Fin radiating structure and radiator

Abstract

The utility model provides a fin radiating structure and a radiator. The fin heat dissipation structure comprises a heat conduction carrier plate and a fin backflow pipe set. A refrigerant cavity is formed in the heat conduction carrier plate; the fin backflow pipe set comprises at least two condensation fin-shaped pipes, and each condensation fin-shaped pipe is obliquely arranged outside the heat conduction carrier plate. The position of a refrigerant gas inlet of each condensation fin-shaped pipe is higher than the position of a refrigerant liquid outlet of the corresponding condensation fin-shaped pipe, and the refrigerant gas inlets communicate with the refrigerant cavity, so that gaseous refrigerants formed by evaporation in the refrigerant cavity can be dispersed into the condensation fin-shaped pipes through the refrigerant gas inlets. Independent heat dissipation is realized through each ventilation gap formed between the adjacent condensation fin-shaped pipes; and the refrigerant liquid outlet is communicated with the refrigerant cavity, so that the gaseous refrigerant in each condensation fin-shaped pipe can be cooled and condensed to form a liquid refrigerant, and the liquid refrigerant can quickly flow back to the position, close to the electronic element, in the refrigerant cavity under the action of gravity to maintain gas-liquid phase change circulation.

Description

Technical Field

[0001] This disclosure relates to the technical field of heat dissipation for electronic components, and in particular to a finned heat dissipation structure and a heat sink. Background Technology

[0002] High-power electronic components such as GTOs, MCTs, and IGBTs generate a significant amount of heat during operation. If this heat accumulates continuously on their surfaces, it can easily lead to a decline in their performance. To improve heat dissipation efficiency, some manufacturers employ heat sink structures, such as those disclosed in Chinese patent document CN216161725U, to cool these components. However, due to their design, when sustained high temperatures occur on the surface of high-power electronic components, a large amount of refrigerant vaporizes and flows into the serpentine tube. This necessitates designing more bends in the serpentine tube to extend the condensation path. As the number of bends increases, the refrigerant experiences greater resistance at these bends, resulting in a slower flow rate. Consequently, the refrigerant struggles to return to the electronic component location for timely gas-liquid phase change circulation, ultimately leading to a decrease in the overall heat dissipation performance of the high-power electronic components. Utility Model Content

[0003] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a finned heat dissipation structure and heat sink that features stable gas-liquid phase change, smooth gas-liquid circulation, and good condensation effect on electronic components.

[0004] The purpose of this disclosure is achieved through the following technical solution:

[0005] A finned heat dissipation structure, comprising:

[0006] A heat-conducting carrier plate has a refrigerant cavity formed inside it, and electronic components are mounted on the outside of the heat-conducting carrier plate. The heat-conducting carrier plate is used to conduct the heat energy of the electronic components to the refrigerant in the refrigerant cavity, so that the liquid refrigerant evaporates to form gaseous refrigerant.

[0007] The finned heat dissipation structure includes a finned return tube assembly;

[0008] The finned return tube assembly includes at least two condensing finned tubes, each of which is inclinedly disposed outside the heat-conducting carrier plate, and a ventilation gap is formed between two adjacent condensing finned tubes. The position of the refrigerant gas inlet of each condensing finned tube is higher than the position of the refrigerant liquid outlet of the corresponding condensing finned tube. The refrigerant gas inlet is connected to the refrigerant cavity to guide gaseous refrigerant into the condensing finned tube to condense into liquid refrigerant. The refrigerant liquid outlet is connected to the refrigerant cavity to guide liquid refrigerant into the refrigerant cavity to exchange heat with the electronic components.

[0009] In some embodiments, each of the condenser fins forms a refrigerant gas inlet at a position higher than the electronic component; each of the condenser fins is inclined downward and forms a refrigerant liquid outlet at a position close to the electronic component to guide the liquid refrigerant back to the position of the electronic component.

[0010] In some embodiments, at least two of the condenser fins are arranged in parallel along a direction perpendicular to the heat-conducting carrier plate and form a condenser assembly; the ventilation gap is formed between two adjacent condenser fins in the same condenser assembly.

[0011] In some embodiments, the finned heat dissipation structure further includes a heat dissipation fan, which is disposed close to the condenser assembly; the air outlet of the heat dissipation fan faces the heat-conducting carrier plate and is connected to each of the ventilation gaps to form a convection air duct.

[0012] In some embodiments, the finned reflux tube assembly further includes a gas collection tower and a liquid collection tower; the gas collection tower and the liquid collection tower are both vertically mounted on the heat-conducting carrier plate and are respectively connected to the refrigerant cavity; the gas collection tower is connected to the refrigerant gas inlet of each of the condensing finned tubes, and the liquid collection tower is connected to the refrigerant liquid outlet of each of the condensing finned tubes.

[0013] In some embodiments, the finned reflux tube assembly further includes a liquid outlet tube; a first end of the liquid outlet tube is connected to the liquid collection tower base; a second end of the liquid outlet tube is connected to the refrigerant chamber and is positioned opposite to one of the electronic components.

