Pilot plant for simulating PCB etching in laboratory
By adopting a rotating tray and movable nozzle design in a laboratory PCB etching pilot-scale device, combined with temperature control components, the problem of uneven pressure in the spray area was solved, achieving uniform etching effect and accurate experimental data, and improving the success rate of chemical solution online testing.
Patent Information
- Application Number
- CN202423199025.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-21
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2034-12-21
AI Technical Summary
The existing pilot plant uses a fixed spray system, which results in uneven pressure distribution in the spray area, affecting the consistency and stability of the etching effect. It cannot truly reflect the situation on the actual production line, thus limiting the accuracy and reliability of the experimental results.
The design employs a rotatable tray and movable nozzle, combined with a temperature control component, to achieve uniform spraying and temperature control of the etching solution, simulating the actual production environment and improving the accuracy and persuasiveness of experimental data.
The design of the rotating tray and movable nozzle ensures uniform spraying of the etching solution, reduces over-etching or under-etching caused by uneven local pressure, improves the authenticity of experimental data and the success rate of online testing of the etching solution, and enhances the persuasiveness of the experimental results.
Smart Images
Figure CN223827518U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to laboratory testing equipment technical field especially relates to a laboratory simulation PCB etching pilot plant device. BACKGROUND
[0002] Printed circuit board (PCB) is an important component of modern electronic products, which is widely used in electronic equipment, not only provides physical support for electronic components, but also realizes electrical interconnection. With the continuous miniaturization and high performance of electronic products, higher requirements are put forward for the manufacturing process of PCB. Among them, outer layer etching as one of the key processes directly affects the quality and performance of PCB. At present, laboratory research usually adopts beaker experiment to preliminarily verify the effect of etching additive, but this method is difficult to truly reflect the situation on the actual production line, which limits the reliability and practicality of experimental results.
[0003] The existing pilot plant mostly adopts fixed type spraying system, that is, the relative position of spraying nozzle and workbench for placing PCB board is fixed. This design has many limitations in actual operation. First, the pressure distribution of spraying area is uneven, and the over-etching phenomenon may occur in some areas due to too high pressure, while in other areas, etching is insufficient due to too low pressure. Secondly, this fixed type spraying method cannot flexibly adjust the spraying angle and range, further affecting the consistency and stability of etching effect, and cannot guarantee the accuracy of experimental data. UTILITY MODEL CONTENT
[0004] In order to realize more uniform spraying etching effect of PCB board and improve the accuracy of pilot test data, the application provides a laboratory simulation PCB etching pilot plant device.
[0005] In order to achieve the above purpose, the application adopts the following technical scheme:
[0006] A laboratory simulation PCB etching pilot plant device, comprising a box body, a spraying assembly, a temperature control assembly and a controller, the box body top is provided with a cover, the box body is provided with a liquid storage cavity for filling etching liquid and a supporting assembly for placing PCB board, the spraying assembly is communicated with the liquid storage cavity, for sucking and spraying the etching liquid in the liquid storage cavity, the temperature control assembly is used for controlling the temperature of etching liquid;
[0007] The supporting assembly comprises a tray and a driving motor, the driving motor is arranged outside the bottom of the box body and is electrically connected with the controller, the tray is arranged in the liquid storage cavity and is higher than the liquid level of etching liquid, the output end of the driving motor is connected with a transmission shaft, the transmission shaft penetrates into the box body and is connected to the bottom of the tray, and the tray is driven to rotate by the driving motor.
[0008] By employing the aforementioned device, during testing, the PCB board is placed on a tray within the support assembly. The spray assembly sprays the etching solution, and the tray rotates the PCB board, resulting in a more uniform etching effect. This makes the test results more consistent with actual production conditions, increasing the persuasiveness and authenticity of pilot-scale data, and ultimately improving the success rate of online etching solution testing. Furthermore, by controlling the temperature of the etching solution to be close to the field test temperature through the temperature control assembly, the field environment can be simulated in the laboratory, which helps to test the actual effect of the etching solution and improves the accuracy of pilot-scale data.
