Superconducting acquisition module

Abstract

The utility model provides a superconducting acquisition module. The superconducting acquisition module comprises a case; the plurality of functional areas are distributed in the case, different functional areas need different temperature control precisions, and heat insulation plates are arranged between the functional area with the highest temperature control precision and other functional areas; the temperature control systems are arranged in the functional areas in a one-to-one correspondence mode and conduct independent temperature control on the corresponding functional areas, and the temperature control precision of the temperature control systems is consistent with the temperature control precision needed by the corresponding functional areas. Independent temperature control systems corresponding to the temperature control precision are configured for functional areas with different temperature control precision requirements, independent temperature control is performed on each functional area through the independent temperature control system of each functional area, and meanwhile, the functional area with the highest temperature control precision is thermally isolated from other functional areas through a thermal insulation plate, so that the temperature control precision of the functional area is improved. The influence of heat of other functional areas on the functional area with the highest temperature control precision is prevented, the overall temperature control cost and complexity of the superconducting acquisition module can be reduced, and the temperature control precision required by each functional area can be ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic power technical field, concretely relates to a superconducting collection module. BACKGROUND

[0002] With the development of superconducting technology, superconducting collection modules are widely used in high-precision sensors, medical imaging devices, particle accelerators, astronomical observations and other fields. The signals generated by the normal operation of superconducting elements are very small, and require high-precision measuring instruments. High-precision measuring instruments have high requirements for temperature, and any temperature fluctuation can seriously affect the accuracy and stability of the collection.

[0003] The signals generated by superconducting elements need to be collected with high precision, and temperature has a greater impact on weak signals. Therefore, temperature fluctuations have a great impact on high-precision collection, especially for functional modules responsible for signal collection such as collection equipment and collection circuits. The heat of some non-collection functional modules such as power modules of superconducting collection modules does not directly affect the working precision of the superconducting collection module. However, the existing cooling method often uses air cooling for overall cooling, which cannot target the temperature control and cooling of functional areas with different temperature control requirements. Therefore, how to target the temperature control and cooling of functional areas with different temperature control requirements has become a technical problem to be solved. SUMMARY

[0004] The present application provides a power supply power module, which at least solves the technical problem of how to target the temperature control and cooling of functional areas with different temperature control requirements in the related art.

[0005] The present application provides a superconducting collection module, which includes: a case; a plurality of functional areas distributed in the case, different functional areas having different temperature control precision requirements, wherein the functional area with the highest temperature control precision has a heat insulation plate between it and other functional areas; a plurality of temperature control systems are one-to-one corresponding to the plurality of functional areas, and independently control the corresponding functional areas, the temperature control precision of the temperature control system is consistent with the temperature control precision required by the corresponding functional area.

[0006] In one embodiment, the heat insulation plate is provided between adjacent functional areas.

[0007] In one embodiment, the functional area includes a power supply area, a main control area and a measurement area, wherein the temperature control precision required by the power supply area, the main control area and the measurement area increases in turn.

[0008] In an embodiment, the temperature control system in the power supply area comprises a first temperature sensor and a first speed-regulated fan, wherein the first temperature sensor is arranged in the space of the power supply area or on the first heat source of the power supply area, and the first speed-regulated fan is arranged on the cabinet.

[0009] In an embodiment, the power supply area runs through the cabinet, and the first speed-regulated fan is arranged at both ends of the power supply area to form a convection air duct in the power supply area.

[0010] In an embodiment, the first heat source comprises a plurality of power circuit modules, and at least one of the power circuit modules is provided with a first heat sink.

[0011] In an embodiment, the temperature control system in the main control area comprises a second temperature sensor, a second speed-regulated fan and a second heat sink, one side of the second heat sink is in contact with a second heat source of the main control area, the other side is located in an air duct formed by the second speed-regulated fan, and the second temperature sensor is in contact with the second heat source or the second heat sink.

[0012] In an embodiment, the air inlet of the main control area is arranged on a first side plate of the cabinet, the air outlet is arranged on a second side plate adjacent to the first side plate, and the second speed-regulated fan is arranged at the air inlet and / or the air outlet.

[0013] In an embodiment, the temperature control system in the measurement area comprises a third temperature sensor and a heat source regulator, wherein the third temperature sensor is arranged on a measurement circuit in the measurement area, and the heat source regulator is connected with the temperature sensor to regulate the heat output of the heat source in the superconducting acquisition module.

