Jig for semiconductor device detection and semiconductor device detection equipment

Abstract

The utility model provides a jig for semiconductor device detection, and belongs to the technical field of semiconductor device production. The jig for detecting the semiconductor device comprises a bottom plate. A detachable jig unit and a clamp are arranged on the bottom plate, the clamp comprises a base and a clamping piece, the base is detachably arranged on the bottom plate, the clamping piece is arranged on one side of the base and connected with the base through an elastic connecting structure, and a clamping position is formed between the clamping piece and the jig unit. According to the jig, all parts are unitized, and all the units are spliced for use, so that the parts of the jig can be independently replaced when being damaged or failed, the repeated utilization rate and reliability of the jig are improved, and the economic benefits of the jig are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device manufacturing technology, and in particular to a fixture and equipment for testing semiconductor devices. Background Technology

[0002] X-ray inspection, as a non-destructive testing method, plays a crucial role in the quality inspection of industrial products. Especially in the semiconductor device manufacturing process, X-ray inspection is widely used to inspect critical structures such as bonding wires and lead frames within the device to ensure product quality and reliability. In current semiconductor device X-ray inspection practices, whether automated or manual, some form of fixture is required to support and position the device under test. Common fixture types include tubing, trays, and custom-made fixtures. While custom-made fixtures can be tailored to the specific dimensions of semiconductor devices to improve inspection accuracy and stability, different devices often have different dimensions. This means that fixtures and even equipment need to be manufactured separately for different devices. This not only increases production costs but also leads to low fixture reusability. Furthermore, if any part of the fixture malfunctions, the entire fixture often needs to be scrapped, further reducing its economic efficiency and practicality.

[0003] Therefore, it is necessary to improve existing semiconductor device testing fixtures to overcome the shortcomings of the existing technology. Utility Model Content

[0004] To overcome the problems existing in related technologies, one of the objectives of this utility model is to provide a fixture for testing semiconductor devices. This fixture modularizes its various parts and uses them in combination. This allows for individual replacement of damaged or failed parts, improving the reusability and reliability of the fixture and enhancing its economic benefits.

[0005] A fixture for testing semiconductor devices includes a base plate; the base plate is provided with a detachable fixture unit and a clamp, the clamp includes a base and a clamping member, the base is detachably disposed on the base plate, the clamping member is disposed on one side of the base, the clamping member is connected to the base through an elastic connection structure, and a clamping position is formed between the clamping member and the fixture unit.

[0006] Specifically, the base plate is made of high-strength, wear-resistant metal materials, such as stainless steel or aluminum alloy, ensuring good stability and durability during use. The base plate is designed with standardized mounting holes and positioning slots for easy installation and removal of the fixture unit and clamps. The fixture unit is customized according to the specific model of the semiconductor device and testing requirements, including but not limited to test probes, positioning pins, and support platforms. The fixture unit is detachably connected to the base plate via bolts or snap-fit ​​structures, facilitating quick replacement according to different testing needs.

[0007] During use, this fixture selects appropriate fixture units and clamps based on the model of the semiconductor device to be tested and the testing requirements, and installs them on the base plate. The semiconductor device is placed in the clamping position, and the elastic connection structure of the clamping parts is adjusted to ensure a tight fit and stable fixation. Then, the testing equipment is started to perform various performance tests and parameter checks on the semiconductor device. Furthermore, since both the fixture unit and the base are detachably mounted on the base plate, this modular design allows for individual replacement of damaged or failed parts, eliminating the need to replace the entire fixture and significantly improving its reusability. The modular design also makes maintenance and upkeep more convenient, enabling timely detection and repair of potential problems, thereby enhancing the fixture's reliability and stability. Replacing damaged parts individually reduces the cost of replacing the entire fixture and extends its service life, thus significantly improving economic efficiency.

[0008] In a preferred embodiment of this invention, a first clamping surface is provided on one side wall of the fixture unit, and a second clamping surface is provided on the clamping member. The first clamping surface and the second clamping surface are parallel to each other, and both the first clamping surface and the second clamping surface are perpendicular to the surface of the base.

