Touch module

Abstract

The utility model provides a touch module, and relates to the technical field of touch modules. The touch module comprises a shell, a circuit board, a middle layer and a first detection layer, the shell comprises a first cover plate and a second cover plate which are connected, and the circuit board is arranged between the first cover plate and the second cover plate. The middle layer is connected to one side, facing the first cover plate, of the circuit board; the first detection layer is arranged on the side, away from the circuit board, of the middle layer and provided with a first induction area electrically connected with the circuit board. The first cover plate is provided with a first touch control area, and the first touch control area and the first induction area are oppositely arranged. According to the touch module, the distance between the first touch area and the first detection layer is shortened, the touch semaphore can be improved, and the reliability and sensitivity of the touch module are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to touch module technical field especially is touch module. BACKGROUND

[0002] In the existing capacitive touch module, the internal circuit board has a sensor, the distance between the touch panel and the internal circuit board is large, which leads to a large distance between the touch panel and the sensor when the user performs a touch operation on the touch panel, so that the micro control unit (MCU) connected with the circuit board receives a very low amount of capacitive signals, or even cannot receive the amount of capacitive signals, thereby causing the phenomenon of touch module failure or insensitivity.

[0003] At present, some schemes of adding a touch film between the circuit board and the touch panel exist in the market, the touch film is electrically connected with the internal circuit board through a flexible circuit board, the touch film has a sensor, although the distance between the touch panel and the sensor can be reduced, the assembly process is complex, the connection of the flexible circuit board with the sensor and the circuit board is unreliable, and the comprehensive cost is high. SUMMARY

[0004] The utility model aims at providing a touch module, which can increase the amount of capacitive signals of the touch module and improve the reliability and sensitivity of the touch module.

[0005] In a first aspect, the utility model provides a touch module, which comprises:

[0006] A shell comprising a first cover plate and a second cover plate connected with each other;

[0007] A circuit board arranged between the first cover plate and the second cover plate;

[0008] An intermediate layer connected to one side of the circuit board facing the first cover plate;

[0009] A first detection layer arranged on the side of the intermediate layer away from the circuit board, the first detection layer having a first sensing area electrically connected with the circuit board;

[0010] The first cover plate is provided with a first touch area, and the first touch area is arranged opposite to the first sensing area.

[0011] In an optional embodiment, the intermediate layer is provided with a via hole, at least one conductive member is arranged in the via hole, one end of the conductive member is electrically connected with the first sensing area, and the other end of the conductive member is electrically connected with the circuit board.

[0012] In an optional embodiment, the circuit board is provided with a solder pad, and the conductive member is electrically connected with the circuit board through the solder pad.

[0013] In an optional embodiment, a plurality of the solder pads are provided on the circuit board, the plurality of the solder pads are arranged in the projection of the first sensing area on the circuit board, and the plurality of the solder pads are symmetrically distributed about the center of the projection, facilitating fault-tolerant soldering assembly and facilitating mass production control.

[0014] In an optional embodiment, the intermediate layer is made of reinforced epoxy resin laminated material.

[0015] In an optional embodiment, a first adhesive is provided on the side of the first cover plate facing the intermediate layer, and the projection of the first adhesive on the first detection layer covers at least the first sensing area, so that the first adhesive can reduce the thickness of the air layer between the first sensing area and the touch surface, further improving the signal quantity.

[0016] In an optional embodiment, the thickness of the first adhesive is less than or equal to the spacing between the first detection layer and the first cover plate, which can improve the tolerance to tolerances and reduce the difficulty of assembly.

[0017] In an optional embodiment, a second detection layer is provided on the side of the circuit board facing the second cover plate, and the second detection layer is provided with a second sensing area; and a second touch area corresponding to the second sensing area is provided on the side surface of the second cover plate away from the first cover plate, which can meet more rich scene requirements, such as detection of gripping.

[0018] In an optional embodiment, a third adhesive is provided on the side of the second cover plate facing the second detection layer, and the projection of the third adhesive on the second detection layer covers at least the second sensing area.

[0019] In an optional embodiment, the touch module further comprises a first support, one end of the first support is connected to the first cover plate, and the other end is connected to the second cover plate; and the circuit board is connected to the first support, so that a space for accommodating the second detection layer is formed between the second cover plate and the circuit board.