[0014] In some embodiments, the finned reflux tube assembly further includes multiple gas-catching conduits; the first ends of the multiple gas-catching conduits are distributed on the heat-conducting carrier plate and are positioned above the electronic components; the first end of each gas-catching conduit is connected to the refrigerant cavity, and the second end of each gas-catching conduit is connected to the gas collection tower base.

[0015] In some embodiments, the finned heat dissipation structure further includes a plurality of heat dissipation fins; the plurality of heat dissipation fins are arranged on the thermally conductive carrier plate and correspond to the positions of the electronic components; and / or,

[0016] The heat-conducting carrier plate includes a copper plate and an aluminum plate composite that are bonded together, with the refrigerant cavity formed within the aluminum plate composite; the outer surface of the copper plate is used to mount the electronic components.

[0017] In some embodiments, the condenser fins extend in a straight line.

[0018] A heat sink includes the finned heat dissipation structure of any of the above embodiments.

[0019] Compared with the prior art, this disclosure has at least the following advantages:

[0020] In the aforementioned finned heat dissipation structure, because the electronic components are mounted outside the heat-conducting carrier plate, the liquid refrigerant in the refrigerant cavity absorbs the heat generated by the electronic components and evaporates into gaseous refrigerant. Because the gaseous refrigerant has a lower density than the liquid refrigerant, it accumulates at higher positions within the refrigerant cavity. Furthermore, since at least two condensing finned tubes are inclinedly positioned outside the heat-conducting carrier plate, and the refrigerant gas inlet of each condensing finned tube is connected to the refrigerant cavity, the gaseous refrigerant evaporated within the refrigerant cavity can be dispersed into each condensing finned tube through the respective refrigerant gas inlets. It can then independently dissipate heat through the ventilation gaps formed between adjacent condensing finned tubes, accommodating the simultaneous condensation of a large amount of gaseous refrigerant. Subsequently, the liquid refrigerant outlet, located below the refrigerant gas inlet on each condensing finned tube, is connected to the refrigerant cavity, allowing the gaseous refrigerant within each condensing finned tube to condense and dissipate heat, forming liquid refrigerant. The liquid refrigerant can then rapidly flow back into the refrigerant cavity near the electronic components under gravity to maintain the gas-liquid phase change cycle, ultimately ensuring stable heat dissipation for the high-power electronic components. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a finned heat dissipation structure according to an embodiment of the present disclosure;

[0023] Figure 2 for Figure 1 A cross-sectional view of the finned heat dissipation structure shown;

[0024] Figure 3 This is a schematic diagram of the finned heat dissipation structure according to another embodiment of the present disclosure;

[0025] Figure 4 This is a cross-sectional view of a finned heat dissipation structure according to yet another embodiment of the present disclosure;

[0026] Figure 5 for Figure 4 The enlarged view shown at point A in the middle;

[0027] Figure 6 This is a schematic flowchart illustrating a method for manufacturing a finned heat dissipation structure according to another embodiment of this disclosure.

[0028] Figure label:

[0029] 10. Electronic components;

[0030] 100. Heat-conducting carrier plate; 110. Copper plate body; 120. Aluminum plate composite; 101. Refrigerant cavity;

[0031] 200. Finned reflux pipe assembly; 210. Condenser assembly row; 211. Condenser finned tube; 2110. Condenser main pipe; 2111. Lower liquid collection chamber; 211a. Capillary guide groove; 2120. End pipe; 2130. Capillary gas trap; 2131. Capillary condenser reset spring wire; 213a. Liquid collection tip; 220. Gas collection tower base; 2210. Arc-shaped limiting slide groove; 230. Liquid accumulation tower base; 240. Liquid outlet pipe; 250. Gas trap duct; 201. Ventilation gap;

[0032] 300. Cooling fan;

[0033] 400. Heat dissipation fins. Detailed Implementation

[0034] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0038] Please refer to the following: Figure 1 and Figure 2One embodiment of the finned heat dissipation structure includes a heat-conducting carrier plate 100 and a finned return pipe assembly 200; a refrigerant cavity 101 is formed inside the heat-conducting carrier plate 100, and an electronic component 10 is mounted on the outside of the heat-conducting carrier plate 100; the heat-conducting carrier plate 100 is used to conduct the heat energy of the electronic component 10 to the refrigerant in the refrigerant cavity 101, so that the liquid refrigerant evaporates to form a gaseous refrigerant; the finned return pipe assembly 200 includes at least two condensing finned tubes 211, each condensing finned tube 211 being inclinedly arranged in the heat-conducting carrier plate 100. A ventilation gap 201 is formed outside the heat transfer plate 100 and between two adjacent condenser finned tubes 211. The refrigerant gas inlet of each condenser finned tube 211 is positioned higher than the refrigerant liquid outlet of the corresponding condenser finned tube 211. The refrigerant gas inlet is connected to the refrigerant cavity 101 to guide gaseous refrigerant into the condenser finned tube 211 to condense and form liquid refrigerant. The refrigerant liquid outlet is connected to the refrigerant cavity 101 to guide liquid refrigerant into the refrigerant cavity 101 to exchange heat with the electronic components 10. In one embodiment, the condenser finned tubes 211 extend in a straight line, enabling the gaseous refrigerant to flow in a straight line, thereby accelerating the heat dissipation and condensation of the gaseous refrigerant to form liquid refrigerant.

