Semiconductor wafer cleaning device

Abstract

The utility model discloses a semiconductor wafer cleaning device, which is applied to the field of cleaning devices and comprises a cleaning bin, and one side of the cleaning bin is fixedly connected with a connecting plate. Through the arrangement of the driving motor, the threaded rod, the threaded disc, the connecting supporting frame and the cleaning screen frames, the two cleaning screen frames can synchronously move upwards or upwards, and sinking cleaning and lifting after cleaning of semiconductor crystals can be met; a rotating motor is arranged to drive a second gear and a first gear to rotate, the first gear drives a supporting column and two connecting supporting frames in the supporting column to rotate so that the positions of the two cleaning screen frames can be exchanged, and only one cleaning screen frame sinks into the cleaning bin to be cleaned each time. The other cleaning screen frame can be used for feeding before cleaning or discharging after cleaning of the semiconductor crystal; therefore, the device does not need to stop feeding and discharging, the feeding and discharging time can be saved, and the cleaning efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a cleaning device field, especially in a kind of semiconductor wafer cleaning device. BACKGROUND

[0002] At present, the Chinese utility model with announcement number CN 210129491 U discloses a kind of semiconductor wafer cleaning device;The above prior art adopts the way of flushing to semiconductor crystal and is cleaned, its cleaning process, need first feeding and put into semiconductor crystal and is cleaned, after cleaning, unloading and taking down semiconductor crystal, there is the time difference of feeding and unloading before and after the cleaning of device, feeding and unloading process device needs to stop, influence cleaning efficiency.To solve the above-mentioned problems, we propose a kind of semiconductor wafer cleaning device. UTILITY MODEL CONTENT

[0003] The utility model aims at providing a kind of semiconductor wafer cleaning device, its advantage is that device does not need to stop feeding and unloading.

[0004] The above technical purpose of the utility model is realized by the following technical scheme: a kind of semiconductor wafer cleaning device, including cleaning bin, the side of the cleaning bin is fixedly connected with connecting plate, the top of the connecting plate is equipped with support column, the inside of the support column is equipped with screw thread disc, the inside screw thread of the screw thread disc is connected with threaded rod, the surface of the screw thread disc is fixedly connected with two connection support frames, the bottom of two connection support frames is fixedly connected with cleaning net frame, the top of the support column is installed with drive motor, the output end of the drive motor is fixedly installed with threaded rod through coupling;The surface of the support column is fixedly sleeved with gear one, the gear one is engaged with gear two, the top of the gear two is equipped with rotary motor, the rotary motor is fixedly installed with cleaning bin through support, the output end of the rotary motor is fixedly installed with gear two through key.

[0005] The above technical scheme is adopted, by setting drive motor, threaded rod, screw thread disc, connection support frame and cleaning net frame, two cleaning net frames can be synchronized to move upward or upward, can satisfy the sinking cleaning of semiconductor crystal and lifting after cleaning;By setting rotary motor drive gear two and gear one rotation, by gear one drive support column and the two connection support frames inside it rotate, the position of two cleaning net frames can be exchanged, only one cleaning net frame of two cleaning net frames will be cleaned by sinking into the inside of cleaning bin each time, and the other cleaning net frame can be fed before cleaning of semiconductor crystal or unloaded after cleaning;So, without stopping device to feed and unload, can save feeding and unloading time, improve cleaning efficiency.

[0006] The utility model is further provided as: the surface of the support column is equipped with two guide grooves, the inside of two guide grooves is slidably connected with two connection support frames respectively.

[0007] By means of the guiding groove, the connecting support frame is guided and the connecting support frame is facilitated to slide up and down.

[0008] The utility model discloses further set up: the surface fixed connection of screw disc has two sliding blocks no.

[0009] By means of the sliding block no. and the sliding groove, the screw disc is linearly guided to move up and down, and the screw disc is limited to rotate with the rotation of the screw rod.

