Energy-saving heating and refrigerating device based on semiconductor temperature control module
By combining a semiconductor temperature control module with preheating and precooling modules, and utilizing the hot and cold ends of the semiconductor cooling chip simultaneously, the problems of bulky, high energy consumption, and bacterial growth in stagnant water in existing devices are solved, achieving instant fresh fluid output and energy-saving effects.
Patent Information
- Application Number
- CN202520174227.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-26
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-26
AI Technical Summary
Existing refrigeration or heating devices are bulky, noisy, energy-intensive, and have low cooling efficiency. Furthermore, stagnant water stored for extended periods is prone to bacterial growth, failing to meet immediate use and hygiene requirements.
The system employs a semiconductor temperature control module, which combines a preheating module and a precooling module with first and second semiconductor cooling chips to preheat or precool the fluid. Combined with a heating supplement module and a cooling supplement module, it enables the instantaneous output of hot and cold fluids to meet diverse needs. Furthermore, by utilizing both the hot and cold ends of the semiconductor cooling chips simultaneously, it improves energy utilization efficiency.
It enables the instant supply of fresh hot or cold water, meeting users' hygiene needs, saving energy, and achieving a fast and energy-saving effect.
Smart Images
Figure CN223826516U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor refrigeration sheet, especially relates to an energy -conserving heating and refrigeration device based on semiconductor temperature control module. BACKGROUND
[0002] In the existing refrigeration or heating device, heating is relatively simple, can realize instant heating, realizes "no stale water", but wants to cool water to be more difficult, liquid specific heat capacity is big, density is big, wants to cool liquid quickly, cooling power demand is very high, this leads to equipment heavy, noisy. The thermal conductivity of gas is low, and a large contact area of the cold surface is required to achieve a large temperature drop. The equipment is large, and the cooling efficiency is low due to the existence of diffusion thermal resistance. In order to make the product small, the price low, the noise low, most of them choose to cool or heat in advance, and store cold or hot water in the water tank, which leads to the fact that the water actually drunk is not fresh water. When different flavors of fruit juice, coffee, wine, sparkling water and other drinks need to be prepared on site, the taste of stale water cannot meet the needs of use, and stale water stored for a long time is easy to breed bacteria, causing health problems; At the same time, the device with refrigeration and heating functions is large in size and high in energy consumption, which does not meet the needs of energy saving. CONTENT
[0003] The utility model aims at providing a kind of fast, energy -conserving heating and refrigeration device based on semiconductor temperature control module, to solve the technical problems in the above background technique.
[0004] To achieve the above object, the utility model embodiment provides a kind of fast, energy -conserving heating and refrigeration device based on semiconductor temperature control module, including preheating module and precooling module;First semiconductor refrigeration sheet is equipped between the preheating module and the precooling module, the hot end of the first semiconductor refrigeration sheet is attached to the preheating module, the cold end of the first semiconductor refrigeration sheet is attached to the precooling module, one end of the preheating module is communicated with heating supplement module, one end of the precooling module is communicated with refrigeration supplement module, second semiconductor refrigeration sheet is equipped between the heating supplement module and the refrigeration supplement module, the hot end of the second semiconductor refrigeration sheet is attached to the heating supplement module, the cold end of the first semiconductor refrigeration sheet is attached to the refrigeration supplement module;First fluid can enter preheating from the preheating module, then pass through the heating supplement module and be heated, and flow out through the hot end outlet, second fluid can enter precooling from the precooling module, then pass through the refrigeration supplement module and be cooled, and flow out through the cold end outlet.
[0005] Optionally, the preheating module includes a first heat preservation barrel;A preheating channel is arranged in the first heat preservation barrel, and the first heat preservation barrel is filled with a heating medium, and the preheating channel is immersed in the heating medium.
[0006] Optionally, the pre-cooling module comprises a second insulation barrel; a pre-cooling channel is arranged in the second insulation barrel; the second insulation barrel is filled with refrigeration medium; and the pre-cooling channel is immersed in the refrigeration medium.
[0007] Optionally, the pre-heating channel comprises a first inlet and a first outlet; the first outlet is connected to the heating supplement module; the first fluid can enter from the first inlet and flow out from the first outlet into the heating supplement module; the pre-cooling channel comprises a second inlet and a second outlet; the second outlet is connected to the refrigeration supplement module; and the second fluid can enter from the second inlet and flow out from the second outlet into the refrigeration supplement module.
