Test board for touch drive circuit

Abstract

The embodiment of the utility model provides a test board for a touch drive circuit, and the test board comprises a development board which is connected with a mainboard of a mobile terminal and the touch drive circuit; the development board comprises a downlink interface communication module used for receiving and transmitting the touch signal and obtaining touch point data based on the touch signal, and an uplink interface communication module connected with the mobile terminal mainboard. The downlink data conversion module is used for converting the touch point data into touch point data which can be identified by a mobile terminal mainboard and / or a PC tool; and the uplink data conversion module is used for converting a command or data received from the mobile terminal mainboard and / or the PC tool into an operation time sequence communicated with the touch driving circuit. By means of the test board, the touch signal and the display signal can be separated, and the effect of collecting interference data from the display screen is achieved under the condition that a TPIC driver in the mobile terminal is not updated.

Description

Technical Field

[0001] This specification relates to the field of mobile terminal touch detection technology, and in particular to a test board for touch driving circuits. Background Technology

[0002] Figure 1 This is a schematic diagram illustrating the structure of the display and touch framework of a mobile terminal (including mobile phones, tablets, etc.) in the prior art, such as... Figure 1 As shown, the mobile terminal motherboard 101 provides display signals and sends them to the display screen 102. The Touch Panel Driver Integrated Circuit (TPIC) 103 collects touch signals from the touch screen 104 and then communicates with the mobile terminal motherboard 101 to provide touch point information. During TPIC debugging or testing, it is necessary to collect interference data from the display screen and develop noise reduction algorithms. However, specific TPIC models correspond to specific TPIC drivers in the mobile terminal motherboard. If the driver is missing, the TPIC cannot communicate and be tested normally with the mobile terminal. Utility Model Content

[0003] The purpose of this specification is to provide a test board for touch driving circuits to separate touch signals from display signals, thereby achieving the effect of collecting interference data from the display screen without updating the TPIC driver in the mobile terminal.

[0004] To address the aforementioned technical problems, this specification provides a test board for a touch driving circuit, comprising: a development board, which is connected to a mobile terminal motherboard and a touch driving circuit respectively; the development board acquires touch signals from the touch screen through the touch driving circuit and reports the touch signals to the mobile terminal motherboard to complete touch reporting; the development board includes:

[0005] A downlink interface communication module for transmitting and receiving the touch signals and obtaining touch point data based on the touch signals, wherein the downlink interface communication module is connected to the touch driving circuit;

[0006] The uplink interface communication module is connected to the motherboard of the mobile terminal;

[0007] A downlink data conversion module is used to convert the touch point data into touch point data that can be recognized by the mobile terminal motherboard and / or PC tools. The downlink data conversion module is connected to the downlink interface communication module.

[0008] An uplink data conversion module is used to convert commands or data received from the mobile terminal motherboard and / or PC tools into operation timing for communication with the touch driver circuit. The uplink data conversion module is connected to the downlink interface communication module and the uplink interface communication module, respectively.

[0009] In some embodiments of this specification, the test board for the touch driving circuit further includes: an adapter board for separating the touch signal and the display signal of the display screen, disposed between the development board and the touch driving circuit, and disposed between the mobile terminal motherboard and the display screen.

[0010] In some embodiments of this specification, the development board is connected to the mobile terminal motherboard via a first USB bus.

[0011] In some embodiments of this specification, the development board is connected to the PC tool via a second USB bus.

[0012] In some embodiments of this specification, the development board is connected to a second USB bus via the uplink interface communication module.

[0013] In some embodiments of this specification, when the touchscreen is touched, an interrupt signal in the touch signal is sent to the development board through the downlink interface communication module.

[0014] In some embodiments of this specification, when the mobile terminal motherboard triggers an instruction to reset the touch driver circuit, the development board transmits the instruction to the touch driver circuit through the downlink interface communication module for reset.

[0015] In some embodiments of this specification, when the development board receives data from the mobile terminal motherboard to set the register value, it reads and writes the register data through the downlink interface communication module in accordance with the communication timing required by the touch driver circuit.

