Display module and vehicle-mounted display device

Abstract

The utility model discloses a display module and a vehicle-mounted display device, the display module of one embodiment comprises a backlight module, a display panel and a cover plate, and a backlight source of the backlight module and a driving chip of the display panel are both arranged on a first side edge of a frame area; the backlight module comprises a back plate, a middle frame and a backlight assembly, the back plate comprises a main plate and a side plate, and the middle frame comprises a middle frame main body, a frame side body and a frame retaining wall which are arranged in clamping grooves of the main plate and the side plate; a backlight source of the backlight assembly is arranged in an accommodating space formed by the main board and the frame side body, and a driving chip is arranged in an accommodating space formed by the frame retaining wall and the frame side body; the display module further comprises a first heat dissipation adhesive tape arranged on the side, close to the cover plate, of the driving chip, a second heat dissipation adhesive tape arranged on the side, away from the cover plate, of the driving chip and a heat insulation structure arranged on the side, close to the second heat dissipation adhesive tape, of the frame side body, and the first heat dissipation adhesive tape and the second heat dissipation adhesive tape extend to the frame retaining wall. According to the embodiment of the utility model, the heat dissipation performance of the display module is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technical field especially, and it is a kind of display module and vehicle-mounted display device. BACKGROUND

[0002] With the rapid development of display technology, display screen is applied to more and more application scenarios.For example, in the vehicle-mounted application scenario, the market demand focuses on narrow-frame high-brightness touch liquid crystal display screen.However, in practical application, the display device has a heat dissipation problem. SUMMARY

[0003] To solve at least one of the above problems, the utility model provides a display module in the first embodiment, comprising backlight module, display panel and cover plate arranged at the light emitting side of the display panel, the display module includes display area and frame area surrounding the display area, the backlight source of the backlight module and the driving chip of the display panel are both arranged at the first side edge of the frame area;

[0004] The backlight module includes back plate, middle frame and backlight assembly, the back plate includes main plate, side plate connected with the edge of main plate, corresponding to the first side edge area of the frame area: the main plate and side plate form a clamping groove, the middle frame includes middle frame main body arranged in the clamping groove, frame side body extending along the main plate towards the display area, and frame barrier wall extending along the side plate towards the cover plate, the backlight assembly includes the backlight source;

[0005] The backlight assembly is arranged in the accommodating space formed by the main plate and frame side body, and the driving chip is arranged in the accommodating space formed by the frame barrier wall and the frame side body;

[0006] The display module further includes first heat dissipation tape arranged at the side of the driving chip close to the cover plate, second heat dissipation tape arranged at the side of the driving chip away from the cover plate, and heat insulation structure arranged at the side of the frame side body close to the second heat dissipation tape, and the first heat dissipation tape and the second heat dissipation tape extend to the frame barrier wall.

[0007] For example, in the display module provided in some embodiments of the present application, the display module further includes a flexible circuit board connected with the driving chip, one side of the flexible circuit board crosses the frame barrier wall and the side plate in sequence and extends to the main plate, the display panel includes array substrate and color film substrate arranged in layers, the driving chip is arranged on the array substrate and located at the side of the color film substrate close to the frame barrier wall,

[0008] An end of the first heat dissipation tape is attached to an edge of the color film substrate near the frame side wall, covering a side of the driving chip away from the frame side body, covering a side of the flexible circuit board near the cover plate, and extending to the side plate;

[0009] The second heat dissipation tape is attached to a side of the array substrate near the frame side body, covering a side of the flexible circuit board away from the cover plate, and extending to the side plate, and a projection of the driving chip on the cover plate falls within a projection of the second heat dissipation tape on the cover plate.

[0010] For example, in the display module provided in some embodiments of the present application, the first heat dissipation tape is a uniform heating single-sided tape, including a heat-conducting adhesive layer, a uniform heating layer, a base material and a heat radiation layer which are sequentially stacked on the driving chip;

[0011] The second heat dissipation tape includes a heat-conducting adhesive layer, a heat-conducting layer, a base material and a heat radiation layer which are sequentially stacked on a side of the array substrate away from the cover plate.

[0012] For example, in the display module provided in some embodiments of the present application, the heat insulation structure is heat insulation foam,

[0013] A projection of the driving chip on the cover plate falls within a projection of the heat insulation foam on the cover plate;

[0014] A projection of the backlight source on the cover plate falls within a projection of the heat insulation foam on the cover plate.