[0009] The first clamping surface and the second clamping surface are parallel to each other, and both are perpendicular to the surface of the base, ensuring the accuracy and stability of clamping.

[0010] In the manufacturing process of some semiconductor devices, vertical inspection of the device is required. Existing technologies often use device tubes, trays, or custom-made fixtures as inspection jigs. However, with tubes and trays, the gaps are relatively large, allowing the device to tilt at a significant angle, making it difficult for X-ray point light source-based inspection equipment to align and inspect, resulting in decreased inspection efficiency and accuracy. This application addresses this issue by using a first and second clamping surface, ensuring that the semiconductor device remains vertical when held by both surfaces, thus guaranteeing inspection accuracy.

[0011] In a preferred embodiment of this utility model, the bottom of the base is provided with two connecting ears, which are symmetrically arranged on opposite sides of the base.

[0012] The connecting ear is provided with a first mounting hole, and the base is detachably connected to the base plate by bolts passing through the first mounting hole.

[0013] In this embodiment, during installation, the connecting lugs of the base are aligned with the mounting area on the base plate to ensure that the first mounting hole is aligned with the corresponding hole on the base plate.

[0014] Use bolts to pass through the first mounting hole and tighten them into the corresponding holes on the base plate to achieve a firm connection between the base and the base plate.

[0015] When disassembly is required, simply loosen the bolts counterclockwise to easily remove the base from the base plate. The symmetrically arranged connecting ears and first mounting hole design ensure the balance and stability of the base during installation, effectively preventing the clamp from shaking or shifting during use.

[0016] In a preferred embodiment of this utility model, a guide strip is provided on the base plate, the guide strip protrudes from the surface of the base plate, and a slot is provided on the base, the guide strip is engaged with the guide strip;

[0017] The base is also equipped with a locking element that passes through the base and connects to the bottom plate. The locking element can be a threaded hole or a similar structure for receiving locking screws or other locking devices. The position of the locking element matches a corresponding point on the bottom plate to ensure that the base is further securely locked after engagement.

[0018] In this embodiment, the base is initially positioned on the base plate by aligning the guide strip with the slot. This step simplifies the installation process while ensuring accurate positioning.

[0019] Next, a locking component (such as a locking screw) is inserted through the base and tightened to the corresponding point on the base plate, achieving a secure connection between the base and the base plate. This dual fixing method (clamping + locking) ensures high stability of the fixture during use. The clamping design of the guide strip and the slot allows the base to be quickly and accurately positioned on the base plate, greatly improving installation accuracy and efficiency. In an optimal usage scenario, the base can also move along the guide strip via the slot to adjust its position as needed.

[0020] In a preferred embodiment of this utility model, the elastic connection structure includes a connecting post and a sleeve. The connecting post is disposed on the base, the sleeve is disposed on the clamping member, the sleeve is sleeved on the connecting post, and a spring is disposed between the sleeve and the connecting post.

[0021] In actual use, the sleeve is set on the clamping part, and its inner diameter is slightly larger than the outer diameter of the connecting post, so that the sleeve can be fitted onto the connecting post and a certain gap is left for the spring to be installed.

[0022] A spring is placed between the sleeve and the connecting post, with its two ends abutting against the inner wall of the sleeve and the outer wall of the connecting post, respectively. The spring was selected considering its elastic modulus, stiffness, and durability to ensure a stable clamping force during long-term use. When it is necessary to clamp a semiconductor device, an external force is used to push the clamping element towards the base, causing the sleeve to slide along the connecting post and compressing the spring.

[0023] When the spring is compressed, it generates a reaction force that pushes the clamping element to firmly hold the semiconductor device. Due to the elasticity of the spring, the clamping element can automatically adapt to semiconductor devices of different sizes and shapes, ensuring the stability and reliability of the clamping.

[0024] When it is necessary to release the semiconductor device, simply remove the external force, and the spring force will push the clamp back to its original position, achieving a quick and easy release.

[0025] The flexible connection structure allows the clamping element to automatically adapt to semiconductor devices of different sizes and shapes, greatly improving the flexibility and versatility of clamping. The elasticity of the spring provides a continuous clamping force, ensuring the stability and reliability of the semiconductor devices during the testing process.

