Sand-proof computer

Abstract

The utility model discloses a dust-proof computer relates to computer equipment technical field, wherein the dust-proof computer includes shell, function module, heat dissipation module and dustproof pad group, the shell is equipped with the accommodation space, the gland plate is arranged in the accommodation space, and the plane of gland plate is parallel to the plane of shell bottom plate; the functional module is arranged in the accommodating space and comprises a mainboard which is positioned between the bottom plate and the gland plate; the heat dissipation module is arranged in the accommodating space and is used for dissipating heat of the gland plate; the dustproof pad group comprises a first dustproof pad and a second dustproof pad, the first dustproof pad is arranged between the main plate and the gland plate and abuts against the main plate and the gland plate, and the second dustproof pad is arranged between the main plate and the bottom plate and abuts against the main plate and the bottom plate; according to the technical scheme provided by the utility model, the mainboard of the computer can be effectively prevented from being damaged by sand and dust in a severe environment.

Description

Technical Field

[0001] This utility model relates to the field of computer equipment technology, and in particular to a computer that is dustproof. Background Technology

[0002] Computers generate a significant amount of heat during operation, and air cooling is simple, inexpensive, and meets the cooling needs of most applications, thus it is commonly used. However, in dusty environments such as deserts, mines, and outdoor equipment rooms, where the air contains large amounts of dust particles, traditional air cooling systems can draw in dust, causing blockages in the computer's cooling channels, reducing cooling efficiency, and potentially damaging computer hardware.

[0003] Traditional methods of preventing dust pollution mainly rely on installing filters or dust covers at the air intake to physically block dust particles from entering the computer. However, these methods are prone to failure when the amount of dust is large or the particles are fine, allowing dust to still enter the computer. Furthermore, filters and dust covers need to be cleaned or replaced regularly. If not cleaned in time, they will lose their effectiveness, allowing dust to enter the computer and adhere to internal components (such as the motherboard), affecting the computer's operational stability. Utility Model Content

[0004] The main purpose of this invention is to provide a dustproof computer, which is designed to effectively prevent dust from damaging the computer's motherboard in harsh environments.

[0005] To achieve the above objectives, the present invention proposes a dust-proof computer, comprising:

[0006] The housing has an accommodating space, and a cover plate is disposed in the accommodating space, with the plane of the cover plate being parallel to the plane of the bottom plate of the housing;

[0007] A functional module, located in the accommodating space, includes a motherboard, which is situated between the base plate and the cover plate;

[0008] A heat dissipation module is provided in the accommodating space to dissipate heat from the cover plate;

[0009] The dustproof pad assembly includes a first dustproof pad and a second dustproof pad. The first dustproof pad is disposed between the motherboard and the pressure plate and abuts against the motherboard and the pressure plate. The second dustproof pad is disposed between the motherboard and the base plate and abuts against the motherboard and the base plate.

[0010] In one embodiment, the functional module further includes a functional component disposed on the motherboard and detachably connected to the motherboard. The functional component passes through the pressure cover plate and is sealed to the pressure cover plate.

[0011] In one embodiment, the functional component includes multiple expansion cards that can be detachably connected to the motherboard, and the dustproof pad assembly further includes multiple third dustproof pads that are configured one-to-one with the multiple expansion cards. The pressure plate is provided with a first through hole corresponding to the expansion card, and the third dustproof pad is disposed at the end of the first through hole and abuts against the expansion card.

[0012] In one embodiment, the functional component further includes a plurality of heat sinks that can be detachably connected to the motherboard, and the dust pad assembly further includes a plurality of fourth dust pads that are provided in a one-to-one correspondence with the plurality of heat sinks. The pressure plate is provided with a second through hole corresponding to the expansion card, and the fourth dust pad is provided at the end of the second through hole and abuts against the heat sink.

[0013] In one embodiment, the first dustproof pad, the second dustproof pad, the third dustproof pad, and the fourth dustproof pad are made of a material that is elastic and can withstand temperatures ranging from -50°C to 200°C.

[0014] In one embodiment, the heat dissipation module includes a heat dissipation fan, and the housing has heat dissipation holes on opposite side walls in the front-back or left-right direction. The heat dissipation fan is disposed near the side wall of the housing with the heat dissipation holes, and a filter assembly is sandwiched between the heat dissipation fan and the heat dissipation holes.

