Flexible printed circuit (FPC) device and printed circuit board (PCB) welding jig

Abstract

The utility model relates to a flexible FPC (Flexible Printed Circuit) device and PCB (Printed Circuit Board) welding jig. According to the technical scheme, the jig is characterized by comprising a printing base, a patch carrier and a backflow pressing assembly, a placing groove is formed in the printing base; the patch carrier is detachably arranged in the placement groove; an accommodating groove which is correspondingly matched with the PCB is formed in the surface mounting carrier; a plurality of pressing block positioning holes are formed in the patch carrier; a plurality of pressing block positioning columns in one-to-one correspondence with the pressing block positioning holes are arranged on the backflow pressing assembly; the backflow pressing assembly is detachably connected with the patch carrier; under the condition that the pressing block positioning columns of the backflow pressing assembly are inserted into the corresponding pressing block positioning holes, the backflow pressing assembly presses the flexible FPC device on the PCB of the patch carrier; the PCB golden finger position can be conveniently protected, the production efficiency is improved, and large-scale production of products can be conveniently realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB production fixture technical field, more specifically, it relates to a kind of flexible FPC device and PCB welding fixture. BACKGROUND

[0002] With the promotion of the national "Broadband China, optical network city" project, optical network information capacity surges, high-speed broadband optical module becomes a big research hotspot in current optical communication field. With the development of 5G technology, the demand for optical module is increasing, but the cost requirement for optical module is also increasing.

[0003] In the production and manufacturing of optical module, the problem of PCB board and flexible board patching is involved, and the mature SMT process is adopted for PCB patching, while the welding between flexible board and PCB commonly adopts manual welding, hotbar (pulse hot bar welding), laser welding and SMT method. The first three methods have obvious disadvantages, manual welding has the problem of inconsistent welding and increases labor cost, hotbar has the problem of space limitation (high-density small-size optical module cannot be adopted), and laser welding has the problem of high equipment cost. For SMT process, the same patching method as optical device is adopted for the welding of flexible board, which is the most ideal cost reduction method.

[0004] The patent with the patent number CN 101083878 A discloses a welding method of FPC board and PCB board and a special fixture thereof, comprising the following steps: first, printing tin paste on a large PCB board composed of multiple PCB small plates; second, SMT mounting components on the PCB board; third, positioning the PCB board in the clamping groove of the lower template of the fixture; fourth, aligning the pad positions of the FPC board and the PCB board; fifth, covering the upper template of the fixture on the upper surface of the PCB board, the pad positions are pressed to 50% to 80%, the lower bottom surface of the upper template must be kept horizontal, and the upper template is locked by rotating the lower template; sixth, placing the locked fixture into a closed reflow furnace for reflow welding; seventh, demolding and taking out to check the welding condition of the FPC board and the PCB board. The special fixture provided by the invention comprises an upper template and a lower template.

[0005] Since the above welding method and special fixture do not protect the gold finger part of the PCB, the gold finger is easily contaminated. Usually, in order to prevent the surface of the gold finger part from being contaminated, high-temperature protective glue is pasted on each PCB gold finger part before printing, and the PCB flows with the gold finger part, and the high-temperature glue on the gold finger part of the finished product is removed before shipment. It is troublesome and wastes manpower and materials, and it is not suitable for batch operation. UTILITY MODEL CONTENT

[0006] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a flexible FPC device and PCB welding fixture to solve the above-mentioned technical problems.

[0007] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a flexible FPC device and PCB soldering fixture, comprising: a printed circuit board base, a surface mount carrier, and a reflow pressing assembly; a placement groove is provided on the printed circuit board base; the surface mount carrier is detachably disposed in the placement groove; the surface mount carrier is provided with a receiving groove corresponding to and adapted to the PCB; the surface mount carrier is provided with a plurality of pressure block positioning holes; the reflow pressing assembly is provided with a plurality of pressure block positioning posts corresponding one-to-one with the plurality of pressure block positioning holes; the reflow pressing assembly is detachably connected to the surface mount carrier; when the pressure block positioning posts of the reflow pressing assembly are inserted into the corresponding pressure block positioning holes, the reflow pressing assembly presses the flexible FPC device onto the PCB of the surface mount carrier.

[0008] Specifically, when soldering flexible FPC devices to PCBs, the PCB panel is first placed in a receiving slot, then the mounting carrier is placed on a printed circuit board (PCB) base. High-temperature tape is then applied to the PCB base and the gold finger areas of each PCB sub-board within the PCB panel, ensuring complete overlap between the tape and the gold finger portion of the PCB sub-board. The PCB panel contains multiple PCB sub-boards arranged in one or more rows. Applying the high-temperature tape allows for the protection of the gold finger portions on a row of PCB sub-boards at a time, enabling batch processing of the gold fingers on the PCB sub-boards.

[0009] After the gold fingers are protected, the printing base is placed into the automatic printing machine to print solder paste onto each PCB board. After solder paste printing, the printing base is output, and the high-temperature tape on the PCB panel can be quickly removed by peeling it off. The placement carrier is then removed from the printing base, and the flexible FPC device is placed on the PCB panel to adhere it. The reflow bonding assembly is then installed on the placement carrier, pressing the flexible FPC device onto the PCB panel. The placement carrier is then placed flat in the reflow oven for automatic reflow soldering, melting the solder paste between the flexible FPC device and the PCB panel to complete the soldering. After soldering, the reflow bonding assembly is removed from the placement carrier, and the soldered PCB panel can be removed from the placement carrier for subsequent processes.