[0015] For example, in the display module provided in some embodiments of the present application, the heat insulation foam includes a heat-conducting adhesive layer, a heat insulation closed-cell foaming layer, a uniform heating layer, a base material and a black resin layer which are sequentially stacked on the frame side body.

[0016] For example, in the display module provided in some embodiments of the present application, the backlight assembly includes a backlight source, an optical film layer and a light guide plate, the backlight source is arranged on a side of the side plate facing the display area, and the optical film layer and the light guide plate are stacked on a side of the backlight source near the display area;

[0017] The side plate includes a first groove, the backlight source is arranged in the first groove, and the backlight source, the optical film layer and the light guide plate include a preset size of avoidance space therebetween.

[0018] For example, in the display module provided in some embodiments of the present application, the frame area further includes a second side edge arranged opposite to the first side edge, and a third side edge and a fourth side edge arranged opposite to each other,

[0019] Corresponding to at least one region of the second side, the third side and the fourth side: the middle frame of the backlight module comprises a frame support side in contact with the side of the back plate, and a frame support part extending towards the display area along the bottom edge of the back plate, and the backlight assembly comprises an optical film layer and a light guide plate stacked in the accommodating space formed by the back plate and the frame support part;

[0020] The side of the back plate comprises a second groove, and the second groove, the optical film layer and the light guide plate comprise the avoiding space;

[0021] The backlight module further comprises a sticking part arranged between the frame support side and the side of the back plate.

[0022] For example, in the display module provided by some embodiments of the present application, the frame support side comprises a turned edge extending away from the side of the back plate on the side away from the display area.

[0023] For example, in the display module provided by some embodiments of the present application, the frame support part is provided with at least one hanging ear at one end close to the cover plate, and the side of the back plate comprises a fixed clamping groove corresponding to the hanging ear.

[0024] For example, in the display module provided by some embodiments of the present application, the cover plate is provided with an ink layer located in the frame area on the side close to the backlight module,

[0025] The surface of the back plate close to the side of the cover plate is provided with a cover plate support part for supporting the cover plate, and the cover plate support part comprises a soft support structure in contact with the ink layer, and the orthogonal projection of the soft support structure on the cover plate falls within the orthogonal projection of the ink layer on the cover plate.

[0026] For example, in the display module provided by some embodiments of the present application, the surface of the back plate close to the side of the cover plate is provided with a third groove and a first flat surface, the soft support structure is arranged in the third groove, the thickness of the soft support structure in the direction perpendicular to the cover plate is thicker than the depth of the third groove by a first distance, and the first flat surface is provided with hot melt adhesive with a thickness of the first distance between the cover plate.

[0027] For example, in the display module provided by some embodiments of the present application, the surface of the back plate close to the side of the cover plate is a second flat surface, and the soft support structure comprises a plurality of soft support substructures arranged on the second flat surface.

[0028] For example, in the display module provided by some embodiments of the present application, the surface of the back plate close to one side of the cover plate includes a first boss, and the soft support structure is arranged on the first boss, and the orthographic projection of the soft support structure on the cover plate covers the orthographic projection of the first boss on the cover plate.

[0029] The second embodiment of the present application provides a vehicle-mounted display device comprising the display module as described in the first embodiment.

[0030] For example, in the vehicle-mounted display device provided by some embodiments of the present application, a support structure for bearing the display module is further included,

[0031] The support structure includes at least one first clamping structure, the side plate of the display module includes a second clamping structure arranged one-to-one with the first clamping structure, and the vehicle-mounted display device further includes a heat dissipation structure arranged between the first clamping structure and the second clamping structure.

[0032] The beneficial effects of the present application are as follows:

[0033] The present application provides a display module and a vehicle-mounted display device, which can effectively alleviate the problem of high surface temperature of the display product caused by the arrangement of the driving chip and the backlight source on the same side of the display module frame area in the narrow frame design. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0035] Figure 1 The present application provides a display module and a vehicle-mounted display device, which can effectively alleviate the problem of high surface temperature of the display product caused by the arrangement of the driving chip and the backlight source on the same side of the display module frame area in the narrow frame design.

[0036] Figure 2Structure schematic view of the first side edge area of the display module according to an embodiment of the present application is shown;

[0037] Figure 3 Structure schematic view of the first heat dissipation adhesive tape according to an embodiment of the present application is shown;

[0038] Figure 4 Structure schematic view of the second heat dissipation adhesive tape according to an embodiment of the present application is shown;

[0039] Figure 5 Structure schematic view of the heat insulation structure according to an embodiment of the present application is shown;

[0040] Figure 6 Structure schematic view of the first side edge area of the display module according to another embodiment of the present application is shown;

[0041] Figure 7 Structure schematic view of the second / third / fourth side edge area of the display module according to an embodiment of the present application is shown;

[0042] Figures 8a-8c Schematic view of the soft support structure according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the present application, the present application will be further described below with reference to the preferred embodiments and the accompanying drawings. Like reference numerals will be used to represent like elements throughout the specification. It should be understood by those skilled in the art that the specific description below is illustrative rather than limiting, and should not be used to limit the scope of protection of the present application.

