Bare chip feeding device for SMT (Surface Mount Technology)

Abstract

The utility model provides a bare chip feeding device for SMT (surface mount technology), which relates to the technical field of SMT and comprises a substrate, at least one accommodating groove and a fixing mechanism. The containing groove is formed in the substrate and used for containing a waffle box containing a bare chip, and a gap is formed between the inner wall of the containing groove and the outer wall of the waffle box; the fixing mechanism is arranged on the base plate, corresponds to the containing groove and is used for enabling the waffle box to abut against the containing groove in a releasable mode. At least one containing groove is formed in the substrate and used for containing the waffle box containing the bare chip, and the fixing mechanism corresponding to the containing groove is arranged and used for enabling the waffle box to abut against the containing groove in a releasable mode, so that reliable fixing of the waffle box is achieved, and meanwhile taking and placing are convenient.

Description

Technical Field

[0001] This utility model relates to the field of SMT technology, and in particular to a bare chip feeding device for SMT assembly. Background Technology

[0002] Surface Mount Technology (SMT) is an important technology in the electronics assembly industry. It directly mounts electronic components onto the surface of a printed circuit board (PCB), instead of inserting the component leads into holes in the PCB as in through-hole mounting. SMT offers advantages such as high assembly density, high reliability, and high production efficiency, and is widely used in various electronic products.

[0003] In the SMT production process, the feeding device is an essential piece of equipment. It is responsible for accurately and stably feeding electronic components to the pick-and-place machine so that the placement head can pick them up and mount them onto the PCB. For traditional components such as chip resistors and capacitors, tape, tube, or tray feeding devices are usually used.

[0004] In recent years, with the continuous development of integrated circuit technology, more and more bare dies are being directly used in SMT production. A bare die refers to an unpackaged integrated circuit chip, which has advantages such as small size, light weight, and high performance, but is also more fragile and susceptible to static electricity, mechanical damage, etc.

[0005] A waffle pack is a common method of packaging bare chips. It places the bare chip in regularly arranged grooves to protect the chip and facilitate transportation and retrieval.

[0006] Chinese patent application CN114408469A discloses an automatic tray feeding mechanism for SMT processing, which fixes the tray. However, it targets the entire tray that carries the surface mount components, rather than the smaller waffle cassette. Therefore, it cannot solve the problem of feeding bare chips in SMT production.

[0007] Therefore, it is necessary to improve the existing bare chip feeding technology for SMT assembly in order to overcome the shortcomings of the existing technology. Utility Model Content

[0008] To overcome the problems existing in related technologies, the purpose of this utility model is to provide a bare die feeding device for SMT assembly. This device provides at least one receiving groove on the substrate to accommodate a waffle cassette containing a bare die, and a fixing mechanism corresponding to the receiving groove for releasably engaging the waffle cassette with the groove, thus achieving reliable fixing of the waffle cassette and facilitating easy placement and removal. This overcomes the problems existing in the prior art regarding bare die feeding for SMT assembly.

[0009] A bare die feeding device for SMT assembly, comprising:

[0010] substrate;

[0011] At least one receiving groove is disposed on the substrate for receiving a waffle box containing a bare chip, and there is a gap between the inner wall of the receiving groove and the outer wall of the waffle box.

[0012] A fixing mechanism is disposed on the substrate, corresponding to the receiving groove, for releasably causing the waffle box to abut against the receiving groove.

[0013] By incorporating a receiving slot and a fixing mechanism, the waffle box containing the bare chip can be reliably fixed on the substrate, preventing displacement or tilting during SMT placement, thereby improving placement accuracy and yield. The gap design between the inner wall of the receiving slot and the outer wall of the waffle box facilitates the insertion and removal of the waffle box.