[0015] In one embodiment, the filter assembly includes filter cotton and a filter support, the periphery of the filter cotton being connected to the filter support, and the filter support exerting tension on the filter cotton.

[0016] In one embodiment, two filter components are provided. One filter component is located between the cooling fan and the side wall of the housing where the heat dissipation hole is located, and the other filter component is located near the other side wall of the housing where the heat dissipation hole is located.

[0017] In one embodiment, the housing and the cover plate are made of metal.

[0018] In one embodiment, a heat dissipation component is sandwiched between at least one of the base plate and the motherboard, and between the cover plate and the motherboard.

[0019] In one embodiment, the heat dissipation assembly includes a first heat-conducting plate and a second heat-conducting plate that abut against each other, wherein the first heat-conducting plate abuts against the motherboard and the second heat-conducting plate abuts against the base plate or the pressure plate.

[0020] In this invention, since the core component of a computer is the motherboard, a pressure plate, a first dustproof pad, and a second dustproof pad are used to seal and protect the motherboard, preventing sand and dust from entering and damaging it. This helps prevent computer malfunctions due to hardware damage. The heat from the motherboard is transferred to the base plate and the pressure plate. The heat dissipation module cools the base plate and the pressure plate, reducing the motherboard's heat. This effectively prevents sand and dust from contacting the motherboard in harsh environments without affecting heat dissipation efficiency, thus avoiding damage to the computer's motherboard. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the structure of an embodiment of the dustproof computer provided by this utility model;

[0023] Figure 2 for Figure 1 Side view of the embodiment shown;

[0024] Figure 3 for Figure 1 A partial exploded view of the embodiment shown.

[0025] Explanation of icon numbers:

[0026] 100. Housing; 11. Accommodation space; 12. Cover plate; 121. First through hole; 122. Second through hole; 13. Base plate; 14. Heat dissipation holes; 15. Filter plate;

[0027] 200. Functional module; 21. Motherboard; 22. Functional component; 221. Expansion card; 222. Heatsink;

[0028] 300. Heat dissipation module; 31. Cooling fan;

[0029] 400. Dustproof mat set; 41. First dustproof mat; 42. Second dustproof mat; 43. Third dustproof mat; 44. Fourth dustproof mat;

[0030] 500. Filter assembly; 51. Filter cotton; 52. Filter support.

[0031] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0033] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0034] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0035] This invention proposes a computer that is resistant to sand and dust.

[0036] Please see Figures 1 to 3 In one embodiment of this utility model, the dustproof computer includes:

[0037] The housing 100 has a receiving space 11, and a cover plate 12 is disposed in the receiving space 11, and the plane of the cover plate 12 is parallel to the plane of the bottom plate 13 of the housing 100.

[0038] Functional module 200 is located in accommodating space 11 and includes motherboard 21, which is located between base plate 13 and cover plate 12.

[0039] A heat dissipation module 300 is provided in the accommodating space 11 to dissipate heat from the pressure cover plate 12;

[0040] The dustproof pad assembly 400 includes a first dustproof pad 41 and a second dustproof pad 42. The first dustproof pad 41 is disposed between the main board 21 and the pressure plate 12 and abuts against the main board 21 and the pressure plate 12. The second dustproof pad 42 is disposed between the main board 21 and the base plate 13 and abuts against the main board 21 and the base plate 13.

[0041] In this invention, since the core component of the computer is the motherboard 21, the motherboard 21 is sealed and protected by a pressure plate 12, a first dustproof pad 41, and a second dustproof pad 42. This prevents dust from entering the motherboard 21 and causing damage, thus helping to prevent computer malfunctions due to hardware damage. The heat from the motherboard 21 is transferred to the base plate 13 and the pressure plate 12. The heat dissipation module 300 dissipates heat from the base plate 13 and the pressure plate 12, reducing the heat of the motherboard 21. This effectively prevents dust from contacting the motherboard 21 in harsh environments without affecting heat dissipation efficiency, thus avoiding damage to the computer's motherboard 21.