[0044] It should be noted that the "on", "formed on" and "disposed on" described herein can mean that one layer is directly formed or disposed on another layer, or can mean that one layer is indirectly formed or disposed on another layer, i.e. there are other layers between the two layers. In this document, unless otherwise stated, the term "in the same layer" means that two layers, components, members, elements or parts can be formed by the same patterning process, and the two layers, components, members, elements or parts are generally formed of the same material. In this document, unless otherwise stated, the expression "patterning process" generally includes the steps of coating, exposing, developing, etching, stripping of photoresist, etc. The expression "one patterning process" means a process of forming a patterned layer, component, member, etc. using one mask plate.

[0045] To achieve the narrow frame requirement of display products, such as Figure 1As shown, the display module 100 is a plan view, including a display area 102 and a frame area 101 surrounding the display area, the frame area 101 includes oppositely arranged first and second side edges 1011 and 1012, and oppositely arranged third and fourth side edges 1013 and 1014, wherein the second, third and fourth side edges 1012, 1013 and 1014 are narrow frame designs, and the driving chip 23 and the backlight source 16 of the display module are arranged on the first side edge 1011. However, since the driving chip and the backlight source are arranged on the same side wide edge, the temperature of this side edge accumulates and radiates upward to the surface of the cover plate, which can easily cause the surface temperature of the cover plate to be too high if not cooled in time; at the same time, according to the structure of three side edges being narrow frame and one side edge being wide frame, the wide frame side edge is usually fixed, and the other three side edges are suspended to form a three-side-suspended central control and a ceiling screen with the wide edge as the rotating shaft, and are embedded into the whole machine, which has the problems of difficult product heat dissipation and high product surface temperature.

[0046] As shown in Figure 1 and Figure 2 An embodiment of the utility model provides a display module, including a backlight module, a display panel 20 and a cover plate 30 arranged on the light emitting side of the display panel 20, the display module includes a display area 102 and a frame area 101 surrounding the display area 102, the backlight source 16 of the backlight module and the driving chip 23 of the display panel 20 are all arranged on the first side edge 1011 of the frame area 101;

[0047] The backlight module includes a back plate, a middle frame and a backlight assembly, the back plate includes a main plate 11 and a side plate 12 connected with the edge of the main plate 11, corresponding to the first side edge area of the frame area 101: the main plate 11 and the side plate 12 form a clamping groove, the middle frame includes a middle frame main body 13 arranged in the clamping groove, a frame side body 14 extending along the main plate 11 towards the display area 102, and a frame blocking wall 15 extending along the side plate 12 towards the cover plate 30, and the backlight assembly includes the backlight source 16;

[0048] The backlight assembly is arranged in the accommodating space formed by the main plate 11 and the frame side body 14, and the driving chip 23 is arranged in the accommodating space formed by the frame blocking wall 15 and the frame side body 14;

[0049] The display module further includes a first heat dissipation adhesive tape 41 arranged on the side of the driving chip 23 close to the cover plate 30, a second heat dissipation adhesive tape 42 arranged on the side of the driving chip 30 away from the cover plate 30, and a heat insulation structure 43 arranged on the side of the frame side body 14 close to the second heat dissipation adhesive tape 42, and the first and second heat dissipation adhesive tapes 41 and 42 extend to the frame blocking wall 15.

[0050] In the embodiment, in the case that the driving chip and the backlight source are arranged on the same side wide side, causing the surface of the display product to overheat, according to the existing structure of the display module, the heat generated by the driving chip close to the cover plate is effectively conducted to the middle frame of the backlight module for rapid heat dissipation, and the heat generated by the backlight source is isolated from the heat generated by the driving chip, so as to avoid the heat generated by the backlight source from affecting the surface temperature of the display product, thereby improving the user experience of the display product with a smaller cost.

[0051] Specifically, the heat generated by the driving chip during operation is conducted to the middle frame of the backlight module for rapid heat dissipation through the first heat dissipation tape arranged on the side of the driving chip close to the cover plate and the second heat dissipation tape arranged on the side of the driving chip away from the cover plate, and the heat generated by the driving chip and the backlight source is effectively isolated through the heat insulation structure arranged between the driving chip and the backlight source, so as to effectively improve the heat dissipation performance of the display module, which has practical application value.

