Optical module

Abstract

The utility model provides an optical module which comprises a laser, an electric connecting piece and a circuit board, and the electric connecting piece is connected with the laser and the circuit board. The electric connecting piece comprises a first adapter plate, a second adapter plate and a third adapter plate, the lower surface of the first adapter plate is connected with the upper surface of the second adapter plate, the lower surface of the second adapter plate is provided with a second metal layer, and the second metal layer is connected with the upper surface of the third adapter plate. And the second metal layer is connected with the second signal bonding pad and the laser through routing. A first gap is formed in one end, close to the circuit board, of the second adapter plate, the distance between the side wall of the first gap and the circuit board is reduced from the upper surface of the second adapter plate to the lower surface of the second adapter plate, the impedance of the second metal layer is reduced, and impedance discontinuity is reduced. A second gap is formed in one end, close to the laser, of the third adapter plate, the distance between the side wall of the second gap and the laser is increased from the upper surface of the third adapter plate to the lower surface of the third adapter plate, the impedance of the second metal layer is reduced, and impedance discontinuity is reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, the optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved. CONTENT OF THE UTILITY MODEL

[0003] The present disclosure provides an optical module, which reduces impedance discontinuity.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] A circuit board having an embedded entrance; a surface of a side wall of the embedded entrance forms a first signal pad and a second signal pad;

[0006] An optical transmitting component disposed in the embedded entrance, comprising:

[0007] A first housing having a laser disposed therein, and a first insertion hole formed at one end thereof;

[0008] An electrical connector inserted into the first insertion hole, one end of which is electrically connected to the laser, and the other end of which is electrically connected to the first signal pad and the second signal pad;

[0009] The electrical connector comprises:

[0010] A first adapter plate provided with a first metal layer; the first metal layer is electrically connected to the second signal pad;

[0011] A second adapter plate, an upper surface of which is connected to a lower surface of the first adapter plate, and a second metal layer is disposed on the lower surface; one end of the second metal layer is connected to the first signal pad by wire bonding, and the other end of the second metal layer is connected to the laser by wire bonding;

[0012] A third adapter plate, an upper surface of which is connected to the second metal layer;

[0013] One end of the second adapter plate close to the circuit board forms a first notch, and the distance between the side wall of the first notch and the circuit board is reduced from the upper surface of the second adapter plate to the lower surface of the second adapter plate; one end of the third adapter plate close to the laser forms a second notch, and the distance between the side wall of the second notch and the laser is increased from the upper surface of the third adapter plate to the lower surface of the third adapter plate.

[0014] The technical scheme has the following beneficial effects: the present disclosure provides an optical module, which comprises a circuit board and a light emitting component. The circuit board has an embedding entrance, and the light emitting component is arranged at the embedding entrance to connect the light emitting component with the circuit board. A side wall of the embedding entrance has a first signal pad and a second signal pad. The first signal pad is used for transmitting a low-frequency signal, and the second signal pad is used for transmitting a high-frequency signal. The light emitting component comprises a first shell and an electrical connector. The first shell is internally provided with a laser, which is used for generating an optical signal. An end of the first shell forms a first insertion hole, and the electrical connector is inserted into the first insertion hole to connect the electrical connector with the first shell. One end of the electrical connector is connected with the laser to provide an electrical signal for the laser, so that the laser generates the optical signal under the action of the electrical signal. The other end of the electrical connector is connected with the first signal pad and the second signal pad to connect the electrical connector with the circuit board, thereby transmitting the electrical signal between the electrical connector and the circuit board. The electrical connector comprises a first adapter plate, a second adapter plate and a third adapter plate. The lower surface of the first adapter plate is connected with the upper surface of the second adapter plate, and the lower surface of the second adapter plate is connected with the upper surface of the third adapter plate. The first adapter plate is provided with a first metal layer, and the first metal layer is connected with the second signal pad by wire bonding to transmit the low-frequency signal between the electrical connector and the circuit board. The lower surface of the second adapter plate is provided with a second metal layer, and the second metal layer can be connected with the upper surface of the third adapter plate. One end of the second metal layer is connected with the first signal pad by wire bonding, and the other end of the second metal layer is connected with the laser by wire bonding to transmit the high-frequency signal between the laser chip and the circuit board. The first gap is formed at one end of the second adapter plate close to the circuit board. From the upper surface of the second adapter plate to the lower surface of the second adapter plate, the distance between the side wall of the first gap and the circuit board is reduced, so that the medium in which the second metal layer is located changes from ceramic to ceramic and air, and the proportion of air increases. The dielectric constant of air is smaller than that of ceramic, thereby reducing the impedance of the second metal layer to approach the impedance of the wire bonding with air as the medium, so as to reduce the impedance discontinuity. The second gap is formed at one end of the third adapter plate close to the laser. From the upper surface of the third adapter plate to the lower surface of the third adapter plate, the distance between the side wall of the second gap and the laser is increased, so that the medium in which the second metal layer is located changes from ceramic to ceramic and air, and the proportion of air increases, thereby reducing the impedance of the second metal layer to approach the impedance of the wire bonding with air as the medium, so as to reduce the impedance discontinuity.

[0015] In some embodiments, the side wall of the first gap is an inclined surface or a stepped surface; and the side wall of the second gap is an inclined surface or a stepped surface.

[0016] The technical scheme has the following beneficial effects: the side wall of the first gap is a stepped surface, and the distance between the side wall of the first gap and the circuit board gradually decreases from the upper surface of the second adapter plate to the lower surface of the second adapter plate. The distance between the side wall of the first gap and the circuit board gradually decreases, so that the proportion of air in the medium gradually increases, and the impedance of the second metal layer gradually decreases to approach the impedance of the wire bonding in air, thereby reducing impedance discontinuity.