[0016] In some embodiments of this specification, the development board is connected to the touch driving circuit via a touch signal transmission line.

[0017] In some embodiments of this specification, when the mobile terminal motherboard triggers a command to reset the touch driver circuit, the development board transmits the command to the touch driver circuit through the downlink interface communication module for reset.

[0018] In some embodiments of this specification, when the development board receives data from the mobile terminal motherboard to set register values, the development board reads and writes register data through the downlink interface communication module.

[0019] In some embodiments of this specification, when a finger touches the touch screen, the downlink interface communication module sends an interrupt signal from the touch signal to the uplink data conversion module. The uplink data conversion module communicates with the touch driving circuit through the downlink interface communication module to obtain touch point data.

[0020] The test board for touch driving circuits provided in this specification is configured as follows: The development board is connected to both the mobile terminal motherboard and the touch driving circuit. The development board acquires touch signals from the touchscreen via the touch driving circuit and reports these signals to the mobile terminal motherboard to complete touch reporting. With this development board configuration, the display signals generated by the mobile terminal motherboard are directly transmitted to the display screen for display, while the touch signals generated by the touchscreen are transmitted to the development board after passing through the touch driving circuit. This achieves the separation of touch signals and display signals, enabling the collection of interference data from the display screen without updating the TPIC driver in the mobile terminal. Alternatively, an adapter board can be used to separate the touch signals and display signals. The display signals are transmitted to the display screen after passing through the adapter board to complete the display function, while the touch signals generated by the touchscreen are separated and sent to the development board. This also achieves the collection of interference data from the display screen without updating the TPIC driver in the mobile terminal. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the display and touch framework of a mobile terminal (including mobile phones, tablets, etc.) in the prior art;

[0023] Figure 2 This is a schematic diagram of the connection structure between the development board and the mobile terminal touch detection device in the embodiments of this specification;

[0024] Figure 3 This is a schematic diagram of the structure of the test board used for the touch driving circuit in the embodiments of this specification;

[0025] Figure 4 This is a schematic diagram illustrating the connection structure between the development board and adapter board and the touch detection device of the mobile terminal in the embodiments of this specification.

[0026] Figure 5This is a schematic diagram of the structure of a test board used for touch driving circuits in an embodiment of this specification.

[0027] Explanation of reference numerals in the attached diagram: 101, Mobile terminal motherboard; 102, Display screen; 103, Touch driver circuit; 104, Touch screen; 201, Development board; 202, USB bus; 203, USB bus; 204, PC tool; 300, Test board; 301, Downlink interface communication module; 302, Uplink interface communication module; 303, Downlink data conversion module; 304, Uplink data conversion module; 401, Adapter board. Detailed Implementation

[0028] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0029] As mentioned above, in Figure 1 In the context of the display and touch framework structure diagram of a mobile terminal, when debugging or testing TPIC, it is necessary to collect interference data from the display screen and develop noise reduction algorithms. However, specific models of TPIC correspond to specific TPIC drivers in the mobile terminal motherboard. If the TPIC driver is missing, the TPIC cannot communicate and be tested normally with the mobile terminal.

[0030] To address the aforementioned problems, this specification provides an embodiment of a test board for touch driving circuits, which is described below in conjunction with... Figure 2 and Figure 3 The test board for touch driving circuitry in the embodiments of this specification is described.

[0031] like Figure 2 and Figure 3 As shown in the figure, this specification provides a test board 300 for a touch driving circuit. The test board 300 may include a development board 201, which is connected to a mobile terminal touch detection device. The mobile terminal touch detection device may include a mobile terminal motherboard 101, a display screen 102, a touch driving circuit 103, and a touch screen 104. Specifically, the development board 201 is connected to the mobile terminal motherboard 101 and the touch driving circuit 103, respectively. The mobile terminal motherboard 101 is connected to the display screen 102 and transmits the generated display signals to the display screen 102 for display. The development board 201 is connected to the mobile terminal motherboard 101 and is connected to the touch screen 104 through the touch driving circuit 103. The touch driving circuit 103 acquires the touch signals from the touch screen and reports the touch signals to the mobile terminal motherboard 101 to complete the touch reporting.