[0026] In a preferred embodiment of this utility model, the elastic connection structure includes a guide rail, a slider, and an elastic element. The guide rail is fixed on the base, and the length direction of the guide rail is set along the width direction of the clamping position.

[0027] The slider is mounted on the guide rail, and the clamping member is provided on one side of the slider. The elastic member is disposed between the slider and the base.

[0028] The elastic connection structure in this embodiment consists of a guide rail, a slider, and an elastic element. The guide rail is fixed to the base to provide a stable sliding track for the slider.

[0029] The slider is mounted on a guide rail and can slide freely along it. A clamping element is located on one side of the slider for holding semiconductor devices. The design of the fit between the slider and the guide rail ensures smooth and stable sliding.

[0030] An elastic element, typically a spring or similar resilient component, is positioned between the slider and the base. One end of the elastic element abuts against the slider, and the other end abuts against the base, providing elastic support and a return force to the slider. When a semiconductor device needs to be clamped, an external force pushes the slider along the guide rail towards the base, simultaneously compressing the elastic element.

[0031] When the elastic element is compressed, it generates a reaction force that pushes the slider and clamping components to tightly grip the semiconductor device. Due to the elasticity of the elastic element, the clamping components can automatically adapt to semiconductor devices of different sizes and shapes, ensuring the stability and reliability of the clamping.

[0032] When it is necessary to release the semiconductor device, simply remove the external force, and the elastic force of the elastic element will push the slider and clamping parts back to their original positions, achieving quick and easy release.

[0033] In a preferred embodiment of this utility model, the sidewall of the base plate is provided with a first connecting structure and a second connecting structure, and the first connecting structure and the second connecting structure are respectively provided on different sidewalls of the base plate, and the first connecting structure and the second connecting structure are mutually compatible.

[0034] The different base plates are interlocked by the cooperation of the first connecting structure and the second connecting structure.

[0035] Different base plates can be spliced ​​together to meet the testing needs of different testing platforms.

[0036] In practical use, the first connecting structure is set on one side wall of the base plate. It can be a protruding buckle, slot or similar structure with a defined size and shape so as to cooperate with the second connecting structure of other base plates.

[0037] The second connecting structure is located on the opposite side wall of the base plate, opposite to the first connecting structure, and is designed to be compatible with it. The second connecting structure can be a recessed slot, a protrusion, or a similarly shaped structure, used to receive and fix the first connecting structure. When it is necessary to expand the testing platform or construct testing areas of different shapes, this can be achieved by splicing multiple base plates together. During splicing, the first connecting structure of one base plate is aligned with the second connecting structure of another base plate, and then pressed or rotated to make them tightly locked together. Because the first and second connecting structures are designed to be compatible, the spliced ​​base plates maintain a stable connection and will not easily separate due to external forces. By splicing base plates of different numbers and shapes, testing platforms that meet various testing needs can be constructed. For example, large, complex testing platforms can be constructed for simultaneous testing of multiple semiconductor devices; small, simple testing platforms can also be constructed for rapid and flexible single-testing.

[0038] In a preferred embodiment of this invention, the base plate is provided with a plurality of second mounting holes, and the second mounting holes are provided with detachable positioning screws.

[0039] The second mounting hole is used to place a positioning screw to cooperate with the outer packaging of the fixture to assist in the positioning of automatic X-ray detection, thereby improving the accuracy of X-ray detection.

[0040] In a preferred embodiment of this invention, an outer packaging strip is provided on the side wall edge of the base plate, and the outer packaging strip is snapped onto the base plate.

[0041] The outer packaging strip is made of metal and is used in conjunction with positioning screws to assist in automatic X-ray detection and positioning.

[0042] The second objective of this utility model is to provide a semiconductor device testing device, including a worktable, on which a semiconductor device testing fixture as described above is provided.

[0043] The worktable is the core component of semiconductor device testing equipment. Designed as a stable and flat surface, it holds and supports semiconductor devices and testing fixtures. The equipment also includes necessary testing devices and instruments, such as X-ray inspection equipment, sensors, and test probes, for testing various electrical and physical characteristics of semiconductor devices. By integrating optimized fixtures into the testing equipment, personnel can more conveniently and quickly test semiconductor devices. The flexibility and expandability of the fixtures make the testing process more efficient, reducing unnecessary waiting and adjustment time.

