Slicing water supply equipment and silicon wafer inserting and slicing system

Abstract

The utility model discloses fragmentation water supply equipment and a silicon wafer inserting fragmentation system, and belongs to the technical field of silicon wafer processing equipment.The fragmentation water supply equipment is provided with a water purification pipeline, the water purification pipeline is used for supplying clean water to a water spraying pump, the amount of water sucked by the water spraying pump from a wafer inserting machine water tank through a water suction pipeline can be reduced, and therefore the wafer inserting fragmentation efficiency is improved. Therefore, the cleanliness of water in the side spraying pipeline is improved, the pipeline blockage phenomenon during side spraying fragmentation is reduced, the silicon wafer fragmentation uniformity and the silicon wafer quality are improved, the requirements for daily cleaning of the side spraying pipeline and the like are reduced, and the machining efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer processing equipment, and particularly relates to a wafer separating water supply device and a wafer inserting and separating system. BACKGROUND

[0002] In the production process of solar silicon wafers, the silicon wafers need to be processed by wafer inserting and separating, and the adjacent silicon wafers are separated by using a side spraying mode. However, the pipe blockage phenomenon is relatively serious when the current equipment sprays, which affects the wafer separating water pressure, and the water pressure is often uneven or even without water pressure. The above conditions will cause the loss of silicon wafer quality, affect the wafer separating uniformity, and significantly affect the processing efficiency. CONTENT OF THE UTILITY MODEL

[0003] The utility model aims at solving the technical problem of the serious pipe blockage phenomenon in the current side spraying wafer separating, and another object of the utility model is to provide a wafer inserting and separating system.

[0004] TECHNICAL SCHEME In a first aspect, the utility model discloses a wafer separating water supply device, which comprises:

[0005] a wafer inserting machine water tank;

[0006] a water suction pipeline, a water suction port of which is arranged in the wafer inserting machine water tank;

[0007] a side spraying pipeline, which has a spraying port arranged in the wafer inserting machine water tank;

[0008] a water spraying pump, which comprises a first water inlet end and a first water outlet end, the first water inlet end is connected with the water suction pipeline to communicate the wafer inserting machine water tank through the water suction pipeline, and the first water outlet end is connected with the side spraying pipeline to pump water to the side spraying pipeline;

[0009] a water purification pipeline, which is connected with the first water inlet end to supply water to the water spraying pump.

[0010] In some embodiments, the wafer separating water supply device further comprises:

[0011] a pressure relief pipeline, one end of which is connected with the first water outlet end, and the other end of which is connected with the water purification pipeline.

[0012] In some embodiments, the wafer separating water supply device further comprises:

[0013] a pressure relief valve arranged on the pressure relief pipeline.

[0014] In some embodiments, the water suction port is arranged in the wafer inserting machine water tank, and a filter is further arranged in the wafer inserting machine water tank, and the filter is arranged at the water suction port of the water suction pipeline.

[0015] In some embodiments, the wafer slicing water supply device further comprises:

[0016] a water suction pump comprising a second water inlet end and a second water outlet end, the second water inlet end being connected with the wafer slicing machine water tank, and the second water outlet end being connected with the clean water pipeline.

[0017] In some embodiments, the side spraying pipeline comprises:

[0018] a first pipeline and a second pipeline, the spraying nozzles of the first pipeline and the second pipeline being respectively arranged on two sides of the wafer slicing machine water tank.

[0019] In some embodiments, the wafer slicing water supply device further comprises a water pressure detection table, which is arranged on the first pipeline and the second pipeline respectively, and is used for detecting the water pressure of the first pipeline and the second pipeline.

[0020] In some embodiments, the wafer slicing water supply device further comprises an adjusting valve, which is arranged on the first pipeline and the second pipeline respectively, and is used for adjusting the water pressure of the first pipeline and the second pipeline.

[0021] In some embodiments, the wafer slicing water supply device further comprises:

[0022] an overflow pipeline connected with the clean water pipeline, and used for supplying overflow water to the clean water pipeline.