[0010] By configuring a printing base to work in conjunction with a surface mount carrier, the PCB panel can be placed on the carrier before being inserted into the printing base. This facilitates the application of high-temperature resistant tape to the gold finger positions of all PCB sub-boards on the PCB panel. The printing base is also compatible with automatic printing machines for rapid solder paste printing on the corresponding positions of the PCB sub-boards. After printing, the surface mount carrier can be quickly removed from the printing base simply by peeling off the high-temperature resistant tape. Corresponding flexible FPC devices are then mounted on the carrier, ensuring proper alignment with the corresponding PCB sub-boards. A reflow bonding assembly then presses the flexible FPC devices onto the PCB sub-boards. This reflow bonding assembly presses all flexible FPC devices together, preventing misalignment. The reflow bonding assembly is positioned using positioning posts and holes, ensuring stability during bonding and preventing misalignment. The surface mount carrier is then placed directly on the stencil of the reflow oven, allowing the flexible FPC devices and PCB boards on the carrier to undergo reflow soldering. This improves the soldering consistency and reliability between the flexible FPC devices and the PCB boards, facilitating mass production of the products.

[0011] Optionally, the printing base includes: a fixture base and a fixture cover; the fixture base and the fixture cover are rotatably connected; a placement groove corresponding to and adapted to the patch carrier is provided on the fixture cover; a plurality of cover positioning holes are provided on the fixture cover; and a plurality of base positioning posts corresponding one-to-one with the plurality of cover positioning holes are provided on the fixture base.

[0012] Specifically, when mounting the placement carrier onto the printing base, the printing base can be directly placed into the placement slot on the fixture cover. When removing the placement carrier from the printing base, since the size of the placement slot is similar to the outer dimensions of the placement carrier, the fixture cover is rotated to separate it from the fixture base, thus freeing the placement carrier from the restriction of the placement slot on the fixture cover, making it easy to remove the placement carrier from the printing base. The positioning holes on the cover and the positioning pins on the base ensure the positioning accuracy of the fixture cover and the fixture base, preventing misalignment between the fixture cover and the fixture base that could cause the placement carrier to shift.

[0013] The placement slot is 1mm larger on each side than the patch carrier, and its depth is the same as the thickness of the patch carrier. To ensure the rotation of the fixture cover is unaffected by the patch carrier, a clearance slot is provided on the side of the fixture cover facing the fixture base. This clearance slot communicates with the placement slot and is slightly larger than the placement slot, ensuring the fixture cover's rotation is unaffected by the patch carrier. The fixture cover can be connected to the fixture base via hinges, allowing rotation of both the fixture cover and base, or via other rotating connectors such as shafts.

[0014] Optionally, a plurality of first magnetic blocks are provided on the base of the fixture; a plurality of second magnetic blocks corresponding one-to-one with the plurality of first magnetic blocks are provided on the upper cover of the fixture; the first magnetic blocks and the second magnetic blocks are attracted to each other accordingly.

[0015] Specifically, by setting a first magnetic block on the fixture base and a second magnetic block on the fixture cover, the position of the fixture cover and the fixture base can be kept constant during printing, and the fixture cover can be prevented from detaching from the fixture base. The first and second magnetic blocks can only be separated by applying external force to the fixture cover and the fixture base, thereby allowing the fixture cover to be rotated and opened.

[0016] Optionally, the fixture base is provided with a carrier positioning post; a carrier positioning hole is provided on the patch carrier; when the patch carrier is installed in the placement slot, the carrier positioning post is correspondingly inserted into the carrier positioning hole.

[0017] Specifically, when the patch carrier is installed in the placement slot, the position of the patch carrier on the fixture base can be restricted by the cooperation of the carrier positioning pin and the carrier positioning hole, ensuring that the patch carrier is always in the designated position to avoid the patch carrier shifting.

[0018] Optionally, the fixture base is provided with a clearance groove.

[0019] By creating a recessed groove on the jig base, a gap is created between the jig base and the jig top cover, making it easier to insert fingers or other tools into the recessed groove and to separate the jig base and the jig top cover.

[0020] Optionally, the patch carrier includes: a carrier body; a receiving groove corresponding to and adapted to the PCB is formed on the carrier body; a plurality of PCB positioning posts corresponding to and adapted to the positioning holes of the PCB are provided in the receiving groove; and a plurality of the carrier positioning holes are provided on the carrier body.

[0021] Specifically, the size of the receiving slot is the same as the size of the PCB panel. By setting PCB positioning posts in the receiving slot that correspond to and match the positioning holes on the PCB panel, the position of the PCB panel can be prevented from shifting when it is placed in the receiving slot.

[0022] Optionally, a number of ventilation holes are provided in the receiving groove; at least one double-sided high-temperature resistant adhesive is provided in the receiving groove.

[0023] Specifically, several ventilation holes, the same number as the PCB sub-boards, are provided at the bottom of the receiving slot. These ventilation holes facilitate heat dissipation from the PCB sub-boards, preventing heat buildup. Furthermore, double-sided high-temperature resistant adhesive is applied inside the receiving slot. After the PCB panel is placed inside, the adhesive further restricts its position, preventing horizontal movement.

[0024] In practical applications, the double-sided high-temperature resistant adhesive has three strips, two of which are symmetrically arranged on the left and right sides, and the other is arranged horizontally in the middle of the receiving groove; and an adhesive groove is opened on the receiving groove, and the double-sided high-temperature resistant adhesive is placed in the adhesive groove to ensure that the surface of the double-sided high-temperature resistant adhesive is flush with the surface of the receiving groove.

[0025] Optionally, at least one pick-up / placement slot is provided on the side of the carrier body located in the receiving slot; the pick-up / placement slot is connected to the receiving slot.

[0026] Specifically, the inner wall of the pick-and-place slot is arc-shaped. Preferably, there are two pick-and-place slots, symmetrically arranged on both sides of the receiving slot. After the flexible FPC device is soldered to the PCB sub-board, a hand can be inserted into the pick-and-place slot to directly contact the side of the PCB panel, making it easy to remove the PCB panel.