[0009] Preferably, the upper surface of the tray is provided with a fixing member, the fixing member including two symmetrically arranged clamps, and the PCB board is placed between the two clamps.
[0010] By using the above-mentioned device, the PCB board is stably fixed by the clamps, reducing the displacement of the PCB board during the etching process, ensuring that the PCB board maintains the correct position during the pilot production process, and ensuring the uniformity and accuracy of the etching.
[0011] Preferably, the spray assembly includes a centrifugal pump, a suction pipe, and an outlet pipe. One end of the suction pipe is connected to the inlet of the centrifugal pump, and the other end is connected to the storage chamber. One end of the outlet pipe is connected to the outlet of the centrifugal pump, and the other end passes through the cover and extends to the top of the tray. A pressure gauge is provided on the outlet pipe. The centrifugal pump is electrically connected to the controller.
[0012] By employing the aforementioned device, the etching solution can circulate between the storage chamber and the centrifugal pump, enabling continuous spraying of the PCB board and improving the utilization rate of the etching solution. The centrifugal pump continuously and stably provides the pressure required for testing, and the pressure gauge displays the spraying pressure, facilitating monitoring and adjustment. This makes the laboratory test pressure closer to the actual pilot-scale test, and solves the problem that beaker experiments cannot simulate on-site pressure. This allows laboratory personnel to obtain data that more closely resembles on-site testing, making the data obtained from the laboratory more convincing and authentic, thereby increasing the success rate of the etching solution's online testing.
[0013] Preferably, a movable nozzle is provided at the end of the liquid outlet pipe away from the centrifugal pump, and the movable nozzle faces the tray.
[0014] Preferably, the movable nozzle includes a nozzle body, a connecting pipe, and a nozzle. The connecting pipe is disposed in the inner cavity of the nozzle body. The nozzle body is rotatably connected to the outer wall of the liquid outlet pipe. The connecting pipe is internally connected to the liquid outlet pipe. The end of the connecting pipe away from the liquid outlet pipe is connected to the nozzle, and the nozzle is fan-shaped.
[0015] By adopting the above-mentioned device, the movable nozzle and fan-shaped nozzle improve the spraying flexibility, which can ensure that the etching solution is sprayed evenly on the PCB board, increase the contact area between the etching solution and the PCB board, and prevent the situation of excessive local pressure in the spraying area leading to over-etching or insufficient local pressure leading to insufficient etching, thereby further improving the accuracy of experimental data.
[0016] Preferably, the movable nozzle further includes a telescopic rod that passes through the side wall of the housing and extends into the housing to connect with the nozzle tube. The telescopic rod drives the nozzle tube to rotate.
[0017] By using the above-mentioned device, the telescopic rod is used to assist the rotation of the nozzle tube, thereby achieving a more uniform sandblasting effect.
[0018] Preferably, the temperature control component includes a temperature sensor and a heating element, both of which extend into the liquid storage chamber and are electrically connected to the controller.
[0019] By using the above-mentioned device, the temperature sensor can monitor the temperature of the etching solution in the storage chamber in real time, and the heating tube heats the etching solution, thereby simulating the test temperature in the real field.
[0020] Preferably, a drain pipe is provided at the bottom of the box, the drain pipe is connected to the liquid storage chamber, and a drain valve is provided on the drain pipe.
[0021] By using the above-mentioned device, the etching solution is discharged from the drain pipe after it becomes ineffective, making it more convenient to replace the etching solution or clean the storage chamber.
[0022] This application has the following beneficial effects:
[0023] 1. In this application, during testing, the PCB board is placed on a tray in the support assembly, and the spray assembly sprays the etching solution. The tray rotates the PCB board, thereby achieving a more uniform etching effect and making the test results more consistent with actual production conditions. This increases the persuasiveness and authenticity of the pilot-scale data, thereby improving the success rate of the etching solution's online testing. By controlling the temperature of the etching solution to be close to the temperature of the field test through the temperature control assembly, the field environment can be simulated in the laboratory, which helps to test the actual effect of the etching solution and improves the accuracy of the pilot-scale data.