[0023] In a second aspect, a wafer slicing system provided by the embodiments of the present application comprises the wafer slicing water supply device according to any one of the above embodiments.

[0024] Beneficial effects: the wafer slicing water supply device provided by the embodiments of the present application comprises: a wafer slicing machine water tank; a water suction pipeline, a water suction port of which is arranged on the wafer slicing machine water tank; a side spraying pipeline, which has a spraying nozzle arranged on the wafer slicing machine water tank; a water spraying pump comprising a first water inlet end and a first water outlet end, the first water inlet end being connected with the water suction pipeline to communicate the wafer slicing machine water tank through the water suction pipeline, and the first water outlet end being connected with the side spraying pipeline to pump water to the side spraying pipeline; and a clean water pipeline connected with the first water inlet end to supply water to the water spraying pump. The wafer slicing water supply device provided by the embodiments of the present application supplies relatively clean water to the water spraying pump through the clean water pipeline, which can reduce the amount of water sucked by the water spraying pump from the wafer slicing machine water tank through the water suction pipeline, thereby improving the cleanliness of water in the side spraying pipeline, reducing the pipeline clogging phenomenon during side spraying, improving the uniformity of wafer slicing and the quality of wafers, reducing the need for daily cleaning of the side spraying pipeline, and improving the processing efficiency.

[0025] The wafer slicing system provided by the embodiments of the present application can have all the technical features and technical effects of the wafer slicing water supply device described above, and will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings needed to be used in the description of the embodiments will be briefly introduced. Obviously, the accompanying drawings in the following description only represent some of the embodiments of the present application, and all other drawings obtained by those skilled in the art without any creative effort based on these drawings also belong to the protection scope of the present application.

[0027] Figure 1 The structural schematic diagram of the slice water supply equipment provided by the first embodiment of the present application is shown in the figure.

[0028] Figure 2 The structural schematic diagram of the slice water supply equipment provided by the second embodiment of the present application is shown in the figure.

[0029] Figure 3 The structural schematic diagram of the slice water supply equipment provided by the third embodiment of the present application is shown in the figure.

[0030] Figure 4 The structural block diagram of the silicon wafer inserting and slicing system provided by the embodiments of the present application is shown in the figure.

[0031] The accompanying drawings are as follows: 10-silicon wafer inserting and slicing system; 100-slice water supply equipment; 110-inserting machine water tank; 111-filtering part; 112-plugging part; 113-drainage port; 120-water suction pipeline; 121-water suction port; 130-side jetting pipeline; 131-jetting port; 132-first pipeline; 133-second pipeline; 134-water pressure detection table; 135-regulating valve; 140-jetting pump; 141-first water inlet end; 142-first water outlet end; 150-clean water pipeline; 160-pressure relief pipeline; 161-pressure relief valve; 170-water suction pump; 171-second water inlet end; 172-second water outlet end; 180-overflow pipeline. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort also belong to the protection scope of the present application.

[0033] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or device must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The meaning of "a plurality of" is two or more, at least one of which can be one, two or more, unless otherwise explicitly specified. The terms "mount", "connect", "connect" should be broadly understood, for example, it can be a fixed connection, or it can be a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two devices or the interaction relationship between two devices, unless otherwise explicitly specified. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more features.

[0034] As an introduction to the present application, a silicon wafer insertion and separation system is introduced, which is used for the insertion process of solar silicon wafers. In the insertion process, the solar silicon wafers need to be side-sprayed and separated to separate adjacent silicon wafers. However, at present, silicates and other impurities are generated in the cutting process of solar silicon wafers, which are adsorbed in the silicon wafers and are difficult to remove. When side-spraying and separating, the silicates and impurities between the silicon wafers enter the water tank of the insertion machine, and then are sucked into the side-spraying pipeline. Long-term accumulation causes serious blockage of the side-spraying pipeline and the water tank filter screen. This will affect the water pressure for separation, leading to uneven water pressure and no water pressure, which will further cause loss of silicon wafer quality and affect the uniformity of silicon wafer separation. Timely manual cleaning requires disassembly of the pipeline, resulting in a large waste of working hours and labor intensity, and periodic cleaning cannot guarantee that the cleanliness of the pipeline meets the requirements, resulting in a lot of loss of silicon wafer quality and processing time.

