Circuit board and electronic product
By designing the microphone mounting area on the circuit board to be larger than its projected area, and setting blind holes and sound outlet holes on the pads, combined with the design of the foam area, the problem of sound leakage after the microphone device is soldered to the circuit board is solved, and the sound effect is improved.
Patent Information
- Application Number
- CN202423297317.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2034-12-30
AI Technical Summary
The existing microphone components, after being soldered to the circuit board, suffer from severe sound leakage due to gaps, affecting the sound quality.
Design a circuit board structure in which the area of the microphone device mounting area is larger than its projected area on the front side, and provide sound holes and multiple blind holes on the pads to improve flatness. The electrical connection between the pads and the microphone device, combined with the design of the foam area to reduce gaps, forms a sealed structure.
It effectively reduces the gap between the microphone components and the solder pads, improves sound leakage, and enhances sound quality.
Smart Images
Figure CN223829513U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of circuit board, in particular to a circuit board and electronic product. BACKGROUND
[0002] The microphone (MIC) plays an extremely important role in electronic products, and its application scenarios are very wide, including but not limited to call function, voice recognition and audio recording, etc. After the existing microphone device and the circuit board are welded, there is a large gap between them, which causes serious sound leakage and affects the sound effect. CONTENT OF THE UTILITY MODEL
[0003] The present application provides a circuit board and electronic product, which has better sound leakage prevention effect to improve the sound effect.
[0004] The present application provides a circuit board, comprising: a body part and a first solder pad, the body part comprises opposite front and back surfaces, the front surface is provided with a microphone device mounting area for mounting a microphone device, the area of the microphone device mounting area is greater than the area of the projection of the microphone device on the front surface; the first solder pad is arranged in the microphone device mounting area for welding and fixing with the microphone device, the first solder pad is provided with a sound outlet hole and a plurality of first blind holes, the sound outlet hole penetrates through the back surface of the body part, and the first blind hole is provided with a first conductive part electrically connected with the microphone device.
[0005] Further, a plurality of first blind holes are arranged at the corners of the first solder pad, respectively.
[0006] Further, a plurality of first blind holes are arranged at the corners of the first solder pad, respectively.
[0007] Further, three first blind holes are arranged at the corners of the first solder pad, respectively.
[0008] Further, the centers of the three first blind holes at the four corners of the first solder pad are connected by straight lines, and four first blind holes with straight center lines are arranged on each side of the first solder pad.
[0009] Further, the front surface is provided with a second solder pad, the second solder pad is welded with the microphone device, the second solder pad is provided with a plurality of second blind holes, the second blind hole is provided with a second conductive part electrically connected with the microphone device, and the centers of the plurality of second blind holes are connected by a square; and / or,
[0010] The front surface is provided with a third pad, the third pad is welded with the microphone device, a plurality of third blind holes are arranged on the third pad, a third conductive part electrically connected with the microphone device is arranged in the third blind hole, and the center lines of the plurality of third blind holes are in a square shape.
[0011] Further, the area of the microphone device mounting area beyond the microphone device is a clearance area or is provided with a continuous metal layer.
[0012] Further, the back surface of the body part is provided with a foam area, the foam area is provided with foam, the foam is provided with an opening communicating with the sound hole, and the center axis of the sound hole is collinear with the center axis of the opening.
[0013] Further, the foam area is a clearance area or is provided with a continuous metal layer.
[0014] The electronic product provided by the embodiment of the present application comprises a microphone device and the circuit board, and the microphone device is welded with the first pad.
[0015] The circuit board of the embodiment of the present application ensures the flatness of the microphone device after being welded on the circuit board by the area of the microphone device mounting area being greater than the area of the projection of the microphone device on the front surface, and minimizes the gap between the microphone device and the first pad to improve the sound leakage and further improve the sound effect. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a schematic diagram of the cross section of the electronic product, wherein only a part of the electronic product is shown;
[0017] Figure 2 is Figure 1 is a schematic diagram of the front surface of the circuit board, wherein the dashed box represents the projection area of the microphone device on the circuit board;
[0018] Figure 3 is Figure 1 is a schematic diagram of the back surface of the circuit board, wherein only a part of the circuit board is shown. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments (or, “embodiments”) of the present application will be described clearly and completely in conjunction with the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated.