[0044] The beneficial effects of this utility model are as follows:

[0045] This utility model provides a semiconductor device testing fixture, which includes a base plate. The base plate is equipped with a detachable fixture unit and a clamp. The clamp includes a base and a holding member. The base is detachably mounted on the base plate, and the clamp is located on one side of the base. The clamp and the base are connected by an elastic connection structure, forming a clamping position between the clamp and the fixture unit. During use, the appropriate fixture unit and clamp are selected according to the model of the semiconductor device to be tested and the testing requirements, and then installed on the base plate. The semiconductor device is placed in the clamping position, and the elastic connection structure of the clamp is adjusted to ensure that the clamp fits tightly against the semiconductor device, ensuring its secure fixation. Then, the testing equipment is started to perform various performance tests and parameter checks on the semiconductor device. Furthermore, since both the fixture unit and the base are detachably mounted on the base plate, the detachable design allows for modularization of the fixture unit and base. This modular design makes maintenance and upkeep of the fixture more convenient, enabling timely detection and repair of potential problems, thereby enhancing the reliability and stability of the fixture. By replacing the damaged parts individually, the cost of replacing the entire fixture is reduced, while the service life of the fixture is increased, thus significantly improving economic efficiency.

[0046] This application also provides a semiconductor device testing apparatus, which includes a worktable on which a semiconductor device testing fixture as described above is disposed. This apparatus, through the fixture, can meet the testing needs of various semiconductor devices, and the fixture has low operating costs, thereby reducing the testing cost of semiconductor devices. Attached Figure Description

[0047] Figure 1 This is a perspective view of the semiconductor device testing fixture provided in an embodiment of this utility model;

[0048] Figure 2 This is a side view of a semiconductor device testing fixture provided in an embodiment of this utility model;

[0049] Figure 3 This is a schematic diagram of the splicing of multiple semiconductor device testing fixtures provided in the embodiments of this utility model;

[0050] Figure 4 This is a schematic diagram of the elastic connection structure provided in the embodiments of this utility model, which includes a connecting column and a sleeve;

[0051] Figure 5 This is a schematic diagram of the elastic connection structure provided in the embodiments of this utility model, which includes a guide rail.

[0052] Figure 6 This is a top view of the base provided in an embodiment of this utility model;

[0053] Figure 7 This is a schematic diagram showing the cooperation between the base and the guide bar in an embodiment of this utility model.

[0054] Figure label:

[0055] 1. Fixture unit; 11. First clamping surface; 12. Clamping position; 2. Base; 21. Connecting ear; 22. First mounting hole; 3. Clamping component; 31. Second clamping surface; 4. First connecting structure; 5. Second connecting structure; 6. Base plate; 61. Guide strip; 7. Outer packaging strip; 8. Second mounting hole; 9. Elastic connecting structure; 91. Connecting post; 92. Spring; 93. Sleeve; 94. Guide rail; 95. Slider; 96. Elastic component. Detailed Implementation

[0056] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0057] Existing semiconductor testing fixtures, while customizable to the specific dimensions of semiconductor devices to improve testing accuracy and stability, often suffer from varying device sizes. This necessitates the creation of custom fixtures and even separate equipment for each device, increasing production costs and resulting in low fixture reusability. Furthermore, a malfunction in any part of the fixture often necessitates scrapping the entire fixture, further reducing its economic viability and practicality. Therefore, this application provides a semiconductor device testing fixture.

[0058] Example 1

[0059] like Figures 1-7 As shown, this embodiment provides a semiconductor device testing fixture, including a base plate 6; the base plate 6 is provided with a detachable fixture unit 1 and a clamp, the clamp includes a base 2 and a clamping member 3, the base 2 is detachably disposed on the base plate 6, the clamping member 3 is disposed on one side of the base 2, the clamping member 3 is connected to the base 2 by an elastic connection structure 9, and a clamping position 12 is formed between the clamping member 3 and the fixture unit 1.