[0020] In an optional embodiment, the housing further comprises a second support, one end of the second support is connected to the first cover plate, and the other end is connected to the second cover plate.

[0021] In an optional embodiment, the touch module is a front cover switch, a handle switch, a charging port switch, a tailgate switch, or a decorative strip switch.

[0022] In an optional embodiment, the first cover plate is provided with the first touch area on the side surface away from the second cover plate.

[0023] In an optional embodiment, the touch module further comprises a panel connected to a side of the first cover plate away from the second cover plate, and a surface of the panel away from the first cover plate is provided with the first touch area.

[0024] In an optional embodiment, a second adhesive is arranged between the panel and the first cover plate, and a projection of the second adhesive on the first detection layer covers at least the first sensing area.

[0025] The touch module provided by the embodiment of the utility model has the beneficial effects that:

[0026] The touch module provided by the embodiment of the utility model has the beneficial effects that: BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical scheme in the specific embodiments of the utility model or the prior art, the drawings needed in the specific embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0028] Figure 1 It is a structural schematic view of a touch module of the prior art;

[0029] Figure 2 It is a structural schematic view of another touch module of the prior art;

[0030] Figure 3 It is a first structural schematic view of the touch module provided by the embodiment of the utility model;

[0031] Figure 4 It is a connection structural schematic view of the circuit board, the intermediate layer and the first detection layer in the touch module provided by the embodiment of the utility model;

[0032] Figure 5 It is Figure 4 It is a top view structural schematic view of the structure;

[0033] Figure 6 for Figure 4 A cross-sectional structural schematic view of the structure along the via axis;

[0034] Figure 7 A kind of pad distribution schematic diagram of circuit board in the touch module provided by the embodiment of the utility model;

[0035] Figure 8 Another kind of pad distribution schematic diagram of circuit board in the touch module provided by the embodiment of the utility model;

[0036] Figure 9 The first structure schematic diagram of intermediate layer provided by the embodiment of the utility model on the circuit board in the touch module;

[0037] Figure 10 The second structure schematic diagram of intermediate layer provided by the embodiment of the utility model on the circuit board in the touch module;

[0038] Figure 11 The third structure schematic diagram of intermediate layer provided by the embodiment of the utility model on the circuit board in the touch module;

[0039] Figure 12 The first position distribution schematic diagram of intermediate layer provided by the embodiment of the utility model on the circuit board in the touch module;

[0040] Figure 13 The second position distribution schematic diagram of intermediate layer provided by the embodiment of the utility model on the circuit board in the touch module;

[0041] Figure 14 The second structure schematic diagram of the touch module provided by the embodiment of the utility model;

[0042] Figure 15 The third structure schematic diagram of the touch module provided by the embodiment of the utility model;

[0043] Figure 16 The fourth structure schematic diagram of the touch module provided by the embodiment of the utility model;

[0044] Figure 17 The fifth structure schematic diagram of the touch module provided by the embodiment of the utility model;

[0045] Figure 18 The layout position schematic diagram of the touch module in the vehicle application provided by the embodiment of the utility model.

[0046] Icon: 10-touch panel; 11-touch area; 20-circuit board; 21-touch film; 22-flexible circuit board; 100-touch module; 110-housing; 111-first cover plate; 112-first touch area; 114-panel; 115-second cover plate; 116-second touch area; 117-second support column; 120-circuit board; 121-solder pad; 123-micro control unit; 130-intermediate layer; 131-via; 133-conductive piece; 140-first detection layer; 141-first sensing area; 150-first adhesive; 160-second adhesive; 170-second detection layer; 180-first support column; 201-front cover switch; 202-handle switch; 203-decorative strip switch; 204-charging port switch; 205-tailgate switch. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0049] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0050] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0051] In addition, the terms "horizontal", "vertical", "overhang" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. As "horizontal" merely means that it is more horizontal than "vertical", it does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0052] In the description of the utility model, it is necessary to point out that, unless there is definite stipulation and limitation, the terms "arrange", "install", "connect" and "connect" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected, it can be mechanical connection, or electrical connection, it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0053] In combination Figure 1 Touch module includes touch panel 10 and circuit board 20, when finger contacts the touch area 11 of touch panel 10, the conductive property of human body and large mass constitute the conductive layer of ground.The operation constitutes a parallel-plate capacitor, and the capacitance value between the sensing area on the circuit board 20 and the finger is formula Wherein, ε 0 It is air dielectric constant;ε r It is the relative dielectric constant of cover layer;A is the contact area of finger and cover layer;D is the thickness of cover layer.The cover layer here can be understood as all coverings between the touch surface and the sensing area of circuit board 20, that is, including the air layer between finger and sensing area and touch panel 10 etc.From the formula, if d is smaller, then the capacitance value C F It is larger, that is, the amount of capacitive signals that touch module can receive is more, and the signal is more stable, and touch is more reliable and sensitive.Conversely, if d is larger, then the capacitance value C F It is smaller, that is, the amount of capacitive signals that touch module can receive is less, and the signal is less stable, and even cannot receive the amount of capacitive signals.