[0052] In an optional embodiment, as shown in Figure 2 The display module further includes a flexible circuit board 28 connected with the driving chip 23, one side of the flexible circuit board 28 sequentially passes through the frame barrier wall 15 and the side plate 12 and extends to the main plate 11, the display panel 26 includes an array substrate 21 and a color film substrate 22 arranged in layers, the driving chip 23 is arranged on the array substrate 21 and located on the side of the color film substrate 22 close to the frame barrier wall 101,

[0053] One end of the first heat dissipation tape 41 is attached to the edge position of the side of the color film substrate 22 close to the frame barrier wall 15, covering the side of the driving chip 23 away from the frame side body 14, covering the side of the flexible circuit board 28 close to the cover plate 30 and extending to the side plate 12;

[0054] The second heat dissipation tape 42 is attached to the side of the array substrate 21 close to the frame side body 14, covering the side of the flexible circuit board 28 away from the cover plate 30 and extending to the side plate 12, and the orthographic projection of the driving chip 23 on the cover plate 30 falls within the orthographic projection of the second heat dissipation tape 42 on the cover plate 30.

[0055] In the embodiment, the flexible circuit board connected with the driving chip is used to further set the extension direction of the first heat dissipation tape 41 and the second heat dissipation tape 42 on the basis of the foregoing embodiment, so as to realize rapid heat dissipation of the heat emitted by the driving chip to the back plate of the backlight module.

[0056] Specifically, as shown in Figure 2As shown, according to the structure setting of the display panel 20 and the backlight module, on the side of the driving chip close to the cover plate, i.e. above the driving chip, the heat generated by the driving chip is conducted out by setting the first heat dissipation tape 41. Figure 3 As shown, the first heat dissipation tape 41 of the embodiment is a uniform heating single-sided tape, which comprises a heat-conducting adhesive layer 411, a uniform heating layer 412, a substrate 413 and a heat radiation layer 414 which are sequentially stacked on the driving chip, and the orthographic projection of the first heat dissipation tape 41 on the cover plate 30 covers the orthographic projection of the driving chip 23 on the cover plate 30. In the embodiment, the heat generated by the driving chip is uniformly and rapidly dissipated and conducted out by the first heat dissipation tape 41, for example, the heat generated by the driving chip is rapidly dissipated along the uniform heating layer of the tape, so that the heat generated by the driving chip is dissipated by the first heat dissipation tape 41 which is set above the driving chip 23 and covers the driving chip 23 to reduce the surface temperature of the driving chip, and is rapidly conducted to the back plate of the backlight module along the flexible circuit board. The back plate is a die-casting structure, which is beneficial to heat conduction and heat dissipation.

[0057] Meanwhile, on the side of the driving chip 23 away from the cover plate 30, i.e. on the surface of the array substrate 21 away from the cover plate 30, i.e. below the driving chip, the heat generated by the driving chip is conducted out by setting the second heat dissipation tape 42. As shown, Figure 4 As shown, the second heat dissipation tape 42 comprises a heat-conducting adhesive layer 421, a heat-conducting layer 422, a substrate 423 and a heat radiation layer 434 which are sequentially stacked on the array substrate 21, and the orthographic projection of the second heat dissipation tape 42 on the cover plate 30 covers the orthographic projection of the driving chip 23 on the cover plate 30. In the embodiment, the heat generated by the driving chip is rapidly conducted to the frame wall and the back plate by the second heat dissipation tape 42, and is uniformly and rapidly conducted out. That is, the heat generated by the driving chip is conducted out by the second heat dissipation tape 42 which is set below the driving chip 23 and on the side of the array substrate away from the cover plate to reduce the surface temperature of the driving chip.

[0058] It is worth noting that the embodiment is only used to illustrate the specific implementation of the present application, and the shape and area of the first heat dissipation tape and the second heat dissipation tape are not specifically limited in the present application. The larger the area of the tape, the more obvious the heat dissipation effect. Those skilled in the art should select appropriate tape shape and area according to actual application requirements, which will not be described here.

[0059] In an optional embodiment, the heat insulation structure is heat insulation foam, the orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the heat insulation foam on the cover plate; and the orthographic projection of the backlight source on the cover plate falls into the orthographic projection of the heat insulation foam on the cover plate.