[0035] Therefore, the embodiments of the present application provide a separation water supply device 100 and a silicon wafer insertion and separation system 10, which reduces the use of dirty water in the water tank by introducing relatively clean clean water, improves the cleanliness of the circulating water quality, and reduces the risk of blockage.

[0036] Please refer to Figure 4 The separation water supply device 100 of the embodiments of the present application is part of the silicon wafer insertion and separation system 10, which is used to supply water for side-spraying and separating in the insertion process.

[0037] Please refer to Figure 1 The separation water supply device 100 of the embodiments of the present application includes a water tank 110 of an insertion machine, a water suction pipeline 120, a side-spraying pipeline 130, a water spraying pump 140 and a clean water pipeline 150.

[0038] The insert piece machine water tank 110 is arranged on the insert piece machine, and is used to receive the side spray water during the side spray slicing in the insert piece process. The water suction pipeline 120 is used to suck water from the insert piece machine water tank 110, and the water suction port 121 of the water suction pipeline 120 is arranged on the insert piece machine water tank 110 to suck the water in the insert piece machine water tank 110 through the water suction port 121. The side spray pipeline 130 is used to perform the side spray slicing, and the spray port 131 of the side spray pipeline 130 is arranged on the insert piece machine water tank 110, so that the insert piece machine water tank 110 can be sprayed to blow and separate the silicon wafer. The water spraying pump 140 pumps water to the side spray pipeline 130 to increase the water pressure in the side spray pipeline 130, so as to blow and separate the silicon wafer. The water spraying pump 140 includes a first water inlet end 141 and a first water outlet end 142. The first water inlet end 141 is the suction port of the water spraying pump 140, and the first water inlet end 141 is connected with the water suction pipeline 120 to communicate the insert piece machine water tank 110 through the water suction pipeline 120, that is, the first water inlet end 141 is connected at the water outlet port of the water suction pipeline 120. The first water outlet end 142 is the discharge port of the water spraying pump 140, and the first water outlet end 142 is connected with the side spray pipeline 130 to pump water to the side spray pipeline 130. The clean water pipeline 150 is connected with the first water inlet end 141 to supply water to the water spraying pump 140. The water supplied by the clean water pipeline 150 is clean water, which can be tap water, or hot overflow water, cold overflow water and the like in the silicon wafer production process. The cleanliness of the water supplied by the clean water pipeline 150 is better than that of the water in the insert piece machine water tank 110.

[0039] Therefore, when the water spraying pump 140 works, part of the water entering the pump from the first water inlet end 141 is the water in the insert piece machine water tank 110, and the other part is the clean water directly supplied by the clean water pipeline 150. In this way, the use amount of dirty water in the insert piece machine water tank 110 can be reduced, and the water quality cleanliness of the side spray circulating water can be improved. Therefore, the phenomenon of pipeline blockage during the side spray slicing can be reduced, the uniformity of the silicon wafer slicing and the quality of the silicon wafer can be improved, the demand for daily cleaning of the side spray pipeline can be reduced, and the processing efficiency can be improved.

[0040] Please refer to Figure 2 and Figure 3 In some embodiments, the slicing water supply device 100 further includes a pressure relief pipeline 160, one end of the pressure relief pipeline 160 is connected with the first water outlet end 142, and the other end of the pressure relief pipeline 160 is connected with the clean water pipeline 150. In this way, when the water spraying pump 140 works, part of the water pumped out from the first water outlet end 142 can flow into the pressure relief pipeline 160, so as to reduce the water pressure in the side spray pipeline 130, and make the water pressure in the side spray pipeline 130 meet the actual side spray demand pressure. The probability of pipeline pressure accumulation is reduced, the pipeline is protected, the service life of the pipeline is improved, and the risk of blockage of the side spray pipeline 130 due to the deposition of silicates and impurities and the like is reduced.