[0054] Figure 1 As an existing touch module, the distance between the touch area 11 of touch panel 10 and the sensing area of circuit board 20 is large, which is prone to the phenomenon of less capacitive signal amount, unstable received capacitive signal, and even unable to receive signal.

[0055] Figure 2 As another existing touch module, a touch film 21 is added between the circuit board 20 and the touch panel 10, the touch film 21 is electrically connected with the internal circuit board 20 through a flexible circuit board 22, and the touch film 21 has a sensor sensing area, although this way can reduce the distance between the touch panel 10 and the sensor sensing area, but the assembly process is complex, unstable connection is prone to occur, and the comprehensive cost is high.

[0056] In order to overcome at least one defect in the prior art, the embodiment proposes a touch module 100 which can effectively shorten the distance between the touch area and the sensing area, increase the amount of capacitive signals, and has a simple structure, stable connection, and reduced improvement cost.

[0057] Some embodiments of the utility model will be described in detail below with reference to the drawings. In the case of no conflict, the following examples and features in the examples can be combined with each other.

[0058] The touch module 100 provided by the embodiment of the utility model can be applied to some touch switches. For example, when the touch module 100 is applied to a vehicle, it can be specifically used for the front cover switch 201, the handle switch 202, the charging port switch 204, the refueling port switch, the tailgate switch 205, or the decorative strip switch 203 of the vehicle. Of course, it can also be applied to other scenarios outside the vehicle, such as ships, aircraft, or other devices that need to be touched, which are not specifically limited here.

[0059] In combination Figure 3 The touch module 100 provided by the embodiment of the utility model includes a shell 110, a circuit board 120, an intermediate layer 130, and a first detection layer 140. The shell 110 includes a first cover plate 111 and a second cover plate 115 connected to each other, and the circuit board 120 is arranged between the first cover plate 111 and the second cover plate 115. The intermediate layer 130 is connected to one side of the circuit board 120 facing the first cover plate 111; the first detection layer 140 is arranged on the side of the intermediate layer 130 away from the circuit board 120, and the first detection layer 140 has a first sensing area 141 electrically connected to the circuit board 120. The first cover plate 111 is provided with a first touch area 112, and the first touch area 112 is arranged opposite to the first sensing area 141. The touch module 100 shortens the distance between the first touch area 112 and the first detection layer 140 by arranging the intermediate layer 130, which is beneficial to improve the capacitive signal amount of touch and improve the reliability and sensitivity of the touch module 100. Moreover, the structure is simple, the connection is reliable, and the cost is saved.

[0060] In combination Figures 4 to 6 Optionally, the intermediate layer 130 is provided with a via hole 131, at least one conductive piece 133 is arranged in the via hole 131, one end of the conductive piece 133 is electrically connected to the first sensing area 141, and the other end is electrically connected to the circuit board 120. The conductive piece 133 can be a copper column, silver paste, or a tin column of metal material arranged in the via hole 131, or a conductive material such as graphene. The conductive piece 133 is mainly used to realize the electrical connection between the first detection layer 140 and the circuit board 120, so the conductive piece 133 can be any conductive material, which is not specifically limited here.

[0061] In this embodiment, the via hole 131 is a signal via hole, mainly used for transmitting the signal of the first detection layer 140 to the circuit board 120. The via hole 131 can be a single through hole, or a combination of a buried hole and a blind hole, etc., and the form is not limited. The number and distribution position of the via hole 131 can be flexibly set according to the actual situation. The shape of the via hole 131 can be circular, square, diamond, oval or any other shape, which is not specifically limited here.

