

[0037] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0038] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0042] Reference Figure 1 This application provides an adhesive storage device, which includes:

[0043] The glue storage mechanism 1 has a glue storage cavity inside, and the glue storage mechanism 1 is provided with a glue inlet 11 and an air extraction port 12 that are connected to the glue storage cavity.

[0044] Vacuuming mechanism 2 is connected to air extraction port 12 and is used to adjust the vacuum level of the glue storage chamber.

[0045] The glue inlet 11 is used to connect the glue supply mechanism 101. When the vacuum degree of the glue storage chamber is higher than or equal to the set vacuum degree, the glue in the glue supply mechanism 101 can be input into the glue storage chamber through the glue inlet 11.

[0046] In this embodiment, the glue storage chamber inside the glue storage mechanism 1 is used to store glue. Specifically, external glue can be transported into the glue storage chamber through the glue inlet 11 to facilitate the preservation of the glue. When the glue is needed, a fixed amount of glue can be output from the glue storage chamber.

[0047] See Figure 1 The vacuum mechanism 2 is connected to the air extraction port 12. When the vacuum mechanism 2 is activated, it can extract the gas in the glue storage chamber, thereby achieving the purpose of adjusting the vacuum level in the glue storage chamber.

[0048] In a specific embodiment, such as Figure 1 As shown, the vacuum pumping mechanism 2 is connected to the air extraction port 12 through a vacuum pumping pipeline. The extension of the vacuum pipeline facilitates the flexible arrangement of the vacuum pumping mechanism 2. A switch control valve can be installed on the vacuum pumping pipeline to control the opening and closing of the vacuum pipeline. Through the action of the vacuum pumping mechanism 2 and the opening and closing operation of the switch control valve, the accuracy and efficiency of the vacuum pumping mechanism 2 in vacuuming the glue storage cavity can be guaranteed.

[0049] See Figure 1 and Figure 2 The glue inlet 11 is used to connect to the glue supply mechanism 101, which can be a glue bottle or a glue storage container. The glue storage chamber in the glue supply mechanism 101 can maintain a standard atmosphere pressure, or the pressure of the glue storage chamber is adjustable, and the adjustment range is 0.5-2.0 standard atmospheres. When the vacuum mechanism 2 performs vacuum treatment on the glue storage chamber, it can reduce the gas pressure in the glue storage chamber, that is, increase the vacuum degree of the glue storage chamber. When the vacuum degree of the glue storage chamber is higher than or equal to the set vacuum degree, the gas pressure in the glue storage chamber will be significantly lower than the gas pressure in the glue storage chamber of the glue supply mechanism 101. Under the action of the pressure difference, the glue in the glue supply mechanism 101 can be input into the glue storage chamber through the glue inlet 11 to store the glue inside the glue storage mechanism 1.

[0050] In this embodiment, after the vacuuming mechanism 2 evacuates the glue storage chamber, it can transfer the glue through the pressure difference, enabling the glue supply mechanism 101 to supply glue to the glue storage chamber; it can also isolate the glue in the storage chamber from the air, reducing the possibility of glue contamination, facilitating the preservation of the glue in the storage chamber, and ensuring the storage efficiency and purity of the glue.

[0051] In this embodiment, the glue storage mechanism 1 can store glue for multiple uses, and output a certain amount of glue each time, so as to ensure the glue usage while ensuring the glue storage environment, avoiding glue from coagulating due to exposure to air, and improving the glue usage efficiency.

[0052] The glue storage device provided in this application includes a glue storage mechanism 1, which has a glue storage cavity inside. The glue storage mechanism 1 is provided with a glue inlet 11 and a vacuum port 12 connected to the glue storage cavity. A vacuuming mechanism 2 is connected to the vacuum port 12 and is used to adjust the vacuum degree of the glue storage cavity. The glue inlet 11 is used to connect to the glue supply mechanism 101. When the vacuum degree of the glue storage cavity is higher than or equal to the set vacuum degree, the glue in the glue supply mechanism 101 can be input into the glue storage cavity through the glue inlet 11. After the vacuuming mechanism 2 performs vacuuming treatment on the glue storage cavity, it can realize the glue supply mechanism 101 to the glue storage cavity and facilitate the preservation of the glue in the glue storage cavity, ensuring the storage efficiency and purity of the glue.

[0053] In some embodiments, the vacuum degree is set to 0.05MPa-0.098MPa, such as 0.06MPa, 0.07MPa, 0.08MPa or 0.09MPa.