[0060] Specifically, the base plate 6 is made of high-strength, wear-resistant metal materials, such as stainless steel or aluminum alloy, ensuring good stability and durability during use. The base plate 6 is designed with standardized mounting holes and positioning slots for easy installation and removal of the fixture unit 1 and the clamp. The fixture unit 1 is customized according to the specific model of the semiconductor device and testing requirements, including but not limited to test probes, positioning pins, and support platforms. The fixture unit 1 is detachably connected to the base plate 6 via bolts or a snap-fit ​​structure, facilitating quick replacement according to different testing needs.

[0061] During use, this fixture selects the appropriate fixture unit 1 and clamps based on the model of the semiconductor device to be tested and the testing requirements, and installs them on the base plate 6. The semiconductor device is placed in the clamping position 12, and the elastic connection structure 9 of the clamping member 3 is adjusted to ensure a tight fit between the clamping member 3 and the semiconductor device, guaranteeing its stability. Then, the testing equipment is started to perform various performance tests and parameter checks on the semiconductor device. Furthermore, since both fixture unit 1 and base 2 are detachably mounted on the base plate 6, this modular design allows for individual replacement of the fixture unit 1 and base 2 when a part is damaged or fails, eliminating the need to replace the entire fixture and significantly improving its reusability. The modular design also makes maintenance and upkeep of the fixture more convenient, enabling timely detection and repair of potential problems, thereby enhancing the fixture's reliability and stability. By replacing damaged parts individually, the cost of replacing the entire fixture is reduced, while simultaneously extending the fixture's lifespan, thus significantly improving economic efficiency.

[0062] More preferably, in this embodiment, the base plate 6 is provided with a plurality of second mounting holes 8, and the second mounting holes 8 are provided with detachable positioning screws.

[0063] The second mounting hole 8 is where a positioning screw is placed to cooperate with the outer packaging of the fixture to assist in the positioning of automatic X-ray detection, thereby improving the accuracy of X-ray detection.

[0064] In this embodiment, an outer packaging strip 7 is provided on the side wall edge of the base plate 6, and the outer packaging strip 7 is snapped onto the base plate 6.

[0065] The outer packaging strip 7 is made of metal and is used in conjunction with the positioning screw to assist in automatic X-ray detection and positioning.

[0066] Example 2

[0067] This embodiment is an improvement on embodiment 1.

[0068] like Figures 1-7 As shown, in this embodiment, a first clamping surface 11 is provided on one side wall of the fixture unit 1, and a second clamping surface 31 is provided on the clamping member 3. The first clamping surface 11 and the second clamping surface 31 are parallel to each other, and both the first clamping surface 11 and the second clamping surface 31 are perpendicular to the surface of the base 2.

[0069] The first clamping surface 11 and the second clamping surface 31 are parallel to each other, and both are perpendicular to the surface of the base 2, ensuring the accuracy and stability of clamping.

[0070] In the manufacturing process of some semiconductor devices, vertical inspection of the device is required. Existing technologies often use device tubes, trays, or custom-made fixtures as inspection jigs. However, with tubes and trays, the gaps are relatively large, allowing the device to tilt at a significant angle, making it difficult for X-ray point light source-based inspection equipment to align and inspect, resulting in decreased inspection efficiency and accuracy. This application, through the arrangement of a first clamping surface 11 and a second clamping surface 31, ensures that the semiconductor device remains vertical when clamped by the two surfaces, thereby guaranteeing inspection accuracy.

[0071] Example 3

[0072] This embodiment is an improvement on embodiment 2.

[0073] like Figures 1-7As shown, in this embodiment, the bottom of the base 2 is provided with connecting ears 21, and two connecting ears 21 are provided, which are symmetrically arranged on opposite sides of the base 2.

[0074] The connecting ear 21 is provided with a first mounting hole 22, and the base 2 is detachably connected to the base plate 6 by bolts passing through the first mounting hole 22.

[0075] In this embodiment, during installation, the connecting ear 21 of the base 2 is aligned with the mounting area on the base plate 6 to ensure that the first mounting hole 22 is aligned with the corresponding hole on the base plate 6.

