Exposure device with automatic leveling structure

Abstract

The utility model discloses an exposure device with an automatic leveling structure. The exposure device comprises a lifting part and an exposure part arranged on the lifting part, the exposure part comprises a universal seat mounted on the lifting part; the exposure platform is mounted on the universal seat, and a wafer is placed on the exposure platform; the mask plate is located above the exposure platform, and a preset distance is formed between the mask plate and the exposure platform; the leveling piece comprises a leveling fixing plate and at least three leveling beads, the leveling fixing plate is located between the wafer and the mask plate, the leveling beads are arranged on the leveling fixing plate, the leveling fixing plate is connected to the half position of the leveling beads, and the number of the leveling beads is at least three. According to the utility model, the wafer and the mask plate are leveled by designing the leveling piece between the wafer and the mask plate, and meanwhile, the exposure platform is arranged on the universal seat to carry out adaptive leveling work, so that high repeatability and stability in the wafer production process are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer photoetching field, and specifically is an exposure device with automatic leveling structure. BACKGROUND

[0002] At present, the no leveling exposure between wafer and mask is adopted in most manual wafer exposure processes, the hardware mechanism of the early design is used to level, and the production is locked after fine adjustment according to the production condition.

[0003] With the progress of science and technology, wafer manufacturing process is continuously upgraded, and the wafer industry is developing towards high integration, high precision and high reliability, and the precision requirement of wafer manufacturing equipment is also higher and higher.

[0004] In the existing wafer exposure process, there is no automatic leveling mechanism, and it is difficult to meet the high repeatability and stability in the wafer production process.

[0005] The precision of the produced product is low, and it is difficult to maintain consistency in different batches and different times, which puts forward higher requirements for the production of subsequent processes and increases the whole production cost.

[0006] In the case of no automatic leveling function, higher requirements are put forward for the machining precision of spare parts on the exposure equipment, the equipment manufacturing cost is increased, and the equipment needs to be adjusted after working for a period of time, which requires high technical level of the operator and seriously affects the work efficiency.

[0007] Therefore, it is necessary to design an exposure device with automatic leveling structure to solve the above problems. CONTENT OF THE UTILITY MODEL

[0008] The utility model aims at providing an exposure device with automatic leveling structure to solve the above problems in the prior art.

[0009] Technical scheme: an exposure device with automatic leveling structure, comprising:

[0010] Lifting part, exposure part installed on the lifting part;

[0011] The exposure part comprises:

[0012] Universal seat, installed on the lifting part;

[0013] Exposure platform, installed on the universal seat, the wafer is placed on the exposure platform;

[0014] Mask plate, located above the exposure platform, the mask plate and the exposure platform have a predetermined distance;

[0015] The leveling piece comprises a leveling fixed plate between the wafer and the mask plate, and leveling beads arranged on the leveling fixed plate, the leveling fixed plate is connected at one half of the leveling beads, and the leveling beads are designed as at least three.

[0016] The leveling piece is designed between the wafer and the mask plate to level the wafer and the mask plate, the exposure platform is arranged on the universal seat to adapt to the leveling work, and the high repeatability and stability in the wafer production process are met.

[0017] Meanwhile, the higher requirement for the machining precision of spare parts on the exposure equipment under the condition of no automatic leveling function is avoided, and the equipment manufacturing cost is reduced.

[0018] The operator does not need to adjust the exposure device, and the work efficiency is improved.

[0019] In a further embodiment, the lifting part comprises:

[0020] A base frame;

[0021] A driving member comprising a driving motor connected with the base frame, a lead screw connected with an output end of the driving motor, guide rods installed on the base frame and located on both sides of the lead screw, and a lifting frame sleeved with the lead screw and the guide rods;

[0022] A top frame arranged at the top end of the guide rods and the lead screw.

[0023] The exposure platform is driven to rise by the lifting part, and abuts against the leveling piece, so that the leveling piece is in contact with the mask plate, and the wafer placed on the exposure platform is parallel to the mask plate, thereby facilitating the exposure work.

[0024] In a further embodiment, the universal seat comprises:

[0025] A universal base, wherein a vacuum chamber is formed in the universal base;

[0026] A universal movable block arranged on the universal base and matched with the vacuum chamber;

[0027] A vacuum pump connected with the lifting frame, wherein a vacuum suction port of the vacuum pump is connected to the vacuum chamber.

[0028] A through groove extending to the vacuum chamber can be formed in the universal base, and a pipeline connected to the through groove can be designed at the vacuum suction port of the vacuum pump.

[0029] The universal seat is designed to adapt to the swing of the exposure platform during leveling, and the vacuum pump is designed to suck the air in the vacuum chamber, so that the universal movable block and the universal base are relatively fixed.

[0030] In further embodiments, the gimbal base is mounted on the top of the lifting frame, and the exposure platform is mounted on the gimbal movable block.

[0031] In further embodiments, the side of the base frame is provided with a taking and placing part, which comprises:

[0032] A connecting frame connected with the base frame;

[0033] A supporting column mounted on the connecting frame;

[0034] A rotating motor mounted on the supporting column, and the output end of the rotating motor is provided with a claw, which is matched with the leveling part.