[0054] In the above embodiment, the set vacuum degree is set in the range of 0.05MPa-0.098MPa, so that when the vacuum degree of the glue storage chamber is higher than or equal to the set vacuum degree, the glue supply mechanism 101 can easily supply glue to the glue storage chamber; moreover, the vacuum degree of 0.05MPa-0.098MPa can effectively reduce air, moisture and other impurities in the glue, thereby improving the purity of the glue, and the low oxygen environment helps to slow down the oxidation rate of the glue, extend its service life and facilitate the storage of the glue.

[0055] It is worth noting that during the process of the glue supply mechanism 101 supplying glue to the glue storage chamber, the pressure in the glue storage chamber will increase, which means that the vacuum degree of the glue storage chamber will decrease. However, the vacuum degree of the glue storage chamber can be kept higher than or equal to the set vacuum degree by the vacuum pumping mechanism 2.

[0056] In this embodiment, the vacuum level is set to a pressure that is a certain value lower than the actual atmospheric pressure by one standard atmosphere, that is, the actual atmospheric pressure = one standard atmosphere - the set vacuum level.

[0057] Specifically, the vacuum degree is set to 0.05 MPa, which means the actual air pressure is 0.05 MPa lower than one standard atmosphere (0.101 MPa), i.e., the actual air pressure is 0.101 MPa - 0.05 MPa = 0.051 MPa; the vacuum degree is set to 0.098 MPa, which means the actual air pressure is 0.098 MPa lower than one standard atmosphere, i.e., the actual air pressure is 0.101 MPa - 0.098 MPa = 0.003 MPa.

[0058] In some embodiments, see Figure 1 and Figure 2The glue inlet 11 is connected to a glue inlet pipe 111, and the end of the glue inlet pipe 111 away from the glue inlet 11 is used to connect and cooperate with the glue supply mechanism 101.

[0059] In the above embodiments, the glue storage cavity inside the glue storage mechanism 1 has conditions that are conducive to glue storage. In order to facilitate glue storage, the volume of the glue storage cavity inside the glue storage mechanism 1 can be larger than the volume of the cavity inside the glue supply mechanism 101. That is, when the glue in the glue supply mechanism 101 is input into the glue storage cavity through the glue inlet 11, multiple glue supply mechanisms 101 need to supply glue together to meet the glue storage capacity of the glue storage mechanism 1.

[0060] When supplying glue to the glue storage mechanism 1 through multiple glue supply mechanisms 101, in order to facilitate the replacement of the glue supply mechanism 101, the glue supply mechanism 101 can be connected to the glue inlet pipe 111 by plugging. That is, the glue supply mechanism 101 and the glue inlet pipe 111 can be detachably connected. After one glue supply mechanism 101 has finished supplying glue, it can be directly unplugged from the glue inlet pipe 111, and then another glue supply mechanism 101 containing glue can be plugged into the glue inlet pipe 111, which improves the efficiency of the glue supply mechanism 101 in supplying glue to the glue storage mechanism 1.

[0061] In one specific embodiment, see Figure 2 A first control valve 112 is provided on the glue inlet pipe 111. The first control valve 112 is used to control the opening and closing of the glue inlet pipe 111. When the glue supply mechanism 101 supplies glue to the glue storage mechanism 1, the first control valve 112 can be set to the open state to facilitate the replenishment of glue in the glue storage mechanism 1. When the glue supply mechanism 101 finishes supplying glue to the glue storage mechanism 1, the first control valve 112 can be set to the closed state to prevent external air and impurities from entering the glue storage mechanism 1 through the glue inlet pipe 111.

[0062] In some embodiments, see Figure 1 and Figure 3 The glue storage mechanism 1 is provided with a glue outlet 13 that communicates with the glue storage chamber, and a glue dispensing device 14 is detachably connected to the glue outlet 13.

[0063] The glue dispensing device 14 is used to dispense glue to the glue application mechanism 102.

[0064] In this embodiment, when the glue stored in the glue storage mechanism 1 is needed, the glue can be pressed out from the glue dispensing device 14 by pressurizing the glue storage chamber, or the glue can be extracted from the glue dispensing device 14 by suction. The glue application mechanism 102 is located below the glue dispensing device 14 to take out the glue into the glue application mechanism 102, which facilitates the glue application operation of the glue application mechanism 102.

[0065] It is worth noting that the amount of glue dispensed by the glue dispensing device 14 to the glue application mechanism 102 can be controlled by applying pressure or suction to ensure that the amount of glue dispensed by the glue dispensing device 14 at one time is equal to or slightly greater than the amount of glue applied by the glue application mechanism 102 at one time. This ensures the convenience of glue application while avoiding contamination and waste of glue in the glue application mechanism 102.