[0032] like Figure 3 As shown, the development board 201 includes: a downlink interface communication module 301, an uplink interface communication module 302, a downlink data conversion module 303, and an uplink data conversion module 304.

[0033] The downlink interface communication module 301 can be used to send and receive touch signals and obtain touch point data based on the touch signals. The downlink interface communication module 301 is connected to the touch driving circuit.

[0034] In specific implementation, the downlink interface communication module 301 is connected to the touch drive circuit 103 and is used to send and receive touch signals from the touch drive circuit 103.

[0035] In some embodiments of this specification, when the touch screen 104 is touched, an interrupt signal in the touch signal is sent to the development board 201 through the downlink interface communication module 301.

[0036] In some embodiments of this specification, when the mobile terminal motherboard 101 triggers a command to reset the touch driver circuit 103, the development board 201 transmits the command to the touch driver circuit 103 for reset via the downlink interface communication module 301.

[0037] In some embodiments of this specification, when the development board 201 receives data from the mobile terminal motherboard 101 to set the register value, the development board 201 reads and writes the register data through the downlink interface communication module 301 in accordance with the communication timing required by the touch driver circuit 103.

[0038] The uplink interface communication module 302 is connected to the mobile terminal motherboard 101. In a specific implementation, the uplink interface communication module 302 is connected to both the mobile terminal motherboard 101 and the PC tool 204. The uplink interface communication module 302 can receive commands or data sent by the mobile terminal motherboard 101, or send data to the mobile terminal motherboard 101, via the USB bus 202. The uplink interface communication module 302 can also receive commands (including commands for debugging the touch driver circuit 103) or data sent by the PC tool 204, or send data to the PC tool 204, via the USB bus 203.

[0039] The downlink data conversion module 303 can be used to convert touch point data into touch point data that can be recognized by the mobile terminal motherboard and / or PC tools. The downlink data conversion module 303 is connected to the downlink interface communication module.

[0040] In specific implementation, the downlink data conversion module 303 is connected to the downlink interface communication module 301 and the uplink interface communication module 302, and is used to convert the commands or data received from the host (mobile terminal motherboard 101 and PC tool 204) into operation timing for communication with the touch drive circuit 103.

[0041] Examples are given below:

[0042] Example 1: PC tool 204 sends a command to development board 201 to reset touch driver circuit 103. Downlink data conversion module 303 will use downlink interface communication module 301 to operate the RESET signal to pull it low for a specific time and then pull it high again. This RESET signal will cause touch driver circuit 103 to reset.

[0043] Example 2: The mobile terminal motherboard 101 sends data to set the register value. The downlink data conversion module 303 will use the downlink interface communication module 301, following the communication timing required by the touch driver circuit 103, and use communication buses such as SPI or I2C to read and write the register data.

[0044] The uplink data conversion module 304 can be used to convert commands or data received from the mobile terminal motherboard and / or PC tools into operation timing for communication with the touch drive circuit 103. The uplink data conversion module 304 is connected to the downlink interface communication module and the uplink interface communication module respectively.

[0045] In practice, when a finger touches the touchscreen 104, an interrupt signal in the touch signal is sent to the uplink data conversion module 304 via the downlink interface communication module 301. The uplink data conversion module 304 then detects that a finger has touched the touchscreen 104 and communicates with the touch driver circuit 103 via the downlink interface communication module 301 to obtain a set of touch point data. This set of touch point data is packaged using a proprietary protocol, which is bound to the touch driver circuit 103. After receiving the data, the uplink data conversion module 304 unpacks it according to the protocol to obtain the touch information, then repackages the information according to the format required by the HID protocol and sends it to the host via the uplink interface communication module 302.

[0046] It should be noted that the downlink data conversion module 303 and the uplink data conversion module 304 can be conventional data conversion modules or format conversion modules. The conversion includes, but is not limited to, analog-to-digital conversion, format conversion, logarithmic conversion, square root conversion, etc. This manual does not limit them to these.