[0024] 2. In this application, the movable nozzle and fan-shaped nozzle improve the flexibility of spraying, which can ensure that the etching solution is sprayed evenly on the PCB board, increase the contact area between the etching solution and the PCB board, and prevent the situation of excessive local pressure in the spraying area leading to over-etching or insufficient local pressure leading to insufficient etching. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the overall structure of the laboratory simulated PCB etching pilot device according to an embodiment of this utility model;
[0026] Figure 2 This is a cross-sectional view of the laboratory simulated PCB etching pilot device according to an embodiment of this utility model;
[0027] Figure 3 This is another schematic diagram of the laboratory simulated PCB etching pilot device according to an embodiment of this utility model;
[0028] Figure 4 This is a schematic diagram of the movable nozzle of the laboratory simulated PCB etching pilot device according to an embodiment of this utility model.
[0029] Explanation of reference numerals in the attached figures:
[0030] 1. Housing; 11. Liquid storage chamber; 2. Spray assembly; 21. Centrifugal pump; 22. Suction pipe; 23. Discharge pipe; 24. Pressure gauge; 25. Movable nozzle; 251. Nozzle tube; 252. Connecting pipe; 253. Nozzle; 254. Telescopic rod; 3. Temperature control assembly; 31. Temperature sensor; 32. Heating tube; 4. Controller; 5. Cover; 6. Support assembly; 61. Tray; 62. Drive motor; 63. Drive shaft; 64. Fixing component; 641. Clip; 7. Drain pipe; 71. Drain valve. Detailed Implementation
[0031] The following is in conjunction with the appendix Figures 1-4 This application will be described in further detail.
[0032] A laboratory-scale PCB etching simulation device, such as Figures 1-2 As shown, the device includes a housing 1, a spray assembly 2, a temperature control assembly 3, a support assembly 6, and a controller 4. The housing 1 contains a storage chamber 11 for storing etching solution. A cover 5 is fitted to the top of the housing 1 to reduce the entry of dust and impurities that could contaminate the etching solution. The controller 4 is fixed to the outside of the housing 1 to ensure the device performs tests according to predetermined targets and parameters. The support assembly 6 holds and secures the PBC board. The spray assembly 2 is connected to the storage chamber 11 and is used to draw in and spray the etching solution from the storage chamber 11. The temperature control assembly 3 controls the temperature of the etching solution, ensuring it closely approximates the actual test temperature and improving the accuracy of the experimental data.
[0033] like Figures 1-2As shown, the temperature control component 3 includes a temperature sensor 31 and a heating element 32. The temperature sensor 31 extends to the bottom of the storage chamber 11 to monitor the temperature of the etching solution. The temperature sensor 31 is electrically connected to the controller 4, and the real-time temperature is displayed on the control panel of the controller 4. The heating element 32 extends from one side of the housing 1 into the storage chamber 11 and is electrically connected to the controller 4 to heat the etching solution. By monitoring and adjusting the temperature inside the storage chamber 11 in real time through the controller 4, the actual test temperature can be simulated.
[0034] like Figures 1-2 As shown, the support assembly 6 includes a tray 61 and a drive motor 62. The drive motor 62 is mounted at the bottom of the housing 1 and electrically connected to the controller 4. The tray 61 is positioned within the liquid storage chamber 11 and is above the surface of the etching solution. The output end of the drive motor 62 is connected to a drive shaft 63, which extends through the housing 1 and is fixedly connected to the bottom of the tray 61. The drive motor 62 drives the tray 61 to rotate, thereby improving the uniformity of spraying and enhancing the accuracy of experimental data. In this embodiment, the drive shaft 63 is made of polytetrafluoroethylene (PTFE), which has good corrosion resistance and strength, extending the service life of the device.