[0027] Optionally, the carrier body is provided with a plurality of third magnetic blocks; the jig base is provided with a plurality of fourth magnetic blocks corresponding one-to-one with the plurality of third magnetic blocks; the third magnetic blocks and the fourth magnetic blocks are attracted to each other.

[0028] Specifically, the third and fourth magnetic blocks can be used to attach the vehicle body to the jig base, further improving the connection stability between the vehicle body and the jig base.

[0029] Optionally, a loading / unloading port is provided on the side of the vehicle body.

[0030] Specifically, two pick-up and drop-off ports are symmetrically arranged on both sides of the vehicle body; the pick-up and drop-off ports are inwardly guided arc-shaped through slots. By setting the pick-up and drop-off ports, the force-bearing effect of the vehicle body can be improved, thereby making it easier to remove the vehicle body from the jig base.

[0031] In summary, this utility model has the following beneficial effects:

[0032] By configuring a printing base to work in conjunction with a surface mount carrier, the PCB panel can be placed on the carrier before being inserted into the printing base. This facilitates the application of high-temperature resistant tape to the gold finger positions of all PCB sub-boards on the PCB panel. The printing base is also compatible with automatic printing machines for rapid solder paste printing on the corresponding positions of the PCB sub-boards. After printing, the surface mount carrier can be quickly removed from the printing base simply by peeling off the high-temperature resistant tape. Corresponding flexible FPC devices are then mounted on the carrier, ensuring proper alignment with the corresponding PCB sub-boards. A reflow bonding assembly then presses the flexible FPC devices onto the PCB sub-boards. This reflow bonding assembly presses all flexible FPC devices together, preventing misalignment. The reflow bonding assembly is positioned using positioning posts and holes, ensuring stability during bonding and preventing misalignment. The surface mount carrier is then placed directly on the stencil of the reflow oven, allowing the flexible FPC devices and PCB boards on the carrier to undergo reflow soldering. This improves the soldering consistency and reliability between the flexible FPC devices and the PCB boards, facilitating mass production of the products. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of the patch carrier mounted on the printing base in this utility model;

[0034] Figure 2 This is a schematic diagram of the printing base in this utility model;

[0035] Figure 3 This is a schematic diagram of the structure of the fixture base in this utility model;

[0036] Figure 4 This is a schematic diagram of the structure of the fixture cover in this utility model;

[0037] Figure 5 This is a schematic diagram of the patch carrier in this utility model;

[0038] Figure 6 This is a schematic diagram of the reflow pressing assembly in this utility model;

[0039] Figure 7 This is a schematic diagram of the structure of the reflow pressing assembly installed on the patch carrier in this utility model.

[0040] In the diagram: 1. Printed base; 110. Fixture base; 120. Fixture top cover; 2. SMT carrier; 3. Reflow pressing assembly; 4. Placement slot; 5. Receiving slot; 6. Press block positioning hole; 7. Press block positioning post; 8. Top cover positioning hole; 9. Base positioning post; 10. First magnetic block; 11. Second magnetic block; 12. Carrier positioning post; 13. Carrier positioning hole; 14. Clearance slot; 15. PCB positioning post; 16. Ventilation hole; 17. Double-sided high-temperature resistant adhesive; 18. Pick-and-place slot; 19. Third magnetic block; 20. Fourth magnetic block; 21. Pick-and-place port. Detailed Implementation

[0041] To make the objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0043] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0044] Example 1

[0045] This embodiment provides a flexible FPC device and PCB soldering fixture, such as Figures 1-7 As shown, the assembly includes: a printed circuit board base 1, a surface mount carrier 2, and a reflow bonding assembly 3; a placement slot 4 is provided on the printed circuit board base 1; the surface mount carrier 2 is detachably disposed in the placement slot 4; the surface mount carrier 2 is provided with a receiving slot 5 that corresponds to and is adapted to the PCB; the surface mount carrier 2 is provided with a plurality of pressure block positioning holes 6; the reflow bonding assembly 3 is provided with a plurality of pressure block positioning posts 7 that correspond one-to-one with the plurality of pressure block positioning holes 6; the reflow bonding assembly 3 is detachably connected to the surface mount carrier 2; when the pressure block positioning posts 7 of the reflow bonding assembly 3 are inserted into the corresponding pressure block positioning holes 6, the reflow bonding assembly 3 presses the flexible FPC device onto the PCB of the surface mount carrier 2.

[0046] Specifically, when soldering flexible FPC devices to PCBs, the PCB panel is first placed in the receiving slot 5, then the mounting carrier 2 is placed on the printed circuit board base 1, and high-temperature tape is applied to the gold finger areas of each PCB sub-board in the PCB panel, ensuring complete overlap between the tape and the gold finger portion of the PCB sub-board. Multiple PCB sub-boards are arranged in one or more rows on the PCB panel; applying the high-temperature tape allows for the protection of the gold finger portion of a row of PCB sub-boards at a time, enabling batch processing of the gold fingers on the PCB sub-boards.

[0047] After the gold fingers are protected, the printing base 1 is placed into the automatic printing machine to print solder paste onto each PCB board. After the solder paste printing is complete, the printing base 1 is output, and the high-temperature resistant tape on the PCB panel can be quickly removed by peeling off the high-temperature resistant tape attached to the printing base 1. Then, the placement carrier 2 is removed from the printing base 1, and the flexible FPC device is placed on the PCB panel to adhere it. Next, the reflow bonding assembly 3 is installed on the placement carrier 2, pressing the flexible FPC device onto the PCB panel. The placement carrier 2 is then placed flat in the reflow oven for automatic reflow soldering, melting the solder paste between the flexible FPC device and the PCB panel to complete the soldering. After the soldering of the flexible FPC device and the PCB panel is complete, the reflow bonding assembly 3 is removed from the placement carrier 2, and the soldered PCB panel can be removed from the placement carrier 2 for subsequent processes.