[0039] It is understandable that since the electronic component 10 is installed outside the heat-conducting carrier plate 100, the liquid refrigerant in the refrigerant cavity 101 can absorb the heat generated by the electronic component 10 and evaporate to form gaseous refrigerant. Because the density of the gaseous refrigerant is less than that of the liquid refrigerant, it will accumulate at a higher position in the refrigerant cavity 101. Furthermore, since at least two condenser finned tubes 211 are inclinedly arranged outside the heat-conducting carrier plate 100, the refrigerant gas inlet of each condenser finned tube 211 is connected to the refrigerant chamber 101, so that the gaseous refrigerant formed by evaporation in the refrigerant chamber 101 can be dispersed into each condenser finned tube 211 through each refrigerant gas inlet, and can be dissipated independently through each ventilation gap 201 formed between adjacent condenser finned tubes 211, in order to adapt to the situation of a large amount of gaseous refrigerant condensing at the same time. Then, the refrigerant liquid outlet set on each condenser finned tube 211 at a lower position than the refrigerant gas inlet is connected to the refrigerant chamber 101, so that the gaseous refrigerant in each condenser finned tube 211 can dissipate heat and condense to form liquid refrigerant. The liquid refrigerant can be quickly returned to the position of the refrigerant chamber 101 near the electronic component 10 under the influence of gravity to maintain the gas-liquid phase change cycle, and finally make the heat dissipation of the high-power electronic component 10 stable.

[0040] Please see Figure 2As shown, in some embodiments, the extension direction of each condenser fin 211 is inclined to the horizontal direction. It can be understood that since the extension direction of each condenser fin 211 is inclined to the horizontal direction, each condenser fin 211 exhibits a situation where one end is higher than the other in the plane of gravity. Specifically, each condenser fin 211 is inclined from the corresponding refrigerant gas inlet to the corresponding refrigerant liquid outlet, so that the gaseous refrigerant in each condenser fin 211 can move from the refrigerant gas inlet to the refrigerant liquid outlet along the inclined direction under the action of gravity. During this process, the gaseous refrigerant dissipates heat and condenses to form liquid refrigerant, and the liquid refrigerant experiences little resistance in its straight flow. The liquid refrigerant can quickly flow back into the refrigerant cavity 101 through the refrigerant liquid outlet to cool the electronic component 10.

[0041] Please see Figure 3 In some embodiments, the finned heat dissipation structure further includes a heat dissipation fan 300, which is positioned close to the condenser assembly 210. The air outlet of the heat dissipation fan 300 faces the heat-conducting carrier plate 100 and is connected to each ventilation gap 201 to form a convection air duct. It can be understood that since the air outlet of the heat dissipation fan 300 is positioned facing the heat-conducting carrier plate 100, the air blown from the air outlet of the heat dissipation fan 300 can dissipate heat from the heat-conducting carrier plate 100. The air can further carry away the heat in each ventilation gap 201 through the convection air duct, thereby accelerating the condensation of gaseous refrigerant in the condenser finned tube 211.

[0042] Please refer to the following: Figure 2 and Figure 3 In some embodiments, the finned return pipe assembly 200 further includes a gas collection tower 220 and a liquid collection tower 230; both the gas collection tower 220 and the liquid collection tower 230 are vertically mounted on the heat-conducting carrier plate 100 and are respectively connected to the refrigerant chamber 101; the gas collection tower 220 is connected to the refrigerant gas inlet of each condenser finned tube 211, and the liquid collection tower 230 is connected to the refrigerant liquid outlet of each condenser finned tube 211. It can be understood that, since the gas collection tower 220, vertically mounted on the heat-conducting carrier plate 100, is connected to the refrigerant chamber 101, it can uniformly collect the gaseous refrigerant generated in the refrigerant chamber 101, and through the gas collection tower 220 connected to the refrigerant gas inlet of each condenser finned tube 211, the gaseous refrigerant can be evenly distributed to each condenser finned tube 211. Furthermore, since the liquid collection tower 230, which is vertically installed on the heat-conducting carrier plate 100, is connected to the refrigerant chamber 101, and is connected to the refrigerant liquid outlet of each condenser finned tube 211 through the liquid collection tower 230, the liquid refrigerant condensed in each condenser finned tube 211 can be concentrated in the liquid collection tower 230 and then enter the refrigerant chamber 101, ensuring the consistency of the refrigerant quality flowing back into the refrigerant chamber 101.

[0043] Please see Figure 1In some embodiments, each condenser fin 211 is a flat straight tube, and the width direction of each condenser fin 211 is aligned with the direction of gravity. It can be understood that, since the width direction of each condenser fin 211 is aligned with the direction of gravity, the density of the gaseous refrigerant in each condenser fin 211 is less than the density of the liquid refrigerant. That is, the gaseous refrigerant floats in the upper layer of the condenser fin 211, while the liquid refrigerant sinks in the lower layer. This separates the gaseous and liquid refrigerants, reducing heat exchange or obstruction between them. This not only improves the condensation efficiency of the gaseous refrigerant but also accelerates the return flow rate of the liquid refrigerant.