[0047] pass Figure 2The development board setup shown allows the display signal generated by the mobile terminal motherboard to be directly transmitted to the display screen for display, while the touch signal generated by the touch screen is transmitted to the development board after passing through the touch driver circuit. This achieves the separation of touch signal and display signal, enabling the collection of interference data from the display screen without updating the TPIC driver in the mobile terminal.

[0048] In some embodiments of this specification, the display signals connected between the mobile terminal motherboard 101 and the display screen 102 may include the following signals: MIPI clock signal, 4 pairs of differential data signals (e.g., named D0 / D1 / D2 / D3) and reset signal RESET (MIPI_DSI_RST), etc.

[0049] In some embodiments of this specification, the touch signals connected between the development board 201 or the mobile terminal motherboard 101 and the touch driver circuit 103 may include the following signals: communication bus I2C (SCL / SDA), SPI (CS / SCLK / MISO / MOSI), reset signal RESET (TP_RST), and interrupt signal IRQ (TP_INT), etc.

[0050] It is understandable that the development board 201 uses a proprietary protocol to communicate with the touch driver circuit 103 to obtain reporting data or interference data (i.e. touch signals), and then uses the corresponding protocol to report the touch signals to the mobile terminal motherboard 101 to complete the touch reporting.

[0051] In practice, development board 201 can use the HID protocol to report touch signals to mobile terminal motherboard 101. HID (Human Interface Device) is a widely used standard protocol primarily used to connect computers and peripheral devices such as keyboards, mice, game controllers, and touchscreens. Development board 201 defines report descriptors according to the HID protocol. When a touch signal is detected, development board 201 packages the touch signal according to the format defined in the report descriptor and then reports it to mobile terminal motherboard 101.

[0052] In some embodiments of this specification, the development board 201 is connected to the mobile terminal motherboard 101 via the USB bus 202, and the touch signal is reported to the mobile terminal motherboard 101 via the USB bus 202 using the HID protocol.

[0053] In some embodiments of this specification, the development board 201 is connected to a PC tool 204 via a USB bus 203, and the touch drive circuit 103 can be debugged using the PC tool 204.

[0054] In some embodiments of this specification, the development board 201 is connected to the touch control drive circuit 103 via a touch signal transmission line.

[0055] In some embodiments of this specification, the touch signal transmission line is a flying wire, but this application is not limited thereto.

[0056] In some embodiments of this specification, such as Figure 4 and Figure 5 As shown, the test board for the touch driving circuit also includes an adapter board 401 for separating the touch signal and the display signal of the display screen. The adapter board 401 is disposed between the development board 201 and the touch driving circuit 103, and between the mobile terminal motherboard 101 and the display screen 102.

[0057] It is understandable that after setting up the adapter board 401, the development board 201 wirelessly connects to the touch control drive circuit 103 via the touch signal transmission line (e.g., a flying wire).

[0058] like Figure 4 As shown, the display signal generated by the mobile terminal motherboard 101 is separated by the adapter board 401 and then transmitted to the display screen 102 for display. The touch screen 104 generates a touch signal after being touched, and this touch signal is separated by the adapter board 401 and then sent to the development board 201.

[0059] In some embodiments of this specification, the adapter board 401 is provided with a ribbon cable for distinguishing between touch signals and display signals.

[0060] The test board for touch driving circuits provided in this specification is configured as follows: The development board is connected to both the mobile terminal motherboard and the touch driving circuit. The development board acquires touch signals from the touchscreen via the touch driving circuit and reports these signals to the mobile terminal motherboard to complete touch reporting. With this development board configuration, the display signals generated by the mobile terminal motherboard are directly transmitted to the display screen for display, while the touch signals generated by the touchscreen are transmitted to the development board after passing through the touch driving circuit. This achieves the separation of touch signals and display signals, enabling the collection of interference data from the display screen without updating the TPIC driver in the mobile terminal. Alternatively, an adapter board can be used to separate the touch signals and display signals. The display signals are transmitted to the display screen after passing through the adapter board to complete the display function, while the touch signals generated by the touchscreen are separated and sent to the development board. This also achieves the collection of interference data from the display screen without updating the TPIC driver in the mobile terminal.