[0017] The side wall of the second gap is a stepped surface, and the distance between the side wall of the second gap and the laser gradually increases from the upper surface of the third adapter plate to the lower surface of the third adapter plate. The distance between the side wall of the second gap and the laser gradually increases, so that the proportion of air in the medium gradually increases, and the impedance of the second metal layer gradually decreases to approach the impedance of the wire bonding in air, thereby reducing impedance discontinuity.

[0018] In some embodiments, a light module is provided, and the second metal layer includes:

[0019] The signal metal layer includes:

[0020] The first signal metal part is located in the middle of the signal metal layer.

[0021] The second signal metal part is located at the end of the signal metal layer, and one end of the second signal metal part is connected with the first signal metal part, and the other end of the second signal metal part is connected with the laser or the first signal pad through wire bonding. The width of the second signal metal part is greater than the width of the first signal metal part.

[0022] The second signal metal part is located in the projection area of the first gap on the second metal layer, and the second gap on the second metal layer.

[0023] The technical scheme has the following beneficial effects: the second metal layer comprises a signal metal layer, and the signal metal layer is used for transmitting a high-frequency signal. The signal metal layer comprises a first signal metal part and a second signal metal part. The first signal metal part is located in the middle of the signal metal layer, and the second signal metal part is located at the end of the signal metal layer. One end of the second signal metal part is connected with the first signal metal part, and the other end of the second signal metal part is connected with the laser or the first signal pad through wire bonding, so that the high-frequency signal between the laser and the circuit board can be transmitted through the signal metal layer. The second signal metal part serves as a wire bonding area of the signal metal layer, and the width size of the second signal metal part is greater than the width size of the first signal metal part, so as to provide sufficient bonding space for wire bonding. The second signal metal part is located in the projection area of the first gap in the second metal layer, so that the medium of the signal metal layer is changed from ceramic to ceramic and air, the dielectric constant of the signal metal layer is changed, and then the impedance of the signal metal layer is changed. The second signal metal layer is located in the projection area of the second gap in the second metal layer, so that the medium of the signal metal layer is changed from ceramic to ceramic and air, the dielectric constant of the signal metal layer is changed, and then the impedance of the signal metal layer is changed.

[0024] In some embodiments, a light module is provided, and the second metal layer comprises:

[0025] A ground metal layer is provided between the signal metal layer and the first metal layer.

[0026] A capacitor is attached to the ground metal layer, one end of the capacitor is connected with the ground metal layer, and the other end of the capacitor is connected with the laser and the first metal layer.

[0027] The technical scheme has the following beneficial effects: the second metal layer comprises a ground metal layer, and there is a gap between the ground metal layer and the signal metal layer, so as to reduce electromagnetic interference. The capacitor is attached to the ground metal layer, one end of the capacitor is connected with the ground metal layer, and the other end of the capacitor is connected with the laser and the first metal layer, so as to realize a filtering function.

[0028] In some embodiments, a light module is provided, and the first adapter board comprises:

[0029] An adapter part is provided with the first metal layer on the upper surface.

[0030] A support part is connected with the first metal layer on the lower surface. The width size of the support part is smaller than the width size of the adapter part.

[0031] The technical scheme has the following beneficial effects: the first adapter plate comprises an adapter part and a supporting part, the upper surface of the adapter part is provided with a first metal layer, the lower surface of the supporting part is connected with the first metal layer, and the width size of the supporting part is smaller than the width size of the adapter part, so as to shield part of the first metal layer, so that the first metal layer is partially exposed, and the electrical connection of the first metal layer with the circuit board and the laser is facilitated.

[0032] In some embodiments, a light module is provided, further comprising:

[0033] A first protective cover is arranged on the circuit board, and a gap is formed between the top of the first protective cover and the circuit board; the first protective cover covers the first signal pad and the first metal layer.

[0034] The technical scheme has the following beneficial effects: the light module further comprises a first protective cover, the bottom of the first protective cover is arranged on the circuit board, and a gap is formed between the top of the first protective cover and the circuit board, so as to protect the devices in the gap. The first protective cover covers the first signal pad and the first metal layer, so as to protect the wire bonding between the first signal pad and the first metal layer.

[0035] In some embodiments, a light module is provided, further comprising:

[0036] A light receiving component is arranged on the circuit board, comprising:

[0037] A light receiving chip is arranged on the circuit board, and is connected with the light receiving component.

[0038] A transimpedance amplification chip is arranged on the circuit board, and is connected with the light receiving chip.

[0039] The technical scheme has the following beneficial effects: the light module further comprises a light receiving component, the light receiving component is arranged on the circuit board, and the light receiving component is used for receiving an optical signal. The light receiving component comprises a light receiving chip and a transimpedance amplification chip, the light receiving chip is used for converting the optical signal into a current signal. The transimpedance amplification chip is arranged on the circuit board, and the transimpedance amplification chip is connected with the light receiving chip, so as to convert the current signal into a voltage signal.

[0040] In some embodiments, a light module is provided, and the light receiving chip is reversely mounted on the transimpedance amplification chip.

[0041] The technical scheme has the following beneficial effects: the light receiving chip is reversely mounted on the transimpedance amplification chip, so as to shorten the signal transmission path.

[0042] In some embodiments, a light module is provided, and the light receiving chip is integrated with a lens, and the lens is used for converging an optical signal.

[0043] The technical scheme has the following beneficial effects: the light receiving chip is integrated with the lens, and the lens is used for focusing the optical signal to improve the optical coupling efficiency. The light receiving chip is integrated with the lens, and the alignment tolerance can be increased.

[0044] In some embodiments, a light module is provided, and the light emitting component further comprises:

[0045] A first lens is located in the light emitting direction of the laser, and is used for collimating the optical signal.