[0035] The claw is eccentrically arranged at the output end of the rotating motor, and the claw comprises a connecting part mounted on the output end of the rotating motor and a plurality of claw frames connected with the connecting part, which are matched with the leveling part.

[0036] The claw is located between the mask plate and the wafer, and when the leveling part is placed on the claw, the leveling bead of the leveling part is close to the mask plate, and when the lifting part drives the wafer to rise, the wafer abuts against the leveling bead and makes the leveling bead contact with the mask plate.

[0037] The position of the leveling part is changed by designing the taking and placing part, and when the leveling part needs to work, the taking and placing part drives the leveling part to rotate to the bottom of the mask plate, and when exposure is performed, the taking and placing part drives the leveling part to rotate to the outside of the mask plate, so that the leveling part does not affect the exposure work.

[0038] Beneficial effects: the utility model discloses a kind of exposure devices with automatic leveling structure, and the utility model discloses leveling part is designed between wafer and mask plate, and wafer and mask plate are leveled, and exposure platform is set on gimbal seat simultaneously, and leveling work is adapted, to meet the high repeatability and stability in wafer production process in turn;

[0039] Meanwhile, higher requirements on machining precision of spare parts on exposure equipment under the condition of no automatic leveling function are avoided, and equipment manufacturing cost is reduced.

[0040] Without the need for operator to adjust exposure device, improve work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 It is the structure schematic diagram of the utility model.

[0042] Figure 2 It is the claw structure schematic diagram of the utility model.

[0043] Reference signs are:

[0044] 11, universal base; 12, universal movable block; 13, exposure platform; 14, wafer; 15, leveling bead; 16, leveling fixed plate; 17, mask plate;

[0045] 21, bottom frame; 22, top frame; 23, screw rod; 24, guide rod; 25, lifting motor; 26, lifting frame; 27, vacuum pump;

[0046] 31, connecting frame; 32, support column; 33, rotary motor; 34, clamping jaw. DETAILED DESCRIPTION

[0047] The application relates to an exposure device with an automatic leveling structure, which is explained in detail through specific embodiments.

[0048] An exposure device with an automatic leveling structure, comprising:

[0049] a lifting part, and an exposure part installed on the lifting part;

[0050] the lifting part comprises:

[0051] a bottom frame 21;

[0052] a driving member, which comprises a driving motor connected with the bottom frame 21, a screw rod 23 connected with the output end of the driving motor, guide rods 24 installed on the bottom frame 21 and located on both sides of the screw rod 23, and a lifting frame 26 sleeved with the screw rod 23 and the guide rods 24;

[0053] a top frame 22 arranged at the top end of the guide rods 24 and the screw rod 23.

[0054] The exposure platform 13 is lifted by the lifting part, and is abutted against the leveling member, so that the leveling member is in contact with the mask plate 17, and then the wafer 14 placed on the exposure platform 13 is parallel to the mask plate 17, thereby facilitating the exposure work.

[0055] the exposure part comprises:

[0056] a universal base installed on the lifting part;

[0057] an exposure platform 13 installed on the universal base, and the wafer 14 is placed on the exposure platform 13;

[0058] a mask plate 17 located above the exposure platform 13, and the mask plate 17 has a predetermined distance from the exposure platform 13;

[0059] a leveling member, which comprises a leveling fixed plate 16 located between the wafer 14 and the mask plate 17, and leveling beads 15 arranged on the leveling fixed plate 16, the leveling fixed plate 16 is connected at one half of the leveling beads 15, and the leveling beads 15 are designed at least three.

[0060] The utility model discloses a find the piece between wafer 14 and mask plate 17, and find the flatness of wafer 14 and mask plate 17, and set up exposure platform 13 on universal seat, and adapt to find the flatness work, and then satisfy the high repeatability and stability in wafer 14 production process,

[0061] Meanwhile, higher requirements for machining precision of spare parts on the exposure equipment are avoided in the absence of automatic leveling function, and equipment manufacturing cost is reduced;

[0062] Without the adjustment of exposure device by operating personnel, the work efficiency is improved.

[0063] The universal seat comprises:

[0064] Universal base 11, the universal base 11 is opened in vacuum chamber;

[0065] Universal movable block 12, set up on the universal base 11, with the vacuum chamber adaptation;

[0066] Vacuum pump 27, connected with lifting frame 26, the vacuum suction port of vacuum pump 27 is connected to the vacuum chamber.

[0067] The universal base 11 can be extended to the vacuum chamber by opening a through groove, and the through groove is connected to the through groove by designing a pipeline at the vacuum suction port of the vacuum pump 27.

[0068] By designing the universal seat, the swing of the exposure platform 13 during leveling is adapted, and by designing the vacuum pump 27 to suck the air in the vacuum chamber, the universal movable block 12 and the universal base 11 are relatively fixed.

[0069] The universal base 11 is installed on the top of the lifting frame 26, and the exposure platform 13 is installed on the universal movable block 12.