[0010] The utility model discloses further set up: the bottom of gear no. 2 does not contact with connecting plate, and the output of rotary motor does not contact with connecting plate.

[0011] By means of the bottom of gear no. 2 and the output of rotary motor not contacting with the connecting plate, the output of rotary motor and gear no. 2 are not blocked by the connecting plate or do not rub against the connecting plate when rotating.

[0012] The utility model discloses further set up: the top of connecting plate is equipped with circular slide groove, and the inside slide connection of circular slide groove has two sliding blocks no. 2 with support column fixed connection.

[0013] By means of the circular slide groove and the sliding block no. 2, the support column is assisted to rotate, and the support column is supported.

[0014] The utility model discloses further set up: the inside installation of cleaning storehouse has ultrasonic generator, and the inside injection of cleaning storehouse has cleaning fluid.

[0015] By means of the ultrasonic generator, ultrasonic waves are generated, and the semiconductor crystal is cleaned by ultrasonic vibration and cleaning fluid.

[0016] The ultrasonic generator generates ultrasonic waves to clean, and the working principle is not repeated here.

[0017] In summary, the utility model has the following beneficial effects:

[0018] By means of the driving motor, the screw rod, the screw disc, the connecting support frame and the cleaning screen frame, the two cleaning screen frames can move upward or upward synchronously, and the semiconductor crystal can be cleaned and lifted after cleaning.

[0019] By setting up the rotary motor drive gear two and gear one rotation, through gear one drive support column and its inside two connecting support frame rotation can be two cleaning net frame position exchange, two cleaning net frame each time only one cleaning net frame will be immersed in the inside of cleaning warehouse cleaning, while the other cleaning net frame can be before the cleaning of semiconductor crystal loading or after cleaning unloading; so without device stop for loading and unloading, can save loading and unloading time, improve the cleaning efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is the structure of the utility model stereogram;

[0021] Figure 2 is the utility model gear one and gear two meshing schematic diagram;

[0022] Figure 3 is the utility model local structure plan view;

[0023] Figure 4 is the utility model Figure 3 A structure of the utility model enlarged view.

[0024] Reference signs: 1, cleaning warehouse;2, connecting plate;3, support column;4, threaded disc;5, threaded rod;6, connecting support frame;7, cleaning net frame;8, drive motor;9, gear one;10, gear two;11, rotary motor;12, guide slot;13, sliding block one;14, sliding slot;15, circular ring sliding slot;16, sliding block two;17, ultrasonic generator. DETAILED DESCRIPTION

[0025] The utility model will be further explained in detail in connection with the drawings.

[0026] Example 1:

[0027] Reference Figure 1 , Figure 2 and Figure 3The utility model provides a semiconductor wafer cleaning device, including the cleaning bin 1, one side of cleaning bin 1 is fixedly connected with the connecting plate 2, the top of connecting plate 2 is equipped with the support column 3, the inside of support column 3 is equipped with the screw plate 4, the inside screw thread connection of screw plate 4 has the threaded rod 5, the surface fixed connection of screw plate 4 has two connecting support frames 6, the bottom fixed connection of two connecting support frames 6 has the cleaning net frame 7, the top of support column 3 is installed with drive motor 8, and the output of drive motor 8 is fixedly installed with threaded rod 5 through the shaft coupling, the surface fixed sleeve of support column 3 has gear one 9, and gear one 9 is engaged with gear two 10, and the top of gear two 10 is equipped with rotary motor 11, and rotary motor 11 is fixedly installed with cleaning bin 1 through the support, and the output of rotary motor 11 is fixedly installed with gear two 10 through the key, through the setting drive motor 8, threaded rod 5, screw plate 4, connecting support frame 6 and cleaning net frame 7, two cleaning net frames 7 can be synchronous to move up or up, can satisfy the sinking cleaning of semiconductor crystal and the lifting after cleaning, through the setting rotary motor 11 drive gear two 10 and gear one 9 rotation, the position of two cleaning net frames 7 can be exchanged by the rotation of gear one 9 and the inside two connecting support frames 6 of support column 3, and only one cleaning net frame 7 in two cleaning net frames 7 will be washed in the inside of cleaning bin 1 every time, and the other cleaning net frame 7 can be loaded before the cleaning of semiconductor crystal or unloaded after the cleaning, so that the device does not need to stop loading and unloading, can save loading and unloading time, improves the cleaning efficiency.