[0035] As shown in Figure 1-2, to better secure the PCB board, a fastener 64 is bolted to the upper surface of the tray 61. The fastener 64 includes two symmetrically arranged clamping pieces 641. During operation, the PCB board is placed between the two clamping pieces 641 to reduce displacement of the PCB board during rotation, ensuring that the PCB board maintains the correct position during pilot testing and guaranteeing the uniformity and accuracy of etching.
[0036] like Figure 1 As shown, the spray assembly 2 includes a centrifugal pump 21, a suction pipe 22, and an outlet pipe 23. The centrifugal pump 21 is located on one side of the housing 1, and is connected to the storage chamber 11 via the suction pipe 22 and the outlet pipe 23. Specifically, one end of the suction pipe 22 is connected to the inlet of the centrifugal pump 21, and the other end extends to the bottom of the storage chamber 11. One end of the outlet pipe 23 is connected to the outlet of the centrifugal pump 21, and the other end passes through the cover 5 and extends directly above the tray 61. A pressure gauge 24 is installed on the outlet pipe 23 to display the spray pressure, facilitating monitoring and adjustment of the spray pressure. Furthermore, the centrifugal pump 21 is electrically connected to a controller 4. By adjusting the operating frequency of the centrifugal pump 21 through the controller 4, precise control of the spray pressure is achieved. This makes the pressure in laboratory tests closer to that in real-world pilot-scale testing, solving the problem that beaker experiments cannot simulate real-world pressure. This allows laboratory personnel to obtain data closer to real-world testing, making the data obtained in the laboratory more convincing and authentic. In this embodiment, both the suction tube 22 and the discharge tube 23 are made of polytetrafluoroethylene (PTFE) to ensure corrosion resistance.
[0037] like Figures 3-4 As shown, to expand the spraying area, a movable nozzle 25 is provided at the end of the outlet pipe 23 away from the centrifugal pump 21. The movable nozzle 25 includes a nozzle body 251, a connecting pipe 252, and a nozzle 253. The nozzle body 251 is rotatably connected to the outer wall of the outlet pipe 23, and the connecting pipe 252 is located within the inner cavity of the nozzle body 251, and is sealed to the outlet pipe 23. The end of the connecting pipe 252 away from the outlet pipe 23 is connected to a fan-shaped nozzle 253. Compared to a circular nozzle 253, the fan-shaped nozzle 253 sprays etching solution over a larger and more uniform area.
[0038] In addition, such as Figures 3-4 As shown, a telescopic rod 254 is also connected to one side of the movable nozzle 25. A cylinder is fixed to one side of the housing 1. The cylinder is connected to the telescopic rod 254. The telescopic rod 254 passes through the side wall of the housing 1. The telescopic end of the telescopic rod 254 extends into the housing 1 and connects to the nozzle tube 251. The telescopic rod 254 drives the nozzle tube 251 to rotate, thereby realizing the angle adjustment of the movable nozzle 25, so as to more effectively cover the entire PCB board surface and reduce the occurrence of local over-etching or insufficient etching.
[0039] like Figures 1-2 As shown, since the etching solution will become ineffective after prolonged use, a drain pipe 7 is installed at the bottom of the housing 1. The drain pipe 7 is connected to the storage chamber 11 to facilitate the discharge of the ineffective etching solution. A drain valve 71 is installed on the drain pipe 7. When it is necessary to replace the etching solution, the drain valve 71 is opened, and the etching solution flows out from the drain pipe 7. This also facilitates the cleaning of the storage chamber 11. After the cleaning wastewater is discharged from the drain pipe 7, the drain valve 71 is closed, and new etching solution can be installed, increasing the practicality of the device.