[0066] In one specific embodiment, the dispensing device 14 can be a nozzle. After the nozzle dispenses glue to the glue application mechanism 102, if the nozzle is in contact with air for a long time, glue crystals will form at the nozzle outlet, affecting the quality of the glue dispensed by the nozzle again. The nozzle provided in this embodiment can be disassembled and replaced. The replaced nozzle can prevent glue particles from forming in the nozzle, ensuring the quality of the glue dispensed by the nozzle to the glue application mechanism 102.

[0067] In one embodiment, the glue dispensing mechanism 102 can be a glue container such as a dropper or a beaker. Before using the glue container, it needs to be cleaned using a cleaning mechanism.

[0068] In some embodiments, see Figure 3 A glue outlet 13 is connected to a glue outlet tube 131, and the end of the glue outlet tube 131 away from the glue outlet 13 is screwed to the glue dispensing device 14.

[0069] In this embodiment, the end of the dispensing tube 131 away from the dispensing port 13 may have an internal thread or an external thread, and the input end of the dispensing device 14 may have an external thread or an internal thread that matches the aforementioned internal thread or external thread. By rotating the dispensing device 14, the dispensing device 14 can be installed into the dispensing tube 131 or removed from the dispensing tube 131, simplifying the disassembly and assembly operation of the dispensing device 14.

[0070] In one specific embodiment, see Figure 3 A second control valve 132 is provided on the glue dispensing pipe 131. The second control valve 132 is used to control the opening and closing of the glue dispensing pipe 131. When the glue dispensing device 14 outputs glue to the glue application mechanism 102, the second control valve 132 can be set to be in the open state to facilitate the replenishment of glue in the glue application mechanism 102. When the glue dispensing device 14 finishes dispensing glue to the glue application mechanism 102, the second control valve 132 can be set to be in the closed state to prevent external air and impurities from entering the glue storage mechanism 1 through the glue dispensing pipe 131.

[0071] In some embodiments, see Figure 3 The glue storage mechanism 1 includes a filter 15, which is connected to the output end of the glue dispensing device 14.

[0072] In this embodiment, during the process of dispensing glue from the glue dispensing device 14 to the glue application mechanism 102, the glue dispensing device 14 will be filtered by the filter 15 before being dispensed to the glue application mechanism 102. The filter 15 can filter out air bubbles and impurities in the glue, improve the cleanliness of the glue, and ensure the quality of the glue used in the glue application mechanism 102.

[0073] In some embodiments, the filter 15 includes a filter screen having a plurality of mesh openings with a pore size of 0.03 μm to 5 μm, such as 0.05 μm, 0.2 μm, 0.5 μm, 1.0 μm or 3 μm.

[0074] In the above embodiment, the filter screen is installed at the output end of the dispensing device 14. The glue output by the dispensing device 14 will be filtered by the filter screen before being output to the glue application mechanism 102. When the mesh size of the filter screen is taken from a value in the range of 0.03μm-5μm, it can effectively filter out small particulate impurities in the glue, such as dust, fibers, metal fragments, etc., to ensure the purity of the glue. On the other hand, it can avoid the risk of the filter screen being blocked when the glue passes through the filter screen.

[0075] In one specific embodiment, the mesh size is 0.25μm. Since the adhesive has a certain viscosity, the 0.25μm mesh size facilitates the passage of the adhesive and prevents the filter from being clogged by impurities.

[0076] In some embodiments, see Figure 1 The glue storage device also includes a pressurizing mechanism 3. The glue storage mechanism 1 is provided with a pressurizing port 16 that is connected to the glue storage chamber. The pressurizing mechanism 3 is connected to the pressurizing port 16 and is used to input protective gas into the glue storage chamber.

[0077] When the pressure in the glue storage chamber is greater than or equal to the set pressure, the glue in the glue storage chamber is delivered to the glue dispensing device 14 through the glue outlet 13.

[0078] In this embodiment, the pressurizing mechanism 3 can be a pump body or a motor pressurizing mechanism. The pressurizing mechanism 3 is connected to the pressurizing port 16 through a pressurizing pipeline and can input protective gases such as nitrogen and helium into the glue storage chamber to increase the gas pressure in the glue storage chamber.

[0079] When the gas pressure in the glue storage chamber is greater than or equal to the set pressure, the gas in the glue storage chamber has reached a high pressure state. Under the action of high pressure, the glue in the glue storage chamber is delivered to the glue dispensing device 14 through the glue outlet 13, thereby realizing the glue dispensing device 14 to the glue application mechanism 102.