[0014] The function of the retaining mechanism is to reliably secure the waffle cassette containing the bare die within the receiving slot on the substrate, while ensuring easy and quick removal when the waffle cassette needs to be replaced. This 'releasable contact' means that the retaining mechanism can apply sufficient force to ensure a tight contact between the waffle cassette and the bottom and / or sidewalls of the receiving slot, thereby preventing displacement or movement of the waffle cassette during SMT placement and ensuring the pick-up accuracy of the bare die. Since there is a gap between the inner wall of the receiving slot and the outer wall of the waffle cassette, the retaining mechanism needs to eliminate or compensate for this gap to ensure that the waffle cassette is in a defined and stable position within the receiving slot. The design of the retaining mechanism must allow the operator to release the waffle cassette from the receiving slot by operating (e.g., pulling the latch, rotating the knob, releasing the magnetic attraction, etc.) when a new waffle cassette needs to be replaced. This releasability ensures the maintainability and ease of operation of the equipment.

[0015] Furthermore, the number of receiving slots can be adjusted according to actual needs. For example, multiple receiving slots can be set up to accommodate multiple waffle boxes, thereby improving feeding efficiency.

[0016] Furthermore, the fixing mechanism can take various forms, including magnetic fixing (magnets interacting with the waffle box or an additional metal sheet), snap-on fixing (push-pull, rotary, press-type, etc.), and can be used individually or in combination. The fixing mechanism ensures reliable contact between the waffle box and the inner wall of the receiving slot when fixed.

[0017] Furthermore, the shape of the substrate can be designed according to the actual application scenario, and is not limited to rectangles, but can also be circles, polygons, etc.

[0018] Furthermore, the inner wall of the receiving slot can be equipped with guide structures, such as bevels or protrusions, to facilitate the insertion of the waffle box. After insertion, these guide structures can cooperate with the fixing mechanism to achieve more precise positioning.

[0019] Furthermore, a buffer layer (such as rubber or foam) can be added to the substrate to reduce the impact of vibration on the bare chip. The buffer layer can be located at the contact point with the waffle box or at the bottom of the substrate.

[0020] Furthermore, the inner wall of the receiving slot can be designed to be slightly inclined (conical) or rounded, so that the waffle box can fit more tightly when it is pushed to the bottom of the receiving slot by the fixing mechanism.

[0021] Furthermore, the fixing mechanism can be designed with adjustable fixing force to accommodate waffle boxes of different sizes or weights.

[0022] Furthermore, the edge of the receiving groove is also provided with finger grooves to facilitate the placement and removal of the waffle box.

[0023] The finger slot design makes it easier for operators to pinch the edge of the waffle box with their fingers, making it easier to remove or put it into the receiving slot, improving the convenience and efficiency of operation, and reducing the risk of damaging the bare chip due to improper operation.

[0024] Furthermore, the shape of the finger groove can be designed in various ways, such as semi-circular, U-shaped, V-shaped, etc.

[0025] Furthermore, the number and position of the finger slots can be adjusted according to the shape and size of the waffle box. For example, finger slots can be set on all four sides of the receiving slot, or only on two opposite sides.

[0026] Furthermore, anti-slip textures or materials that increase friction can be added to the finger grooves to improve the reliability of picking up and putting down.

[0027] Furthermore, in addition to setting finger slots, ejection holes can also be set at the bottom of the receiving slot, allowing the waffle box to be ejected from the bottom using an external tool.

[0028] Furthermore, the fixing mechanism includes a fixing head and a spring. The inner wall of the receiving groove has a channel, which is slidably engaged with the fixing head. One end of the spring abuts against the fixing head, and the other end is fixed in the channel.

[0029] The spring-loaded fixing mechanism is simple and reliable, and can provide continuous fixing force to ensure that the waffle box will not loosen in the receiving slot.

[0030] Furthermore, springs can be of various types, such as coil springs, leaf springs, disc springs, etc.

[0031] Furthermore, the shape of the fixing head can be designed according to the shape of the waffle box, such as a flat surface, a curved surface, a V-shape, etc.

[0032] Furthermore, the materials for the fixing head and channel can be selected as needed, such as wear-resistant and corrosion-resistant materials.

[0033] Furthermore, multiple springs and fixing heads can be installed to improve the uniformity of the fixing force.

[0034] Furthermore, soft materials such as rubber or plastic can be added to the fixing head to avoid scratching the waffle box.

[0035] Furthermore, the other end of the spring may not be fixed inside the channel, but rather abut against other structures on the substrate.

[0036] Furthermore, there are two channels, both of which are perpendicular to the inner wall and their directions are perpendicular to each other.