[0061] In addition, it should be noted that the test board used for touch driving circuits can be applied to the field of mobile terminal touch detection technology, or to other technical fields other than mobile terminal touch detection, without any restrictions.

[0062] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, system embodiments are basically similar to method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments. In the description of this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments in this specification. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0063] Although the process described above includes multiple operations that occur in a specific order, it should be clearly understood that these processes may include more or fewer operations, which may be executed sequentially or in parallel (e.g., using parallel processors or a multithreaded environment).

[0064] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or the value of a process variable (e.g., temperature, pressure, time, etc.) is described as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, it is intended to indicate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc., are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, etc.

[0065] 0.1. These are merely examples intended to be clear, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are clearly described in the specification in a similar manner.

[0066] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0067] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified elements, components, parts, or steps, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute included by “may” is optional.

[0068] Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The use of "a" or "an" to describe an element, component, part, or step does not imply the exclusion of other elements, components, parts, or steps.

[0069] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference.

Claims

1. A test board for touch driving circuits, characterized in that, include: The development board is connected to the mobile terminal motherboard and the touch driver circuit respectively; The development board acquires touch signals from the touchscreen through the touch driver circuit and reports the touch signals to the mobile terminal motherboard to complete touch reporting; the development board includes: A downlink interface communication module for transmitting and receiving the touch signals and obtaining touch point data based on the touch signals, wherein the downlink interface communication module is connected to the touch driving circuit; The uplink interface communication module is connected to the motherboard of the mobile terminal; A downlink data conversion module is used to convert the touch point data into touch point data that can be recognized by the mobile terminal motherboard and / or PC tools. The downlink data conversion module is connected to the downlink interface communication module. An uplink data conversion module is used to convert commands or data received from the mobile terminal motherboard and / or PC tools into operation timing for communication with the touch driver circuit. The uplink data conversion module is connected to the downlink interface communication module and the uplink interface communication module, respectively.

2. The test board according to claim 1, characterized in that, Also includes: An adapter board for separating the touch signal and the display signal of the display screen connected to the mobile terminal motherboard is disposed between the development board and the touch driving circuit, and between the mobile terminal motherboard and the display screen.

3. The test board according to claim 1, characterized in that, The development board is connected to the mobile terminal motherboard via a first USB bus.

4. The test board according to claim 1, characterized in that, The development board is connected to the PC via a second USB bus.

5. The test board according to claim 4, characterized in that, The development board is connected to the second USB bus via the uplink interface communication module.

6. The test board according to claim 1, characterized in that, When the touchscreen is touched, the interrupt signal in the touch signal is sent to the development board through the downlink interface communication module.

7. The test board according to claim 6, characterized in that, When the mobile terminal motherboard triggers a command to reset the touch driver circuit, the development board transmits the command to the touch driver circuit through the downlink interface communication module for reset.

8. The test board according to claim 7, characterized in that, When the development board receives data from the mobile terminal motherboard to set the register value, it reads and writes the register data through the downlink interface communication module in accordance with the communication timing required by the touch driver circuit.

9. The test board according to claim 1, characterized in that, The development board is connected to the touch driving circuit via a touch signal transmission line.

10. The test board according to claim 1, characterized in that, When the mobile terminal motherboard triggers a command to reset the touch driver circuit, the development board transmits the command to the touch driver circuit through the downlink interface communication module to perform the reset.

11. The test board according to claim 1, characterized in that, When the development board receives data from the mobile terminal motherboard to set the register value, the development board reads and writes the register data through the downlink interface communication module.

12. The test board according to claim 1, characterized in that, When a finger touches the touch screen, the downlink interface communication module sends an interrupt signal from the touch signal to the uplink data conversion module. The uplink data conversion module communicates with the touch driving circuit through the downlink interface communication module to obtain touch point data.

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