[0014] In an embodiment, a semiconductor refrigeration module is further arranged in the measurement area. 。

[0015] The present application has at least the following beneficial effects:

[0016] In the superconducting acquisition module, the cabinet is divided into multiple functional areas according to different functions and different temperature control precision requirements, and independent temperature control systems with corresponding temperature control precision are configured for functional areas with different temperature control precision requirements. The independent temperature control systems of the functional areas are used for independent temperature control of the functional areas. For the functional area with the highest temperature control precision, a heat insulation plate is used to thermally insulate the functional area from other functional areas to prevent the heat of other functional areas from affecting the functional area with the highest temperature control precision. This not only reduces the temperature control cost and complexity of the superconducting acquisition module, but also ensures the required temperature control precision of each functional area and the accuracy of signal acquisition of the superconducting acquisition module. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings incorporated into the specification and forming a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows, and obviously, other drawings can be obtained by those skilled in the art without creative labor under the premise of not paying the creative labor.

[0019] Fig. 1 It is an exemplary functional area and temperature control system distribution schematic diagram of a superconducting acquisition module in the embodiments of the present application.

[0020] Fig. 2 It is a structural schematic diagram of a first perspective of an exemplary superconducting acquisition module in the embodiments of the present application.

[0021] Fig. 3 It is a structural schematic diagram of a second perspective of an exemplary superconducting acquisition module in the embodiments of the present application.

[0022] Legend of the drawings:

[0023] 100, case; 101, functional area; 102, heat insulation plate; 103, temperature control system; 104, first side plate; 105, second side plate; 10, power supply area; 11, first speed regulating fan; 20, main control area; 21, second speed regulating fan; 22, second heat dissipation plate; 30, measurement area. DETAILED DESCRIPTION

[0024] In order to make the person in the art better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application.

[0025] It is to be understood that the terms "first", "second", and the like, used in the description and the claims of the present application as well as the above description of the drawings merely refer to different categories and do not necessarily imply a sequence or order of, for example, the described steps. It is to be understood that the use of the terms first, second, etc., is not to be interpreted as a sequence or order of steps, but merely to distinguish one step from another. Further, the terms "comprises", "comprising", "has", "having", "includes", "including", and the like, are to be construed open- ended, i.e., to mean including but not limited to, to cover a and equivalents thereof. It is further to be understood that the use of relational terms such as first, second, top, bottom, upper, lower, and the like, are used solely to distinguish one from another, without necessarily implying a sequence or order or a particular position or arrangement.

[0026] As shown in Figs. 1-3 The present application provides a superconducting acquisition module, comprising a cabinet 100, a plurality of functional areas 101 distributed in the cabinet, different functional areas 101 require different temperature control accuracies, wherein the functional area 101 with the highest temperature control accuracy is thermally insulated from other functional areas 101 by a heat insulation plate 102; a plurality of temperature control systems 103 are correspondingly arranged in the plurality of functional areas 101, and each temperature control system 103 is used for independently controlling the temperature of the corresponding functional area 101, and the temperature control accuracy of the temperature control system 103 is consistent with the temperature control accuracy required by the corresponding functional area 101.

[0027] The target object to which the superconducting acquisition module is applied is a superconducting element, and the signal generated by the superconducting element when it is normally operating is very weak. Therefore, the signal generated by the superconducting element needs to be collected with high accuracy. However, the temperature has a great influence on the weak signal, and therefore the fluctuation of the temperature has a great influence on the high-precision collection, especially on the functional modules responsible for signal collection such as collection equipment and collection circuit. The heat of some non-collection functional modules such as the power module of the superconducting acquisition module does not directly affect the working accuracy of the superconducting acquisition module. In the embodiment, the functional modules in the superconducting acquisition module have different requirements for temperature control accuracy. Based on this, in the embodiment, the cabinet 100 is divided into a plurality of functional areas 101 according to different functions and different requirements for temperature control accuracy. The independent temperature control system 103 with corresponding temperature control accuracy is configured for the functional area with different requirements for temperature control accuracy. The independent temperature control system of each functional area 101 is used to independently control the temperature of each functional area 101. For the functional area 101 with the highest temperature control accuracy, the heat insulation plate 102 is used to thermally insulate it from other functional areas 101, so as to prevent the heat of other functional areas 101 from affecting the functional area 101 with the highest temperature control accuracy. This can not only reduce the temperature control cost and complexity of the superconducting acquisition module as a whole, but also ensure the required temperature control accuracy of each functional area, thereby ensuring the accuracy of signal collection of the superconducting acquisition module.

[0028] In an embodiment, since the temperature control accuracy of each functional area 101 is different, the heat generated during operation is also different, in order to better ensure that the functional modules of each functional area 101 can operate at an ideal temperature, in this embodiment, a heat insulation plate 102 is arranged between adjacent functional areas 101, which can independently control the temperature of each area, avoid interference between heat sources, and ensure the measurement accuracy of the superconducting acquisition module.