[0037] The design of two mutually perpendicular channels and fixing heads allows the waffle box to be fixed from two directions, providing a more stable fixation effect and preventing the waffle box from rotating or moving in the horizontal plane.

[0038] Furthermore, the angle between the two channels does not have to be strictly perpendicular; for example, it can be set to a slightly tilted angle.

[0039] Furthermore, the two channels can be set on adjacent surfaces of the inner wall.

[0040] Furthermore, the channel is provided, and the channel is arranged along the diagonal of the projection of the receiving groove, and the fixing head abuts against one side of the waffle box in an L-shape.

[0041] The single channel and L-shaped fixing head arranged along the diagonal allow for securing the waffle box with fewer components, resulting in a more compact structure. The L-shaped fixing head can simultaneously abut against two adjacent sides of the waffle box, providing a better securing effect.

[0042] Furthermore, the shape of the fixing head is not limited to L-shape; it can also be other shapes, such as T-shape, U-shape, etc.

[0043] Furthermore, the angle of the channel does not have to be strictly along the diagonal; it can be adjusted as needed.

[0044] Furthermore, multiple channels and fixing heads can be set up in different directions.

[0045] Furthermore, at least one corner of the inner wall extends outward.

[0046] The outward extension design at the corner increases the effective holding space of the receiving slot, avoids interference between the corners of the waffle box and the inner wall of the receiving slot, and facilitates the insertion and removal of the waffle box.

[0047] Furthermore, the extended portion can be designed into different shapes such as arcs, slopes, and polygons.

[0048] Furthermore, the material is made of a material with a low coefficient of thermal expansion and / or antistatic properties.

[0049] Using materials with a low coefficient of thermal expansion can reduce dimensional changes in the feeder when temperature varies, improving placement accuracy. Using anti-static materials can prevent electrostatic discharge from damaging the bare chip.

[0050] Furthermore, the substrate is made of bakelite material.

[0051] Bakelite is a commonly used engineering plastic with good mechanical strength, heat resistance, insulation and antistatic properties. It is also easy to process and has a low cost, making it suitable for manufacturing substrates for SMT feeding devices.

[0052] Furthermore, in addition to bakelite, other materials with low coefficients of thermal expansion and / or antistatic properties can be selected, such as ceramics, certain engineering plastics (e.g., PEEK, PPS), carbon fiber composites, etc.

[0053] Furthermore, the antistatic effect can be achieved by coating the substrate surface with an antistatic coating or by performing surface treatment.

[0054] Furthermore, the substrate is provided with markings for indication and / or traceability.

[0055] Identification tags can be used to indicate information such as the model, specifications, and production date of the feeding device, facilitating identification and management. Traceability tags can be used to record the usage and maintenance history of the feeding device, enabling traceability and quality control.

[0056] Furthermore, the markings can take many forms, such as lettering, printing, labeling, laser marking, etc.

[0057] Furthermore, the content of the logo can be customized according to actual needs.

[0058] Furthermore, identification methods such as QR codes and barcodes can be used to store more information.

[0059] Furthermore, there are two finger slots, which are arranged opposite to each other.

[0060] The two opposing finger slots are more ergonomic, making it easier for users to pinch the sides of the waffle box with their thumb and forefinger, thus making it easier to remove the waffle box.

[0061] Furthermore, the two finger slots can be placed on either side of the longer side of the waffle box or on either side of the shorter side.

[0062] Furthermore, the finger slots can be placed near the four corners of the waffle box.

[0063] The beneficial effects of this utility model are as follows:

[0064] This utility model provides a bare die feeding device for SMT assembly. This device achieves reliable fixation and convenient replacement of bare dies packaged in waffle cassettes during the SMT assembly process by providing a receiving slot on the substrate for accommodating waffle cassettes and a corresponding releasable fixing mechanism. The receiving slot provides space for the waffle cassette, and the gap between its inner wall and the outer wall of the waffle cassette facilitates insertion and removal. The fixing mechanism releasably fixes the waffle cassette for easy replacement. In the fixed state, the waffle cassette reliably abuts against the inner wall of the receiving slot, ensuring the positional accuracy and stability of the waffle cassette during the assembly process. This effectively improves the accuracy and yield of SMT assembly and avoids assembly failures caused by waffle cassette displacement or tilting. Attached Figure Description

[0065] Figure 1 This is a schematic diagram of a bare chip feeding device for SMT assembly provided in Embodiment 1 of this application.