[0048] By setting up the printing base 1 to cooperate with the placement carrier 2, the PCB panel can be placed on the placement carrier 2 and then placed into the printing base 1. This facilitates the application of high-temperature resistant tape to the gold finger positions of all PCB sub-boards on the PCB panel. The printing base 1 is also compatible with automatic printing machines for rapid solder paste printing on the corresponding positions of the PCB sub-boards. After printing, the placement carrier 2 can be quickly removed from the printing base 1 simply by peeling off the high-temperature resistant tape. Corresponding flexible FPC devices are then mounted on the placement carrier 2, ensuring proper alignment between the flexible FPC devices and the corresponding PCB sub-boards. The reflow pressing assembly 3 then presses the flexible FPC devices onto the PCB sub-board. The reflow pressing assembly 3 can press all flexible FPC devices to prevent positional misalignment. The reflow pressing assembly 3 is positioned using pressure block positioning posts 7 and pressure block positioning holes 6, making the reflow pressing assembly 3 more stable during pressing and preventing misalignment. The mounting carrier 2 is then placed directly on the stencil of the reflow oven, allowing the flexible FPC devices and PCB boards on the mounting carrier 2 to undergo reflow soldering. This improves the soldering consistency and reliability between the flexible FPC devices and the PCB boards, facilitating mass production of the products.

[0049] In this embodiment, there are two of each of the pressure block positioning holes 6 and pressure block positioning posts 7, and they are arranged symmetrically.

[0050] Optionally, the printing base 1 is provided with a carrier positioning post 12; the patch carrier 2 is provided with a carrier positioning hole 13; when the patch carrier 2 is installed in the placement slot 4, the carrier positioning post 12 is inserted into the carrier positioning hole 13.

[0051] Specifically, when the patch carrier 2 is installed in the placement slot 4, the position of the patch carrier 2 on the printing base 1 can be restricted by the cooperation of the carrier positioning post 12 and the carrier positioning hole 13, so as to ensure that the patch carrier 2 is always in the designated position and to avoid the patch carrier 2 from shifting.

[0052] Optionally, the patch carrier 2 includes: a carrier body; a receiving groove 5 that corresponds to and is adapted to the PCB on the carrier body; a plurality of PCB positioning posts 15 that correspond to and are adapted to the positioning holes of the PCB in the receiving groove 5; and a plurality of carrier positioning holes 13 that are disposed on the carrier body.

[0053] Specifically, the size of the receiving groove 5 is the same as the size of the PCB panel. By setting PCB positioning posts 15 in the receiving groove 5 that correspond to and match the positioning holes on the PCB panel, the position of the PCB panel can be prevented from shifting when the PCB panel is placed in the receiving groove 5.

[0054] In this embodiment, four PCB positioning posts 15 are provided, which are respectively located at the four ends of the receiving groove 5.

[0055] Optionally, at least one pick-up / placement slot 18 is provided on the vehicle body and on the side of the receiving slot 5; the pick-up / placement slot 18 is connected to the receiving slot 5.

[0056] Specifically, the inner wall of the pick-and-place slot 18 is arc-shaped. Preferably, there are two pick-and-place slots 18, symmetrically arranged on both sides of the receiving slot 5. After the flexible FPC device is soldered to the PCB sub-board, a hand can be inserted into the pick-and-place slot 18 to directly contact the side of the PCB panel, making it easy to remove the PCB panel.

[0057] Optionally, the carrier body is provided with a plurality of third magnetic blocks 19; the printing base 1 is provided with a plurality of fourth magnetic blocks 20 corresponding one-to-one with the plurality of third magnetic blocks 19; the third magnetic blocks 19 and the fourth magnetic blocks 20 are attracted to each other.

[0058] Specifically, the third magnetic block 19 and the fourth magnetic block 20 can be used to attach the carrier body to the printing base 1, thereby further improving the connection stability between the carrier body and the printing base 1.

[0059] In this embodiment, four of each of the third magnetic block 19 and the fourth magnetic block 20 are provided and are arranged in a centrally symmetrical manner.

[0060] Optionally, the reflow bonding assembly 3 includes a bonding strip; the width of the bonding strip is consistent with the distance between the solder of the two rows of PCB small boards in the PCB panel. Therefore, when the bonding strip is placed on the surface mount carrier 2 and the pressure block positioning post 7 is inserted into the corresponding pressure block positioning hole 6, the bonding strip can completely cover the solder area of ​​the flexible FPC device and the PCB small board, thereby avoiding the misalignment of the solder area of ​​the flexible FPC device and the PCB small board.

[0061] Example 2

[0062] This embodiment provides a flexible FPC device and PCB soldering fixture, such as Figures 1-7 As shown, the assembly includes: a printed circuit board base 1, a surface mount carrier 2, and a reflow bonding assembly 3; a placement slot 4 is provided on the printed circuit board base 1; the surface mount carrier 2 is detachably disposed in the placement slot 4; the surface mount carrier 2 is provided with a receiving slot 5 that corresponds to and is adapted to the PCB; the surface mount carrier 2 is provided with a plurality of pressure block positioning holes 6; the reflow bonding assembly 3 is provided with a plurality of pressure block positioning posts 7 that correspond one-to-one with the plurality of pressure block positioning holes 6; the reflow bonding assembly 3 is detachably connected to the surface mount carrier 2; when the pressure block positioning posts 7 of the reflow bonding assembly 3 are inserted into the corresponding pressure block positioning holes 6, the reflow bonding assembly 3 presses the flexible FPC device onto the PCB of the surface mount carrier 2.