[0080] In this embodiment, the pressure setting can be in the range of 0.15MPa-3.0MPa, so as to ensure that the glue is delivered to the dispensing device 14 through the dispensing port 13 under high pressure, while avoiding excessive pressure from the pressurizing mechanism 3 and damage to the glue storage mechanism 1.

[0081] It is worth noting that when the vacuum mechanism 2 is connected to the air extraction port 12 and used to adjust the vacuum level of the glue storage chamber, during the process of the glue storage chamber reaching negative pressure, a pressurizing mechanism 3 can be used to input protective gas into the glue storage chamber to replace the air in the glue storage chamber, thereby quickly adjusting the environmental purity inside the glue storage mechanism 1 and ensuring the long-term storage of the glue.

[0082] In some embodiments, see Figure 1 The glue storage device also includes a control mechanism 4, which has a accommodating space, and the glue storage mechanism 1 is disposed in the accommodating space.

[0083] The control mechanism 4 includes a control device for controlling the environmental parameters of the accommodating space.

[0084] During storage, if the storage environment of the adhesive changes frequently, or if the temperature and humidity of the storage environment are too high or too low, the adhesive is prone to denaturation, reducing its service life. This application provides a control mechanism 4 to surround the adhesive storage mechanism 1, and a temperature and humidity controller or a combination of a temperature controller and a humidity controller can control the environmental parameters of the storage space. The environmental parameters of the adhesive storage chamber in the adhesive storage mechanism 1 will change with the environmental parameters of the storage space, so the environmental parameters of the adhesive storage chamber in the adhesive storage mechanism 1 can be controlled. Specifically, the temperature and humidity of the storage space can be adjusted according to the characteristics of the adhesive to achieve good conditions for adhesive storage and ensure the storage life of the adhesive.

[0085] In some embodiments, the environmental parameters include temperature parameters and humidity parameters, with the temperature parameter in the range of 20°C-30°C and the humidity parameter in the range of 45%-60%, for example, setting the temperature parameter in the range of 22±2°C and the humidity parameter in the range of 50±3%.

[0086] In the above embodiments, when the adhesive is in a temperature range of 20℃-30℃ and a humidity range of 45%-60%, the adhesive can maintain the stability of its physical and chemical properties, avoiding problems such as deterioration, layering, crystallization, solidification or loss of tackiness due to excessively high or low temperatures; at the same time, suitable humidity conditions can prevent the adhesive from absorbing too much moisture or drying out excessively, thereby maintaining its tackiness and performance.

[0087] In this embodiment, by controlling the temperature, it is possible to avoid the accelerated decomposition or reaction of the components in the adhesive due to high temperature, and the solidification or crystallization of the adhesive due to low temperature, thereby extending the shelf life of the adhesive, ensuring that the adhesive can achieve a good tack state when used, and improving the bonding strength and durability.

[0088] See Figure 1 The glue storage device also includes a draining mechanism 5. The bottom of the glue storage device 1 is provided with a drain port 17 that is connected to the glue storage chamber. The draining mechanism 5 is connected to the drain port 17 to facilitate the discharge of residual glue from the glue storage device 1.

[0089] In addition, the glue storage mechanism 1 can also be recycled. For example, after a type of glue in the glue storage mechanism 1 is used up, a cleaning solvent can be added to the glue storage mechanism 1 for cleaning, and then the cleaning solvent can be discharged through the draining mechanism 5, so that the glue storage mechanism 1 can store different types of glue.

[0090] This application provides a glue storage system, which includes a cleaning mechanism and the aforementioned glue storage device;

[0091] The glue in the glue storage chamber can be output to the glue application mechanism 102, and the cleaning mechanism is used to clean the glue application mechanism 102.

[0092] In this embodiment, the glue supplied by the glue supply mechanism 101 in the glue storage device of the glue storage system can be input into the glue storage chamber through the glue inlet 11. After the vacuuming mechanism 2 performs vacuuming treatment on the glue storage chamber, it can both realize the glue supply mechanism 101 to the glue storage chamber and facilitate the preservation of the glue in the glue storage chamber, thus ensuring the storage efficiency and purity of the glue.

[0093] In addition, the cleaning mechanism cleans the glue application mechanism 102, which improves the cleanliness of the glue output to the glue application mechanism 102 each time, ensuring the storage life and effectiveness of the glue in the glue application mechanism 102 during use.