[0029] In an embodiment, as shown in Fig. 2 The superconducting acquisition module is divided into a power supply area 10, a main control area 20 and a measurement area 30 according to the temperature control accuracy and function, wherein the temperature control accuracy required by the power supply area 10, the main control area 20 and the measurement area 30 is increased in turn. That is, the measurement area 30 is the most critical area in the entire system, which has a built-in superconducting acquisition module, and requires extremely stable temperature. The performance of the measurement circuit is extremely sensitive to temperature changes, and any temperature fluctuation can cause the performance of the measurement circuit to decrease, thereby affecting the acquisition accuracy. Therefore, the temperature control of the measurement area 30 must achieve very high accuracy, and the temperature fluctuation amplitude should be as small as possible. As shown in Fig. 2 The heat insulation plate 102 is arranged between the measurement area 30 and the main control area 20 and the power supply area 10 to achieve efficient thermal insulation and ensure that the heat of the power supply area 10 and the main control area 20 does not directly affect the measurement area 30, avoiding the influence of temperature fluctuation on the signal measurement accuracy of the superconducting element.

[0030] In an embodiment, the power supply area 10 mainly includes power supply modules, transformers, power supply regulators and other power circuits, which will generate a large amount of heat during operation. Although the heat of the power supply area 10 does not directly affect the working accuracy of the superconducting acquisition module, it has a direct impact on the stability of the power supply system. The working temperature of the power supply module needs to be kept within a certain range to prevent power instability, system crash or shortened life caused by overheating. Therefore, in this embodiment, the temperature control system in the power supply area 10 can adopt a regional temperature control system, that is, the temperature control system of the power supply area 10 can cool the entire area of the power supply area 10, specifically, the temperature control system of the power supply area 10 includes a first temperature sensor and a first speed-adjusting fan 11, wherein the first temperature sensor is arranged in the space of the power supply area 10 or on the first heat source of the power supply area 10, and the first speed-adjusting fan 11 is arranged on the case 100. The first temperature sensor detects the temperature change of the power supply area 10 in real time, and the first speed-adjusting fan 11 automatically adjusts the speed according to the temperature change, so that when the air volume increases, the heat can be discharged faster, and when the air volume decreases, the power consumption and noise can be reduced.

[0031] In an embodiment, the power supply area 10 runs through the cabinet 100, and the first speed-regulated fan 11 is arranged at both ends of the power supply area 10 to form a convection air duct in the power supply area 10. One first speed-regulated fan 11 can be arranged at each end to form a convection air duct (as shown by the arrows in the figure) through the power supply area 10 by the air in and out of the two first speed-regulated fans, and the heat is rapidly dissipated from the power supply area 10 to the outside by the convection effect of the air flow. Fig. 2

[0032] In an embodiment, the first heat source includes a plurality of power circuit modules, and at least one of the power circuit modules is provided with a first heat sink. For some heat sources in the power supply area 10 that generate more heat, such as power modules, a first heat sink can be arranged on the power module, which cooperates with the first speed-regulated fan 11 to rapidly dissipate the heat of some heat sources that generate more heat to the outside, ensure that the temperature of the power supply area 10 is always maintained within a safe range, avoid damage to the power supply system caused by overheating, and at the same time, avoid heat interference to other areas, especially the measurement area 30.

[0033] In an embodiment, the main control area 20 contains key electronic components such as processors, signal amplifiers, control units, storage modules, etc. The temperature change of this area has a greater impact on the performance of the superconducting acquisition module, especially when the temperature is too high, which can cause unstable operation of each electronic component in the main control area 20, data loss or decline in acquisition accuracy. Therefore, the main control area 20 needs more accurate temperature control management. In this embodiment, the main control area 20 can use a component temperature control system. Specifically, the temperature control system of the main control area 20 can include a second temperature sensor, a second speed-regulated fan 21 and a second heat sink 22, one side of the second heat sink 22 is in contact with the second heat source of the main control area 20, the other side is located in the air duct formed by the second speed-regulated fan 21, and the second temperature sensor is in contact with the second heat source or the second heat sink 22. In this embodiment, for the core components of the main control area 20, such as processors and signal amplifiers, a large area of second heat sink 22 is installed around them, and the second heat sink 22 is designed to maximize the heat conduction efficiency so as to rapidly conduct the heat from the components to the outside of the cabinet 100. The main control area 20 is also equipped with a second speed-regulated fan 21 and a second temperature sensor. The second speed-regulated fan 21 is connected with the second temperature sensor, and when the temperature rises, the second speed-regulated fan 21 speeds up to remove the heat; when the temperature decreases, the second speed-regulated fan 21 slows down to reduce power consumption and noise.

[0034] ​In an embodiment, the main control area 20 occupies less space than the power supply area 10, and therefore, in this embodiment, the air inlet of the main control area 20 is arranged on the first side plate 104 of the cabinet, the air outlet is arranged on the second side plate 105 adjacent to the first side plate 104, and the second speed-regulating fan 21 is arranged at the air inlet and / or the air outlet. The cooperation of the second speed-regulating fan 21 and the second heat sink 22 arranged on the core device can ensure the temperature stability of the main control area 20, ensure the efficient completion of the computing task, and avoid the influence of excessively high temperature on the stability and reliability of each component in the main control area 20.