[0063] Specifically, when soldering flexible FPC devices to PCBs, the PCB panel is first placed in the receiving slot 5, then the mounting carrier 2 is placed on the printed circuit board base 1, and high-temperature tape is applied to the gold finger areas of each PCB sub-board in the PCB panel, ensuring complete overlap between the tape and the gold finger portion of the PCB sub-board. Multiple PCB sub-boards are arranged in one or more rows on the PCB panel; applying the high-temperature tape allows for the protection of the gold finger portion of a row of PCB sub-boards at a time, enabling batch processing of the gold fingers on the PCB sub-boards.

[0064] After the gold fingers are protected, the printing base 1 is placed into the automatic printing machine to print solder paste onto each PCB board. After the solder paste printing is complete, the printing base 1 is output, and the high-temperature resistant tape on the PCB panel can be quickly removed by peeling off the high-temperature resistant tape attached to the printing base 1. Then, the placement carrier 2 is removed from the printing base 1, and the flexible FPC device is placed on the PCB panel to adhere it. Next, the reflow bonding assembly 3 is installed on the placement carrier 2, pressing the flexible FPC device onto the PCB panel. The placement carrier 2 is then placed flat in the reflow oven for automatic reflow soldering, melting the solder paste between the flexible FPC device and the PCB panel to complete the soldering. After the soldering of the flexible FPC device and the PCB panel is complete, the reflow bonding assembly 3 is removed from the placement carrier 2, and the soldered PCB panel can be removed from the placement carrier 2 for subsequent processes.

[0065] By setting up the printing base 1 to cooperate with the placement carrier 2, the PCB panel can be placed on the placement carrier 2 and then placed into the printing base 1. This facilitates the application of high-temperature resistant tape to the gold finger positions of all PCB sub-boards on the PCB panel. The printing base 1 is also compatible with automatic printing machines for rapid solder paste printing on the corresponding positions of the PCB sub-boards. After printing, the placement carrier 2 can be quickly removed from the printing base 1 simply by peeling off the high-temperature resistant tape. Corresponding flexible FPC devices are then mounted on the placement carrier 2, ensuring proper alignment between the flexible FPC devices and the corresponding PCB sub-boards. The reflow pressing assembly 3 then presses the flexible FPC devices onto the PCB sub-board. The reflow pressing assembly 3 can press all flexible FPC devices to prevent positional misalignment. The reflow pressing assembly 3 is positioned using pressure block positioning posts 7 and pressure block positioning holes 6, making the reflow pressing assembly 3 more stable during pressing and preventing misalignment. The mounting carrier 2 is then placed directly on the stencil of the reflow oven, allowing the flexible FPC devices and PCB boards on the mounting carrier 2 to undergo reflow soldering. This improves the soldering consistency and reliability between the flexible FPC devices and the PCB boards, facilitating mass production of the products.

[0066] In this embodiment, there are two of each of the pressure block positioning holes 6 and pressure block positioning posts 7, and they are arranged symmetrically.

[0067] Optionally, the printing base 1 is provided with a carrier positioning post 12; the patch carrier 2 is provided with a carrier positioning hole 13; when the patch carrier 2 is installed in the placement slot 4, the carrier positioning post 12 is inserted into the carrier positioning hole 13.

[0068] Specifically, when the patch carrier 2 is installed in the placement slot 4, the position of the patch carrier 2 on the printing base 1 can be restricted by the cooperation of the carrier positioning post 12 and the carrier positioning hole 13, so as to ensure that the patch carrier 2 is always in the designated position and to avoid the patch carrier 2 from shifting.

[0069] Optionally, the patch carrier 2 includes: a carrier body; a receiving groove 5 that corresponds to and is adapted to the PCB on the carrier body; a plurality of PCB positioning posts 15 that correspond to and are adapted to the positioning holes of the PCB in the receiving groove 5; and a plurality of carrier positioning holes 13 that are disposed on the carrier body.

[0070] Specifically, the size of the receiving groove 5 is the same as the size of the PCB panel. By setting PCB positioning posts 15 in the receiving groove 5 that correspond to and match the positioning holes on the PCB panel, the position of the PCB panel can be prevented from shifting when the PCB panel is placed in the receiving groove 5.

[0071] In this embodiment, four PCB positioning posts 15 are provided, which are respectively located at the four ends of the receiving groove 5.

[0072] Optionally, a plurality of ventilation holes 16 are provided in the receiving groove 5; at least one double-sided high-temperature resistant adhesive 17 is provided in the receiving groove 5.

[0073] Specifically, the bottom of the receiving groove 5 has several ventilation holes 16, the same number as the number of PCB sub-boards and corresponding in position. These ventilation holes 16 facilitate heat dissipation from the PCB sub-boards, preventing heat buildup. Furthermore, double-sided high-temperature resistant adhesive 17 is provided inside the receiving groove 5. After the PCB panel is placed inside, the adhesive further restricts its position, preventing horizontal movement.

[0074] In this embodiment, ten PCB sub-boards are arranged on the PCB panel, and the ten PCB sub-boards are arranged symmetrically in two rows on the PCB panel; ten ventilation holes 16 are provided, and their positions are consistent with those of the PCB sub-boards.

[0075] In practical applications, three double-sided high-temperature resistant adhesive strips 17 are provided, two of which are symmetrically arranged on the left and right sides, and the other is arranged horizontally in the middle of the receiving groove 5; and an adhesive groove is provided on the receiving groove 5, and the double-sided high-temperature resistant adhesive strip 17 is placed in the adhesive groove to ensure that the surface of the double-sided high-temperature resistant adhesive strip 17 is flush with the surface of the receiving groove 5.

[0076] Optionally, at least one pick-up / placement slot 18 is provided on the vehicle body and on the side of the receiving slot 5; the pick-up / placement slot 18 is connected to the receiving slot 5.