[0060] In the embodiment, the heat generated by the driving chip and the backlight source is isolated by setting the heat insulation bubble cotton between the driving chip and the backlight source. Furthermore, considering the problem of surface heating of the display product, the heat dissipation problem of the driving chip and the heat dissipation problem of the backlight source, the heat insulation bubble cotton is set in the space between the frame side body and the frame blocking wall and the array substrate in the limited space between the driving chip and the backlight source on the basis of quickly leading out the heat generated by the driving chip by using the first heat dissipation tape and the second heat dissipation tape and leading out the heat of the backlight source from the mainboard and the frame side body, so as to block the heat transmission between the driving chip and the backlight source and ensure that the isolation range of the heat insulation bubble cotton covers the driving chip and the backlight source to achieve better heat insulation effect, that is, the orthographic projection of the driving chip and the orthographic projection of the backlight source are both in the orthographic projection of the heat insulation bubble cotton. Thus, on the basis of the existing structure of the display module, the specified material is set at the specified position to conduct heat and insulate heat by using the characteristics of the existing structure, so as to effectively reduce the surface temperature of the display product and improve the user experience of the display product with smaller cost.

[0061] Specifically, as shown in Figure 5 The heat insulation bubble cotton 43 includes a heat-conducting adhesive layer 431, a heat insulation closed-cell foaming layer 432, a heat equalizing layer 433, a base material 434 and a black resin layer 435 which are sequentially stacked on the frame side body. The heat generated by the backlight source and the heat generated by the driving chip are blocked from the middle by the multiple film layers which are stacked, so as to prevent the heat generated by the backlight source from continuing to spread upwards, thereby reducing the surface temperature of the display product. As shown in Figure 1 The size of the heat insulation bubble cotton 43 is set according to the shape of the display module itself and the position, shape and length of the backlight source 16, so as to isolate the heat of the driving chip and the backlight source, as shown in Figure 2 When the heat insulation bubble cotton 43 is set, the support bubble cotton 19 is set at the position close to the display area of the heat insulation bubble cotton, so as to realize the support function on the basis of realizing the heat insulation function.

[0062] Considering the width of the first side edge, in an optional embodiment, as shown in Figure 6 The backlight assembly includes the backlight source 16, the optical film layer 17 and the light guide plate 18, the backlight source 16 is arranged on one side of the side plate 12 which faces the display area 102, the optical film layer 17 and the light guide plate 18 are stacked on one side of the backlight source 16 which is close to the display area 102; the side plate 12 includes the first groove 44, the backlight source 16 is arranged in the first groove 44, and the backlight source 16, the optical film layer 17 and the light guide plate 18 include the pre-set size of the avoiding space.

[0063] The first recess 44 is arranged at the position where the main plate 11 of the backlight module is installed on the backlight 16, so that the backlight is arranged inwardly, and the width of the frame of the first side is effectively shortened while ensuring the clearance between the backlight 16, the optical film layer 17 and the light guide plate 18. That is, the clearance between the backlight and the optical film layer and the light guide plate of the backlight module is formed by locally avoiding through slotting on the side of the main plate, which on the one hand meets the requirements of the film pressing amount and expansion space of the optical film material, and on the other hand meets the reliability requirements of the narrow frame design of the display module.

[0064] In order to further improve the narrow frame design of the display module, in an optional embodiment, as shown in Figure 1 and Figure 7 The frame area 101 further includes a second side 1012 opposite to the first side 1011, and a third side 1013 and a fourth side 1014 opposite to each other,

[0065] Corresponding to at least one area of the second side 1012, the third side 1013 and the fourth side 1014: the middle frame of the backlight module includes a frame support side 51 in contact with the side of the back plate 10, and a frame support part 52 extending along the bottom edge of the back plate 10 towards the display area 102, and the backlight assembly includes an optical film layer 17 and a light guide plate 18 stacked in the accommodating space formed by the back plate 10 and the frame support part 52;

[0066] The side of the back plate 10 includes a second recess 45, and the second recess 45 and the optical film layer 17 and the light guide plate 18 include the clearance; the backlight module further includes a sticking part 46 arranged between the frame support side 51 and the side of the back plate 10.

[0067] In this embodiment, the clearance between the optical film layer and the light guide plate of the backlight module is formed by locally avoiding through slotting on the inside of the back plate, which on the one hand meets the requirements of the film pressing amount and expansion space of the optical film material, and on the other hand meets the reliability requirements of the narrow frame design of the display module. In order to avoid the collapse, deformation and knocking of the middle frame, double-sided adhesive tape is arranged between the side of the back plate and the frame support side of the middle frame to fix and support the middle frame.