[0008] Optionally, the pre-heating module comprises a first displacement part connected to the first insulation barrel through a pipeline; the pre-cooling module comprises a second displacement part connected to the second insulation barrel through the pipeline; the hot end of the first semiconductor refrigeration sheet is attached to the first displacement part; and the cold end of the first semiconductor refrigeration sheet is attached to the second displacement part.
[0009] Optionally, the heating supplement module comprises a third displacement part; the refrigeration supplement module comprises a fourth displacement part; the first outlet is connected to the third displacement part through the pipeline; the second outlet is connected to the fourth displacement part through the pipeline; the hot end of the second semiconductor refrigeration sheet is attached to the third displacement part; and the cold end of the second semiconductor refrigeration sheet is attached to the fourth displacement part.
[0010] Optionally, the first fluid enters the third displacement part, is heated, and then flows out from the hot end outlet; and the second fluid enters the fourth displacement part, is cooled, and then flows out from the cold end outlet.
[0011] Optionally, the pre-heating channel and the pre-cooling channel can be one of a coil channel, a fin-type curved microchannel, a fin-type straight microchannel, and a tube-fin microchannel.
[0012] Optionally, the pre-heating channel and the pre-cooling channel are detachably arranged in the first insulation barrel and the second insulation barrel.
[0013] Compared with the prior art, the above one or more technical solutions of the energy-saving heating and refrigeration device based on the semiconductor temperature control module provided in the embodiments of the present application at least have one of the following technical effects:
[0014] The preheating module and the precooling module can make the device output hot fluid and cold fluid at the same time, meet the diverse needs of people, and through the first semiconductor refrigeration piece and the second semiconductor refrigeration piece, the fluid is preheated or precooled first, and then heated or cooled when needed, so that fresh hot water or cold water can be used immediately, meet the user's requirements for health and immediate use. Further, the cold end and the hot end of the semiconductor refrigeration piece are used at the same time, energy consumption is saved, and the purpose of energy saving is achieved. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.
[0016] Figure 1 The present application is a structural schematic diagram.
[0017] In the drawings, various reference signs represent:
[0018] 100, preheating module; 110, first heat preservation barrel; 120, preheating channel; 121, first inlet; 122, first outlet; 130, heating medium; 140, first displacement part;
[0019] 200, precooling module; 210, second heat preservation barrel; 220, precooling channel; 221, second inlet; 222, second outlet; 230, refrigeration medium; 240, second displacement part;
[0020] 300, first semiconductor refrigeration piece;
[0021] 400, heating supplement module; 410, third displacement part; 420, hot end outlet;
[0022] 500, refrigeration supplement module; 510, fourth displacement part; 520, cold end outlet;
[0023] 600, second semiconductor refrigeration piece;
[0024] 700, pipeline. DETAILED DESCRIPTION
[0025] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the embodiments of the present application, and cannot be understood as a limitation of the present application.
[0026] In the description of the embodiments of the utility model, it needs to understand that the orientation or position relation indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or position relation shown based on the drawings, and is only for the convenience of describing the embodiments of the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model.
[0027] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the utility model, the meaning of "multiple" is two or more than two, unless otherwise explicitly specified and limited.
[0028] In the embodiments of the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements or the interaction relationship between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the embodiments of the utility model can be understood according to the specific circumstances.
[0029] In one embodiment of the utility model, according to Figure 1 As shown in the figure, an energy-saving heating and refrigeration device based on a semiconductor temperature control module, comprising a preheating module 100 and a prefabricated refrigeration module 200; a first semiconductor refrigeration sheet 300 is arranged between the preheating module 100 and the prefabricated refrigeration module 200, the hot end of the first semiconductor refrigeration sheet 300 is attached to the preheating module 100, the cold end of the first semiconductor refrigeration sheet 300 is attached to the prefabricated refrigeration module 200, one end of the preheating module 100 is communicated with a heating supplement module 400, one end of the prefabricated refrigeration module 200 is communicated with a refrigeration supplement module 500, a second semiconductor refrigeration sheet 600 is arranged between the heating supplement module 400 and the refrigeration supplement module 500, the hot end of the second semiconductor refrigeration sheet 600 is attached to the heating supplement module 400, and the cold end of the first semiconductor refrigeration sheet 300 is attached to the refrigeration supplement module 500; a first fluid can enter the preheating module 100 for preheating, then pass through the heating supplement module 400 to increase the temperature, and flow out through the hot end outlet 420, and a second fluid can enter the prefabricated refrigeration module 200 for precooling, then pass through the refrigeration supplement module 500 to decrease the temperature, and flow out through the cold end outlet 520.