[0062] In combination Figure 7 , Figure 8 Optionally, the circuit board 120 is provided with a solder pad 121, and the conductive part 133 is electrically connected to the circuit board 120 through the solder pad 121. The solder pad 121 is arranged on the circuit board 120 to facilitate the connection of the circuit board 120 and the conductive part 133. It can be understood that the plurality of via holes 131 and the plurality of solder pads 121 are arranged one by one, or the plurality of conductive parts 133 and the plurality of solder pads 121 can be arranged one by one, and the surface mount technology (SMT) mode can be used to realize the electrical connection between the conductive part 133 and the circuit board 120.

[0063] Optionally, the circuit board 120 is provided with a plurality of solder pads 121, the plurality of solder pads 121 are arranged in the projection plane of the first sensing area 141 on the circuit board 120, and the plurality of solder pads 121 are symmetrically distributed about the center of the projection plane. The solder pad 121 is arranged in a central symmetric distribution, and when the middle layer 130 is attached to the circuit board 120, the attachment direction of the middle layer 130 does not need to be considered, that is, the middle layer 130 can be directly attached at a certain position or attached after rotating 180 degrees from the position, and the same effect can be achieved. In this way, the convenience and flexibility of the attachment are improved, and the situation that the circuit fails due to the attachment direction is avoided. The design of the central symmetric distribution of the solder pad 121 can make the welding process more simple, the welding assembly fault tolerance higher, and the mass production control more convenient.

[0064] In this embodiment, the cross section of the middle layer 130 is rectangular, and the middle layer 130 is a cube or a cuboid. The first detection layer 140 covers the upper surface of the middle layer 130, that is, the cross section of the first detection layer 140 is rectangular. The thickness of the first detection layer 140 is very thin, which is much smaller than the thickness of the middle layer 130. A part of the first detection layer 140 close to the center is the first sensing area 141. The periphery of the first sensing area 141 is provided with a disturbance signal blocking ring (not shown in the figure). The disturbance signal blocking ring is connected to the circuit board 120 through the wiring of the middle layer 130. The disturbance signal blocking ring can reduce the interference of the liquid on the touch surface on the detection of the first sensing area 141, and the liquid can be water or other liquid with certain conductivity.

[0065] The position of the first sensing area 141 on the first detection layer 140 is not limited. Optionally, the projection of the first sensing area 141 on the circuit board 120 has a rectangular contour, the middle layer 130 has a via hole 131 at each of the four corners of the rectangle, and the via hole 131 is plated with a copper pillar as a conductive piece 133. The circuit board 120 has a solder pad 121 at each of the four corners of the rectangle, and the two solder pads 121 on the diagonal of the rectangle are the same. In this way, the middle layer 130 can be attached after rotating 180 degrees, i.e., the middle layer 130 can be attached in two directions of 0 degrees and 180 degrees, avoiding the failure of reverse attachment. The center-symmetrically distributed solder pads 121 make the welding process more convenient and facilitate mass production control.

[0066] It can be understood that the number of solder pads 121 is not limited to four, but can also be six or eight, etc., which is not limited here. Of course, as long as the plurality of solder pads 121 satisfies the center-symmetrically distributed first sensing area 141 on the projection of the circuit board 120, the reverse attachment of rotation is supported, and the specific number is not limited. In the embodiment, six solder pads 121 are used to attach the middle layer 130, which can realize reliable connection and support reverse attachment of rotation by 180 degrees.

[0067] Of course, the first detection layer 140, the middle layer 130, or the projection of the first sensing area 141 on the circuit board 120 can also have a circular, triangular, semicircular, diamond, square, oval, or other arbitrary shape, which is not limited here.

[0068] It can be understood that the circuit board 120 has a micro control unit 123 integrated therein, and the English abbreviation of the micro control unit 123 is MCU. The solder pad 121 and the MCU are electrically connected by a wire, as shown in Figure 4 . In this way, the MCU can receive the capacitance signal. Of course, in some other embodiments, the MCU can be independently arranged relative to the circuit board 120, and the MCU is electrically connected to the circuit board 120 by a lead or the like, which is not limited here.

[0069] Optionally, the middle layer 130 uses a reinforced epoxy resin laminated material. The reinforced epoxy resin laminated material can be a composite material made of epoxy resin, filler, and glass fiber. This composite material has good insulation, and is especially suitable for high-performance electronic insulation products.