[0020] If the application embodiments involve terms of direction indication or position relationship (for example, up, down, left, right, front, back, inner, outer, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative position relationship, motion condition, etc. between components in a certain specific posture (as shown in the drawings); if the specific posture changes, the direction indication or position relationship will also change accordingly. In addition, the terms "first", "second", etc. in the application embodiments are only used for convenience of description, and cannot be understood as indicating or implying relative importance.
[0021] Referring to Figures 1 to 3 The application embodiment provides a circuit board 100, comprising a body part 1 and a first pad 2.
[0022] The body part 1 comprises opposite front face 11 and back face 12. The front face 11 is provided with a microphone device mounting area 111 for mounting a microphone device 3. The area of the microphone device mounting area 111 is greater than the area of the projection 30 of the microphone device 3 on the front face 11. The first pad 2 is arranged in the microphone device mounting area 111 for welding and fixing with the microphone device 3.
[0023] The area of the microphone device mounting area 111 is greater than the area of the projection of the microphone device 3 on the front face 11, which ensures the flatness of the microphone device 3 after being welded on the circuit board 100, minimizes the gap between the microphone device 3 and the first pad 2, improves the sound leakage, and further improves the sound effect.
[0024] In some embodiments, the area of the microphone device mounting area 111 beyond the microphone device 3 is a clearance area or is provided with a continuous metal layer, which ensures the flatness in this area to avoid affecting the flatness of the microphone device 3 after being welded on the circuit board 100.
[0025] In some embodiments, the metal layer is copper skin, and the application does not limit the material of the metal layer.
[0026] In some embodiments, the first distance L1 of the edge of the microphone device mounting area 111 beyond the microphone device 3 is 0.1 mm, and the application does not limit the first distance L1, which can be adjusted according to actual conditions.
[0027] In some embodiments, the projection of the microphone device 3 in the microphone device mounting area 111 is a rectangle with a size of 2.85 mm*1.95 mm, and the application does not limit the shape and size of the projection, which can be adjusted according to actual conditions.
[0028] In some embodiments, the microphone sound hole 31 on the microphone device 3 is a circular hole with a diameter of 0.55mm or 0.36mm. The shape and size of the microphone sound hole 31 are not limited in the present application and can be adjusted as needed.
[0029] The first pad 2 is provided with a sound hole 21 and a plurality of first blind holes 22. The sound hole 21 penetrates the back surface 12 of the body part 1. The sound hole 21 is located below the microphone sound hole 31 and communicates with the microphone sound hole 31. The first blind hole 22 is provided with a first conductive part (not shown) electrically connected with the microphone device 3. The first conductive part is electrically connected with the circuit on the circuit board 100.
[0030] In some embodiments, the first pad 2 is a square with a width of 1.45mm. The shape and size of the first pad 2 are not limited in the present application and can be adjusted as needed.
[0031] In some embodiments, the sound hole 21 is a circular hole with a diameter of 0.95mm. The shape and size of the sound hole 21 are not limited in the present application and can be adjusted as needed.
[0032] In some embodiments, a plurality of first blind holes 22 are respectively arranged at the corners of the first pad 2. After the microphone device 3 is welded, unevenness is easily generated at the first blind hole 22, which affects the flatness of the microphone device 3. The circuit board 100 is arranged at the corners of the first pad 2 through a plurality of first blind holes 22, which can improve the flatness of the microphone device 3, reduce the gap between the microphone device 3 and the first pad 2, improve the sound leakage, and thus improve the sound effect.
[0033] In some embodiments, a plurality of first blind holes 22 are respectively arranged at the corners of the first pad 2, which can further improve the flatness of the microphone device 3.