[0030] Specifically, the device can output hot fluid and cold fluid simultaneously by the pre-heating module 100 and the pre-cooling module 200, meet the diverse needs of people, and by setting the first semiconductor refrigeration piece 300 and the second semiconductor refrigeration piece 600, the fluid is preheated or pre-cooled, and then heated or cooled when needed, so that fresh hot water or cold water can be used immediately, meet the user's requirements for health and instant use. Further, the cold end and the hot end of the semiconductor refrigeration piece are used simultaneously, energy is used efficiently, energy consumption is saved, and the purpose of energy saving is achieved.
[0031] Further, the first fluid and the second fluid can be liquid or gas.
[0032] In another embodiment of the present application, according to Figure 1 As shown in the figure, the pre-heating module 100 comprises a first heat preservation barrel 110; the first heat preservation barrel 110 is provided with a pre-heating channel 120, and the first heat preservation barrel 110 is filled with a heating medium 130, and the pre-heating channel 120 is immersed in the heating medium 130. The pre-cooling module 200 comprises a second heat preservation barrel 210; the second heat preservation barrel 210 is provided with a pre-cooling channel 220, and the second heat preservation barrel 210 is filled with a refrigeration medium 230, and the pre-cooling channel 220 is immersed in the refrigeration medium 230.
[0033] Specifically, the first heat preservation barrel 110 and the second heat preservation barrel 210 can reduce the emission of heat and cold, and reduce energy consumption. The pre-heating channel 120 and the pre-cooling channel 220 can supply the first fluid and the second fluid to flow, and the external heating medium 130 and the refrigeration medium 230 heat or cool the first fluid and the second fluid inside to reach the predetermined temperature.
[0034] In another embodiment of the present application, according to Figure 1 As shown in the figure, the pre-heating channel 120 comprises a first inlet 121 and a first outlet 122; the first outlet 122 is communicated with the heating supplement module 400, and the first fluid can enter from the first inlet 121 and flow out from the first outlet 122 into the heating supplement module 400; the pre-cooling channel 220 comprises a second inlet 221 and a second outlet 222; the second outlet 222 is communicated with the refrigeration supplement module 500, and the second fluid can enter from the second inlet 221 and flow out from the second outlet 222 into the refrigeration supplement module 500.
[0035] Specifically, the pre-heating module 100 and the pre-cooling module 200 are a preliminary preparation for the early stage, and only a preliminary temperature is reached, if the fluid at the temperature is required, the second semiconductor refrigeration piece 600 can not be started, and the fluid is directly discharged from the hot end outlet 420 and the cold end outlet 520, if the required temperature is not reached, the second semiconductor refrigeration piece 600 is started to supplement heating, and after the required temperature is reached, the fluid is discharged from the hot end outlet 420 and the cold end outlet 520.
[0036] In another embodiment of the present application, according to Figure 1 As shown in the figure, the pre-heating module 100 comprises a first displacement part 140, the first displacement part 140 is communicated with the first heat preservation barrel 110 through a pipeline 700, the pre-cooling module 200 comprises a second displacement part 240, the second displacement part 240 is communicated with the second heat preservation barrel 210 through the pipeline 700, the hot end of the first semiconductor refrigeration piece 300 is attached to the first displacement part 140, and the cold end is attached to the second displacement part 240. The heating supplement module 400 comprises a third displacement part 410, and the refrigeration supplement module 500 comprises a fourth displacement part 510; the first outlet 122 is communicated with the third displacement part 410 through the pipeline 700, the second outlet 222 is communicated with the fourth displacement part 510 through the pipeline 700, the hot end of the second semiconductor refrigeration piece 600 is attached to the third displacement part 410, and the cold end is attached to the fourth displacement part 510. The first fluid is heated after entering the third displacement part 410 and is discharged from the hot end outlet 420, and the second fluid is cooled after entering the fourth displacement part 510 and is discharged from the cold end outlet 520. Specifically, the first semiconductor refrigeration piece 300 can heat the medium in the first heat preservation barrel 110 through the first displacement part 140 and the second displacement part 240, and can cool the medium in the second heat preservation barrel 210, the heating medium 130 and the cooling medium 230 pass through the pre-heating channel 120 and the pre-cooling channel 220, so that the first fluid and the second fluid are preliminarily heated and cooled. The second semiconductor refrigeration piece 600 supplements heating or cooling for the first fluid and the second fluid flowing through the third displacement part 410 and the fourth displacement part 510, so that the required temperature is reached. Further, the first displacement part 140, the second displacement part 240, the third displacement part 410 and the fourth displacement part 510 are all heat-conducting materials. The first semiconductor refrigeration piece 300 and the second semiconductor refrigeration piece 600 can heat or cool the medium flowing through the inside.