[0046] A second lens is located in the collimating direction of the first lens, and is used for converging the optical signal.

[0047] The technical scheme has the following beneficial effects: the light emitting component further comprises the first lens and the second lens, the first lens is located in the light emitting direction of the laser, and the first lens is used for collimating the optical signal emitted by the laser. The second lens is located in the collimating direction of the first lens, and the second lens is used for converging the collimated optical signal. BRIEF DESCRIPTION OF DRAWINGS

[0048] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0049] Figure 1 A partial structure diagram of a light communication system according to some embodiments is provided.

[0050] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided.

[0051] Figure 3 A structure diagram of a light module according to some embodiments is provided.

[0052] Figure 4 An exploded view of a light module according to some embodiments is provided.

[0053] Figure 5a A structure diagram of the internal structure of a light module according to some embodiments is provided.

[0054] Figure 5b An exploded view of the internal structure of a light module according to some embodiments is provided.

[0055] Figure 6a A structure diagram of the internal structure of a light module according to some embodiments is provided.

[0056] Figure 6b An exploded view of an internal structure of an optical module according to some embodiments, from another perspective;

[0057] Figure 7 A structure diagram of an optical receiving component according to some embodiments;

[0058] Figure 8a A structure diagram of an optical transmitting component according to some embodiments;

[0059] Figure 8b An exploded view of an optical transmitting component according to some embodiments;

[0060] Figure 8c A sectional view of an optical transmitting component according to some embodiments;

[0061] Figure 9a An exploded view of an electrical connector according to some embodiments;

[0062] Figure 9b An exploded view of an electrical connector according to some embodiments, from another perspective;

[0063] Figure 9c A partial view of an electrical connector according to some embodiments;

[0064] Figure 10 A structure diagram of a second adapter plate according to some embodiments;

[0065] Figure 11 A structure diagram of a third adapter plate according to some embodiments;

[0066] Figure 12 A sectional view of an electrical connector according to some embodiments;

[0067] Figure 13a A sectional view of an optical module according to some embodiments;

[0068] Figure 13b A sectional view of an optical module according to some embodiments, from another perspective;

[0069] Figure 14 A simulation diagram of an optical transmitting component according to some embodiments. DETAILED DESCRIPTION

[0070] The following description, in conjunction with the accompanying drawings, provides a clear and detailed account of some embodiments of this disclosure. However, the described embodiments are merely some, and not all, of the embodiments described herein. All other embodiments obtained by those skilled in the art based on the embodiments provided herein are within the scope of protection of this disclosure.

[0071] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0072] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0073] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0074] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0075] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0076] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0077] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0078] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0079] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0080] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0081] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0082] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0083] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0084] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0085] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0086] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0087] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0088] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0089] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0090] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0091] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0092] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0093] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0094] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0095] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0096] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0097] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0098] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0099] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0100] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0101] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0102] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0103] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0104] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0105] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0106] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 3 and Figure 4 As shown. The light emitting component 400 is used to emit a second light signal.

[0107] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown, the optical receiving unit 500 is used to receive the first optical signal and convert the first optical signal into an electrical signal.

[0108] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0109] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0110] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0111] In some embodiments, the light emitting component 400 is connected to the first end of the light receiving component 500 so that the light signal emitted by the light emitting component 400 is transmitted to the light receiving component 500.

[0112] In some embodiments, a DSP chip 320 may be disposed on the upper surface of the circuit board 300. The DSP chip 320 may be connected to the light emitting component 400 so that the light emitting component 400 can receive the electrical signals transmitted by the DSP chip 320 and emit light signals according to the electrical signals. The DSP chip 320 may be connected to the light receiving component 500 so that the DSP chip 320 can receive the electrical signals transmitted by the light receiving component 500 and process the electrical signals.

[0113] Figure 5a This is a structural diagram of the internal structure of an optical module according to some embodiments. Figure 5b This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 5a and Figure 5b As shown, in some embodiments, the circuit board 300 may be provided with an insertion port 310. The light emitting component 400 may be placed in the insertion port 310.

[0114] In some embodiments, the light receiving component 500 may be disposed on the upper surface of the circuit board 300. A first signal pad 330 may be disposed on the upper surface of the upper surface of one sidewall of the insertion port 310. The light emitting component 400 may be connected to the first signal pad 330 via wire bonding, so that the light emitting component 400 can be electrically connected to the circuit board 300. For example, the first signal pad 330 may be a high-frequency signal pad, and the high-frequency metal layer of the light emitting component 400 may be connected to the first signal pad 330 via wire bonding, so that high-frequency signals can be transmitted between the light emitting component 400 and the circuit board 300.

[0115] Figure 6a This is a structural diagram of the internal structure of an optical module provided according to some embodiments, viewed from another perspective. Figure 6b This is an exploded view of the internal structure of an optical module according to some embodiments, taken from another perspective. Figure 6a and Figure 6b As shown, in some embodiments, a second signal pad 350 may be provided on the lower surface of the circuit board 300. The second signal pad 350 may be located on the lower surface of one side wall of the insertion port 310. The light emitting component 400 may be connected to the second signal pad 350 via wire bonding, so that the light emitting component 400 can be electrically connected to the circuit board 300. For example, the second signal pad 350 may be a low-frequency signal pad, and the low-frequency metal layer of the light emitting component 400 may be connected to the second signal pad 350 via wire bonding, so that low-frequency signals can be transmitted between the light emitting component 400 and the circuit board 300.