[0028] Further, two guide grooves 12 are formed on the surface of the support column 3, and the inside of the two guide grooves 12 is respectively slidably connected with the two connecting support frames 6. Through the setting of the guide grooves 12, the connecting support frames 6 are guided, and the connecting support frames 6 are facilitated to slide up and down.

[0029] Further, two sliding blocks one 13 are fixedly connected to the surface of the screw plate 4, and two sliding grooves 14 slidably connected with the sliding blocks one 13 are formed on the inner wall of the support column 3. Through the setting of the sliding blocks one 13 and the sliding grooves 14, the up and down movement of the screw plate 4 is linearly guided, and the screw plate 4 is limited to avoid rotating with the threaded rod 5.

[0030] Further, the bottom of the gear two 10 does not contact the connecting plate 2, and the output end of the rotary motor 11 does not contact the connecting plate 2. Through the bottom of the gear two 10 and the output end of the rotary motor 11 not contacting the connecting plate 2, the output end of the rotary motor 11 and the gear two 10 will not be blocked by the connecting plate 2 or will not rub with the connecting plate 2 when rotating.

[0031] Further, the top of the connecting plate 2 is provided with a circular sliding groove 15, the inside of the circular sliding groove 15 is slidably connected with two sliding blocks 16 fixedly connected with the supporting columns 3, through the arrangement of the circular sliding groove 15 and the sliding blocks 16, the supporting columns 3 can be rotated and supported.

[0032] Further, the inside of the cleaning bin 1 is provided with an ultrasonic generator 17, the inside of the cleaning bin 1 is filled with cleaning liquid, through the arrangement of the ultrasonic generator 17, ultrasonic waves can be generated, the semiconductor crystal can be cleaned by ultrasonic vibration and the cleaning liquid.

[0033] The ultrasonic generator 17 generates ultrasonic waves for cleaning, which is a prior art, and its working principle will not be described here.

[0034] Brief description of the use process:

[0035] When used, the semiconductor crystal is placed in the inside of a cleaning mesh frame 7.

[0036] Then the output end of the driving motor 8 is controlled to rotate counterclockwise by the controller, and the threaded rod 5 is driven to rotate through the coupling, when the threaded rod 5 rotates counterclockwise, the threaded disc 4 can drive the two connecting support frames 6 to descend, and when the two connecting support frames 6 descend, the two cleaning mesh frames 7 can be synchronously driven to descend, the cleaning mesh frame 7 located at the top of the cleaning bin 1 and the semiconductor crystal in the inside of the cleaning mesh frame 7 can sink into the cleaning liquid in the inside of the cleaning bin 1, and the other cleaning mesh frame 7 can descend to the height of the cleaning mesh frame 7 in the cleaning liquid, the cleaning mesh frame 7 is outside, at this time, the staff can place the semiconductor crystal to be cleaned next time in the inside of the cleaning mesh frame 7.

[0037] When the cleaning mesh frame 7 with the semiconductor crystal sinks into the cleaning liquid in the inside of the cleaning bin 1, the ultrasonic generator 17 is started to generate ultrasonic waves, the ultrasonic waves vibrate the water and the semiconductor crystal in the inside of the cleaning mesh frame 7 to clean.

[0038] After cleaning, the cleaning mesh frame 7 outside also completes the semiconductor crystal placement work.