[0044] Typically, since the gaseous refrigerant floats in the upper part of the condenser finned tube 211, and the flow velocity of the gaseous refrigerant is often greater than that of the liquid refrigerant, the gaseous refrigerant, which is prone to not condensing, enters the refrigerant chamber 101 near the electronic component 10 before the liquid refrigerant that is formed by condensation. This causes bubbles to be generated in the refrigerant chamber 101 near the electronic component 10. The bubbles occupy the contact area between the liquid refrigerant and the electronic component 10, thereby reducing the heat exchange efficiency of the electronic component 10.

[0045] To reduce the impact of air bubbles on electronic component 10, please refer to the following: Figure 4 and Figure 5In one embodiment, the condenser finned tube 211 includes a condenser main tube 2110, two end tubes 2120, and a capillary gas trap 2130. The inner diameter of the condenser main tube 2110 gradually decreases along the direction of gravity, and a lower liquid collection chamber 2111 is formed at the bottom of the condenser main tube 2110. One end tube 2120 is fixed to the first side end of the lower liquid collection chamber 2111 and rotatably connected to the gas collection tower base 220. The other end tube 2120 is fixed to the second side end of the lower liquid collection chamber 2111 and rotatably connected to the liquid collection tower base 230. The gas collection tower base 220 and the liquid collection tower base 230 are respectively connected to the lower liquid collection chamber 2111 through the corresponding end tubes 2120. The capillary gas trap 2130 is vertically arranged inside the condenser main tube 2110 and rotatably connected to the inner wall of the lower liquid collection chamber 2111. A ventilation gap 201 is formed between the condenser main tubes 2110 of two adjacent condenser finned tubes 211. It is understandable that, since the end pipe 2120 fixed to the first side end of the lower liquid collection chamber 2111 is rotatably connected to the gas collecting tower base 220, and the end pipe 2120 fixed to the second side end of the lower liquid collection chamber 2111 is rotatably connected to the liquid collecting tower base 230, the condensing main pipe 2110 rotates between the gas collecting tower base 220 and the liquid collecting tower base 230. Furthermore, since the inner diameter of the condensing main pipe 2110 gradually decreases along the direction of gravity, the liquid refrigerant will accumulate in the lower liquid collection chamber 2111 along the inner wall of the condensing main pipe 2110. At this time, the center of gravity of the condensing main pipe 2110 will shift and rotate, causing it to tilt. The ventilation gap 2 between the air outlet of the cooling fan 300 and the two adjacent condensing main pipes 2110... The 01 connection forms a convection air duct. The airflow from the cooling fan 300 blows the condenser main pipe 2110, causing it to oscillate. This oscillation causes the capillary gas-catching mesh 2130, connected to the inner wall of the lower liquid collection chamber 2111, to oscillate synchronously, capturing more gaseous refrigerant floating in the condenser main pipe 2110. The gaseous refrigerant, interfered with by the capillary gas-catching mesh 2130, not only slows its flow but also condenses into liquid refrigerant. Under the combined effects of oscillation and gravity, the liquid refrigerant accumulates more quickly in the lower liquid collection chamber 2111 and then enters the refrigerant chamber 101 through the liquid collection tower 230, thus reducing the occurrence of gaseous refrigerant entering the condenser main pipe 2110. Please refer to [link / reference]. Figure 5 In some embodiments, the bottom of the capillary gas-catching mesh 2130 extends into the lower liquid collection chamber 2111 and forms a liquid collection tip 213a, so that the liquid refrigerant dispersed on the capillary gas-catching mesh 2130 is accelerated to gather into large droplets through the liquid collection tip 213a, and is eventually quickly collected into the lower liquid collection chamber 2111.

[0046] Furthermore, due to the large width of the capillary air-catching mesh 2130, if the airflow intensity of the cooling fan 300 is weak, the capillary air-catching mesh 2130 may come to rest after tilting and falling over. To solve the above problem, please refer to... Figure 5In one embodiment, the capillary gas-catching mesh 2130 is connected to the inner wall of the condenser main pipe 2110 by a plurality of capillary condensation reset elastic wires 2131 on both sides. When the capillary gas-catching mesh 2130 is tilted and fallen, if the airflow intensity of the cooling fan 300 is weak, the capillary condensation reset elastic wires 2131 are compressed to form a reset elastic force, so that the capillary gas-catching mesh 2130 can continuously oscillate back and forth. At the same time, the capillary condensation reset elastic wires 2131 can also impede the gaseous refrigerant to accelerate the condensation of the gaseous refrigerant. Specifically, the plurality of capillary condensation reset elastic wires 2131 are vertically spaced along the capillary gas-catching mesh 2130.

[0047] Furthermore, due to the pipe diameter limitation of end pipe 2120 and the increased condensation efficiency of gaseous refrigerant, the condensed liquid refrigerant may accumulate in the lower liquid collection chamber 2111. Please refer to [link / reference needed]. Figure 5 Therefore, in some embodiments, the bottom of the lower liquid collection chamber 2111 is provided with a capillary guide groove 211a, which extends from the gas collection tower base 220 to the liquid collection tower base 230, so that the liquid refrigerant in the lower liquid collection chamber 2111 can flow towards the liquid collection tower base 230 faster through capillary action along the capillary guide groove 211a.