[0068] In order to further improve the support performance of the middle frame, in an optional embodiment, the frame support side includes a turned edge extending away from the side of the back plate to the side away from the display area.

[0069] In the embodiment, considering that the back plate is a die casting and the middle frame is a sheet metal structural part, the frame support side of the middle frame is increased in physical support points on the side edge of the back plate by adopting a flanging process, which improves the support and fixing effect of the middle frame, disperses the pressure, reduces the possibility of deformation and cracking of the middle frame, and improves the product yield and stability of the display module and the user experience.

[0070] To further improve the support performance of the middle frame, in another optional embodiment, at least one lug is arranged at one end of the frame support part close to the cover plate, and the side edge of the back plate includes a fixing slot corresponding to the lug.

[0071] In the embodiment, by arranging a pair of clamping structures on the frame support part and the side edge of the back plate, for example, a hook-shaped lug structure is arranged on the frame support part, and a clamping slot corresponding to the hook-shaped lug structure is arranged on the side edge of the back plate, the displacement of the middle frame in the horizontal direction is limited by the cooperation of the hook-shaped lug and the clamping slot, thereby improving the support and fixing effect of the middle frame, effectively improving the product yield and stability of the display module, and improving the user experience.

[0072] To further improve the stability of the display module, in an optional embodiment, as shown in Figure 2 、 Figure 6 and Figure 7 , an ink layer 31 is arranged on the side of the cover plate 30 close to the backlight module in the frame area 101.

[0073] A cover plate support part 47 for supporting the cover plate 30 is arranged on the surface of the back plate close to the cover plate 30, and the cover plate support part 47 includes a soft support structure in contact with the ink layer 31, and the orthogonal projection of the soft support structure on the cover plate 30 falls within the orthogonal projection of the ink layer 31 on the cover plate 30.

[0074] In the prior art, a dispensing boss is formed on the surface of the back plate close to the cover plate by a dispensing process to support the cover plate, and there are light leakage phenomena caused by the uneven dispensing boss pressing the cover plate, or the dispensing boss damaging the ink layer of the cover plate. In the embodiment, a soft support structure, such as a soft silica gel structure, is arranged between the ink layer of the cover plate and the back plate, and the hard-hard-hard structure of the cover plate-dispensing boss-back plate in the prior art is changed to the hard-soft-hard structure of the cover plate-soft silica gel structure-back plate in the embodiment, which effectively eliminates the light leakage phenomenon and improves the production yield of the back plate, thereby improving the display effect of the display module.

[0075] In an optional embodiment, as shown in Figure 8aAs shown, the surface of the back plate 10 close to the cover plate 30 is provided with a third groove 105 and a first flat surface 106, the soft support structure 47 is arranged in the third groove 105, and the thickness of the soft support structure 47 in the direction perpendicular to the cover plate 30 is thicker than the depth of the third groove 105 by a preset first distance, and the first flat surface 106 is provided with the hot melt adhesive 48 with a thickness of the first distance from the cover plate 30.

[0076] In the embodiment, by arranging the groove on the surface of the back plate close to the cover plate, and arranging the soft support structure in the groove, the first distance is the distance between the back plate and the cover plate, and when the cover plate is pressed under external force, the cover plate is supported by the soft support structure which is deeper than the third groove, and the hot melt adhesive is arranged on the flat surface outside the groove, so that the back plate is effectively prevented from directly contacting the cover plate, and the light leakage phenomenon is eliminated. In the embodiment, the hard-soft-hard structure of the cover plate-soft support structure-back plate is realized by the soft support structure arranged in the third groove and the hot melt adhesive, and the production yield of the back plate and the display effect of the display module are effectively improved.

[0077] In an optional embodiment, as shown in Figure 8b The surface of the back plate 10 close to the cover plate 30 is a second flat surface 107, and the soft support structure 47 includes a plurality of soft support sub-structures arranged on the second flat surface 107.

[0078] In the embodiment, by arranging the soft support structure on the surface of the back plate close to the cover plate, and arranging the hot melt adhesive in the space between the cover plate and the back plate except the soft support structure, when the cover plate is pressed under external force, the cover plate is supported by the soft support structure and the hot melt adhesive, and the back plate is effectively prevented from directly contacting the cover plate, and the light leakage phenomenon is eliminated. In the embodiment, the hard-soft-hard structure of the cover plate-soft support structure-back plate is realized by the soft support structure and the hot melt adhesive, and the production yield of the back plate and the display effect of the display module are effectively improved.