[0066] Figure label:

[0067] 100, substrate; 110, receiving groove; 120, fixing mechanism; 121, fixing head; 130, finger groove. Detailed Implementation

[0068] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0069] Example 1

[0070] like Figure 1As shown, this embodiment provides a bare die feeding device for SMT assembly. The bare die feeding device for SMT assembly includes a substrate 100, which is made of black bakelite board with a thickness of 7.5mm. Bakelite board has good mechanical strength, wear resistance, electrical insulation and excellent antistatic properties, and has a low coefficient of thermal expansion, which can ensure the dimensional stability of the feeding device under temperature changes.

[0071] The substrate 100 has overall dimensions of 323mm x 136mm and is precision machined using CNC machining to ensure dimensional accuracy and surface flatness. The back of the substrate 100 is milled, while the grooved surface on the front remains intact to fully utilize the anti-static properties of bakelite.

[0072] Three rectangular receiving slots 110 are evenly distributed on the front side of the substrate 100 for accommodating 2-inch (50.8mm x 50.8mm) standard-sized waffle boxes.

[0073] The depth of the receiving slot 110 is 3.88mm±0.02mm, and the inner wall size is 50.9mm x 50.9mm±0.05mm, which is slightly larger than the outer size of the waffle box by 0.1mm, forming a small gap to facilitate the smooth insertion and removal of the waffle box and avoid jamming.

[0074] The three corners of the inner wall of the receiving groove 110 all extend outward with a rounded corner to avoid interference with the four corners of the waffle box.

[0075] The edges of the receiving groove 110 are machined with a C0.3 chamfer to further reduce the sharpness of the edges and protect the waffle box and operators.

[0076] Each receiving groove 110 has a rectangular finger groove 130 on each of its two opposite sides, with dimensions of approximately 23.9mm x 5mm and a depth of approximately 6mm.

[0077] The position and size of the finger groove 130 are designed with ergonomics in mind, allowing operators to easily pinch the edge of the waffle box with their thumb and forefinger for quick and convenient picking and placing.

[0078] Each receiving slot 110 is equipped with two push-pull snap-fit ​​fixing mechanisms 120, which are located on adjacent inner walls of the receiving slot 110. Specifically, they are set on adjacent inner walls at corners without rounded corners. On the inner wall of the receiving slot 110, two rectangular channels are provided to slide and engage with the two push-pull snap heads. The size of the channels is slightly larger than the snap heads to ensure smooth sliding.

[0079] A small helical spring is installed inside the channel. One end of the spring abuts against the back of the push-pull latch head, and the other end is fixed to a spring seat at the bottom of the channel. The elastic force provided by the spring always pushes the latch head toward the center of the receiving slot 110, achieving reliable engagement and fixation of the waffle box. The operator needs to overcome the spring force to pull open the latch head.

[0080] Processing technology:

[0081] Three rectangular receiving grooves 110 are machined on the front side of the substrate 100, with a depth of 3.88mm ± 0.02mm and an inner wall size of 50.9mm x 50.9mm ± 0.05mm. The edges are chamfered with a C0.3.

[0082] Rectangular finger grooves 130 with a depth of 6.0 mm are machined on the opposite sides of each receiving groove 110.

[0083] On the back side of the substrate 100, a sliding channel for the latch head is machined at the push-pull latch position of each receiving groove 110, with a depth of 2.5mm.

[0084] On the back side of the substrate 100, a channel with a depth of 4.5 mm is machined to accommodate the spring. This channel is connected to the channel of the push-pull buckle head.

[0085] Clear character markings, including "model", "device name", "code", and "serial number", are laser-engraved at designated locations on the substrate 100 and then sprayed white to ensure that the markings are clearly visible and facilitate product traceability and production management.