[0070] In combination with Figures 9 to 13It should be noted that the shape of the intermediate layer 130 can be flexibly set according to actual conditions, such as a cylindrical shape, a prism shape, a cuboid shape, a circular truncated cone shape, or any other shape. The position of the intermediate layer 130 on the circuit board 120 can also be flexibly designed, such as being located at the middle, end, or edge of the circuit board 120, and the like, which is not specifically limited here. It can be understood that the position of the first touch area 112 is set according to user needs, the first sensing area 141 needs to correspond to the first touch area 112, and the position, size, and the like of the intermediate layer 130 need to be laid out according to the position, size, and product internal space of the first sensing area 141. The height of the intermediate layer 130 is set according to the internal space, so that the distance between the first detection layer 140 and the first cover plate 111 is as small as possible.

[0071] In combination Figure 14 Optionally, the side of the first cover plate 111 facing the intermediate layer 130 is provided with a first adhesive 150, and the projection of the first adhesive 150 on the first detection layer 140 covers at least the first sensing area 141. The first adhesive 150 can reduce the thickness of the air layer between the first sensing area 141 and the touch surface, further improving the amount of capacitive signals. In the present embodiment, the first adhesive 150 is double-sided adhesive. The provision of the first adhesive 150 can reduce the thickness of the air layer between the first cover plate 111 and the first detection layer 140, change the dielectric constant, and increase the relative dielectric constant of the cover layer of the first sensing area 141 between the first cover plate 111 and the first detection layer 140, so as to improve the amount of capacitive signals received by the MCU when touching. Here, the cover layer should be understood to include the air layer, the first adhesive, and the first cover plate, and the like.

[0072] Optionally, the thickness of the first adhesive 150 is less than or equal to the distance between the first detection layer 140 and the first cover plate 111, which can improve the tolerance of the assembly and reduce the assembly difficulty. The thicker the thickness of the first adhesive 150, the more conducive to improving the amount of capacitive signals. Preferably, the thickness of the first adhesive 150 is equal to the distance between the first detection layer 140 and the first cover plate 111, that is, the first adhesive 150 fills the gap between the first detection layer 140 and the first cover plate 111. In this way, there is no air layer between the first detection layer 140 and the first cover plate 111, the relative dielectric constant of the cover layer above the first sensing area 141 is larger, and thus the amount of capacitive signal reception is larger, and the touch control is more reliable. It can be easily understood that the first adhesive 150 can cover only the position corresponding to the first sensing area 141, can also cover the position outside the first sensing area 141, or can completely cover the surface of the first detection layer 140, which is not specifically limited here. The first adhesive 150 can be double-sided adhesive, foam adhesive, or other insulating adhesive layers. Of course, other insulating materials such as a glass layer, a ceramic layer, or the like can also be filled between the first cover plate 111 and the first detection layer 140 to increase the relative dielectric constant of the cover layer above the first sensing area 141, thereby making the amount of capacitive signal reception larger.

[0073] In combination Figure 15 Optionally, the first cover plate 111 is provided with a first touch area 112 on the side surface away from the second cover plate 115. The first touch area 112 is the area on the first cover plate 111 corresponding to the first sensing area 141. The user touches the first touch area 112 with a finger or the like, and the MCU can receive and identify the contact capacitance signal, thereby realizing touch control.

[0074] In some embodiments, the touch module 100 further comprises a panel 114 connected to the side of the first cover plate 111 away from the second cover plate 115, and the panel 114 is provided with the first touch area 112 on the side surface away from the first cover plate 111. It can be understood that when the first cover plate 111 is covered by the panel 114, the first touch area 112 is located on the panel 114, which is convenient for user operation. The panel 114 is provided to adapt to various touch scene applications and also to protect the first cover plate 111. It can be understood that the material and structural shape of the panel 114 can be designed flexibly according to the requirements of the vehicle door handle, front cover door, rear tail door and other mounting carriers.

[0075] In combination Figure 16 Optionally, a second adhesive 160 is arranged between the panel 114 and the first cover plate 111, and the projection of the second adhesive 160 on the first detection layer 140 covers at least the first sensing area 141. The second adhesive 160 and the first adhesive 150 have similar effects of reducing the thickness of the air layer and changing the relative dielectric constant of the covering layer, thereby improving the amount of capacitance signal. The second adhesive 160 can be double-sided adhesive, foam adhesive or other insulating adhesive, and can also be glass, ceramic or other insulating materials, which are not limited here.