[0116] In some embodiments, a first protective cover 340 may be provided on the lower surface of the circuit board 300. The bottom of the first protective cover 340 may be disposed on the circuit board 300, and there is a gap between the top of the first protective cover 340 and the circuit board 300 to protect the devices within the gap. The first protective cover 340 may cover the second signal pad 350 and the low-frequency metal layer of the light emitting component 400 to protect the wire bonding between the second signal pad 350 and the low-frequency metal layer of the light emitting component 400.

[0117] Figure 7 This is a structural diagram of an optical receiving component according to some embodiments. Figure 7 As shown, in some embodiments, the light receiving component 500 may include a light receiving chip 580. The light receiving chip 580 may be disposed on the circuit board 300. The light receiving chip 580 can convert the received light signal into a current signal.

[0118] In some embodiments, solder balls may be provided on the bottom surface of the optical receiver chip 580 so that the optical receiver chip 580 can be mounted upside down on the circuit board 300.

[0119] In some embodiments, the optical receiver chip 580 may integrate a fourth lens. The fourth lens can focus the optical signal and improve optical coupling efficiency. In addition, the fourth lens can increase alignment tolerance and reduce the alignment difficulty between the optical fiber and the optical receiver chip 580.

[0120] In some embodiments, the optical receiving component 500 may include a transimpedance amplifier chip 590. The transimpedance amplifier chip 590 may be disposed on the circuit board 300. The transimpedance amplifier chip 590 may be electrically connected to the optical receiving chip 580 so that the transimpedance amplifier chip 590 can convert a current signal into a voltage signal. The transimpedance amplifier chip 590 may be electrically connected to the DSP chip 320 so that the DSP chip 320 can receive and process the voltage signal.

[0121] The bottom surface of the optical receiver chip 580 can be provided with solder balls, and the upper surface of the transimpedance amplifier chip 590 can be provided with pads corresponding to the solder balls. The optical receiver chip 580 is soldered to the pads of the transimpedance amplifier chip 590, so that the optical receiver chip 580 can be flip-mounted onto the transimpedance amplifier chip 590. Flip-mounting the optical receiver chip 580 onto the transimpedance amplifier chip 590 can shorten the signal transmission path, reduce parasitic parameters, and improve integration density.

[0122] In some embodiments, the optical receiving component 500 may include an optical fiber fastener 530. The optical fiber fastener 530 can be used to secure the optical fiber.

[0123] In some embodiments, the light receiving component 500 may include a third lens 540. The third lens 540 may be located in the light-emitting direction of the fiber optic fixing member 530 to receive the light signal emitted from the fiber optic fixing member 530 and collimate the light signal.

[0124] In some embodiments, the light receiving component 500 may include a second optical multiplexer 550. The light input port of the second optical multiplexer 550 may face the third lens 540, and the second optical multiplexer 550 may be located in the collimating optical path of the third lens 540, so that the second optical multiplexer 550 can receive the optical signal collimated by the third lens 540. The second optical multiplexer 550 can split a beam of optical signals including multiple different wavelengths into multiple beams of optical signals with different wavelengths.

[0125] In some embodiments, the light receiving component 500 may include a light transmitting element 560. The light transmitting element 560 may be located in the light output direction of the second optical multiplexer 550 so that the light transmitting element 560 can receive and transmit multiple light signals of different wavelengths.

[0126] In some embodiments, the light receiving component 500 may include a displacement prism 570. The displacement prism 570 may be located in the light transmission direction of the light transmitting component 560 to receive light signals transmitted through the light transmitting component 560. The displacement prism 570 may change the transmission direction of the light signal so that the light receiving chip 580 can receive the light signal. The displacement prism 570 may be located above the light receiving chip 580.

[0127] In some embodiments, the displacement prism 570 is connected to the light-transmitting element 560, which facilitates the fixing of the displacement prism 570 and reduces the length of the light-receiving element 500.

[0128] The first side of the displacement prism 570 can face the light-transmitting element 560 so that the displacement prism 570 can receive the light signal transmitted through the light-transmitting element 560. The second side of the displacement prism 570 can face the light-transmitting element 560 and the light receiving chip 580 so that the light signal can be reflected to the light receiving chip 580 through the second side of the displacement prism 570.

[0129] In some embodiments, the optical receiving component 500 may include a support plate 520. The support plate 520 may support a displacement prism 570 to increase the distance between the displacement prism 570 and the circuit board 300, providing accommodating space for the transimpedance amplifier chip 590 and the optical receiving chip 580 mounted upside down on the transimpedance amplifier chip 590. The support plate 520 may support the fiber optic fixing member 530, the third lens 540, and the second optical multiplexer 550, so that the central axis of the fiber optic fixing member 530, the central axis of the third lens 540, and the central axis of the optical input port of the second optical multiplexer 550 are aligned, thereby improving coupling efficiency.

[0130] In some embodiments, the optical receiving component 500 may include a second protective cover 510. The second protective cover 510 may cover the optical fiber fixing component 530, the third lens 540, the second optical multiplexer 550, the light-transmitting component 560, the displacement prism 570, the optical receiving chip 580, and the transimpedance amplifier chip 590 to protect the above-mentioned components.

[0131] Figure 8a This is a structural diagram of a light emitting component according to some embodiments. Figure 8b This is an exploded view of a light emitting component provided according to some embodiments. Figure 8c This is a cross-sectional view of a light-emitting component according to some embodiments. Figure 8a , Figure 8b and Figure 8c As shown, in some embodiments, the light emitting component 400 may include a first housing 420. The first housing 420 may have an opening facing the upper housing 201. A first end of the first housing 420 may be provided with a second socket 421. An optical connector 470 may be inserted into the second socket 421 to connect the optical connector 470 to the first housing 420. A second end of the first housing 420 may be provided with a first socket 422. An electrical connector 430 may be inserted into the first socket 422 to connect the electrical connector 430 to the first housing 420.