[0077] Specifically, the inner wall of the pick-and-place slot 18 is arc-shaped. Preferably, there are two pick-and-place slots 18, symmetrically arranged on both sides of the receiving slot 5. After the flexible FPC device is soldered to the PCB sub-board, a hand can be inserted into the pick-and-place slot 18 to directly contact the side of the PCB panel, making it easy to remove the PCB panel.

[0078] Optionally, the carrier body is provided with a plurality of third magnetic blocks 19; the printing base 1 is provided with a plurality of fourth magnetic blocks 20 corresponding one-to-one with the plurality of third magnetic blocks 19; the third magnetic blocks 19 and the fourth magnetic blocks 20 are attracted to each other.

[0079] In this embodiment, four of each of the third magnetic block 19 and the fourth magnetic block 20 are provided and are arranged in a centrally symmetrical manner.

[0080] Specifically, the third magnetic block 19 and the fourth magnetic block 20 can be used to attach the carrier body to the printing base 1, thereby further improving the connection stability between the carrier body and the printing base 1.

[0081] Optionally, a loading / unloading port 21 is provided on the side of the vehicle body.

[0082] Specifically, two pick-up and drop-off ports 21 are symmetrically arranged on both sides of the carrier body; the pick-up and drop-off ports 21 are inwardly guiding arc-shaped through grooves. By setting the pick-up and drop-off ports 21, the force-bearing effect of the carrier body can be improved, thereby making it easier to remove the carrier body from the printing base 1.

[0083] Optionally, the reflow bonding assembly 3 includes a bonding strip; the width of the bonding strip is consistent with the distance between the solder of the two rows of PCB small boards in the PCB panel. Therefore, when the bonding strip is placed on the surface mount carrier 2 and the pressure block positioning post 7 is inserted into the corresponding pressure block positioning hole 6, the bonding strip can completely cover the solder area of ​​the flexible FPC device and the PCB small board, thereby avoiding the misalignment of the solder area of ​​the flexible FPC device and the PCB small board.

[0084] Example 3

[0085] This embodiment provides a flexible FPC device and PCB soldering fixture, such as Figures 1-7 As shown, the assembly includes: a printed circuit board base 1, a surface mount carrier 2, and a reflow bonding assembly 3; a placement slot 4 is provided on the printed circuit board base 1; the surface mount carrier 2 is detachably disposed in the placement slot 4; the surface mount carrier 2 is provided with a receiving slot 5 that corresponds to and is adapted to the PCB; the surface mount carrier 2 is provided with a plurality of pressure block positioning holes 6; the reflow bonding assembly 3 is provided with a plurality of pressure block positioning posts 7 that correspond one-to-one with the plurality of pressure block positioning holes 6; the reflow bonding assembly 3 is detachably connected to the surface mount carrier 2; when the pressure block positioning posts 7 of the reflow bonding assembly 3 are inserted into the corresponding pressure block positioning holes 6, the reflow bonding assembly 3 presses the flexible FPC device onto the PCB of the surface mount carrier 2.

[0086] Specifically, when soldering flexible FPC devices to PCBs, the PCB panel is first placed in the receiving slot 5, then the mounting carrier 2 is placed on the printed circuit board base 1, and high-temperature tape is applied to the gold finger areas of each PCB sub-board in the PCB panel, ensuring complete overlap between the tape and the gold finger portion of the PCB sub-board. Multiple PCB sub-boards are arranged in one or more rows on the PCB panel; applying the high-temperature tape allows for the protection of the gold finger portion of a row of PCB sub-boards at a time, enabling batch processing of the gold fingers on the PCB sub-boards.

[0087] After the gold fingers are protected, the printing base 1 is placed into the automatic printing machine to print solder paste onto each PCB board. After the solder paste printing is complete, the printing base 1 is output, and the high-temperature resistant tape on the PCB panel can be quickly removed by peeling off the high-temperature resistant tape attached to the printing base 1. Then, the placement carrier 2 is removed from the printing base 1, and the flexible FPC device is placed on the PCB panel to adhere it. Next, the reflow bonding assembly 3 is installed on the placement carrier 2, pressing the flexible FPC device onto the PCB panel. The placement carrier 2 is then placed flat in the reflow oven for automatic reflow soldering, melting the solder paste between the flexible FPC device and the PCB panel to complete the soldering. After the soldering of the flexible FPC device and the PCB panel is complete, the reflow bonding assembly 3 is removed from the placement carrier 2, and the soldered PCB panel can be removed from the placement carrier 2 for subsequent processes.

[0088] By setting up the printing base 1 to cooperate with the placement carrier 2, the PCB panel can be placed on the placement carrier 2 and then placed into the printing base 1. This facilitates the application of high-temperature resistant tape to the gold finger positions of all PCB sub-boards on the PCB panel. The printing base 1 is also compatible with automatic printing machines for rapid solder paste printing on the corresponding positions of the PCB sub-boards. After printing, the placement carrier 2 can be quickly removed from the printing base 1 simply by peeling off the high-temperature resistant tape. Corresponding flexible FPC devices are then mounted on the placement carrier 2, ensuring proper alignment between the flexible FPC devices and the corresponding PCB sub-boards. The reflow pressing assembly 3 then presses the flexible FPC devices onto the PCB sub-board. The reflow pressing assembly 3 can press all flexible FPC devices to prevent positional misalignment. The reflow pressing assembly 3 is positioned using pressure block positioning posts 7 and pressure block positioning holes 6, making the reflow pressing assembly 3 more stable during pressing and preventing misalignment. The mounting carrier 2 is then placed directly on the stencil of the reflow oven, allowing the flexible FPC devices and PCB boards on the mounting carrier 2 to undergo reflow soldering. This improves the soldering consistency and reliability between the flexible FPC devices and the PCB boards, facilitating mass production of the products.