[0035] In an embodiment, the measurement area 30 is the most critical area in the entire system, and the built-in superconducting acquisition module requires extremely stable temperature. In addition, the circuit in the measurement area 30 often has small heat dissipation, and therefore, in this embodiment, the temperature control system in the measurement area 30 includes a third temperature sensor and a heat source regulator. The third temperature sensor is arranged on the measurement circuit in the measurement area 30, and the heat source regulator is connected with the temperature sensor and used to adjust the heat output of the heat source in the superconducting acquisition module. In this embodiment, the heat source regulator can be a PWM-based precision temperature control regulator or a PLC-based precision temperature control regulator to adjust the heat output of the heat source in the superconducting acquisition module. For example, the heat source regulator can adjust the working state of the power device in the power supply area 10 to adjust the heat output of the first heat source, or adjust the temperature control system of the power supply area 10 to increase the heat dissipation of the temperature control system of the power supply area 10, for example, increase the rotating speed of the first speed-regulating fan 11. The heat source regulator can also adjust the working state of the components in the main control area 20 to adjust the heat output of the second heat source, or adjust the temperature control system of the main control area 20 to increase the heat dissipation of the temperature control system of the main control area 20, for example, increase the rotating speed of the second speed-regulating fan 21.

[0036] In an embodiment, in order to further improve the temperature control precision, the measurement area 30 can introduce a semiconductor refrigeration module such as a Peltier refrigerator. The semiconductor refrigeration module uses the passage of current to control the temperature difference, and can provide more precise cooling effect. By adjusting the current in real time, the semiconductor refrigeration module can ensure the temperature stability of the measurement area 30 under different working conditions. The temperature of the measurement area 30 can be accurately maintained in the ideal range, and can resist the influence of external heat sources, so as to ensure that the superconducting acquisition module performs data acquisition under the best working condition, and improve the measurement precision and reliability of the system.

[0037] In the above embodiments of the present application, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0038] The above merely describes the preferred embodiments of the present application, and it should be pointed out that, for those skilled in the art, some improvements and refinements can be made without departing from the principles of the present application, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A superconducting data acquisition module, characterized in that, include: Chassis; Multiple functional zones are distributed inside the chassis. Different functional zones require different temperature control accuracies. The functional zone with the highest temperature control accuracy is separated from other functional zones by a heat insulation plate. Multiple temperature control systems are set up one-to-one in the multiple functional areas, and each system independently controls the temperature of its corresponding functional area. The temperature control accuracy of each system is consistent with the temperature control accuracy required by the corresponding functional area.

2. The superconducting acquisition module as described in claim 1, characterized in that, The heat insulation board is provided between each of the adjacent functional areas.

3. The superconducting acquisition module as described in claim 1, characterized in that, The functional area includes a power supply area, a main control area, and a measurement area, wherein the required temperature control accuracy increases sequentially for the power supply area, the main control area, and the measurement area.

4. The superconducting acquisition module as described in claim 3, characterized in that, The temperature control system in the power supply area includes a first temperature sensor and a first speed-regulating fan. The first temperature sensor is disposed in the space of the power supply area or on a first heat source in the power supply area, and the first speed-regulating fan is disposed on the chassis.

5. The superconducting acquisition module as described in claim 4, characterized in that, The power supply area extends through the chassis, and the first speed-regulating fan is located at both ends of the power supply area, which can form a convection airflow duct in the power supply area.

6. The superconducting acquisition module as described in claim 4 or 5, characterized in that, The first heat source includes multiple power circuit modules, and at least one of the power circuit modules is provided with a first heat sink.

7. The superconducting acquisition module as described in claim 3, characterized in that, The temperature control system in the main control area includes a second temperature sensor, a second speed-regulating fan, and a second heat sink. One side of the second heat sink is in contact with the second heat source in the main control area, and the other side is located in the air duct formed by the second speed-regulating fan. The second temperature sensor is in contact with the second heat source or the second heat sink.

8. The superconducting acquisition module as described in claim 7, characterized in that, The air inlet of the main control area is located on the first side panel of the chassis, and the air outlet is located on the second side panel adjacent to the first side panel. The second speed-regulating fan is located on the air inlet and / or the air outlet.

9. The superconducting acquisition module as described in claim 3, characterized in that, The temperature control system in the measurement area includes a third temperature sensor and a heat source regulator. The third temperature sensor is installed on the measurement circuit in the measurement area, and the heat source regulator is connected to the temperature sensor to adjust the heat output of the heat source in the superconducting acquisition module.

10. The superconducting acquisition module as described in claim 3, characterized in that, A semiconductor cooling module is also installed in the measurement area.

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