[0048] Typically, as the amount of liquid refrigerant accumulating in the condenser pipe 2110 increases, the condenser pipe 2110 is more prone to tipping to one side due to uneven stress. In the tipped condenser pipe 2110, the liquid refrigerant is more likely to escape from the lower collection chamber 2111, further slowing down the liquid refrigerant discharge efficiency. Therefore, please refer to... Figure 5 In one embodiment, an arc-shaped limiting groove 2210 is formed on the outer wall of the gas collection tower base 220 at a position higher than the lower liquid collection chamber 2111. A retaining post protrudes from the outer wall of the condensing main pipe 2110 into the arc-shaped limiting groove 2210. The retaining post is movably accommodated in the arc-shaped limiting groove 2210, so that the condensing main pipe 2110 can only swing within the central angle range corresponding to the arc-shaped limiting groove 2210, and will not fall over, thus ultimately preventing the liquid refrigerant from leaving the lower liquid collection chamber 2111.

[0049] Typically, if the exhaust force of the cooling fan 300 is strong, the airflow in the ventilation gap 201 will convect rapidly. Although this results in high heat dissipation efficiency, the contact heat exchange time between the air and the condenser finned tube 211 is also short, which will cause the cooling fan 300 to waste power.

[0050] Please refer to the following: Figure 4 and Figure 5In one embodiment, there are multiple condenser finned tubes 211, which are divided into two condenser assembly rows 210. The two condenser assembly rows 210 are arranged in a hierarchical manner in the direction of gravity, and the condenser finned tubes 211 in the two condenser assembly rows 210 are staggered. The heat dissipation fan 300 is close to the condenser assembly row 210 located at the bottom. It is understandable that, due to the staggered arrangement of the condenser finned tubes 211 in the two condenser combination rows 210, and the proximity of the cooling fan 300 to the bottom condenser combination row 210, when the cooling fan 300 is turned on, the air blown out by the cooling fan 300 will first act on the bottom condenser combination row 210. The air direction will be changed by the turbulence caused by the swinging of the condenser main pipe 2110 in the bottom condenser combination row 210. After acting on the condenser main pipe 2110 in the top condenser combination row 210, the air will be turbulent again, so as to prolong the contact heat exchange time between the air and the condenser finned tubes 211, thereby reducing the waste of power of the cooling fan 300.

[0051] Please see Figure 3 In some embodiments, each condenser finned tube 211 forms a refrigerant gas inlet at a position higher than the electronic component 10; each condenser finned tube 211 is inclined downwards and forms a refrigerant liquid outlet near the electronic component 10 to guide the liquid refrigerant back to the position of the electronic component 10. It can be understood that since the refrigerant in the refrigerant cavity 101 absorbs heat from the electronic component 10 and evaporates to form gaseous refrigerant, the gaseous refrigerant accumulates in the refrigerant cavity 101 at a position higher than the electronic component 10. By forming refrigerant gas inlets at positions higher than the electronic component 10 on each condenser finned tube 211, the accumulated gaseous refrigerant can be guided into the condenser finned tube 211 to condense and form liquid refrigerant, thereby improving the guiding efficiency of the gaseous refrigerant. Furthermore, since the refrigerant liquid outlet is formed at a position on the condenser finned tube 211 near the electronic component 10, the liquid refrigerant can flow back to the position near the electronic component 10 more quickly, thereby accelerating the heat dissipation of the electronic component 10.

[0052] Please see Figure 1 In some embodiments, at least two condensing finned tubes 211 are arranged parallel to each other in a direction perpendicular to the heat-conducting carrier plate 100, forming a condensing assembly 210; a ventilation gap 201 is formed between two adjacent condensing finned tubes 211 in the same condensing assembly 210. It can be understood that since at least two condensing finned tubes 211 are arranged parallel to each other in a direction perpendicular to the heat-conducting carrier plate 100 to form a condensing assembly 210, the condensing assembly 210 can make the structure of the finned return tube assembly 200 more compact and robust and save design space. The ventilation gaps 201 formed between two adjacent condensing finned tubes 211 can independently dissipate heat from the gaseous refrigerant dispersed in the corresponding condensing finned tube 211, thereby accelerating the heat dissipation efficiency of the gaseous refrigerant.

[0053] Please refer to the following: Figure 2 and Figure 3 In some embodiments, the finned return pipe assembly 200 further includes a liquid outlet pipe 240; the first end of the liquid outlet pipe 240 is connected to the liquid collection tower base 230; the second end of the liquid outlet pipe 240 is connected to the refrigerant chamber 101 and is positioned opposite to an electronic component 10. It can be understood that because the first end of the liquid outlet pipe 240 is connected to the liquid collection tower base 230, and the second end of the liquid outlet pipe 240 connected to the refrigerant chamber 101 is positioned opposite to an electronic component 10, the liquid refrigerant in the liquid collection tower base 230 can be directed towards the position of an electronic component 10 via the liquid outlet pipe 240, thereby accelerating the heat dissipation of each electronic component 10.