[0037] In another embodiment of the present application, according to Figure 1As shown, the pre-heating channels 120 and the pre-cooling channels 220 can be one of a coil type channel, a finned curved microchannel, a finned straight microchannel and a tube fin microchannel. Specifically, the longer the length of the flow channel and the denser the fins, the larger the contact area of the temperature-controlled fluid with the heating medium 130 and the refrigeration medium 230 in the first and second heat preservation barrels 110 and 210, and the better the heating or refrigeration effect.
[0038] In another embodiment of the present application, according to Figure 1 As shown, the pre-heating channels 120 and the pre-cooling channels 220 are detachably arranged in the first and second heat preservation barrels 110 and 210. After being detached, the first and second heat preservation barrels can be conveniently heated or cooled to the target temperature by external heating or cooling facilities, and then reassembled into the system, thereby flexibly compatible with external pre-heating or pre-cooling solutions. In addition, the pre-heating channels 120 and the pre-cooling channels 220 are detachable, thereby facilitating replacement and maintenance, and also facilitating cleaning.
[0039] The above is a further detailed description of the present application in combination with specific preferred embodiments, and cannot be deemed to limit the specific implementation of the present application to these descriptions. For ordinary skilled persons in the technical field to which the present application belongs, the architecture form can be flexible and variable without departing from the concept of the present application, and a series of products can be derived. Any simple deduction or replacement should be deemed to belong to the patent protection scope determined by the claims submitted by the present application.
Claims
1. An energy-saving heating and cooling device based on a semiconductor temperature control module, characterized in that, The system includes a preheating module and a precooling module. A first thermoelectric cooler is disposed between the preheating module and the precooling module. The hot end of the first thermoelectric cooler is attached to the preheating module, and the cold end of the first thermoelectric cooler is attached to the precooling module. One end of the preheating module is connected to a heating supplement module, and one end of the precooling module is connected to a cooling supplement module. A second thermoelectric cooler is disposed between the heating supplement module and the cooling supplement module. The hot end of the second thermoelectric cooler is attached to the heating supplement module, and the cold end of the first thermoelectric cooler is attached to the cooling supplement module. A first fluid can enter from the preheating module for preheating, then pass through the heating supplement module for further heating, and flow out through the hot end outlet. A second fluid can enter from the precooling module for precooling, then pass through the cooling supplement module for further cooling, and flow out through the cold end outlet.
2. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 1, characterized in that, The preheating module includes a first insulation barrel; the first insulation barrel is provided with a preheating channel, the first insulation barrel is filled with a heating medium, and the preheating channel is immersed in the heating medium.
3. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 2, characterized in that, The pre-cooling module includes a second insulation barrel; the second insulation barrel is provided with a pre-cooling channel, the second insulation barrel is filled with a refrigerant, and the pre-cooling channel is immersed in the refrigerant.
4. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 3, characterized in that, The preheating channel includes a first inlet and a first outlet; the first outlet is connected to the heating replenishment module, and the first fluid can enter from the first inlet and flow out from the first outlet into the heating replenishment module; the precooling channel includes a second inlet and a second outlet; the second outlet is connected to the cooling replenishment module, and the second fluid can enter from the second inlet and flow out from the second outlet into the cooling replenishment module.
5. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 3, characterized in that, The preheating module includes a first replacement part, which is connected to the first insulation barrel through a pipe. The precooling module includes a second replacement part, which is connected to the second insulation barrel through the pipe. The hot end of the first semiconductor cooling chip is attached to the first replacement part, and the cold end is attached to the second replacement part.
6. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 4, characterized in that, The heating supplement module includes a third replacement section; the cooling supplement module includes a fourth replacement section; the first outlet is connected to the third replacement section through a pipe, the second outlet is connected to the fourth replacement section through a pipe, the hot end of the second semiconductor cooling chip is attached to the third replacement section, and the cold end is attached to the fourth replacement section.
7. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 6, characterized in that, The first fluid enters the third displacement section and is heated before flowing out from the hot end outlet, while the second fluid enters the fourth displacement section and is cooled before flowing out from the cold end outlet.
8. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 3, characterized in that, The preheating channel and the precooling channel can be one of the following: coiled channel, finned curved microchannel, finned straight microchannel, and tube-fin microchannel.
9. The energy-saving heating and cooling device based on a semiconductor temperature control module according to claim 3, wherein the preheating channel and the precooling channel are detachably disposed inside the first insulation barrel and the second insulation barrel.