[0086] The bare chip feeding device provided in this embodiment adopts a bakelite substrate 100, a precision-machined receiving groove 110, a convenient finger groove 130 design, and a reliable push-pull snap-fit ​​fixing mechanism 120, achieving safe, stable, and efficient feeding of bare chips packaged in waffle boxes. The receiving groove 110 and the gap design ensure accurate positioning and convenient handling of the waffle box. The push-pull snap-fit ​​fixing mechanism 120 has a simple and reliable structure, is easy to operate, and ensures that the waffle box will not shift or tilt during SMT placement. The overall design takes into account functionality, reliability, and ease of operation, improving the production efficiency and yield of bare chip SMT placement.

[0087] Example 2

[0088] This embodiment provides an SMT bare chip feeding device that employs a magnetic fixing mechanism 120.

[0089] The substrate 100 is made of black bakelite board, 7.5mm thick, and measures 323mm x 136mm. The back side is milled, while the front side, which has a grooved surface, remains untouched.

[0090] The substrate 100 has grooves cut into it, including three rectangular receiving grooves 110, with dimensions of 50.9mm x 50.9mm ± 0.05mm and a depth of 3.88mm ± 0.02mm, and a C0.3 chamfer. There is a 0.1mm gap between the groove and the waffle box (50.8mm x 50.8mm).

[0091] Each receiving groove 110 extends outward from the inner wall with an arc-shaped finger groove 130, with a depth of approximately 6 mm.

[0092] The fixing mechanism 120 uses magnetic attraction. Four Φ5mm x 3mm N35 neodymium iron boron permanent magnets are pre-embedded in the bottom of the inner wall of each receiving slot 110 and bonded with epoxy resin. A 0.2mm thick low-carbon steel nickel-plated sheet is adhered to the bottom of the waffle box (or tray). Fixing is achieved through the attraction between the magnets and the iron sheet.

[0093] Laser engraving and white spraying of character markings (model, device name, code, serial number, etc.) are applied to the substrate 100.

[0094] The bare chip feeding device provided in this embodiment adopts a magnetic fixing mechanism 120, which has a simple structure, low manufacturing cost, and convenient maintenance. The neodymium iron boron permanent magnet embedded in the bottom of the receiving groove 110 attracts the thin iron sheet at the bottom of the waffle box, providing a uniform fixing force and avoiding localized stress concentration that may be caused by mechanical fixing. The bakelite substrate 100 and the precision-machined receiving groove 110 ensure the dimensional accuracy and anti-static performance of the feeding device. The finger groove 130 facilitates the placement and removal of the waffle box. This solution is suitable for applications requiring moderate fixing force and emphasizing cost-effectiveness and ease of operation.

[0095] Example 3

[0096] This embodiment provides a bare chip SMT feeding device with a single-channel diagonal fixing and an L-shaped fixing head 121.

[0097] The substrate 100 is made of bakelite board with a thickness of 7.5mm. Bakelite board has good mechanical strength, wear resistance, electrical insulation, and antistatic properties, and has a low coefficient of thermal expansion. The overall dimensions of the substrate 100 are 323mm x 136mm, and it is precision machined by CNC to ensure dimensional accuracy and surface flatness. The back of the substrate 100 is milled, while the grooved surface on the front remains intact to fully utilize the antistatic properties of bakelite.

[0098] Four rectangular receiving slots 110 are provided on the substrate 100 for accommodating waffle boxes of standard size (50.8mm x 50.8mm). The depth of the receiving slot 110 is 3.88mm ± 0.02mm, and the inner wall size is 50.9mm x 50.9mm ± 0.05mm, which is slightly larger than the outer size of the waffle box by 0.1mm, forming a small gap to facilitate the insertion and removal of the waffle box and prevent jamming. Each corner of the receiving slot 110 is machined with an outwardly extending rounded corner to avoid interference with the sharp corners of the waffle box.

[0099] In this embodiment, each receiving slot 110 is provided with a fixing mechanism 120, and the fixing mechanism 120 adopts a structure of single-channel diagonal fixing and L-shaped fixing head 121.

[0100] A channel is formed on the inner wall of each receiving groove 110, which is arranged along the diagonal direction of the projection of the receiving groove 110. Specifically, it is located at the corner of the inner wall, away from the corner with rounded corners, and the direction of the channel is towards the corner with rounded corners. The channel is slidably engaged with the fixing head 121. The L-shaped fixing head 121 is made of aluminum alloy.