[0076] A bolt is inserted through the first mounting hole 22 and screwed into the corresponding hole on the base plate 6 to achieve a firm connection between the base 2 and the base plate 6.

[0077] When disassembly is required, simply loosen the bolts counterclockwise to easily remove the base 2 from the base plate 6. The symmetrically arranged connecting ears 21 and the first mounting hole 22 design ensure the balance and stability of the base 2 during installation, effectively preventing the clamp from shaking or shifting during use.

[0078] Example 4

[0079] This embodiment is an improvement on embodiment 2.

[0080] like Figures 1-7 As shown, in this embodiment, the installation method of the base 2 is different from that in embodiment 3. Specifically, a guide strip 61 is provided on the base plate 6, the guide strip 61 protrudes from the surface of the base plate 6, and a slot is provided on the base 2, the guide strip 61 is engaged with the guide strip 61;

[0081] The base 2 is also provided with a locking member, which passes through the base 2 and connects to the base plate 6. The locking member can be a threaded hole or a similar structure, used to receive locking screws or other locking devices. The position of the locking member matches the corresponding point on the base plate 6 to ensure that the base 2 can be further securely locked after snapping.

[0082] In this embodiment, during installation, the base 2 is initially positioned on the base plate 6 by aligning the guide strip 61 with the slot. This step simplifies the installation process while ensuring accurate positioning.

[0083] Next, a locking component (such as a locking screw) passes through the base 2 and is tightened to the corresponding point on the base plate 6, achieving a secure connection between the base 2 and the base plate 6. This dual fixing method (clamping + locking) ensures high stability of the fixture during use. The clamping design of the guide bar 61 and the slot allows the base 2 to be quickly and accurately positioned on the base plate 6, greatly improving installation accuracy and efficiency. In an even better application, the base 2 can also move along the guide bar 61 via the slot to adjust its position as needed.

[0084] Example 5

[0085] This embodiment is an improvement on embodiment 1.

[0086] like Figures 1-4 As shown, this embodiment provides an implementation of an elastic connection structure 9. The elastic connection structure 9 includes a connecting post 91 and a sleeve 93. The connecting post 91 is disposed on the base 2, and the sleeve 93 is disposed on the clamping member 3. The sleeve 93 is sleeved on the connecting post 91, and a spring 92 is disposed between the sleeve 93 and the connecting post 91.

[0087] In actual use, the sleeve 93 is set on the clamping member 3. Its inner diameter is slightly larger than the outer diameter of the connecting post 91, so that the sleeve 93 can be sleeved on the connecting post 91, and a certain gap is left for the spring 92 to be installed.

[0088] Spring 92 is placed between sleeve 93 and connecting post 91, with its two ends abutting against the inner wall of sleeve 93 and the outer wall of connecting post 91, respectively. The selection of spring 92 takes into account its elastic modulus, stiffness, and durability to ensure stable clamping force during long-term use. When it is necessary to clamp semiconductor devices, external force pushes clamping member 3 towards base 2, causing sleeve 93 to slide along connecting post 91 and compress spring 92.

[0089] When spring 92 is compressed, it generates a reaction force that pushes clamping member 3 to firmly hold the semiconductor device. Due to the elasticity of spring 92, clamping member 3 can automatically adapt to semiconductor devices of different sizes and shapes, ensuring the stability and reliability of clamping.

[0090] When it is necessary to release the semiconductor device, simply remove the external force, and the elastic force of the spring 92 will push the clamp 3 back to its original position, achieving quick and easy release.

[0091] The design of the elastic connection structure 9 allows the clamping element 3 to automatically adapt to semiconductor devices of different sizes and shapes, greatly improving the flexibility and versatility of clamping. The elasticity of the spring 92 provides the clamping element 3 with a continuous clamping force, ensuring the stability and reliability of the semiconductor device during the testing process.

[0092] Example 6

[0093] This embodiment is an improvement on embodiment 1.

[0094] like Figures 1-3 , Figures 5-7 As shown, this embodiment provides an implementation of the elastic connection structure 9, which differs from that in Embodiment 5. The elastic connection structure 9 includes a guide rail 94, a slider 95, and an elastic element 96. The guide rail 94 is fixed on the base 2, and its length direction is arranged along the width direction of the clamping position 12.