[0079] In an optional embodiment, as shown in Figure 8c The surface of the back plate 10 close to the cover plate 30 includes a first boss 109, the soft support structure 47 is arranged on the first boss 109, and the orthographic projection of the soft support structure 47 on the cover plate 30 covers the orthographic projection of the first boss 109 on the cover plate 30.

[0080] In the embodiment, by arranging the first boss 109 on the surface of the back plate 10 close to the cover plate 30 and the soft support structure 47 on the first boss 109, and by arranging the hot melt adhesive in the space of the cover plate 30 except the third flat surface 108 and the first boss 109, when the cover plate is pressed under external force, the cover plate is supported by the soft support structure and the hot melt adhesive, direct contact between the back plate and the cover plate is effectively avoided, and the light leakage phenomenon is eliminated. In the embodiment, the hard-soft-hard structure of the cover plate-soft support structure-back plate is realized by the soft support structure and the hot melt adhesive, the production yield of the back plate is effectively improved, and the display effect of the display module is improved.

[0081] Based on the display module of the above embodiment, one embodiment of the utility model also provides a vehicle-mounted display device.

[0082] The vehicle-mounted display device of the embodiment effectively alleviates the heat dissipation problem of the display module by adopting the combined first heat dissipation adhesive tape, the second heat dissipation adhesive tape and the heat insulation structure, and specifically, the heat generated during the operation of the driving chip is conducted to the back plate of the backlight module by the first heat dissipation adhesive tape arranged on the side of the driving chip close to the cover plate and the second heat dissipation adhesive tape arranged on the side of the driving chip away from the cover plate, so as to quickly dissipate heat, and the heat generated by the driving chip and the backlight source is effectively isolated by the heat insulation structure arranged between the driving chip and the backlight source, so that the heat dissipation performance of the display module is improved, and the problem of excessively high surface temperature of the vehicle-mounted display device is reduced.

[0083] In an optional embodiment, the vehicle-mounted display device further comprises a support structure for bearing the display module, the support structure comprises at least one first clamping structure, the side plate of the display module comprises a second clamping structure corresponding to the first clamping structure one by one, and the vehicle-mounted display device further comprises a heat dissipation structure arranged between the first clamping structure and the second clamping structure.

[0084] In the embodiment, the back plate structure of the existing display module and the support structure of the vehicle-mounted display device are utilized, the clamping structure is arranged between the back plate structure and the support structure, for example, the groove is arranged on the back plate structure and the corresponding boss is arranged on the support structure, or the boss is arranged on the back plate structure and the corresponding groove is arranged on the support structure, or the groove and the boss are arranged on the back plate structure and the corresponding boss and groove are arranged on the support structure, and the heat dissipation structure is arranged between the pair of clamping structures, for example, the heat dissipation foam and other heat dissipation materials are arranged, so that the heat generated by the driving chip and the backlight source in the display module is further conducted to the support structure of the vehicle-mounted display device, the heat dissipation function is further improved, and the problem of excessively high surface temperature of the vehicle-mounted display device is improved.

[0085] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. For those skilled in the art, on the basis of the above description, other different forms of changes or variations can be made, and it is impossible to enumerate all the embodiments here. Any obvious changes or variations derived from the technical solutions of the present application still fall within the protection scope of the present application.

Claims

1. A display module, characterized in that, The device includes a backlight module, a display panel, and a cover plate disposed on the light-emitting side of the display panel. The display module includes a display area and a border area surrounding the display area. The backlight of the backlight module and the driving chip of the display panel are both disposed on the first side of the border area. The backlight module includes a back panel, a middle frame, and a backlight assembly. The back panel includes a main board and a side panel connected to the edge of the main board, corresponding to the first side area of ​​the frame area. The main board and the side panel form a slot. The middle frame includes a frame body disposed in the slot, a frame side body extending along the main board toward the display area, and a frame barrier extending along the side panel toward the cover plate. The backlight assembly includes the backlight source. The backlight assembly is disposed within the receiving space formed by the motherboard and the frame side body, and the driver chip is disposed within the receiving space formed by the frame retaining wall and the frame side body; The display module further includes a first heat dissipation tape disposed on the side of the driver chip near the cover plate, a second heat dissipation tape disposed on the side of the driver chip away from the cover plate, and a heat insulation structure disposed on the side of the frame body near the second heat dissipation tape, wherein the first heat dissipation tape and the second heat dissipation tape extend to the frame retaining wall.