[0076] In combination Figure 17 Optionally, the circuit board 120 is provided with a second detection layer 170 on the side facing the second cover plate 115, and the second detection layer 170 is provided with a second sensing area. The second cover plate 115 is provided with a second touch area 116 corresponding to the second sensing area on the side surface away from the first cover plate 111. In this way, the touch module 100 can realize double-sided touch sensing, and the touch function is more abundant, which can meet more scene requirements, such as detection of gripping. It is especially suitable for products or devices that have touch requirements on both sides.

[0077] Optionally, the second cover plate 115 is provided with a third adhesive (not shown in the figure) on the side facing the second detection layer 170, and the projection of the third adhesive on the second detection layer 170 covers at least the second sensing area. The third adhesive is similar to the first adhesive 150 and is mainly used to reduce the thickness of the air layer, increase the relative dielectric constant of the covering layer, and thereby improve the amount of capacitance signal.

[0078] Similarly, the side of the circuit board 120 facing the second cover plate 115 can be sequentially provided with another intermediate layer (not shown), the second detection layer 170, the third glue body, the second cover plate 115, the fourth glue body (not shown), and the back plate (not shown) according to requirements. The side intermediate layer plays a role of reducing the distance between the second touch area 116 and the second detection layer 170. The third glue body and the fourth glue body are used to change the dielectric constant and increase the amount of capacitive signals. The back plate is used to adapt to the installation requirements of various scenes. Among them, the intermediate layer 130, the third glue body, the fourth glue body, and the back plate near the side of the second cover plate 115 can be selectively omitted one or more or all.

[0079] It should be understood that the first touch area 112 and the second touch area 116 in the embodiment can be provided with a touch operation part, such as a touch key, to facilitate user operation. The touch key can be part of the first cover plate 111 or the second cover plate 115, that is, the user can perform touch operation on the surface of the first cover plate 111 and the second cover plate 115 provided as a touch area. Alternatively, an additional key can also be provided in the touch area, which is not specifically limited here.

[0080] Optionally, the touch module 100 further comprises a first support 180, one end of the first support 180 being connected with the first cover plate 111 and the other end being connected with the second cover plate 115; the circuit board 120 is connected on the first support 180, so as to form a space between the second cover plate 115 and the circuit board 120 for accommodating the second detection layer 170. It is easy to understand that when there is no touch requirement on the side of the circuit board 120 close to the second cover plate 115, the circuit board 120 can be directly fixed on the second cover plate 115. When there is a touch requirement on the side, the circuit board 120 is arranged in a spaced manner with the second cover plate 115, and at this time, the circuit board 120 can be fixed on the first support 180. Of course, the third glue body can be filled between the second detection layer 170 and the second cover plate 115 to increase the amount of capacitive signals. The structure form and number of the first support 180 are not limited, as long as the circuit board 120 can be fixed and installed. In addition, the first support 180 also plays a role of increasing the structural strength of the entire module.

[0081] Optionally, the shell 110 further comprises a second support 117, one end of the second support 117 being connected with the first cover plate 111 and the other end being connected with the second cover plate 115. The second support 117, the first cover plate 111, and the second cover plate 115 jointly form a cavity structure for accommodating components such as the circuit board 120, the intermediate layer 130, and the first detection layer 140. The second support 117 can be provided in a columnar or plate shape according to actual requirements, which is not specifically limited here.

[0082] In combination Figure 18It is understood that if the touch module 100 in this embodiment is located on a vehicle, it can be a hood switch 201, handle switch 202, charging port switch 204, tailgate switch 205, or decorative strip switch 203, etc.

[0083] The working principle of the touch module 100 provided in this embodiment is as follows:

[0084] by Figure 3 Taking the structure shown as an example, when a user's finger touches the first touch area 112 on the first cover plate 111, the conductivity of the human body and its large mass form a grounded conductive layer. This operation constitutes a parallel-plate capacitor, and the MCU on the circuit board 120 receives the capacitance signal. Because the circuit board 120 has an intermediate layer 130, the distance between the first detection layer 140 and the first touch area 112 is greatly shortened, effectively increasing the amount of capacitance signal received by the MCU, making the signal more stable, the touch more sensitive, and improving the reliability of the touch module 100.