[0132] One end of the electrical connector 430 can be connected to the second signal pad 350 to electrically connect the electrical connector 430 to the lower surface of the circuit board 300. Another end of the electrical connector 430 can be connected to the first signal pad 330 to electrically connect the electrical connector 430 to the upper surface of the circuit board 300. For example, one end of the high-frequency metal layer of the electrical connector 430 can be connected to the first signal pad 330 via wire bonding.

[0133] A high-frequency metal layer is located within the electrical connector 430, with the wire suspended in air. The electrical connector 430 is made of ceramic. The different dielectric constants of ceramic and air cause a difference in impedance between the wire and the high-frequency metal layer, resulting in impedance discontinuity. To reduce impedance discontinuity, in some embodiments, a first notch is formed at the end of the electrical connector near the circuit board. From the upper surface to the lower surface of the electrical connector, the distance between the sidewall of the first notch and the circuit board decreases. This reduced distance between the sidewall of the first notch and the circuit board changes the dielectric of the second metal layer from ceramic to a mixture of ceramic and air, with an increased proportion of air. Since the dielectric constant of air is less than that of ceramic, the impedance of the second metal layer decreases, approaching the impedance of the wire where the dielectric is air, thereby reducing impedance discontinuity.

[0134] In some embodiments, the light emitting component 400 may include a cover 410. The cover 410 closes to the opening of the first housing 420 to provide a sealed connection between the cover 410 and the first housing 420.

[0135] In some embodiments, a laser array 440 may be disposed within the first housing 420. The laser array 440 may include at least one laser 441, which can emit optical signals, so that the laser array 440 can emit at least one optical signal.

[0136] Laser 441 can be wire-connected to the other end of the high-frequency metal layer of electrical connector 430 so that laser 441 can receive electrical signals transmitted by electrical connector 430 and emit optical signals under the action of the electrical signals.

[0137] A high-frequency metal layer is located within the electrical connector 430, with the wire suspended in air. The electrical connector 430 is made of ceramic. The different dielectric constants of ceramic and air cause a difference in impedance between the wire and the high-frequency metal layer, resulting in impedance discontinuity. To reduce this impedance discontinuity, in some embodiments, a second notch is formed at the end of the electrical connector closest to the laser. From the upper surface to the lower surface of the electrical connector, the distance between the sidewall of the second notch and the laser increases. This increased distance transforms the dielectric of the second metal layer from ceramic to a mixture of ceramic and air, with a higher proportion of air. Since the dielectric constant of air is lower than that of ceramic, the impedance of the second metal layer decreases, approaching the impedance of the wire where the dielectric is air, thus reducing impedance discontinuity.

[0138] In some embodiments, the laser 441 may include a substrate and a laser chip. The substrate has signal lines and signal pads, and the laser chip is disposed on the substrate. One end of the signal pad can be connected to the laser chip, and the other end of the signal pad can be connected to an electrical connector 430, so that the laser chip is connected to the electrical connector 430.

[0139] In some embodiments, a lens array 450 may be disposed within the first housing 420. The lens array 450 may be located in the light emission direction of the laser array 440 to receive the optical signal emitted by the laser array 440. The lens array 450 may be a collimating lens array so that the lens array 450 can collimate the received optical signal. The lens array 450 may include at least one first lens 451, which may be located in the light emission direction of the laser 441.

[0140] In some embodiments, a first optical multiplexer 460 may be disposed within the first housing 420. The first optical multiplexer 460 may be located in the collimation direction of the lens array 450. The first optical multiplexer 460 can combine multiple optical signals of different wavelengths into a single optical signal comprising multiple different wavelengths.

[0141] In some embodiments, the optical connector 470 may include a light window bracket 471. The light window bracket 471 can be inserted into the second socket 421 to achieve a sealed connection between the light window bracket 471 and the first housing 420. The light window bracket 471 may have a first storage through-hole 4712. A light window 4713 can be placed in and sealed to the first storage through-hole 4712 to protect and isolate the optical devices of the first housing 420. The light window 4713 is light-transmitting, allowing light signals to pass through.

[0142] The light window bracket 471 may include a first light-transmitting hole 4711. The first light-transmitting hole 4711 is further away from the first housing 420 than the first placement through hole 4712. One end of the first light-transmitting hole 4711 is connected to the first placement through hole 4712 so that light signals can be transmitted from the first placement through hole 4712 to the first light-transmitting hole 4711 and transmitted along the first light-transmitting hole 4711 in a direction away from the first housing 420.

[0143] The optical connector 470 may include a lens holder 472. One end of the lens holder 472 may be connected to one end of the light window holder 471. The lens holder 472 may have a second light-transmitting aperture 4721. One end of the second light-transmitting aperture 4721 may be connected to a first light-transmitting aperture 4711, so that an optical signal can be transmitted from the first light-transmitting aperture 4711 to the second light-transmitting aperture 4721, and transmitted along the second light-transmitting aperture 4721 in a direction away from the first housing 420.

[0144] The lens holder 472 may have a second storage through hole 4722. One end of the second storage through hole 4722 may be connected to the second light through hole 4721 so that the light signal can be transmitted from the second light through hole 4721 to the second storage through hole 4722 and transmitted along the second storage through hole 4722 in a direction away from the first housing 420.

[0145] The second lens 4723 can be placed in and connected to the second through-hole 4722 to converge the light signal. The second lens 4723 can converge the light signal. The second lens 4723 can be located in the collimation direction of the first lens 451 to converge the light signal collimated by the first lens 451.

[0146] The optical connector 470 may include an adjustment ring 473. One end of the adjustment ring 473 may be connected to the other end of the lens holder 472. The adjustment ring 473 may include a third storage through hole 4731. One end of the third storage through hole 4731 may communicate with a second storage through hole 4722.