2. The display module according to claim 1, characterized in that, The display module also includes a flexible circuit board connected to the driver chip. One side of the flexible circuit board extends across the frame wall and the side plate and reaches the main board. The display panel includes an array substrate and a color filter substrate stacked together. The driver chip is disposed on the array substrate and located on the side of the color filter substrate closer to the frame wall. One end of the first heat dissipation tape is attached to the edge of the color filter substrate near the frame wall, covering the side of the driving chip away from the frame side body, covering the side of the flexible circuit board near the cover plate, and extending to the side plate; The second heat dissipation tape is attached to the side of the array substrate near the frame side, covers the side of the flexible circuit board away from the cover plate, and extends to the side plate. The orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the second heat dissipation tape on the cover plate.

3. The display module according to claim 2, characterized in that, The first heat dissipation tape is a heat-spreading single-sided tape, comprising a thermally conductive adhesive layer, a heat-spreading layer, a substrate, and a heat radiation layer sequentially stacked on the driver chip; The second heat dissipation tape includes a thermally conductive adhesive layer, a thermally conductive layer, a substrate, and a thermally radiating layer, which are sequentially stacked on the side of the array substrate away from the cover plate.

4. The display module according to claim 1, characterized in that, The heat insulation structure is heat insulation foam. The orthographic projection of the driving chip on the cover plate falls into the orthographic projection of the heat insulation foam on the cover plate; The orthographic projection of the backlight on the cover plate falls onto the orthographic projection of the thermal insulation foam on the cover plate.

5. The display module according to claim 4, characterized in that, The thermal insulation foam includes a thermally conductive adhesive layer, a thermally insulating closed-cell foam layer, a heat-equalizing layer, a substrate, and a black resin layer, which are sequentially stacked on the side of the frame.

6. The display module according to any one of claims 1-5, characterized in that, The backlight assembly includes a backlight source, an optical film layer, and a light guide plate. The backlight source is disposed on the side of the side plate facing the display area, and the optical film layer and the light guide plate are stacked on the side of the backlight source close to the display area. The side plate includes a first groove, the backlight is disposed in the first groove, and there is a predetermined clearance space between the backlight, the optical film layer and the light guide plate.

7. The display module according to claim 6, characterized in that, The border area also includes a second side opposite to the first side, and a third and fourth side opposite to each other. Corresponding to at least one of the second side, third side and fourth side: the middle frame of the backlight module includes a frame support side that contacts the side of the back plate, and a frame support portion that extends along the bottom edge of the back plate toward the display area; the backlight assembly includes an optical film layer and a light guide plate stacked in the receiving space formed by the back plate and the frame support portion. The side of the back plate includes a second groove, and the second groove, the optical film layer, and the light guide plate include the clearance space; The backlight module also includes an adhesive portion disposed between the frame support side and the side of the back plate.

8. The display module according to claim 7, characterized in that, The frame support side includes a flange extending toward the side of the back panel away from the display area; or The frame support is provided with at least one hanging ear at one end near the cover plate, and the side of the back plate includes a fixing slot corresponding to each hanging ear.

9. The display module according to any one of claims 1-5, characterized in that, The cover plate has an ink layer located in the frame area on the side near the backlight module. The back plate has a cover plate support portion on the side near the cover plate for supporting the cover plate. The cover plate support portion includes a soft support structure that contacts the ink layer. The orthographic projection of the soft support structure on the cover plate falls into the orthographic projection of the ink layer on the cover plate.

10. The display module according to claim 9, characterized in that, The back plate has a third groove and a first flat surface on the side near the cover plate. The soft support structure is disposed in the third groove. In the direction perpendicular to the cover plate, the thickness of the soft support structure is a predetermined first distance greater than the depth of the third groove. A hot melt adhesive with a thickness of the first distance is laid between the first flat surface and the cover plate. or The surface of the back plate near the cover plate is a second flat surface, and the soft support structure includes a plurality of soft support substructures disposed on the second flat surface; or The surface of the back plate near the cover plate includes a first protrusion, and the soft support structure is disposed on the first protrusion. The orthographic projection of the soft support structure on the cover plate covers the orthographic projection of the first protrusion on the cover plate.

11. A vehicle-mounted display device, characterized in that, Includes the display module as described in any one of claims 1-10.

12. The vehicle-mounted display device according to claim 11, characterized in that, It also includes a support structure for supporting the display module. The support structure includes at least one first snap-fit ​​structure, the side plate of the display module includes a second snap-fit ​​structure that corresponds one-to-one with the first snap-fit ​​structure, and the vehicle display device further includes a heat dissipation structure disposed between the first snap-fit ​​structure and the second snap-fit ​​structure.

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