[0094] In some embodiments, see Figure 4 The cleaning mechanism includes a support 201, a brush body 202 connected to the support 201, and a pipe 203 at least partially disposed on the brush body 202. The surface of the brush body 202 is provided with bristles 2021. The inlet of the pipe 203 is connected to a tank containing cleaning solvent, and the outlet 2031 of the pipe 203 is disposed on the surface of the brush body 202.

[0095] See Figure 5 The cleaning process for glue containers by the cleaning organization includes the following steps:

[0096] S501, Place the glue container to be cleaned directly below the brush body 202;

[0097] S502, slowly place the brush body 202 into the cleaning container;

[0098] S503, open the spray pipe 203 to allow the cleaning solvent in pipe 203 to splash onto the inner wall of the glue container to be cleaned;

[0099] S504, Open the drive unit that drives the brush body 202 to rotate, so that the brush body 202 rotates to clean the glue container;

[0100] S505, After the glue container is cleaned, lift the brush body 202 and remove the cleaned glue container.

[0101] In this embodiment, when the cleaning mechanism cleans the adhesive application mechanism 102, the bristles 2021 on the surface of the brush body 202 can directly contact the inner wall of the adhesive application mechanism 102, and the cleaning efficiency of the adhesive application mechanism 102 is ensured when the brush body 202 rotates; at the same time, the cleaning solvent in the pipeline 203 can be sprayed from the surface of the brush body 202 into the adhesive application mechanism 102, and the cleaning effect of the adhesive application mechanism 102 can be further improved when the brush body 202 is combined with the cleaning solvent.

[0102] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A glue storage device characterized by, include: A glue storage mechanism, wherein the glue storage mechanism has a glue storage cavity inside, and the glue storage mechanism is provided with a glue inlet and a vent that communicate with the glue storage cavity; A vacuuming mechanism, which is connected to the air extraction port and used to adjust the vacuum level of the glue storage chamber; The glue inlet is used to connect to the glue supply mechanism. When the vacuum degree of the glue storage chamber is higher than or equal to the set vacuum degree, the glue in the glue supply mechanism can be input into the glue storage chamber through the glue inlet.

2. The glue storage device of claim 1, wherein, The set vacuum level is 0.05MPa-0.098MPa.

3. The gel storage device of claim 1, wherein, The glue inlet is connected to a glue inlet pipe, and the end of the glue inlet pipe away from the glue inlet is used to connect and cooperate with the glue supply mechanism.

4. The gel storage device of claim 1, wherein, The glue storage mechanism is provided with a glue outlet communicating with the glue storage cavity, and a glue dispensing device is detachably connected to the glue outlet; The dispensing device is used to dispense glue to the glue-using mechanism.

5. The glue storage device of claim 4, wherein, The dispensing port is connected to a dispensing pipe, and the end of the dispensing pipe away from the dispensing port is screwed to the dispensing device.

6. The glue storage device of claim 4, wherein, The glue storage mechanism includes a filter, which is connected to the output end of the glue dispensing device.

7. The adhesive storage device according to claim 6, characterized in that, The filter includes a filter screen with multiple mesh openings, the mesh openings having a diameter of 0.03μm-5μm.

8. The adhesive storage device according to claim 4, characterized in that, It also includes a pressurizing mechanism, wherein the glue storage mechanism is provided with a pressurizing port connected to the glue storage cavity, and the pressurizing mechanism is connected to the pressurizing port and used to input protective gas into the glue storage cavity; When the pressure in the glue storage chamber is greater than or equal to the set pressure, the glue in the glue storage chamber is delivered to the glue dispensing device through the glue outlet.

9. The adhesive storage device according to claim 1, characterized in that, It also includes a control mechanism, which has a receiving space, and the glue storage mechanism is disposed in the receiving space; The control mechanism includes a control device for controlling the environmental parameters of the accommodating space.

10. The adhesive storage device according to claim 9, characterized in that, The environmental parameters include temperature and humidity parameters, with the temperature parameter ranging from 20°C to 30°C and the humidity parameter ranging from 45% to 60%.

11. A glue storage system, characterized in that, Includes a cleaning mechanism and a glue storage device as described in any one of claims 1-10; The glue in the glue storage chamber can be output to the glue application mechanism, and the cleaning mechanism is used to clean the glue application mechanism.

12. The adhesive storage system according to claim 11, characterized in that, The cleaning mechanism includes a support, a brush body, and a pipeline. The brush body is disposed on the support, and at least a portion of the pipeline is disposed on the brush body. The brush body surface is provided with bristles, the inlet of the pipeline is used to input cleaning solvent, and the outlet of the pipeline is located on the surface of the brush body.