[0070] The side of the base frame 21 is provided with a taking and placing part, and the taking and placing part comprises:

[0071] Connecting frame 31, connected with the base frame 21;

[0072] Support column 32, installed on the connecting frame 31;

[0073] Rotary motor 33, installed on the support column 32, the output end of rotary motor 33 is provided with a jaw 34, and the jaw 34 is matched with the leveling piece.

[0074] The jaw 34 is eccentrically arranged at the output end of the rotary motor 33, and the jaw 34 comprises a connecting part installed at the output end of the rotary motor 33, and a plurality of groups of jaw frames connected with the connecting part, and the jaw frames are matched with the leveling piece.

[0075] The supporting claw 34 is located between the mask plate 17 and the wafer 14, when the leveling piece is placed on the supporting claw 34, the leveling ball 15 of the leveling piece is close to the mask plate 17, when the lifting part drives the wafer 14 to rise, the wafer 14 abuts against the leveling ball 15, and the leveling ball 15 is in contact with the mask plate 17;

[0076] The position of the leveling piece is changed by designing the taking and placing part, when the leveling piece is needed to work, the taking and placing part drives the leveling piece to rotate to the bottom of the mask plate 17, when exposure, the taking and placing part drives the leveling piece to rotate to the outside of the mask plate 17, so that the leveling piece does not affect the exposure work.

[0077] The working principle is explained as follows: when working, the supporting claw 34 is rotated by the rotating motor 33, and the leveling piece placed on the supporting claw 34 is moved to the lower side of the mask plate 17;

[0078] At this time, the lifting frame 26 is lifted by rotating the screw rod 23 by the lifting motor 25, the universal seat is lifted, the exposure platform 13 is lifted, the wafer 14 placed on the exposure platform 13 abuts against the leveling piece and makes the leveling piece in contact with the mask plate 17, in the movement process, the leveling piece is separated from the supporting claw 34 and is located at a certain distance above the supporting claw 34, at this time, the gap between the wafer 14 and the mask plate 17 is completely consistent by three-point contact of the three leveling balls, the wafer 14 and the mask plate 17 are leveled, at this time, the air in the vacuum chamber is extracted by the vacuum pump 27, so that the universal movable block 12 and the universal base 11 are relatively fixed, after being fixed, the lifting motor 25 drives the screw rod 23 to rotate, and the lifting frame 26 is lowered by a certain distance, at this time, the leveling piece falls on the supporting claw 34, the supporting claw 34 is rotated by the rotating motor 33, and the leveling piece is moved away, and the next exposure action is performed.

[0079] The preferred embodiments of the utility model are described in detail in combination with the drawings, but the utility model is not limited to the specific details in the above embodiments, and various equivalent transformations can be made to the technical scheme of the utility model within the technical concept of the utility model, and these equivalent transformations all belong to the protection scope of the utility model.

Claims

1. An exposure device with an automatic leveling structure, comprising: Lifting unit, and exposure unit mounted on the lifting unit; The exposure unit is characterized by comprising: A universal joint is installed on the lifting unit; An exposure platform (13) is mounted on the universal joint, and a wafer (14) is placed on the exposure platform (13); A mask (17) is located above the exposure platform (13), and there is a predetermined distance between the mask (17) and the exposure platform (13); The leveling component includes a leveling fixing plate (16) located between the wafer (14) and the mask plate (17), and leveling beads (15) disposed on the leveling fixing plate (16). The leveling fixing plate (16) is connected at half of the leveling beads (15), and at least three leveling beads (15) are designed.

2. The exposure device with an automatic leveling structure according to claim 1, characterized in that: The lifting unit includes: Base frame (21); The driving component includes a drive motor connected to the base frame (21), a lead screw (23) connected to the output end of the drive motor, guide rods (24) mounted on the base frame (21) and located on both sides of the lead screw (23), and a lifting frame (26) sleeved on the lead screw (23) and the guide rods (24); The top frame (22) is located at the top of the guide rod (24) and the lead screw (23).

3. The exposure device with an automatic leveling structure according to claim 1, characterized in that: The universal joint includes: Universal base (11), wherein a vacuum chamber is formed inside the universal base (11); The universal movable block (12) is disposed on the universal base (11) and is adapted to the vacuum chamber; A vacuum pump (27) is connected to a lifting frame (26), and the vacuum pump (27) has a vacuum port connected to a vacuum chamber.

4. The exposure device with an automatic leveling structure according to claim 3, characterized in that: The universal base (11) is installed on the top of the lifting frame (26), and the exposure platform (13) is installed on the universal movable block (12).

5. An exposure device with an automatic leveling structure according to claim 2, characterized in that: The base frame (21) is provided with a pick-and-place component on its side, the pick-and-place component comprising: The connecting frame (31) is connected to the base frame (21); A support column (32) is installed on the connecting frame (31); A rotary motor (33) is mounted on the support column (32). The output end of the rotary motor (33) is provided with a claw (34), which is adapted to the leveling component.

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