[0147] The optical connector 470 may include an adapter 474. One end of the adapter 474 can be inserted into the third through-hole 4731 of the adjusting ring 473 to connect the adapter 474 to the adjusting ring 473. The adapter 474 may include a fourth through-hole 4741. One end of the fourth through-hole 4741 can accommodate an optical fiber ferrule 4742, which can be located in the converging direction of the second lens 4723 so that the optical signal is converged by the second lens 4723 to the optical fiber ferrule 4742. The other end of the fourth through-hole 4741 can accommodate an isolator 4743, which can be located between the second lens 4723 and the optical fiber ferrule 4742 to prevent the optical signal from returning along the original path.

[0148] Figure 9a This is an exploded view of an electrical connector provided according to some embodiments. Figure 9b This is an exploded view of an electrical connector provided according to some embodiments, taken from another perspective. Figure 9c This is a partial view of an electrical connector according to some embodiments. Figure 9a , Figure 9b and Figure 9c As shown, in some embodiments, the electrical connector 430 may include a first adapter plate 431. The first adapter plate 431 may be provided with a first metal layer 435. The first metal layer 435 is a low-frequency metal layer that can transmit low-frequency signals. One end of the first metal layer 435 may be connected to the low-frequency signal pad of the laser 441 via wire bonding, so that low-frequency signals can be transmitted between the electrical connector 430 and the laser 441. The other end of the first metal layer 435 may be connected to the second signal pad 350 of the circuit board 300 via wire bonding, so that low-frequency signals can be transmitted between the electrical connector 430 and the circuit board 300.

[0149] In some embodiments, the first adapter plate 431 may include an adapter portion 4311. The upper surface of the adapter portion 4311 may be provided with a first metal layer 435.

[0150] In some embodiments, the first adapter plate 431 may include a support portion 4312. The lower surface of the support portion 4312 may be connected to the upper surface of the adapter portion 4311 so that the support portion 4312 can shield the first metal layer 435. The upper surface of the support portion 4312 may be sealingly connected to the top plate of the first socket 422.

[0151] The width of the support portion 4312 is smaller than the width of the adapter portion 4311, so that the first metal layer 435 on the adapter portion 4311 can be partially covered by the support portion 4312, that is, the first metal layer 435 on the top surface of the adapter portion 4311 can be partially exposed, so that the first metal layer 435 can be connected to the laser 441 and the circuit board 300 by wire bonding.

[0152] In some embodiments, the first metal layer 435 may include a first sub-metal layer 4351. The first sub-metal layer 4351 is exposed on a first upper surface of the first adapter plate 431 so that it can be wire-connected to the low-frequency signal pads of the laser 441. The first metal layer 435 may include a second sub-metal layer 4352. The second sub-metal layer 4352 is exposed on a second upper surface of the first adapter plate 431 so that it can be wire-connected to the second signal pads 350 of the circuit board 300. The first sub-metal layer 4351 and the second sub-metal layer 4352 are connected by a connecting metal layer so that the first metal layer 435 can transmit low-frequency signals. The connecting metal layer may be located below the support portion 4312, i.e., embedded inside the first adapter plate 431.

[0153] In some embodiments, the electrical connector 430 may include a second adapter plate 432. The upper surface of the second adapter plate 432 is connected to the lower surface of the first adapter plate 431. A second metal layer 434 may be disposed on the lower surface of the second adapter plate 432. The second metal layer 434 is a high-frequency metal layer capable of transmitting high-frequency signals. One end of the second metal layer 434 may be connected to the high-frequency signal pad of the laser 441, so that high-frequency signals can be transmitted between the electrical connector 430 and the laser 441. The other end of the second metal layer 434 may be connected to the first signal pad 330 of the circuit board 300 via wire bonding, so that high-frequency signals can be transmitted between the electrical connector 430 and the circuit board 300.

[0154] In some embodiments, the second metal layer 434 may include a signal metal layer 4341. The signal metal layer 4341 can transmit high-frequency signal lines. The second metal layer 434 may include a ground metal layer 4342. There is a gap between the ground metal layer 4342 and the signal metal layer 4341 to optimize high-frequency signal integrity, reduce electromagnetic interference, and achieve impedance matching, etc.

[0155] In some embodiments, a first signal metal portion 4341b is formed in the middle of the signal metal layer 4341, and a second signal metal portion 4341a is formed at one end of the signal metal layer 4341. One end of the second signal metal portion 4341a can be connected to the first signal metal portion 4341b. The other end of the second signal metal portion 4341a can be connected to the laser 441 or the circuit board 300 via wire bonding. The connection between one end of the second signal metal portion 4341a and the first signal metal portion 4341b, and the connection between the other end of the second signal metal portion 4341a and the laser 441 or the circuit board 300 via wire bonding, allows high-frequency signals between the laser 441 and the circuit board 300 to be transmitted through the signal metal layer 4341.

[0156] The second signal metal portion 4341a can serve as the wire bonding area of ​​the signal metal layer 4341. The width of the second signal metal portion 4341a is greater than the width of the first signal metal portion 4341b, so as to provide sufficient bonding space for wire bonding.

[0157] The gap between the first signal metal portion 4341b and the ground metal layer 4342 is larger than the gap between the second signal metal portion 4341a and the ground metal layer 4342. The width of the second signal metal portion 4341a is larger than the width of the first signal metal portion 4341b, resulting in a significant difference between the impedances of the first signal metal portion 4341b and the second signal metal portion 4341a. To achieve impedance continuity, in some embodiments, the signal metal layer 4341 forms a third signal metal portion 4341c. One end of the third signal metal portion 4341c can be connected to the first signal metal portion 4341b, and the other end of the third signal metal portion 4341c can be connected to one end of the second signal metal portion 4341a. The impedance of the third signal metal portion 4341c is between the impedances of the first signal metal portion 4341b and the second signal metal portion 4341a, thereby achieving impedance continuity.