[0042] In one embodiment, the functional module 200 further includes a functional component 22, which is disposed on the motherboard 21 and detachably connected to the motherboard 21. The functional component 22 passes through the pressure cover plate 12 and is sealed to the pressure cover plate 12. That is, even when the functional component 22 is large, the pressure cover plate 12 and the base plate 13 can still provide sealed protection for the motherboard 21. Furthermore, the functional component 22 includes multiple expansion cards 221 that can be detachably connected to the motherboard 21. The dustproof pad assembly 400 also includes multiple third dustproof pads 43 that are provided one-to-one with the multiple expansion cards 221. The pressure cover plate 12 is provided with a first through hole 121 corresponding to the expansion card 221. The third dustproof pad 43 is disposed at the end of the first through hole 121 and abuts against the expansion card 221, which helps to enhance the performance of the computer without affecting the sealed protection of the motherboard 21 by the pressure cover plate 12 and the base plate 13. Furthermore, the functional component 22 also includes multiple heat sinks 222 that can be detachably connected to the motherboard 21. The dustproof pad assembly 400 also includes multiple fourth dustproof pads 44 that are arranged one-to-one with the multiple heat sinks 222. The cover plate 12 is provided with a second through hole 122 corresponding to the expansion card 221. The fourth dustproof pads 44 are located at the end of the second through hole 122 and abut against the heat sink 222. The heat sink 222 includes multiple heat dissipation fins. One end of the heat dissipation fins abuts against the motherboard 21, and the other end extends out of the cover plate 12, so as to transfer the heat generated on the motherboard 21 to the side of the cover plate 12 away from the motherboard 21. That is, the heat dissipation module 300 can dissipate heat from the heat dissipation fins, thereby helping to enhance the heat dissipation efficiency of the motherboard 21 without affecting the sealing protection of the motherboard 21 by the cover plate 12 and the base plate 13. In other embodiments, the functional component 22 may be located on the motherboard 21 and between the motherboard 21 and the pressure plate 12; or the functional component 22 may only include the expansion card 221 or the heat sink 222.

[0043] In one embodiment, the first dustproof pad 41, the second dustproof pad 42, the third dustproof pad 43, and the fourth dustproof pad 44 are made of a material that is elastic and can withstand temperatures ranging from -50°C to 200°C. Furthermore, the housing 100 and the pressure plate 12 are made of metal. Metal has excellent thermal conductivity, enabling faster heat dissipation from the motherboard 21.

[0044] In one embodiment, the heat dissipation module 300 includes a cooling fan 31. The housing 100 has heat dissipation holes 14 on opposite side walls in the front-back or left-right directions. The cooling fan 31 is positioned near the side wall of the housing 100 with the heat dissipation holes 14, and a filter assembly 500 is sandwiched between the cooling fan 31 and the heat dissipation holes 14. Airflow convects between the two heat dissipation holes 14 to form a heat dissipation channel within the accommodating space 11. The cooling fan 31 helps to accelerate the convection speed of the airflow within the heat dissipation channel, and the heat dissipation fins of the radiator 222 extend into the heat dissipation channel. Furthermore, the cooling fan 31 can draw air from the nearest heat dissipation hole 14 to the outside and deliver air to the furthest heat dissipation hole 14. Therefore, sandwiching the filter assembly 500 between the cooling fan 31 and the heat dissipation holes 14 helps to prevent dust from entering the accommodating space 11. Furthermore, a filter plate 15 is also provided inside the housing. The filter plate 15 is located near the cooling fan 31 and is situated on the side of the cooling fan 31 away from the nearby heat dissipation hole 14. The filter plate 15 has multiple through holes to allow airflow. In other embodiments, the heat dissipation module 300 may include a thermoelectric cooler, with at least three thermoelectric coolers to respectively abut the cold end against the base plate 13, the pressure plate 12, and the heat sink 222.

[0045] In one embodiment, the filter assembly 500 includes a filter cotton 51 and a filter support 52. The periphery of the filter cotton 51 is connected to the filter support 52, and the filter support 52 exerts tension on the filter cotton 51. The filter support 52 supports the filter cotton 51 so that the filter cotton 51 can be held within the receiving space 11 in a state that blocks the heat dissipation holes 14. In other embodiments, the filter assembly 500 may consist only of the filter cotton 51.