[0095] The slider 95 is disposed on the guide rail 94, and the clamping member 3 is disposed on one side of the slider 95. The elastic member 96 is disposed between the slider 95 and the base 2.

[0096] The elastic connection structure 9 in this embodiment consists of a guide rail 94, a slider 95, and an elastic element 96. The guide rail 94 is fixed on the base 2 to provide a stable sliding track for the slider 95.

[0097] The slider 95 is mounted on the guide rail 94 and can slide freely along the guide rail 94. A clamping member 3 is provided on one side of the slider 95 for clamping semiconductor devices. The fit design between the slider 95 and the guide rail 94 ensures smooth and stable sliding.

[0098] An elastic element 96 is disposed between the slider 95 and the base 2, typically a spring 92 or a similar elastic component. One end of the elastic element 96 abuts against the slider 95, and the other end abuts against the base 2, providing elastic support and return force for the slider 95. When it is necessary to clamp a semiconductor device, an external force pushes the slider 95 to slide along the guide rail 94 towards the base 2, simultaneously compressing the elastic element 96.

[0099] When the elastic element 96 is compressed, it generates a reaction force, which pushes the slider 95 and the clamping member 3 to tightly clamp the semiconductor device. Due to the elastic effect of the elastic element 96, the clamping member 3 can automatically adapt to semiconductor devices of different sizes and shapes, and ensure the stability and reliability of clamping.

[0100] When it is necessary to release the semiconductor device, simply remove the external force, and the elastic force of the elastic element 96 will push the slider 95 and the clamping element 3 back to their original positions, achieving quick and easy release.

[0101] Example 7

[0102] This embodiment is an improvement on embodiment 1.

[0103] like Figures 1-7As shown, in this embodiment, the sidewall of the base plate 6 is provided with a first connecting structure 4 and a second connecting structure 5, and the first connecting structure 4 and the second connecting structure 5 are respectively provided on different sidewalls of the base plate 6, and the first connecting structure 4 and the second connecting structure 5 are mutually compatible.

[0104] The different base plates 6 are interlocked by the cooperation of the first connecting structure 4 and the second connecting structure 5.

[0105] Different base plates 6 can be spliced ​​together to meet the testing needs of different testing platforms.

[0106] In practical use, the first connecting structure 4 is set on one side wall of the base plate 6. It can be a protruding buckle, slot or similar structure with a defined size and shape so as to cooperate with the second connecting structure 5 of other base plates 6.

[0107] The second connecting structure 5 is disposed on the other side wall of the base plate 6, opposite to the first connecting structure 4, and is designed to be compatible with the first connecting structure 4. The second connecting structure 5 can be a recessed slot, a protrusion, or a similarly shaped structure, used to receive and fix the first connecting structure 4. When it is necessary to expand the detection platform or construct detection areas of different shapes, this can be achieved by splicing multiple base plates 6 together. During splicing, the first connecting structure 4 of one base plate 6 is aligned with the second connecting structure 5 of another base plate 6, and then pressed or rotated to make them tightly snap together. Since the first connecting structure 4 and the second connecting structure 5 are designed to be compatible, the spliced ​​base plates 6 can maintain a stable connection and will not easily separate due to external forces. By splicing base plates 6 of different numbers and shapes, detection platforms that meet various detection needs can be constructed. For example, large and complex detection platforms can be constructed for simultaneous detection of multiple semiconductor devices; small and simple detection platforms can also be constructed for rapid and flexible single detection.

[0108] Example 8

[0109] like Figures 1-7 As shown, this embodiment provides a semiconductor device testing device, including a worktable, on which a semiconductor device testing fixture as described above is provided.