[0158] In some embodiments, the width of the third signal metal portion 4341c is greater than the width of the first signal metal portion 4341b, and the width of the third signal metal portion 4341c is less than the width of the second signal metal portion 4341a, such that the impedance of the third signal metal portion 4341c is between the impedance of the first signal metal portion 4341b and the impedance of the second signal metal portion 4341a, so as to achieve impedance continuity.

[0159] In some embodiments, the gap between the third signal metal portion 4341c and the ground metal layer 4342 is smaller than the gap between the first signal metal portion 4341b and the ground metal layer 4342, and the gap between the third signal metal portion 4341c and the ground metal layer 4342 is smaller than the gap between the second signal metal portion 4341a and the ground metal layer 4342, such that the impedance of the third signal metal portion 4341c is between the impedance of the first signal metal portion 4341b and the impedance of the second signal metal portion 4341a, so as to achieve impedance continuity.

[0160] In some embodiments, a capacitor 4343 may be mounted on the ground metal layer 4342. One end of the capacitor 4343 may be connected to the laser 441 and the first metal layer 435 by wire bonding, and the other end of the capacitor 4343 may be electrically connected to the ground metal layer 4342 to achieve a filtering function.

[0161] In some embodiments, the electrical connector 430 may include a third adapter plate 433. The upper surface of the third adapter plate 433 may be connected to the second metal layer 434. The lower surface of the third adapter plate 433 may be sealingly connected to the bottom plate of the first socket 422. The lower surface of the third adapter plate 433 may be sealingly connected to the bottom plate of the first socket 422, and the first adapter plate 431 may be sealingly connected to the top plate of the first socket 422, so that the electrical connector 430 is sealingly connected to the first housing 420.

[0162] The second metal layer 434 can be located on the bottom surface of the second adapter plate 432. Then the top surface of the second adapter plate 432 can be a ground layer. The inner layer of the third adapter plate 433 can be a ground layer. The ground layer and the ground metal layer 4342 of the second metal layer 434 are connected through vias to provide the minimum inductance return path for the high-frequency signal, thereby ensuring the integrity of the high-frequency signal.

[0163] Figure 10 This is a structural diagram of a second adapter plate provided according to some embodiments. Figure 10 As shown, in some embodiments, the length of the second adapter plate 432 gradually increases from the upper surface to the lower surface of the second adapter plate 432, so that a first notch 4321 can be formed at one end of the second adapter plate 432.

[0164] In some embodiments, the second adapter plate 432 may be formed of a ceramic plate. The sidewall of the first notch 4321 may be an inclined surface or a stepped surface.

[0165] In some embodiments, the second adapter plate 432 may be formed by combining multiple ceramic plates. From the upper surface to the lower surface of the second adapter plate 432, the length of the multiple ceramic plates gradually increases, making the sidewall of the first notch 4321 a stepped surface.

[0166] Figure 11 This is a structural diagram of a third adapter plate provided according to some embodiments. For example... Figure 11 As shown, in some embodiments, the length of the third adapter plate 433 gradually decreases from the upper surface to the lower surface of the third adapter plate 433, so that a second notch 4331 can be formed at one end of the third adapter plate 433.

[0167] In some embodiments, the third adapter plate 433 may be formed of a ceramic plate. The sidewall of the second notch 4331 may be an inclined surface or a stepped surface.

[0168] In some embodiments, the third adapter plate 433 may be formed by combining multiple ceramic plates. From the upper surface to the lower surface of the third adapter plate 433, the length of the multiple ceramic plates gradually decreases, so that the second notch 4331 can be a stepped surface.

[0169] Figure 12 This is a cross-sectional view of an electrical connector provided according to some embodiments. Figure 13a This is a cross-sectional view of an optical module provided according to some embodiments. Figure 13b This is a cross-sectional view of an optical module provided according to some embodiments, taken from another perspective. Figure 12 , Figure 13a and Figure 13b As shown, in some embodiments, the first metal layer 435 of the first adapter board 431 can be connected to the second signal pad 350 on the lower surface of the circuit board 300 by wire bonding, and one end of the second metal layer 434 on the second adapter board 432 can be connected to the first signal pad 330 on the upper surface of the circuit board 300 by wire bonding.

[0170] The first notch 4321 can be located at one end of the second adapter plate 432 near the circuit board 300. From the upper surface to the lower surface of the second adapter plate 432, the distance d1 between the sidewall of the first notch 4321 and the circuit board 300 gradually decreases, so that the medium in which the signal metal layer 4341 is located changes from ceramic to ceramic and air, and the proportion of air gradually increases. The dielectric constant of air is less than that of ceramic, thereby reducing the impedance of the signal metal layer 4341 to approach the impedance of wire bonding and reduce impedance discontinuity.

[0171] The sidewall of the first notch 4321 is a stepped surface. From the upper surface of the second adapter plate 432 to the lower surface of the second adapter plate 432, the distance d1 between the sidewall of the first notch 4321 and the circuit board 300 decreases approximately gradually in a cyclical manner, either decreasing first and then stabilizing, or stabilizing first and then decreasing.

[0172] The sidewall of the first notch 4321 is an inclined surface. From the upper surface of the second adapter plate 432 to the lower surface of the second adapter plate 432, the distance d1 between the sidewall of the first notch 4321 and the circuit board 300 gradually decreases.