[0054] Please see Figure 3 In some embodiments, the finned reflux pipe assembly 200 further includes multiple gas-catching conduits 250; the first ends of the multiple gas-catching conduits 250 are distributed on the heat-conducting carrier plate 100 and are positioned above the electronic component 10; the first end of each gas-catching conduit 250 is connected to the refrigerant cavity 101, and the second end of each gas-catching conduit 250 is connected to the liquid collection tower base 230. It can be understood that because the first ends of the multiple gas-catching conduits 250 are distributed on the heat-conducting carrier plate 100 above the electronic component 10 and are connected to the refrigerant cavity 101, the multiple gas-catching conduits 250 can collectively capture the gaseous refrigerant dispersed in the refrigerant cavity 101 above the electronic component 10, thereby accelerating the entry of the gaseous refrigerant into the gas collection tower base 220 and improving the condensation efficiency of the finned reflux pipe assembly 200 for the gaseous refrigerant.

[0055] Please see Figure 2 As shown, in some embodiments, the finned heat dissipation structure further includes a plurality of heat dissipation fins 400; the plurality of heat dissipation fins 400 are arranged on the heat-conducting carrier plate 100 and correspond to the positions of the electronic components 10. It can be understood that since the plurality of heat dissipation fins 400 are arranged on the heat-conducting carrier plate 100 at the positions corresponding to the electronic components 10, the heat dissipation fins 400 can accelerate the heat dissipation at the positions of the electronic components 10 on the heat-conducting carrier plate 100, thereby reducing the accumulation of temperature at the electronic components 10.

[0056] In some embodiments, the heat-conducting carrier plate 100 includes a copper plate body 110 and an aluminum plate composite 120 bonded together, with a refrigerant cavity 101 formed within the aluminum plate composite 120; the outer surface of the copper plate body 110 is used to mount electronic components 10. It is understood that because the refrigerant cavity 101 is formed within the aluminum plate composite 120, the aluminum plate composite 120 forms a dense oxide film on the cavity wall of the refrigerant cavity 101, thereby reducing the reaction with the refrigerant such as tetrafluoroethane within the refrigerant cavity 101 and improving the service life of the heat-conducting carrier plate 100. By mounting the electronic components 10 on the outer surface of the copper plate body 110, heat can be acceleratedly conducted to the refrigerant cavity 101 within the aluminum plate composite 120 through the copper plate body 110. In this embodiment, the copper plate body 110 is a copper sheet, the aluminum plate composite 120 is a structure formed by bonding and brazing at least two layers of aluminum sheets, the refrigerant cavity 101 is formed between two adjacent aluminum sheets, each condenser fin tube 211 is installed obliquely on the outside of the aluminum plate composite 120, and the refrigerant gas inlet and the refrigerant liquid outlet of each condenser fin tube 211 are connected to the refrigerant cavity 101.

[0057] Please combine Figure 6 As shown, this disclosure also provides a method for manufacturing a finned heat dissipation structure, applicable to the manufacturing of the finned heat dissipation structure of any of the above embodiments, including some or all of the following steps:

[0058] Obtain the carrier substrate assembly and the return pipe assembly;

[0059] In this embodiment, the carrier substrate assembly includes a copper-aluminum composite base plate and an aluminum cover plate, while the return pipe assembly consists entirely of aluminum pipes, including gas collection pipes, liquid collection pipes, and condensation pipes.

[0060] After milling the refrigerant cavity of the carrier substrate assembly, a heat-conducting carrier plate is obtained.

[0061] Please combine Figure 1 As shown, in this embodiment, the assembly operation after milling the refrigerant cavity includes: using a CNC machine tool to mill the aluminum plate layer of the copper-aluminum composite base plate to form a refrigerant groove on the aluminum plate layer; using a CNC machine tool to mill the aluminum cover plate to match the aluminum cover plate with the copper-aluminum composite base plate; performing an oil removal operation on the milled copper-aluminum composite base plate and aluminum cover plate to remove the residue of cutting fluid and lubricating oil applied before milling, so as to reduce the subsequent welding defects caused by residues, such as uneven plating, blistering or peeling; assembling the aluminum cover plate and the aluminum plate layer of the copper-aluminum composite base plate to close the refrigerant groove and form the refrigerant cavity 101, thus obtaining the heat-conducting carrier plate 100. Specifically, an explosive welding operation is performed on the copper plate 110 and the aluminum plate layer that are bonded together to obtain a copper-aluminum composite base plate. The shock wave generated during the explosion can quickly remove the oxide film on the surface of the aluminum plate layer, thereby making the copper plate 110 and the aluminum plate layer firmly welded together.

[0062] After slitting and rolling the return pipe assembly, a finned return pipe assembly is obtained.

[0063] Please combine Figure 3 As shown, in this embodiment, the assembly operation after slitting and rolling includes: milling the gas collection pipe using a CNC machine tool to obtain the gas collection tower seat 220; milling the liquid collection pipe using a CNC machine tool to obtain the liquid collection tower seat 230; degreasing the gas collection tower seat 220 and the liquid collection tower seat 230 to remove the residue of cutting fluid and lubricating oil applied before milling, so as to reduce the subsequent welding defects caused by residues, such as uneven coating, blistering or peeling; cutting the condenser pipe into equal lengths to obtain at least two condenser straight pipes of equal length; rolling each condenser straight pipe to obtain at least two condenser finned pipes 211; wherein, the condenser finned pipes 211 are all flat straight pipes; assembling the gas collection tower seat 220, the liquid collection tower seat 230 and the condenser finned pipes 211 to obtain the finned return pipe assembly 200.