[0085] In summary, the touch module 100 provided in this embodiment has the following beneficial effects:

[0086] In this touch module 100, by setting an intermediate layer 130, the distance between the first detection layer 140 and the first touch area 112 is shortened, resulting in a larger and more stable capacitive signal received by the MCU, and more sensitive and reliable touch control. The addition of a panel 114 facilitates adaptation to different application scenarios and meets installation requirements in various situations. The placement of the first colloid 150 and the second colloid 160 further reduces the thickness of the air layer, thereby increasing the relative permittivity of the cover layer above the first sensing area 141 and increasing the capacitive signal. The first detection layer 140 achieves electrical connection with the circuit board 120 by opening vias 131 and setting conductive elements 133 on the intermediate layer 130, ensuring reliable connection and supporting 180-degree rotation mounting, offering greater flexibility without complex processes, thus saving costs. Especially in small, irregularly shaped spaces with a certain depth or height, it avoids flexible circuit board connector structures and increases the signal to a recognizable range, greatly improving the area selection for the placement of the touch module 100.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A touch module, characterized in that, include: The housing (110) includes a first cover plate (111) and a second cover plate (115) connected together; A circuit board (120) is disposed between the first cover plate (111) and the second cover plate (115); An intermediate layer (130) is connected to the side of the circuit board (120) facing the first cover plate (111); A first detection layer (140) is disposed on the side of the intermediate layer (130) away from the circuit board (120), and the first detection layer (140) has a first sensing area (141) electrically connected to the circuit board (120). The first cover plate (111) is provided with a first touch area (112), which is disposed opposite to the first sensing area (141). 2.The touch module according to claim 1, characterized in that, The intermediate layer (130) is provided with a via (131), and at least one conductive element (133) is provided in the via (131). One end of the conductive element (133) is electrically connected to the first sensing area (141), and the other end is electrically connected to the circuit board (120). 3.The touch module according to claim 2, wherein, The circuit board (120) is provided with pads (121), and the conductive component (133) is electrically connected to the circuit board (120) through the pads (121).

4. The touch module according to claim 3, wherein, The circuit board (120) is provided with a plurality of pads (121), which are located within the projection surface of the first sensing area (141) on the circuit board (120), and the plurality of pads (121) are symmetrically distributed about the center of the projection surface.

5. The touch module according to claim 1, wherein, The intermediate layer (130) is made of reinforced epoxy resin laminate or the same material as the circuit board (120). 6.The touch module according to claim 1, characterized in that, The first cover plate (111) has a first colloid (150) on the side facing the intermediate layer (130), and the projection of the first colloid (150) on the first detection layer (140) at least covers the first sensing area (141).

7. The touch module according to claim 6, wherein, The thickness of the first colloid (150) is less than or equal to the distance between the first detection layer (140) and the first cover plate (111). 8.The touch module according to claim 1, characterized in that, The circuit board (120) has a second detection layer (170) on the side facing the second cover plate (115), and the second detection layer (170) has a second sensing area; the surface of the second cover plate (115) away from the first cover plate (111) has a second touch area (116) corresponding to the second sensing area.

9. The touch module according to claim 8, wherein, The second cover plate (115) has a third colloid on the side facing the second detection layer (170), and the projection of the third colloid on the second detection layer (170) at least covers the second sensing area. 10.The touch module according to claim 8, characterized in that, The touch module further includes a first pillar (180), one end of which is connected to the first cover plate (111) and the other end of which is connected to the second cover plate (115); the circuit board (120) is connected to the first pillar (180) so that a space for accommodating the second detection layer (170) is formed between the second cover plate (115) and the circuit board (120).

11. The touch module according to claim 1, wherein, The housing (110) also includes a second support column (117), one end of which is connected to the first cover plate (111) and the other end of which is connected to the second cover plate (115).

12. The touch module according to claim 1, characterized in that, The touch module is a front cover switch (201), handle switch (202), charging port switch (204), tailgate switch (205), or decorative strip switch (203).

13. The touch module according to any one of claims 1 to 12, characterized in that, It also includes a panel (114); the panel (114) is connected to the side of the first cover plate (111) away from the second cover plate (115), and the surface of the panel (114) away from the first cover plate (111) is provided with the first touch area (112).

14. The touch module according to claim 13, characterized in that, A second colloid (160) is provided between the panel (114) and the first cover plate (111), and the projection of the second colloid (160) on the first detection layer (140) at least covers the first sensing area (141).

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