[0110] In one specific embodiment, the inspection equipment can be an X-ray inspection device. The worktable is the core component of the semiconductor device inspection equipment, designed as a stable and flat surface for placing and supporting the semiconductor device and the inspection fixtures. The semiconductor device inspection equipment is also equipped with necessary inspection devices and instruments, such as an X-ray inspection instrument, which includes an X-ray source and an X-ray receiver. The X-ray source is located on one side or below the worktable and generates high-intensity X-rays to penetrate the semiconductor device and obtain its internal structural information. The X-ray receiver is located on the other side or above the worktable and receives the X-rays after they have penetrated the semiconductor device, converting them into electrical signals for subsequent processing. The equipment may also include sensors, test probes, etc., for inspecting various electrical and physical characteristics of the semiconductor device. By integrating optimized fixtures into the inspection equipment, inspectors can more conveniently and quickly inspect semiconductor devices. The flexibility and scalability of the fixtures make the inspection process more efficient, reducing unnecessary waiting and adjustment time.

[0111] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings. In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0112] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0113] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. For those skilled in the art, this utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A fixture for testing semiconductor devices, comprising a base plate (6), characterized in that: The base plate (6) is provided with a detachable fixture unit (1) and a clamp. The clamp includes a base (2) and a clamping member (3). The base (2) is detachably mounted on the base plate (6). The clamping member (3) is mounted on one side of the base (2). The clamping member (3) is connected to the base (2) through an elastic connection structure (9). A clamping position (12) is formed between the clamping member (3) and the fixture unit (1).

2. The semiconductor device testing fixture according to claim 1, characterized in that: The jig unit (1) has a first clamping surface (11) on one side wall and a second clamping surface (31) on the clamping member (3). The first clamping surface (11) and the second clamping surface (31) are parallel to each other, and both the first clamping surface (11) and the second clamping surface (31) are perpendicular to the surface of the base (2).

3. The semiconductor device testing fixture according to claim 2, characterized in that: The bottom of the base (2) is provided with connecting ears (21), and two connecting ears (21) are provided, which are symmetrically arranged on opposite sides of the base (2). The connecting ear (21) is provided with a first mounting hole (22), and the base (2) is detachably connected to the base plate (6) by bolts passing through the first mounting hole (22).

4. The semiconductor device testing fixture according to claim 2, characterized in that: A guide strip (61) is provided on the base plate (6), the guide strip (61) protrudes from the surface of the base plate (6), and a slot is provided on the base (2), the guide strip (61) is engaged with the guide strip (61); The base (2) is also provided with a locking member, which passes through the base (2) and connects with the bottom plate (6).

5. A semiconductor device testing fixture according to any one of claims 1-4, characterized in that: The elastic connection structure (9) includes a connecting post (91) and a sleeve (93). The connecting post (91) is disposed on the base (2), and the sleeve (93) is disposed on the clamping member (3). The sleeve (93) is sleeved on the connecting post (91), and a spring (92) is disposed between the sleeve (93) and the connecting post (91).

6. A semiconductor device testing fixture according to any one of claims 1-4, characterized in that: The elastic connection structure (9) includes a guide rail (94), a slider (95) and an elastic element (96). The guide rail (94) is fixed on the base (2), and the length direction of the guide rail (94) is arranged along the width direction of the clamping position (12). The slider (95) is disposed on the guide rail (94), and the clamping member (3) is disposed on one side of the slider (95). The elastic member (96) is disposed between the slider (95) and the base (2).

7. A semiconductor device testing fixture according to any one of claims 1-4, characterized in that: The sidewall of the base plate (6) is provided with a first connecting structure (4) and a second connecting structure (5), and the first connecting structure (4) and the second connecting structure (5) are respectively provided on different sidewalls of the base plate (6), and the first connecting structure (4) and the second connecting structure (5) are mutually compatible. The different base plates (6) are interlocked by the cooperation of the first connecting structure (4) and the second connecting structure (5).

8. A semiconductor device testing fixture according to claim 7, characterized in that: The base plate (6) is provided with a plurality of second mounting holes (8), and the second mounting holes (8) are provided with detachable positioning screws.

9. A semiconductor device testing fixture according to any one of claims 1-4, characterized in that: The sidewall edge of the base plate (6) is provided with an outer packaging strip (7), which is snapped onto the base plate (6).

10. A semiconductor device testing apparatus, comprising a worktable, characterized in that, The workbench is provided with a semiconductor device testing fixture as described in any one of claims 1-9.

Images