[0089] In this embodiment, there are two of each of the pressure block positioning holes 6 and pressure block positioning posts 7, and they are arranged symmetrically.

[0090] Optionally, the printing base 1 includes: a fixture base 110 and a fixture cover 120; the fixture base 110 and the fixture cover 120 are rotatably connected; a placement groove 4 corresponding to and adapted to the patch carrier 2 is provided on the fixture cover 120; a plurality of cover positioning holes 8 are provided on the fixture cover 120; and a plurality of base positioning posts 9 corresponding one-to-one with the plurality of cover positioning holes 8 are provided on the fixture base 110.

[0091] Specifically, when mounting the patch carrier 2 onto the printing base 1, the printing base 1 can be directly placed into the placement slot 4 on the fixture cover 120. When removing the patch carrier 2 from the printing base 1, since the size of the placement slot 4 is similar to the outer dimensions of the patch carrier 2, the fixture cover 120 is rotated to separate the fixture cover 120 from the fixture base 110, thus freeing the patch carrier 2 from the restriction of the placement slot 4 on the fixture cover 120, making it easy to remove the patch carrier 2 from the printing base 1. The positioning holes 8 on the cover and the positioning pins 9 on the base ensure the positioning accuracy of the fixture cover 120 and the fixture base 110, preventing misalignment between the fixture cover 120 and the fixture base 110 that could cause the patch carrier 2 to shift.

[0092] The placement groove 4 is 1mm larger on each side than the patch carrier 2, and its depth is the same as the thickness of the patch carrier 2. To ensure that the rotation of the fixture cover 120 is not affected by the patch carrier 2, a clearance groove 14 is provided on the side of the fixture cover 120 facing the fixture base 110. The clearance groove 14 is connected to the placement groove 4, and its size is slightly larger than that of the placement groove 4, ensuring that the rotation of the fixture cover 120 is not affected by the patch carrier 2. The fixture cover 120 can be connected to the fixture base 110 via a hinge, allowing rotation of both the fixture cover 120 and the fixture base 110, or via a pivot or other rotating connector.

[0093] In this embodiment, four base positioning posts 9 and four upper cover positioning holes 8 are provided, and they are arranged in a centrally symmetrical manner.

[0094] Optionally, a plurality of first magnetic blocks 10 are provided on the fixture base 110; a plurality of second magnetic blocks 11 corresponding one-to-one with the plurality of first magnetic blocks 10 are provided on the fixture cover 120; the first magnetic blocks 10 and the second magnetic blocks 11 are attracted to each other accordingly.

[0095] Specifically, by setting a first magnet 10 on the fixture base 110 and a second magnet 11 on the fixture cover 120, the position of the fixture cover 120 and the fixture base 110 can be kept constant during printing, and the fixture cover 120 can be prevented from detaching from the fixture base 110. Only when an external force is applied to the fixture cover 120 and the fixture base 110 can the first magnet 10 and the second magnet 11 be separated, thereby allowing the fixture cover 120 to be rotated and opened.

[0096] In this embodiment, four of each of the first magnetic block 10 and the second magnetic block 11 are provided and are arranged in a centrally symmetrical manner.

[0097] Optionally, the fixture base 110 is provided with a carrier positioning post 12; the patch carrier 2 is provided with a carrier positioning hole 13; when the patch carrier 2 is installed in the placement slot 4, the carrier positioning post 12 is inserted into the carrier positioning hole 13.

[0098] Specifically, when the patch carrier 2 is installed in the placement slot 4, the position of the patch carrier 2 on the fixture base 110 can be restricted by the cooperation of the carrier positioning post 12 and the carrier positioning hole 13, so as to ensure that the patch carrier 2 is always in the designated position and to avoid the patch carrier 2 from shifting.

[0099] Optionally, the fixture base 110 is provided with a clearance groove 14.

[0100] By creating a recess 14 on the jig base 110, a notch is created between the jig base 110 and the jig cover 120, so that fingers or other tools can be inserted into the recess 14 and the jig base 110 and the jig cover 120 can be separated.

[0101] Optionally, the patch carrier 2 includes: a carrier body; a receiving groove 5 that corresponds to and is adapted to the PCB on the carrier body; a plurality of PCB positioning posts 15 that correspond to and are adapted to the positioning holes of the PCB in the receiving groove 5; and a plurality of carrier positioning holes 13 that are disposed on the carrier body.

[0102] Specifically, the size of the receiving groove 5 is the same as the size of the PCB panel. By setting PCB positioning posts 15 in the receiving groove 5 that correspond to and match the positioning holes on the PCB panel, the position of the PCB panel can be prevented from shifting when the PCB panel is placed in the receiving groove 5.

[0103] Optionally, a plurality of ventilation holes 16 are provided in the receiving groove 5; at least one double-sided high-temperature resistant adhesive 17 is provided in the receiving groove 5.

[0104] Specifically, the bottom of the receiving groove 5 has several ventilation holes 16, the same number as the number of PCB sub-boards and corresponding in position. These ventilation holes 16 facilitate heat dissipation from the PCB sub-boards, preventing heat buildup. Furthermore, double-sided high-temperature resistant adhesive 17 is provided inside the receiving groove 5. After the PCB panel is placed inside, the adhesive further restricts its position, preventing horizontal movement.

[0105] In this embodiment, ten PCB sub-boards are arranged on the PCB panel, and the ten PCB sub-boards are arranged symmetrically in two rows on the PCB panel; ten ventilation holes 16 are provided, and their positions are consistent with those of the PCB sub-boards.