[0039] The output end of the driving motor 8 is controlled to rotate clockwise by the controller, the threaded rod 5 is driven to rotate clockwise by the output end of the driving motor 8, the two connecting support frames 6 and the two cleaning mesh frames 7 are driven to ascend by the threaded disc 4; after the cleaning mesh frame 7 in the inside of the cleaning bin 1 ascends; the output end of the rotating motor 11 is controlled to rotate by the controller, when the output end of the rotating motor 11 rotates, the output end of the rotating motor 11 drives the gear two 10 to rotate through the key, the gear two 10 drives the gear one 9 to rotate through meshing, when the gear one 9 rotates, the supporting column 3 in the inside of the gear one 9 rotates, the two connecting support frames 6 are driven to rotate by the supporting column 3, the positions of the two cleaning mesh frames 7 can be adjusted by rotating.

[0040] After the position of the two cleaning screen frames 7 is exchanged, the original cleaning screen frame 7 in the outside will be located at the top of the cleaning chamber 1, and the original cleaning screen frame 7 sinking into the inside of the cleaning chamber 1 will reach the position of the original cleaning screen frame 7 in the outside.

[0041] Then, the ascending cleaning action is repeated.

[0042] The semiconductor crystal in the inside of the cleaning screen frame 7 in the outside is discharged, and the next batch of semiconductor crystals to be cleaned can be put in to wait for the next cleaning.

[0043] According to the above repeated process, the process of stopping and discharging and feeding can be avoided.

[0044] The clockwise or counterclockwise rotation of the output end of the motor controlled by the controller is the prior art, which is not described in detail.

[0045] The specific embodiment is only an explanation of the present application, and is not a limitation of the present application. Those skilled in the art can make modifications to the embodiment without creative contribution after reading the specification, but as long as the modifications are within the scope of the claims of the present application, they are protected by the patent law.

Claims

1. A semiconductor wafer cleaning apparatus, comprising a cleaning chamber (1), characterized in that: A connecting plate (2) is fixedly connected to one side of the cleaning chamber (1). A support column (3) is provided on the top of the connecting plate (2). A threaded disc (4) is provided inside the support column (3). A threaded rod (5) is threadedly connected inside the threaded disc (4). Two connecting support frames (6) are fixedly connected to the surface of the threaded disc (4). A cleaning mesh frame (7) is fixedly connected to the bottom of the two connecting support frames (6). A drive motor (8) is installed on the top of the support column (3). The output end of the drive motor (8) is fixedly installed with the threaded rod (5) through a coupling. A gear one (9) is fixedly sleeved on the surface of the support column (3). The gear one (9) meshes with a gear two (10). A rotary motor (11) is provided on the top of the gear two (10). The rotary motor (11) is fixedly installed with the cleaning chamber (1) through a bracket. The output end of the rotary motor (11) is fixedly installed with the gear two (10) through a key.

2. The semiconductor wafer cleaning apparatus according to claim 1, characterized in that: The surface of the support column (3) has two guide grooves (12), and the interiors of the two guide grooves (12) are slidably connected to the two connecting support frames (6).

3. The semiconductor wafer cleaning apparatus according to claim 1, characterized in that: Two sliders (13) are fixedly connected to the surface of the threaded disc (4), and two grooves (14) are opened on the inner wall of the support column (3) to slide and connect with the sliders (13).

4. The semiconductor wafer cleaning apparatus according to claim 1, characterized in that: The bottom of the second gear (10) does not contact the connecting plate (2), and the output end of the rotary motor (11) does not contact the connecting plate (2).

5. A semiconductor wafer cleaning apparatus according to claim 1, characterized in that: The top of the connecting plate (2) is provided with an annular groove (15), and two sliders (16) that are fixedly connected to the support column (3) are slidably connected inside the annular groove (15).

6. The semiconductor wafer cleaning apparatus according to claim 1, characterized in that: An ultrasonic generator (17) is installed inside the cleaning chamber (1), and cleaning fluid is injected inside the cleaning chamber (1).

Images