[0101] One side of the L-shaped fixing head 121 slides into the channel, while the other side abuts against one corner of the waffle box and two adjacent sides, forming an L-shaped abutment surface.

[0102] A small helical spring made of stainless steel is installed inside the channel. One end of the spring abuts against the back of the L-shaped fixing head 121, and the other end is fixed inside the channel. The elastic force provided by the spring constantly pushes the L-shaped fixing head 121 to move diagonally toward the center of the receiving groove 110.

[0103] In use, place the waffle box into the receiving slot 110. The operator needs to overcome the spring force and pull the L-shaped fixing head 121 outward along the diagonal direction, so that the L-shaped fixing head 121 moves away from the corner area of ​​the waffle box, and then release the L-shaped fixing head 121. Under the action of the spring, the L-shaped fixing head 121 returns to its original position, and its L-shaped abutment surface abuts against one corner and two adjacent sides of the waffle box, fixing the waffle box in the receiving slot 110 and ensuring that the outer wall of the waffle box reliably abuts against the inner wall of the receiving slot 110.

[0104] A QR code and serial number are affixed to a designated location on the substrate 100 to record device information.

[0105] The bare chip feeding device provided in this embodiment adopts a single-channel diagonal fixing and L-shaped fixing head 121 design, which is simple in structure, has fewer parts, and reduces manufacturing costs. The L-shaped fixing head 121 abuts against one corner and two adjacent sides of the waffle box, providing a stable fixing effect, while reducing the constraint points on the waffle box, making it easier to put in and take out the waffle box. The bakelite substrate 100 ensures the anti-static performance and dimensional stability of the feeding device. This solution, while ensuring basic functions, highlights the simplicity and economy of the structure, and is suitable for application scenarios that are cost-sensitive and have moderate fixing requirements.

[0106] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0107] Furthermore, it should be noted that the use of terms such as "first" and "second" is merely for ease of distinction, and unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application.

[0108] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A bare chip feeding device for SMT assembly, characterized in that, include: substrate(100); At least one receiving groove (110) is disposed on the substrate (100) for receiving a waffle box containing a bare chip, and there is a gap between the inner wall of the receiving groove (110) and the outer wall of the waffle box; A fixing mechanism (120) is disposed on the substrate (100) and corresponds to the receiving groove (110) for releasably causing the waffle box to abut against the receiving groove (110).

2. The bare chip feeding device for SMT assembly according to claim 1, characterized in that: The inner wall of the receiving groove (110) is also provided with a finger groove (130) to facilitate the taking and placing of the waffle box.

3. The bare chip feeding device for SMT assembly according to claim 1, characterized in that: The fixing mechanism (120) includes a fixing head (121) and a spring. The inner wall of the receiving groove (110) is provided with a channel, which is slidably engaged with the fixing head (121). One end of the spring abuts against the fixing head (121), and the other end is fixed in the channel.

4. The bare chip feeding device for SMT assembly according to claim 3, characterized in that: There are two channels and two fixing mechanisms (120). The fixing mechanism (120) corresponds to each channel. Both channels are perpendicular to the inner wall and their directions are perpendicular to each other.

5. The bare chip feeding device for SMT assembly according to claim 3, characterized in that: The channel is provided, and the channel is arranged along the diagonal of the projection of the receiving groove (110). The fixing head (121) abuts against one side of the waffle box in an L-shape.

6. The bare chip feeding device for SMT assembly according to any one of claims 1 to 5, characterized in that: The inner wall extends outward at at least one corner.

7. The bare chip feeding device for SMT assembly according to any one of claims 1 to 5, characterized in that: The substrate (100) is made of a material having a low coefficient of thermal expansion and / or antistatic properties.

8. The bare chip feeding device for SMT assembly according to claim 7, characterized in that: The substrate (100) is made of bakelite material.

9. The bare die feeding device for SMT assembly according to any one of claims 1 to 5, characterized in that: The substrate (100) is provided with markings for indication and / or traceability.

10. The bare chip feeding device for SMT assembly according to claim 2, characterized in that: Two finger slots (130) are provided, and the two finger slots (130) are arranged opposite to each other.

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