[0041] In some embodiments, the water supply device 100 further comprises a pressure relief valve 161 arranged on the pressure relief pipeline 160. By arranging the pressure relief valve 161, the operator can open and close the pressure relief pipeline 160 according to actual needs, so as to ensure the water pressure of the side spraying pipeline 130 and effectively avoid the situation of long-term pressure retention of the pipeline, and keep the side spraying pipeline 130 unobstructed.

[0042] In some embodiments, the water suction port 121 of the water suction pipeline 120 is arranged in the wafer inserting machine water tank 110, and a filter 111 is further arranged in the wafer inserting machine water tank 110 and arranged on the water suction port 121. When the water suction pipeline 120 sucks water in the wafer inserting machine water tank 110, the water can pass through the filter 111 for filtration, so as to improve the cleanliness of the water entering the water suction pipeline 120 and the cleanliness of the water in the side spraying pipeline 130, and reduce the risk of pipeline blockage. Optionally, the filter 111 can be a porous filter core, a filter screen or the like structure, which can be covered at the water suction port 121.

[0043] Please refer to Figures 1 to 3 In some embodiments, the water supply device 100 further comprises a water suction pump 170, which is a device used for sucking water from the wafer inserting machine water tank 110 to adsorb the silicon wafer in the wafer inserting process and conveying the silicon wafer. The water suction pump 170 comprises a second water inlet end 171 and a second water outlet end 172. The second water inlet end 171 is connected with the wafer inserting machine water tank 110 to suck water to adsorb the silicon wafer, and the second water outlet end 172 is connected with the clean water pipeline 150, so that the water outlet thereof also enters the wafer inserting machine water tank 110 through the clean water pipeline 150, guarantees the circulation of water, and mixes with the water in the clean water pipeline 150 to improve the cleanliness of the circulating water. In the related art, the water outlet of the water suction pump 170 directly enters the wafer inserting machine water tank 110 through the end on the wafer inserting machine water tank 110, which can be plugged by the plugging member 112 in the embodiments. By changing the direction of the water outlet of the water suction pump 170, the cleanliness of the water at each position in the entire circulation process can be improved, the blockage frequency of the filter 111, the side spraying pipeline 130 and other pipelines can be reduced, the cleaning frequency can be reduced, and the waste of processing time and labor hours can be reduced.

[0044] Please refer to Figures 1 to 3 In some embodiments, the side spraying pipeline 130 comprises a first pipeline 132 and a second pipeline 133, and the spray nozzles 131 of the first pipeline 132 and the second pipeline 133 are arranged on the two sides of the wafer inserting machine water tank 110, respectively. The silicon wafer is sprayed from both sides to improve the efficiency of dispersing and separating the silicon wafer.

[0045] In some embodiments, the slice water supply device 100 further comprises a water pressure detection table 134 arranged on the first pipe 132 and the second pipe 133 respectively, for detecting the water pressure of the first pipe 132 and the second pipe 133. This can ensure that the water pressure of each pipe in the side spray pipe 130 is always in a controlled state, effectively track the pipe pressure, help to determine the pipe plugging condition, and reduce the occurrence of pressure holding.

[0046] In some embodiments, the slice water supply device 100 further comprises an adjusting valve 135 arranged on the first pipe 132 and the second pipe 133 respectively, for adjusting the water pressure of the first pipe 132 and the second pipe 133. By arranging the adjusting valve 135, the water pressure of each pipe in the side spray pipe 130 can be adjusted in real time as needed, to ensure the stability of the slice operation.