[0046] In one embodiment, two filter assemblies 500 are provided. One filter assembly 500 is disposed between the cooling fan 31 and the side wall of the housing 100 where the heat dissipation hole 14 is provided, and the other filter assembly 500 is disposed near the other side wall of the housing 100 where the heat dissipation hole 14 is provided. This is to further prevent sand and dust from entering the accommodating space 11. In other embodiments, there may be only one filter assembly 500.

[0047] In one embodiment, a heat dissipation component is sandwiched between at least one of the base plate 13 and the motherboard 21, and between the cover plate 12 and the motherboard 21. This allows for faster heat transfer from the motherboard 21 to the cover plate 12 or the base plate 13. Preferably, heat dissipation components are sandwiched between the base plate 13 and the motherboard 21, and between the cover plate 12 and the motherboard 21, which helps to achieve rapid heat dissipation from the motherboard 21. Further, the heat dissipation component includes a first heat-conducting plate and a second heat-conducting plate that abut against each other, with the first heat-conducting plate abutting against the motherboard 21 and the second heat-conducting plate abutting against the base plate 13 or the cover plate 12. Further, the first heat-conducting plate is made of thermally conductive silicone, and the second heat-conducting plate is made of metal. In other embodiments, a dust-proof computer may not have a heat dissipation component.

[0048] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A dust-proof computer, characterized in that, include: The housing has an accommodating space, and a cover plate is disposed in the accommodating space, with the plane of the cover plate being parallel to the plane of the bottom plate of the housing; A functional module, located in the accommodating space, includes a motherboard, which is situated between the base plate and the cover plate; A heat dissipation module is provided in the accommodating space to dissipate heat from the cover plate; The dustproof pad assembly includes a first dustproof pad and a second dustproof pad. The first dustproof pad is disposed between the motherboard and the pressure plate and abuts against the motherboard and the pressure plate. The second dustproof pad is disposed between the motherboard and the base plate and abuts against the motherboard and the base plate.

2. The dust-proof computer as described in claim 1, characterized in that, The functional module also includes a functional component, which is located on the motherboard and detachably connected to the motherboard. The functional component passes through the cover plate and is sealed to the cover plate.

3. The dust-proof computer as described in claim 2, characterized in that, The functional components include multiple expansion cards that can be detachably connected to the motherboard. The dustproof pad assembly also includes multiple third dustproof pads that correspond one-to-one with the multiple expansion cards. The cover plate has a first through hole corresponding to the expansion card. The third dustproof pad is located at the end of the first through hole and abuts against the expansion card.

4. The dust-proof computer as described in claim 3, characterized in that, The functional components also include multiple heat sinks that can be detachably connected to the motherboard. The dust pad assembly also includes multiple fourth dust pads that correspond one-to-one with the multiple heat sinks. The cover plate has a second through hole corresponding to the expansion card. The fourth dust pad is located at the end of the second through hole and abuts against the heat sink.

5. The dust-proof computer as described in claim 4, characterized in that, The first dustproof pad, the second dustproof pad, the third dustproof pad, and the fourth dustproof pad are made of elastic material that can withstand temperatures ranging from -50°C to 200°C.

6. The dust-proof computer as described in claim 1, characterized in that, The heat dissipation module includes a cooling fan. The housing has heat dissipation holes on opposite side walls in the front-back or left-right directions. The cooling fan is located near the side wall of the housing with the heat dissipation holes, and a filter assembly is sandwiched between the cooling fan and the heat dissipation holes.

7. The dust-proof computer as described in claim 6, characterized in that, The filter assembly includes filter cotton and a filter support, the periphery of the filter cotton is connected to the filter support, and the filter support exerts tension on the filter cotton; And / or, the filter assembly is provided in two parts, one filter assembly is provided between the cooling fan and the side wall of the housing where the heat dissipation hole is provided, and the other filter assembly is provided near the other side wall of the housing where the heat dissipation hole is provided.

8. The dust-proof computer as described in claim 1, characterized in that, The housing and the cover plate are made of metal.

9. The dust-proof computer as described in claim 1, characterized in that, A heat dissipation component is sandwiched between at least one of the base plate and the motherboard, and between the cover plate and the motherboard.

10. The dust-proof computer as described in claim 9, characterized in that, The heat dissipation assembly includes a first heat-conducting plate and a second heat-conducting plate that abut against each other, wherein the first heat-conducting plate abuts against the motherboard and the second heat-conducting plate abuts against the base plate or the pressure plate.

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