[0064] After assembling the heat-conducting carrier plate and the finned return pipe assembly, a brazing operation is performed to connect the refrigerant cavity of the heat-conducting carrier plate with the finned return pipe assembly to form a refrigerant phase change circuit.

[0065] In this embodiment, the brazing operation after assembly includes: assembling the heat-conducting carrier plate 100 and the finned return pipe assembly 200 so that the refrigerant cavity 101 is connected to the finned return pipe assembly 200 to form a refrigerant phase change circuit; and performing integral brazing on the heat-conducting carrier plate 100 and the finned return pipe assembly 200 so that the heat-conducting carrier plate 100 and the finned return pipe assembly 200 are connected as one unit.

[0066] A finned heat dissipation structure is obtained by vacuum injection of refrigerant into the refrigerant phase change circuit followed by sealing.

[0067] In this embodiment, the sealing operation after vacuum refrigerant injection includes: evacuating the refrigerant phase change circuit to create a negative pressure environment within it. Under negative pressure, the refrigerant has a lower boiling point and is more likely to evaporate and circulate at low temperatures, for example, evaporating at 35°C to 40°C for internal circulation; slowly injecting refrigerant through the low-pressure side of the refrigerant phase change circuit. When the refrigerant phase change circuit is under negative pressure, the air and moisture inside will be vented to maintain the vacuum, which not only facilitates refrigerant injection but also effectively ensures the normal operation of the refrigerant phase change cycle; and sealing the refrigerant phase change circuit to obtain a finned heat dissipation structure. By sealing the connection points of the heat-conducting carrier plate 100 and the finned return pipe assembly 200, the airtightness of the refrigerant phase change circuit can be improved, thereby stabilizing the vacuum level of the refrigerant phase change circuit and ultimately extending the service life of the finned heat dissipation structure.

[0068] It is understandable that the refrigerant cavity 101 can be formed inside the heat-conducting carrier plate 100 by milling and assembling the refrigerant cavity after milling and rolling the refrigerant tube assembly. The gas collecting tower 220, liquid collecting tower 230 and at least two condensing finned tubes 211 formed from the components of the refrigerant tube assembly can be assembled into a finned refrigerant tube assembly 200. After that, the heat-conducting carrier plate 100 and the finned refrigerant tube assembly 200 can be brazed after assembly to make the heat-conducting carrier plate 100 and the finned refrigerant tube assembly 200 tightly connected, so that the refrigerant cavity 101 is connected to the finned refrigerant tube assembly 200 to form a refrigerant phase change circuit. Finally, the refrigerant phase change circuit is vacuum-injected and then sealed, which not only maintains the vacuum degree of the refrigerant phase change circuit, but also reduces the boiling point of the refrigerant to improve the heat exchange efficiency of the evaporation cycle. In this way, the finned heat dissipation structure made by the finned heat dissipation structure manufacturing method can dissipate heat from the gaseous refrigerant individually through at least two condensing finned tubes 211, and guide the liquid refrigerant to flow back quickly to the refrigerant chamber 101 to dissipate heat from the electronic components 10.

[0069] This disclosure also provides a heat sink, including the finned heat dissipation structure of any of the above embodiments. By applying the finned heat dissipation structure of this disclosure to a heat sink, since the electronic component 10 is mounted outside the heat-conducting carrier plate 100, the liquid refrigerant in the refrigerant cavity 101 can absorb the heat generated by the electronic component 10 and evaporate to form gaseous refrigerant. Because the gaseous refrigerant has a lower density than the liquid refrigerant, it will accumulate at a higher position in the refrigerant cavity 101. Furthermore, since at least two condenser finned tubes 211 are inclinedly arranged outside the heat-conducting carrier plate 100, the refrigerant gas inlet of each condenser finned tube 211 is connected to the refrigerant chamber 101, so that the gaseous refrigerant formed by evaporation in the refrigerant chamber 101 can be dispersed into each condenser finned tube 211 through each refrigerant gas inlet, and can be dissipated independently through each ventilation gap 201 formed between adjacent condenser finned tubes 211, in order to adapt to the situation of a large amount of gaseous refrigerant condensing at the same time. Then, the refrigerant liquid outlet set on each condenser finned tube 211 at a lower position than the refrigerant gas inlet is connected to the refrigerant chamber 101, so that the gaseous refrigerant in each condenser finned tube 211 can dissipate heat and condense to form liquid refrigerant. The liquid refrigerant can be quickly returned to the position of the refrigerant chamber 101 near the electronic component 10 under the influence of gravity to maintain the gas-liquid phase change cycle, and finally make the heat dissipation of the high-power electronic component 10 stable.