[0047] Please refer to Figure 3 In some embodiments, the slice water supply device 100 further comprises an overflow pipe 180 connected to the clean water pipe 150, for supplying overflow water to the clean water pipe 150. The overflow water can be hot water overflow and cold water overflow in the silicon wafer processing process, to improve the utilization rate of water.

[0048] It should be further noted that, in some embodiments, when the wafer inserting machine is changed, the pressure of the clean water in the clean water pipe 150 can also be used to flush the suction pipe 120, the water jet pump 140, the side spray pipe 130, the pressure relief pipe 160, the suction pump 170, and the filter 111, to clean the accumulated dirt to the tank body of the wafer inserting machine tank 110, to realize the internal cleaning of the circulating pipe. Specifically, the wafer inserting machine tank 110 is provided with a sewage outlet 113, and the wafer inserting machine tank 110 is regularly cleaned to discharge sewage from the sewage outlet 113 and change water.

[0049] Correspondingly, the present application also provides a silicon wafer inserting and slicing system 10, which comprises the slice water supply device 100 of any of the above embodiments. Figure 4 Therefore, the silicon wafer inserting and slicing system 10 can have all the technical features and technical effects of the slice water supply device 100 described above, and will not be repeated here. In addition to the slice water supply device 100, the silicon wafer inserting and slicing system 10 also comprises a wafer inserting machine and other structures, which will not be specifically limited here.

[0050] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0051] The above provides a detailed description of the wafer slicing water supply equipment and wafer slicing system provided by the embodiments of the present application, and the principles and implementation manners of the present application are described by using specific examples. The above embodiment description is only used to help understand the technical solutions of the present application and the core idea thereof. It should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A segmented water supply device, characterized in that, include: Insertion machine water tank; The water suction pipe has its suction port located in the water tank of the inserter. A side spray pipe has a nozzle, which is located in the water tank of the inserter; A water pump includes a first inlet end and a first outlet end. The first inlet end is connected to the water suction pipe to connect to the inserter water tank through the water suction pipe. The first outlet end is connected to the side spray pipe for pumping water into the side spray pipe. A water purification pipeline is connected to the first water inlet end and is used to supply water to the water pump.

2. The segmented water supply equipment according to claim 1, characterized in that, The segmented water supply equipment also includes: The pressure relief pipeline is connected at one end to the first water outlet and at the other end to the purified water pipeline.

3. The segmented water supply equipment according to claim 2, characterized in that, The segmented water supply equipment also includes: A pressure relief valve is installed on the pressure relief pipeline.

4. The segmented water supply equipment according to claim 1, characterized in that, The water inlet is located inside the water tank of the inserter, and a filter element is also provided inside the water tank of the inserter, with the filter element located at the water inlet.

5. The segmented water supply equipment according to claim 1, characterized in that, The segmented water supply equipment also includes: The water pump includes a second inlet and a second outlet. The second inlet is connected to the water tank of the inserter, and the second outlet is connected to the water purification pipeline.

6. The segmented water supply equipment according to claim 1, characterized in that, The side spray pipe includes: The first pipeline and the second pipeline are respectively located on both sides of the inserter water tank.

7. The segmented water supply equipment according to claim 6, characterized in that, The segmented water supply equipment also includes a water pressure gauge, which is installed on the first pipeline and the second pipeline respectively, and is used to detect the water pressure in the first pipeline and the second pipeline.

8. The segmented water supply equipment according to claim 7, characterized in that, The segmented water supply equipment also includes regulating valves, which are respectively installed on the first pipeline and the second pipeline, and are used to regulate the water pressure in the first pipeline and the second pipeline.

9. The segmented water supply equipment according to any one of claims 1 to 8, characterized in that, The segmented water supply equipment also includes: An overflow pipe is connected to the purified water pipe and is used to supply overflow water to the purified water pipe.

10. A silicon wafer interfacing and dicing system, characterized in that, Includes the segmented water supply equipment as described in any one of claims 1 to 9.

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