[0034] In some embodiments, three first blind holes 22 are respectively arranged at the corners of the first pad 2, which can further improve the flatness of the microphone device 3.
[0035] In some embodiments, the center lines of the three first blind holes 22 at the four corners of the first pad 2 are right-angled triangles, and each side of the first pad 2 is provided with four first blind holes 22 with center lines as straight lines. The number of corners and the number of first blind holes 22 at each corner are not limited in the present application.
[0036] In some embodiments, a second distance L2 between the center of the outermost first blind hole 22 and the edge of the first pad 2 is 1.65 mm, and the application does not limit the second distance L2, which can be adjusted according to actual conditions.
[0037] In some embodiments, a third distance L3 between the centers of two adjacent first blind holes 22 is 0.2 mm, and the application does not limit the third distance L3, which can be adjusted according to actual conditions.
[0038] In some embodiments, the front surface 11 is provided with a second pad 4 welded with the microphone device 3. A plurality of second blind holes 41 are arranged on the second pad 4. A second conductive part (not shown) electrically connected with the microphone device 3 is arranged in the second blind hole 41. The second conductive part is electrically connected with the circuit in the circuit board 100.
[0039] In some embodiments, the second pad 4 is a rectangle with a width of 0.65 mm*0.55 mm, and the application does not limit the shape and size of the second pad 4, which can be adjusted according to actual conditions.
[0040] In some embodiments, the number of second blind holes 41 is four, and the application does not limit the number of second blind holes 41.
[0041] In some embodiments, a fourth distance L4 between the centers of two adjacent second blind holes 41 is 0.2 mm, and the application does not limit the fourth distance L4, which can be adjusted according to actual conditions.
[0042] In some embodiments, a fifth distance L5 between the center of the leftmost second blind hole 41 and the left edge of the second pad 4 is 0.225 mm, and the application does not limit the fifth distance L5, which can be adjusted according to actual conditions.
[0043] In some embodiments, a sixth distance L6 between the center of the uppermost second blind hole 41 and the upper edge of the second pad 4 is 0.175 mm, and the application does not limit the sixth distance L6, which can be adjusted according to actual conditions.
[0044] In some embodiments, the line connecting the centers of the plurality of second blind holes 41 is a square, which can better improve the flatness of the microphone device 3 after being welded to the circuit board 100, reduce the gap between the microphone device 3 and the second pad 4, and improve the sound leakage, thereby improving the sound effect.
[0045] In some embodiments, the front face 11 is provided with a third pad 5 which is soldered with the microphone device 3. A plurality of third blind holes 51 are arranged on the third pad 5. A third conductive part (not shown) which is electrically connected with the microphone device 3 is arranged in the third blind hole 51. The third conductive part is electrically connected with the circuit on the circuit board 100.
[0046] In some embodiments, the third pad 5 is rectangular with a width of 0.65mm*0.55mm. The shape and size of the third pad 5 are not limited in the present application and can be adjusted as required.
[0047] In some embodiments, the line connecting the centers of the plurality of third blind holes 51 is square, which can better improve the flatness of the microphone device 3 after being soldered to the circuit board 100, reduce the gap between the microphone device 3 and the third pad 5, and improve the sound leakage, thereby improving the sound effect.
[0048] In some embodiments, the number of the third blind holes 51 is four. The number of the third blind holes 51 is not limited in the present application.
[0049] In some embodiments, the seventh distance L7 between the centers of two adjacent third blind holes 51 is 0.2mm. The seventh distance L7 is not limited in the present application and can be adjusted as required.
[0050] In some embodiments, the eighth distance L8 between the center of the rightmost third blind hole 51 and the right edge of the third pad 5 is 0.225mm. The eighth distance L8 is not limited in the present application and can be adjusted as required.
[0051] In some embodiments, the ninth distance L9 between the center of the uppermost third blind hole 51 and the upper edge of the third pad 5 is 0.175mm. The ninth distance L9 is not limited in the present application and can be adjusted as required.