[0070] Compared with the prior art, this disclosure has at least the following advantages:

[0071] In the aforementioned finned heat dissipation structure, since the electronic component 10 is installed outside the heat-conducting carrier plate 100, the liquid refrigerant in the refrigerant cavity 101 can absorb the heat generated by the electronic component 10 and evaporate to form gaseous refrigerant. Because the density of the gaseous refrigerant is less than that of the liquid refrigerant, it will accumulate at a higher position in the refrigerant cavity 101. Furthermore, since at least two condenser finned tubes 211 are inclinedly arranged outside the heat-conducting carrier plate 100, the refrigerant gas inlet of each condenser finned tube 211 is connected to the refrigerant chamber 101, so that the gaseous refrigerant formed by evaporation in the refrigerant chamber 101 can be dispersed into each condenser finned tube 211 through each refrigerant gas inlet, and can be dissipated independently through each ventilation gap 201 formed between adjacent condenser finned tubes 211, in order to adapt to the situation of a large amount of gaseous refrigerant condensing at the same time. Then, the refrigerant liquid outlet set on each condenser finned tube 211 at a lower position than the refrigerant gas inlet is connected to the refrigerant chamber 101, so that the gaseous refrigerant in each condenser finned tube 211 can dissipate heat and condense to form liquid refrigerant. The liquid refrigerant can be quickly returned to the position of the refrigerant chamber 101 near the electronic component 10 under the influence of gravity to maintain the gas-liquid phase change cycle, and finally make the heat dissipation of the high-power electronic component 10 stable.

[0072] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A finned heat dissipation structure, comprising: A heat-conducting carrier plate has a refrigerant cavity formed inside it, and electronic components are mounted on the outside of the heat-conducting carrier plate. The heat-conducting carrier plate is used to conduct the heat energy of the electronic components to the refrigerant in the refrigerant cavity, so that the liquid refrigerant evaporates to form gaseous refrigerant. The finned heat dissipation structure is characterized by comprising a finned return tube assembly; The finned return tube assembly includes at least two condensing finned tubes, each of which is inclinedly disposed outside the heat-conducting carrier plate, and a ventilation gap is formed between two adjacent condensing finned tubes. The position of the refrigerant gas inlet of each condensing finned tube is higher than the position of the refrigerant liquid outlet of the corresponding condensing finned tube. The refrigerant gas inlet is connected to the refrigerant cavity to guide gaseous refrigerant into the condensing finned tube to condense into liquid refrigerant. The refrigerant liquid outlet is connected to the refrigerant cavity to guide liquid refrigerant into the refrigerant cavity to exchange heat with the electronic components.

2. The finned heat dissipation structure according to claim 1, characterized in that, Each of the condenser finned tubes forms a refrigerant gas inlet at a position higher than the electronic component; each of the condenser finned tubes is inclined downwards and forms a refrigerant liquid outlet at a position close to the electronic component, so as to guide the liquid refrigerant back to the position of the electronic component.

3. The finned heat dissipation structure according to claim 1, characterized in that, At least two of the condenser finned tubes are arranged in parallel along a direction perpendicular to the heat-conducting carrier plate and form a condenser assembly; the ventilation gap is formed between two adjacent condenser finned tubes in the same condenser assembly.

4. The finned heat dissipation structure according to claim 3, characterized in that, The finned heat dissipation structure also includes a heat dissipation fan, which is located close to the condenser assembly. The air outlet of the heat dissipation fan faces the heat-conducting carrier plate and is connected to each of the ventilation gaps to form a convection air duct.

5. The finned heat dissipation structure according to claim 1, characterized in that, The finned reflux tube assembly also includes a gas collection tower and a liquid collection tower; the gas collection tower and the liquid collection tower are both vertically mounted on the heat-conducting carrier plate and are respectively connected to the refrigerant cavity; the gas collection tower is connected to the refrigerant gas inlet of each of the condensing finned tubes, and the liquid collection tower is connected to the refrigerant liquid outlet of each of the condensing finned tubes.

6. The finned heat dissipation structure according to claim 5, characterized in that, The finned reflux pipe assembly also includes a liquid outlet pipe; the first end of the liquid outlet pipe is connected to the liquid collection tower base; the second end of the liquid outlet pipe is connected to the refrigerant chamber and is positioned opposite to one of the electronic components.

7. The finned heat dissipation structure according to claim 5, characterized in that, The finned reflux tube assembly also includes multiple gas-catching conduits; the first ends of the multiple gas-catching conduits are distributed on the heat-conducting carrier plate and are higher than the position of the electronic components; the first end of each gas-catching conduit is connected to the refrigerant cavity, and the second end of each gas-catching conduit is connected to the gas collection tower base.

8. The finned heat dissipation structure according to claim 1, characterized in that, The finned heat dissipation structure further includes a plurality of heat dissipation fins; the plurality of heat dissipation fins are arranged on the heat-conducting carrier plate and correspond to the positions of the electronic components; and / or The heat-conducting carrier plate includes a copper plate and an aluminum plate composite that are bonded together, with the refrigerant cavity formed within the aluminum plate composite; the outer surface of the copper plate is used to mount the electronic components.

9. The finned heat dissipation structure according to claim 1, characterized in that, The condenser finned tube extends in a straight line.

10. A radiator, characterized in that, The finned heat dissipation structure includes any one of claims 1 to 9.

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