[0040] Working principle: The prepared etching solution is poured into the storage tank of chamber 1. The temperature power switch is turned on to raise the temperature of the solution to the normal production temperature for PCB manufacturing. Then, centrifugal pump 21 is turned on and adjusted according to the pressure required by the factory to start the device. The etching solution is circulated to rinse the tubes. Once the tubes are full of solution, centrifugal pump 21 is paused. The cover 5 is opened, the PCB test board to be tested is placed in, and it is secured with clips 641. Centrifugal pump 21 is restarted to perform etching tests on the PCB board. During the etching test, the multi-angle adjustment of the movable nozzle 25 ensures that the etching solution evenly covers the surface of the PCB board.
[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A laboratory-scale PCB etching simulation apparatus, characterized in that, The device includes a housing (1), a spray assembly (2), a temperature control assembly (3), and a controller (4). The top of the housing (1) is provided with a cover (5). The housing (1) is provided with a liquid storage chamber (11) for filling etching solution and a support assembly (6) for placing PCB boards. The spray assembly (2) is connected to the liquid storage chamber (11) and is used to draw and spray the etching solution in the liquid storage chamber (11). The temperature control assembly (3) is used to control the temperature of the etching solution. The supporting component (6) includes a tray (61) and a drive motor (62). The drive motor (62) is located at the bottom of the outer side of the housing (1) and is electrically connected to the controller (4). The tray (61) is located in the liquid storage chamber (11) and is higher than the liquid level of the etching solution. The output end of the drive motor (62) is connected to a transmission shaft (63). The transmission shaft (63) passes through the housing (1) and is connected to the bottom of the tray (61). The drive motor (62) drives the tray (61) to rotate.
2. The laboratory simulated PCB etching pilot plant according to claim 1, characterized in that, The upper surface of the tray (61) is provided with a fastener (64), which includes two symmetrically arranged clips (641), and the PCB board is placed between the two clips (641).
3. The laboratory simulated PCB etching pilot plant according to claim 1, characterized in that, The spray assembly (2) includes a centrifugal pump (21), a suction pipe (22) and an outlet pipe (23). One end of the suction pipe (22) is connected to the inlet of the centrifugal pump (21), and the other end is connected to the storage chamber (11). One end of the outlet pipe (23) is connected to the outlet of the centrifugal pump (21), and the other end passes through the cover (5) and extends to the top of the tray (61). A pressure gauge (24) is provided on the outlet pipe (23). The centrifugal pump (21) is electrically connected to the controller (4).
4. The laboratory simulated PCB etching pilot plant according to claim 3, characterized in that, The outlet pipe (23) is provided with a movable nozzle (25) at one end away from the centrifugal pump (21), and the movable nozzle (25) faces the tray (61).
5. The laboratory simulated PCB etching pilot plant according to claim 4, characterized in that, The movable nozzle (25) includes a nozzle tube body (251), a connecting tube (252), and a nozzle (253). The connecting tube (252) is disposed in the inner cavity of the nozzle tube body (251). The nozzle tube body (251) is rotatably connected to the outer wall of the liquid outlet pipe (23). The connecting tube (252) is internally connected to the liquid outlet pipe (23). One end of the connecting tube (252) away from the liquid outlet pipe (23) is connected to the nozzle (253). The nozzle (253) is fan-shaped.
6. The laboratory-scale PCB etching simulation apparatus according to claim 5, characterized in that, The movable nozzle (25) also includes a telescopic rod (254), which passes through the side wall of the housing (1). The telescopic end of the telescopic rod (254) extends into the housing (1) and connects with the nozzle tube (251). The nozzle tube (251) is rotated by the telescopic rod (254).
7. The laboratory simulated PCB etching pilot plant according to claim 1, characterized in that, The temperature control component (3) includes a temperature sensor (31) and a heating tube (32), both of which extend into the liquid storage chamber (11) and are electrically connected to the controller (4).
8. A laboratory-scale PCB etching simulation apparatus according to claim 1, characterized in that, The bottom of the box (1) is provided with a drain pipe (7), which is connected to the liquid storage chamber (11). A drain valve (71) is provided on the drain pipe (7).