[0052] In some embodiments, the back face 12 of the body part 1 is provided with a foam area 121. A foam 6 is arranged in the foam area 121 to prevent sound leakage due to the gap of the back face 12 of the body part 1.
[0053] An opening 61 which communicates with the sound outlet hole 21 is arranged at the middle position of the foam 6. The central axis of the sound outlet hole 21 is collinear with the central axis of the opening 61. The opening 61 can also be arranged eccentrically with the sound outlet hole 21.
[0054] In some embodiments, the area of the foam region 121 is larger than the area of the foam 6, so as to improve the adhesion between the foam 6 and the circuit board 100, and to improve the sealing performance, so as to prevent sound leakage.
[0055] In some embodiments, the foam region 121 is a clearance region or is provided with a continuous metal layer, so as to prevent the unevenness in the foam region 121 from affecting the adhesion of the foam 6, and to improve sound leakage.
[0056] In some embodiments, the foam 6 is fixedly attached to the back surface 12.
[0057] In some embodiments, the metal layer is copper, and the present application does not limit the material of the metal layer.
[0058] The present embodiments provide an electronic product comprising the microphone device 3 and the circuit board 100. The microphone device 3 is soldered to the first pad 2, the second pad 4 and the third pad 5.
[0059] The electronic product comprises a housing 7, and the circuit board 100 is fixed on the housing 7. The housing 7 is provided with an acoustic outlet channel 71 which is in communication with the outside. The sound outlet hole 21, the opening 61 and the acoustic outlet channel 71 are sequentially in communication. The foam 6 fills the gap between the back surface 12 of the body portion 1 and the housing 7, so as to form a seal and prevent sound leakage.
[0060] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of the present application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A circuit board, characterized in that, include: The main body includes a front side and a back side, wherein the front side has a microphone mounting area for mounting a microphone device, and the area of the microphone mounting area is larger than the area of the microphone device projected onto the front side; and A first pad is disposed in the microphone device mounting area for soldering and fixing to the microphone device. The first pad is provided with a sound outlet hole and a plurality of first blind holes. The sound outlet hole penetrates through the back of the main body. A first conductive part electrically connected to the microphone device is disposed in the first blind hole.
2. The circuit board according to claim 1, characterized in that, Multiple first blind vias are respectively disposed at the corners of the first pad.
3. The circuit board according to claim 2, characterized in that, Multiple first blind vias are provided at multiple corners of the first pad.
4. The circuit board according to claim 3, characterized in that, Three first blind vias are respectively provided at multiple corners of the first pad.
5. The circuit board according to claim 4, characterized in that, The lines connecting the centers of the three first blind holes at the four corners of the first pad are all right triangles, and each side of the first pad has four first blind holes with a straight line connecting their centers.
6. The circuit board according to claim 1, characterized in that, The front side is provided with a second pad, which is soldered to the microphone device. The second pad has multiple second blind vias, each containing a second conductive portion electrically connected to the microphone device. The lines connecting the centers of the multiple second blind vias form a square; and / or, The front side is provided with a third pad, which is soldered to the microphone device. The third pad is provided with a plurality of third blind holes, and a third conductive part electrically connected to the microphone device is provided in the third blind hole. The line connecting the centers of the plurality of third blind holes is square.
7. The circuit board according to claim 1, characterized in that, The area beyond the microphone device in the microphone device mounting area is either a clearance area or has a continuous metal layer.
8. The circuit board according to any one of claims 1 to 7, characterized in that, The back of the main body is provided with a foam area, in which foam is provided. The foam has an opening that communicates with the sound outlet, and the central axis of the sound outlet is collinear with the central axis of the opening.
9. The circuit board according to claim 8, characterized in that, The foam area is a clear area or has a continuous metal layer.
10. An electronic product, characterized in that, It includes a microphone device and a circuit board as described in any one of claims 1 to 9, wherein the microphone device is soldered to the first pad.