[0106] In practical applications, three double-sided high-temperature resistant adhesive strips 17 are provided, two of which are symmetrically arranged on the left and right sides, and the other is arranged horizontally in the middle of the receiving groove 5; and an adhesive groove is provided on the receiving groove 5, and the double-sided high-temperature resistant adhesive strip 17 is placed in the adhesive groove to ensure that the surface of the double-sided high-temperature resistant adhesive strip 17 is flush with the surface of the receiving groove 5.

[0107] Optionally, at least one pick-up / placement slot 18 is provided on the vehicle body and on the side of the receiving slot 5; the pick-up / placement slot 18 is connected to the receiving slot 5.

[0108] Specifically, the inner wall of the pick-and-place slot 18 is arc-shaped. Preferably, there are two pick-and-place slots 18, symmetrically arranged on both sides of the receiving slot 5. After the flexible FPC device is soldered to the PCB sub-board, a hand can be inserted into the pick-and-place slot 18 to directly contact the side of the PCB panel, making it easy to remove the PCB panel.

[0109] Optionally, the carrier body is provided with a plurality of third magnetic blocks 19; the jig base 110 is provided with a plurality of fourth magnetic blocks 20 corresponding one-to-one with the plurality of third magnetic blocks 19; the third magnetic blocks 19 and the fourth magnetic blocks 20 are attracted to each other.

[0110] Specifically, the third magnetic block 19 and the fourth magnetic block 20 can be used to attach the vehicle body to the jig base 110, thereby further improving the connection stability between the vehicle body and the jig base 110.

[0111] In this embodiment, four of each of the third magnetic block 19 and the fourth magnetic block 20 are provided and are arranged in a centrally symmetrical manner.

[0112] Optionally, a loading / unloading port 21 is provided on the side of the vehicle body.

[0113] Specifically, two pick-up and drop-off ports 21 are symmetrically arranged on both sides of the vehicle body; the pick-up and drop-off ports 21 are inwardly guiding arc-shaped through grooves. By setting the pick-up and drop-off ports 21, the force-bearing effect of the vehicle body can be improved, thereby facilitating the removal of the vehicle body from the jig base 110.

[0114] Optionally, the reflow bonding assembly 3 includes a bonding strip; the width of the bonding strip is consistent with the distance between the solder of the two rows of PCB small boards in the PCB panel. Therefore, when the bonding strip is placed on the surface mount carrier 2 and the pressure block positioning post 7 is inserted into the corresponding pressure block positioning hole 6, the bonding strip can completely cover the solder area of ​​the flexible FPC device and the PCB small board, thereby avoiding the misalignment of the solder area of ​​the flexible FPC device and the PCB small board.

[0115] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A flexible FPC device and PCB welding fixture, characterized in that, include: Printed substrate, surface mount carrier, and reflow bonding assembly; A placement slot is provided on the printed circuit board base; the surface mount carrier is detachably disposed in the placement slot; the surface mount carrier is provided with a receiving slot that corresponds to and is adapted to the PCB; the surface mount carrier is provided with a plurality of pressure block positioning holes; the reflow pressing assembly is provided with a plurality of pressure block positioning posts that correspond one-to-one with the plurality of pressure block positioning holes; the reflow pressing assembly is detachably connected to the surface mount carrier; when the pressure block positioning posts of the reflow pressing assembly are inserted into the corresponding pressure block positioning holes, the reflow pressing assembly presses the flexible FPC device onto the PCB of the surface mount carrier.

2. The flexible FPC device and PCB welding fixture according to claim 1, characterized in that, The printing base includes: a fixture base and a fixture cover; the fixture base and the fixture cover are rotatably connected; a placement groove corresponding to and adapted to the patch carrier is provided on the fixture cover; a plurality of cover positioning holes are provided on the fixture cover; and a plurality of base positioning posts corresponding one-to-one with the plurality of cover positioning holes are provided on the fixture base.

3. The flexible FPC device and PCB welding fixture according to claim 2, characterized in that, A plurality of first magnetic blocks are provided on the base of the fixture; a plurality of second magnetic blocks are provided on the upper cover of the fixture, each corresponding to one of the first magnetic blocks; the first magnetic blocks and the second magnetic blocks are attracted to each other.

4. The flexible FPC device and PCB welding fixture according to claim 3, characterized in that, The fixture base is provided with a carrier positioning post; the patch carrier is provided with a carrier positioning hole; when the patch carrier is installed in the placement slot, the carrier positioning post is inserted into the carrier positioning hole.

5. The flexible FPC device and PCB welding fixture according to claim 4, characterized in that, The fixture base is provided with a clearance groove.

6. The flexible FPC device and PCB welding fixture according to claim 4, characterized in that, The patch carrier includes: a carrier body; a receiving groove corresponding to and adapted to the PCB on the carrier body; a plurality of PCB positioning posts corresponding to and adapted to the positioning holes of the PCB in the receiving groove; and a plurality of the carrier positioning holes are provided on the carrier body.

7. A flexible FPC device and PCB welding fixture according to claim 6, characterized in that, Several ventilation holes are provided in the receiving groove; at least one double-sided high-temperature resistant adhesive is provided in the receiving groove.

8. A flexible FPC device and PCB welding fixture according to claim 6, characterized in that, At least one pick-up / placement slot is provided on the side of the carrier body and located in the receiving slot; the pick-up / placement slot is connected to the receiving slot.

9. A flexible FPC device and PCB welding fixture according to claim 6, characterized in that, The carrier body is provided with a plurality of third magnetic blocks; the jig base is provided with a plurality of fourth magnetic blocks that correspond one-to-one with the plurality of third magnetic blocks; the third magnetic blocks and the fourth magnetic blocks are attracted to each other.

10. A flexible FPC device and PCB welding fixture according to claim 6, characterized in that, An access port is provided on the side of the vehicle body.

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