[0173] In some embodiments, the second signal metal portion 4341a may be located in the projection area of ​​the first notch 4321 within the second metal layer 434, so that the signal metal layer 4341 can be wire-bonded there, thereby changing the dielectric of the signal metal layer 4341 from ceramic to ceramic and air, thereby changing the dielectric constant of the signal metal layer, and thus changing the impedance of the signal metal layer.

[0174] like Figure 12 , Figure 13a and Figure 13b As shown, in some embodiments, the other end of the second metal layer 434 on the third adapter board 433 can be connected to the high-frequency signal pad of the laser 441 via wire bonding.

[0175] The second notch 4331 can be located at one end of the third adapter plate 433 near the laser 441. From the upper surface to the lower surface of the third adapter plate 433, the distance d2 between the sidewall of the second notch 4331 and the laser 441 increases, so that the medium in which the signal metal layer 4341 is located changes from ceramic to ceramic and air, and the proportion of air increases. The dielectric constant of air is less than that of ceramic, which in turn reduces the impedance of the signal metal layer 4341 to approach the impedance of wire bonding and reduce impedance discontinuity.

[0176] The sidewall of the second notch 4331 is a stepped surface. From the upper surface of the third adapter plate 433 to the lower surface of the third adapter plate 433, the distance d2 between the sidewall of the second notch 4331 and the laser 441 increases approximately gradually in a cyclical manner, either increasing first and then stabilizing, or stabilizing first and then increasing.

[0177] The sidewall of the second notch 4331 is an inclined surface. From the upper surface of the third adapter plate 433 to the lower surface of the third adapter plate 433, the distance d2 between the sidewall of the second notch 4331 and the laser 441 gradually increases.

[0178] In some embodiments, the second signal metal portion 4341a may be located in the projection area of ​​the second notch 4331 within the second metal layer 434, so that the signal metal layer 4341 can be wire bonded there, thereby changing the dielectric of the signal metal layer 4341 from ceramic to ceramic and air, thereby changing the dielectric constant of the signal metal layer, and thus changing the impedance of the signal metal layer.

[0179] Figure 14 This is a simulation diagram of a light emitting component according to some embodiments. Figure 14 As shown, S21 represents bandwidth, with the horizontal axis representing frequency (Freq) in GHz and the vertical axis representing insertion loss in dB. m1 represents the simulation sampling points. S11 represents return loss, with the horizontal axis representing frequency (Freq) in GHz and the vertical axis representing return loss in dB. Figure 14 As shown, the simulation sampling point m1 corresponds to a frequency with an insertion loss of 3dB, a bandwidth of approximately 82GHz, and a return loss of <-10dB.

[0180] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical module, characterized in that, include: Circuit board with an insertion port; The surface of one side wall of the insertion port forms a first signal pad and a second signal pad; A light-emitting component, disposed in the embedded port, includes: The first housing has a laser inside and a first insertion hole at one end; An electrical connector is inserted into the first socket, with one end electrically connected to the laser and the other end electrically connected to the first signal pad and the second signal pad. The electrical connector includes: The first adapter board is provided with a first metal layer; the first metal layer is electrically connected to the second signal pad. The second adapter board has its upper surface connected to the lower surface of the first adapter board, and a second metal layer is provided on the lower surface; one end of the second metal layer is connected to the first signal pad via wire bonding, and the other end of the second metal layer is connected to the laser via wire bonding. The third adapter plate has its upper surface connected to the second metal layer; The second adapter plate has a first notch at one end near the circuit board, extending from the upper surface to the lower surface of the second adapter plate, and the distance between the sidewall of the first notch and the circuit board is reduced; the third adapter plate has a second notch at one end near the laser, extending from the upper surface to the lower surface of the third adapter plate, and the distance between the sidewall of the second notch and the laser is increased.

2. The optical module according to claim 1, characterized in that, The sidewall of the first notch is an inclined surface or a stepped surface; the sidewall of the second notch is an inclined surface or a stepped surface.

3. The optical module according to claim 1, characterized in that, The second metal layer includes: The signal metal layer includes: The first signal metal portion is located in the middle of the signal metal layer; The second signal metal part is located at the end of the signal metal layer, with one end connected to the first signal metal part and the other end connected to the laser or the first signal pad via wire bonding; the width of the second signal metal part is greater than the width of the first signal metal part. The second signal metal portion is located within the projection area of ​​the first notch in the second metal layer, and the second notch is located within the projection area of ​​the second metal layer.

4. The optical module according to claim 3, characterized in that, The second metal layer includes: A ground metal layer has a gap between it and the signal metal layer; a capacitor is mounted on the ground metal layer, one end of the capacitor is connected to the ground metal layer, and the other end of the capacitor is connected to the laser and the first metal layer.

5. The optical module according to claim 1, characterized in that, The first adapter board includes: The adapter has the first metal layer disposed on its upper surface; The support portion has its lower surface connected to the first metal layer; the width of the support portion is smaller than the width of the adapter portion.

6. The optical module according to claim 1, characterized in that, Also includes: The first protective cover is disposed on the circuit board at the bottom and has a gap between its top and the circuit board; the first protective cover covers the first signal pad and the first metal layer.

7. The optical module according to claim 1, characterized in that, Also includes: A light receiving component, located on the circuit board, includes: An optical receiver chip is used to convert optical signals into electrical signals; A transimpedance amplifier chip is mounted on the circuit board and connected to the optical receiver chip.

8. The optical module according to claim 7, characterized in that, The optical receiver chip is mounted upside down on the transimpedance amplifier chip.

9. The optical module according to claim 7, characterized in that, The optical receiver chip integrates a lens, which is used to converge optical signals.

10. The optical module according to claim 1, characterized in that, The light emitting component also includes: The first lens, located in the light-emitting direction of the laser, is used for collimating the optical signal; The second lens, located in the collimating direction of the first lens, is used to converge the optical signal.

Images